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354 results about "High copper" patented technology

Foods High in Copper. The best copper-rich foods include beef liver, lentils, almonds, sunflower seeds, raw kale, turnip greens, blackstrap molasses, asparagus, dark chocolate, sesame seeds, and goat cheese, among others.

Soot treatment process in copper smelting process

The invention provides a soot treatment process in a copper smelting process. The soot treatment process comprises the following steps: firstly carrying out water leaching on copper smelting soot to obtain a water leaching fluid and water leaching residues; then, carrying out acid leaching on one part of the water leaching residues obtained in the last step to obtain an acid leaching fluid, and carrying out alkali leaching on the other part of the water leaching residues to obtain an alkali leaching fluid; carrying out metal replacement on the acid leaching fluid obtained in the last step to precipitate copper to obtain copper-precipitated filtrate; and finally, neutralizing and oxidizing the copper-precipitated filtrate obtained in the last step and the alkali leaching fluid obtained in the last step to obtain ferric arsenate precipitates and arsenic-precipitated filtrate. The soot treatment process provided by the invention, especially the treatment process for high-arsenic high-copper soot realizes the hazard-free treatment effect of arsenic in the high-arsenic high-copper soot, and comprehensively recycles valuable metal copper, zinc and the like in the high-arsenic high-copper soot, so that gradient recycling and comprehensive utilization of soot impurities are realized.
Owner:YANGGU XIANGGUANG COPPER

Mixture containing fluororesin and prepreg prepared from same, and copper clad laminate

The invention specifically relates to a mixture containing fluororesin and a preparation method thereof, belonging to the field of communication materials. A prepreg prepared by impregnating a glass fabric in dispersion liquid of the mixture containing fluororesin and then carrying out drying and the like has uniform glue content, good impregnation quality, strong resin adhesion, smooth surface and appropriate toughness and viscosity. The invention also relates to a high-frequency copper clad laminate prepared from the prepreg, or a film or copper foil made of the mixture containing fluororesin. The prepared copper clad laminate has good thermal-mechanical properties, excellent dielectric properties and high copper foil strength, and can meet requirements on the comprehensive properties of substrate materials in the field of high-frequency communication. According to the invention, the processing properties of traditional fluororesin are greatly improved by using fluorine-containing resin with a low melting point; and a coupling agent is cooperatively used, so interaction between an inorganic filling material and glass fabric and a resin matrix is improved, dispersibility of the inorganic filling material, processing aids and the like in the fluororesin is enhanced, and the overall performance of the copper clad laminate is made more stable.
Owner:CHANGZHOU ZHONGYING SCI & TECH CO LTD

Integrated processing technique for waste water in breadboard production

The invention relates to an efficient process technology for processing plenty of waste water generated in circuit board production, in particular to a pretreatment technology of high copper waste water and difficult biochemical degradation waste water with high COD in the process technology and entire waste water processing technology. First, sorting waste water reasonably according to nature thereof, dividing into as gold thread cyanogen waste water, nickel waste water, silver waste water, copper waste water, peel ink development waste water, high COD waste water and general aqueous washing water, collecting and specially processing the seven kinds of waste water independently, which key technology is the pretreatment technology for copper waste water, peel ink development waste water and high COD waste water. For copper, the key of waste water processing lies in to break complex compound and prevent secondary complexation of remnant Cu2+ and EDTA when adjusting pH to alkaline value; the key of peeling ink development waste water and high COD waste water lies in the foundation that carries out electrocatalysis oxidize to remove partial CODs, on with raise BOD/COD ratio thereof to improve biochemicalness radically.
Owner:深圳市宇力科技有限公司

Method for preparing low-copper molten iron by mixed melting reduction of copper slag and iron ore

InactiveCN101886154AHigh copper concentrationOvercome the disadvantage of higher concentrationFluidised-bed furnacesGranularityCoal
The invention discloses a method for preparing low-copper molten iron by mixed melting reduction of copper slag and iron ore. The method comprises the following processes of: putting the high-temperature molten copper slag into a reduction furnace, grinding a certain amount of slag forming agent CaO, CaCO3 and the like into certain granularity, adding the ground slag forming agent into the reduction furnace, fully melting the mixture, and standing the molten pool for 10 minutes; grinding the iron ore, quantitative additive CaF2 and CaO into certain granularity respectively, then uniformly mixing the iron ore, the CaF2 and the CaO, adding the mixture into the reduction furnace, raising the temperature of the furnace to between 1,600 and 1,700 DEG C, fully melting the materials in the furnace, and then standing the molten pool for 20 minutes; and crushing a coal reducing agent to certain granularity, spraying the crushed coal reducing agent to the molten pool by using inert gas as carrier gas through a spray gun, and performing mixed melting reduction reaction of the copper slag and the iron ore. The method greatly reduces the defect of high copper in the molten iron obtained by single copper slag melting reduction by fully using the mutual coupling effect of the components among the copper slag, the iron ore and the additive and the diluting effect of the molten iron obtained by iron ore reduction on high copper content of the molten iron obtained by copper slag reduction, and has wide applicability.
Owner:KUNMING UNIV OF SCI & TECH

High-Zn, high-Mg and low-Cu ultrahigh-strength corrosion-resisting aluminum alloy and heat treatment method

InactiveCN103014459AExtended limit solid solubilityGood casting performanceIngotSolid solution
The invention discloses a high-Zn, high-Mg and low-Cu ultrahigh-strength corrosion-resisting aluminum alloy and a heat treatment method. The alloy comprises the following components by mass percentage: 6.5-8.3% of Zn, 2.3-3.0% of Mg, 0.8-1.2% of Cu, 0.1-0.2% of Zr, less than 0.15% of Fe, less than 0.1% of Si, and the balance of Al. A preparation method of the alloy comprises the steps of blending, smelting, semi-continuous casting, homogenizing, thermoplastic deformation, short time solid solution, and ageing heat treatment. For the high-Zn, high-Mg and low-Cu ultrahigh-strength corrosion-resisting aluminum alloy prepared with the method, the hardness (HV) is 185-209, the tensile strength sigma b is greater than or equal to 650Mpa, the percentage elongation delta is greater than or equal to 7%, the pitting resistance is high, the cast ingot yield is high, and the stress corrosion resistance is further improved while the mechanical property is kept after multiple regression reageing treatment. The alloy and the heat treatment method solve the problems that the cast ingot yield in the existing high-copper Al-Zn-Mg-Cu ultrahigh-strength aluminium alloy is low, and the strength, toughness and corrosion resistance cannot be compromised. The heat treatment method is simple to operate, and the industrial production is facilitated.
Owner:CENT SOUTH UNIV

Fluorine-containing resin-based copper-clad plate with high dielectric constant and preparation method of plate

The invention belongs to the field of communication materials, and particularly relates to a fluorine-containing resin-based copper-clad plate with a high dielectric constant and a preparation methodof the plate. According to the plate, surfaces of inorganic fillers are collectively modified by coupling agents and parts of fluorine-containing polymers, so that interaction force among the inorganic fillers and fluorine-containing resin substrates are higher, the loading amount of the inorganic fillers in the fluorine-containing resin substrates is high (>=50wt%), the compatibility among the inorganic fillers and the substrates is good, the bonding power among the inorganic fillers and the substrates is high, dispersion performances among the inorganic fillers and the substrates are better,so that a prepared fluorine-containing resin-based dielectric slice is uniform and good in dielectric property, the dielectric constant is larger than or equal to 5.0, and dielectric loss is only smaller than or equal to 0.002. The fluorine-containing resin-based copper-clad plate has a certain mechanical strength, excellent heat stability and high copper foil peel strength and can meet various performance requirements for diversified and complicated functions of the copper-clad plates and high-density and multilayer circuit arrangement and the like in the field of high-frequency and high-speed communication.
Owner:CHANGZHOU ZHONGYING SCI & TECH CO LTD

Method for removing impurities from nickel electrolysis anolyte

The invention provides a method for removing impurities from nickel electrolysis anolyte. The method comprises the steps that: (1) a pH value of a solution to be treated is regulated to 3.0-5.0; nascent-state FeS is added, and a reaction is allowed, such that copper is removed; liquid-solid separation is carried out, such that copper-removed liquid is obtained; (2) chlorine and/or air is delivered into the copper-removed liquid, such that Fe<2+> and Co<2+> are oxidized, and Fe(OH)3 and Co(OH)3 precipitates are formed; and solid-liquid separation is carried out, such that a nickel sulfate solution is obtained. According to the method provided by the invention, FeS is used for removing copper, and a copper removing reaction speed is fast, such that copper in the solution can be deeply removed within minutes. Copper removing depth can be ensured, and high copper-nickel ratio can be obtained in the copper-removing slag. With the rapid reaction copper-removing characteristic, FeS is suitable for large-scale industrialized production copper removing. According to the invention, the copper-removing process is changed to before the iron-removing process, such that adverse reaction by a high-potential solution to the copper-removing process is eliminated. Copper-removing reaction speed is fast, such that the method is suitable for industrialized large-scale production copper removing.
Owner:CENT SOUTH UNIV

Process for extracting copper by wet method from copper-containing sulfidization ore

The invention relates to a method for extracting copper by a copper-containing sulphide ore wet method, which is characterized in that: (1) under the catalytic action of chloride ions, acid water solution containing ferric ions is used to leach a copper-containing sulphide ore, ore pulp is precipitated and then is divided into two parts of upper clear liquid and bottom current; (2) the upper clear liquid is sent into an anode chamber of a diaphragm electrolytic cell to perform the anode oxidation reaction to ferrous ions in the upper clear liquid to generate the ferric ions which are returned to step (1) to be served as leachate; the bottom current is leached out through oxidation iron removal and is subject to the solid-liquid separation; (3) solution obtained after the bottom current is leached out through the oxidation iron removal and is subject to the solid-liquid separation in the step (2) is sent into a cathode chamber of the diaphragm electrolytic cell to be electrowon to produce electrocopper, cathode waste liquid is returned to the step (1) to be leached; leaching residue, under the catalytic action of the chloride ions, oxidizes and leaches the copper in the leaching residue, and the leached copper is reclaimed through extraction-electrowinning. The method has short flow, small investment, low power consumption of electrowinning, wide applicable range of raw materials, easy process operation, and high copper recovery rate, and is environment-friendly and so on.
Owner:BEIJING GENERAL RES INST OF MINING & METALLURGY

Hot isostatic pressing preparation method of high-density molybdenum-copper alloy

InactiveCN104762498AHigh degree of densificationUniform distribution of two phasesSmall sampleHeat conducting
The invention discloses a hot isostatic pressing preparation method of a high-density molybdenum-copper alloy and the hot isostatic pressing preparation method is used for solving the problems that material heat conductivity and device air tightness are influenced by defects such as relatively low relative density, non-uniform component distribution and relatively small sample sizes existing in a process of preparing a molybdenum-copper alloy by using an existing method. The hot isostatic pressing preparation method comprises the following steps: performing ball milling on weighed raw materials, firstly preparing a cold-pressed billet, and then removing a low-density oxide phase by virtue of hydrogen reduction. By adopting a high-vacuum hot isostatic pressing dense sintering method, the density problem of the molybdenum-copper alloy can be successfully solved, the sintering temperature can also be greatly reduced, interface structures of the materials can be effectively controlled, uniform distribution of components can be achieved, and the heat-conducting properties of the materials can be optimized. By adopting the hot isostatic pressing preparation method disclosed by the invention, the molybdenum-copper alloy with high density, high copper content and large size can be successfully prepared, requirements of electronic packaging and heat sink materials for the properties such as material strength and heat conductivity can be met, relatively good market application prospects can be achieved, and the molybdenum-copper alloy is worthy of being popularized and applied in large scale.
Owner:MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS

Method for manufacturing printed circuit board through enhancing semi-additive process

ActiveCN106304668ACross section limitConductive pattern formationEtchingEngineering
The invention discloses a method for manufacturing a printed circuit board through an enhancing semi-additive process. The method comprises the following steps: 1) thinning copper: performing thinning copper treatment on a copper-clad plate, forming a through hole or blind hole, and then manufacturing an electroplating seed layer; 2) transferring pattern: pasting a photosensitive film, forming an electroplating barrier layer on the surface of the copper-clad plate through a pattern transferring method and designing a lead connecting circuit copper layer and a non-circuit copper layer while transferring the pattern; 3) electroplating the pattern: fully plating the blind hole or the through hole while electroplating and forming the circuit pattern; 4) differentially etching: removing the bare bottom copper through a differential etching method and remaining the circuit pattern; 5) electroplating wire: electroplating the circuit pattern through the wire, widening and heightening the circuit; 6) protecting treatment: forming a metal protection layer on the surface of the conductive circuit; 7) cutting off the wire. According to the method provided by the invention, the limitation of the resolution and thickness of the photosensitive film to the cross section of the circuit is broken through and the method is especially fit for manufacturing the fine circuit with high copper thickness.
Owner:广东佛智芯微电子技术研究有限公司
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