11 results about "High copper" patented technology

This invention belongs to the field of wastewater treatment technology, specifically relating to a method for removing metallic impurities from acidic copper-containing etching wastewater at room temperature and pressure. The method includes the following steps: S1, adding an oxidant to the acidic copper-containing etching wastewater to conduct an oxidation-reduction reaction, obtaining a pretreatment solution; S2, adding phosphoric acid or soluble phosphate to the pretreatment solution, adjusting the pH to 1.3-1.7 using a pH adjuster, stirring, and filtering to obtain a purified copper-containing solution. The method provided by this invention achieves high removal rates for Fe, Ni, Zn, Ca, and Mg, while maintaining a high copper ion content. It can recycle and regenerate high-purity copper salt products for application in food, cosmetics, medical, electroplating, and other fields, while also reducing hazardous waste generation, improving economic efficiency, and significantly reducing costs.

The invention belongs to the technical field of wastewater treatment, and particularly relates to a method for removing metal impurities from acidic copper-containing etching wastewater at normal temperature and pressure. The method for removing the metal impurities from the acidic copper-containing etching wastewater at normal temperature and pressure comprises the following steps: S1, adding an oxidizing agent into the acidic copper-containing etching wastewater to carry out oxidation-reduction reaction to obtain a pretreatment solution; and S2, phosphoric acid or soluble phosphate is added into the pretreatment solution, the pH is adjusted to 1.3-1.7 through a pH adjusting agent, stirring and filtering are conducted, and the purified copper-containing solution is obtained. According to the method, the removal rate of Fe, Ni, Zn, Ca and Mg is high, high-content copper ions can be kept, a high-purity copper salt product can be recycled and regenerated to be applied to the fields of food, cosmetics, medical treatment, electroplating and the like, hazardous waste can be reduced, economic benefits are improved, and cost is greatly reduced.

The invention discloses an ultra-low oxygen content pure copper thick plate for magnetron sputtering coating and a preparation method thereof, the ultra-low oxygen content pure copper thick plate for magnetron sputtering coating comprises the following components in percentage by weight: greater than or equal to 99.997% of Cu, 1-3 ppm of O, less than or equal to 5 ppm of Fe, less than or equal to 5 ppm of P, and the balance of inevitable impurity elements; during preparation, firstly, a pure copper thick plate is baked and then fed into a smelting furnace to be smelted, impurity elements and hydrogen in molten copper are removed in an oxygen hydrogen inhibition and oxidation mode, then charcoal covering and bottom blowing of carbon monoxide are adopted for oxygen removal, then heat preservation furnace refining and vertical all-continuous casting are conducted, and finally 12-pass rolling is conducted on a hot rolling mill. By accurately controlling the heating temperature, the heat preservation time, the rolling pass and the deformation amount, the grain size, uniformity and surface quality of a final product are ensured, internal defects are reduced, the prepared pure copper thick plate has the extremely high copper content and the extremely low oxygen content, and important material support is provided for industry development.

The invention provides a preparation method and application of copper-enriched yeast. The preparation method comprises the following steps: carrying out copper-rich fermentation by utilizing saccharomyces cerevisiae with a known preservation number of CCTCC NO: M 2017781, so as to obtain the copper-rich yeast. The saccharomyces cerevisiae (the preservation number is CCTCC NO: M 2017781) in the application is used for absorbing inorganic copper in the copper-containing solution and converting the inorganic copper into organic copper. By utilizing the method, a large amount of yeast with higher copper content can be obtained under the condition of shorter preparation time, the cost is low, and the method is more beneficial to industrial production.

The invention provides a chemical mechanical polishing solution. The chemical mechanical polishing solution comprises grinding particles, a nitrogen-containing heterocyclic compound, organic acid, a twin anionic surfactant and an oxidizing agent. The chemical mechanical polishing solution has a relatively high copper removal rate, and meanwhile, can remarkably reduce disc-shaped recesses and dielectric layer erosion in a copper wire region on a polished pattern wafer.

The invention relates to the technical field of copper powder processing, in particular to flaky copper powder for conductive paste and a preparation method of the flaky copper powder. The method comprises the steps that copper powder which is prepared through PVD and is high in sphericity degree is subjected to ball milling through three kinds of grinding balls which are gradually decreased from high to low, and flaky copper powder is prepared; and then an acidic chemical nickel plating solution is adopted, the pH value of the plating solution is dynamically regulated and controlled, the pH value of the initial stage ranges from 2.0 to 4.0, the pH value of the middle stage ranges from 5.0 to 5.5, the pH value of the later stage ranges from 4.5 to 5.0, and the plating of the flaky copper powder is achieved through ultrasonic assistance. The flaky copper powder prepared through the method is complete and uniform in structure and compact in plating layer, the problems that according to an existing method, the long-term oxidation resistance is poor, the conductivity of the flaky copper powder is affected by residual coatings, and the flaky copper powder is not suitable for being used in special environments such as high temperature and high humidity are solved, and the flaky copper powder obtained through the method is low in resistance and good in oxidation resistance and has good application prospects. The end electrode can be applied to a chip multilayer ceramic capacitor used in a severe environment.

A real-time monitoring system and method for inhibiting arsine evolution in electrodeposition de-arsenic process of copper electrowinning is provided. The system includes a PLC control module, a primary mother liquor real-time monitoring module, an de-arsenication circulating solution real-time monitoring module, a de-arsenicated solution real-time monitoring module, and an accurate regulation module. The present invention utilizes copper-arsenic electrowinning and concentration competition differences, with the difference and limit of copper arsenic concentration in the de-arsenication circulating liquid as the constraint indexs, and the PLC control module is configured to control monitoring modules to acquire copper and arsenic concentrations in a primary mother liquor, an de-arsenication circulating solution and a de-arsenicated solution in real time, to calculate and analyze required copper and arsenic ion concentrations in the de-arsenication circulating solution, and to accurately regulate dosage volume of the primary mother liquor with high copper and arsenic concentrations.

The application discloses a high-copper-content feed for powder injection molding and a preparation method and application thereof, and relates to the technical field of powder injection molding materials. The high-copper-content feed is prepared by mixing metal powder and catalytic debinding binder in a mass ratio of 120-130:5-15 and then performing dense mixing. The metal powder comprises copper-containing powder, and the mass fraction of copper powder in the copper-containing powder is 95-100%. The copper powder comprises three kinds of powders with different particle sizes. By controlling the selection of raw materials of the copper powder, a combination of copper powder raw materials with multiple particle sizes and multiple shapes is screened out, and then the high-copper-content feed is prepared by mixing the copper powder with the catalytic debinding binder and performing dense mixing. The high-copper-content feed has the advantages of strong flowability and good shape maintaining capability, and the structure of a part product obtained by powder injection molding is compact, and the molding rate is high.

A chemical mechanical polishing (CMP) slurry may include: a plurality of particles distributed in a carrier, where at least a portion of the particles of the plurality of particles may have a body including a core including zirconia and a shell covering at least a portion of the core, where the shell includes silica; an oxidant; and a carrier. The CMP slurry may include at least one of: a hydrogen peroxide stability reduction percentage of no greater than 50%; and a high copper material removal rate.

The invention discloses a pure copper thick plate with ultra-low oxygen content for magnetron sputtering coating and a preparation method thereof. Calculated by weight percentage, the pure copper thick plate with ultra-low oxygen content for magnetron sputtering coating has a Cu content of ≥99.997%, an O content of 1-3 ppm, an Fe content of ≤5 ppm, a P content of ≤5 ppm, and the remainder being inevitable impurity elements. During preparation, the pure copper thick plate is first baked and then sent into a smelting furnace for smelting. Impurity elements and hydrogen in the copper liquid are removed by suppressing hydrogen with oxygen and oxidizing the same. Deoxygenation is then carried out by covering with charcoal and bottom blowing carbon monoxide. Refining in a holding furnace and vertical continuous casting are then carried out. Finally, 12 passes of rolling are performed on a hot rolling mill to obtain the plate. The invention ensures the grain size, uniformity and surface quality of the final product and reduces internal defects by precisely controlling the heating temperature, holding time, rolling passes and deformation. The prepared pure copper thick plate has an extremely high copper content and an extremely low oxygen content, providing important material support for the development of the industry.

The invention belongs to the technical field of industrial waste liquid regeneration recycling and chemical material manufacturing, and provides a method for preparing cupric carbonate from printed circuit board alkaline etching waste liquid, which comprises the following steps: step 1, mixing the printed circuit board alkaline etching waste liquid with alkali, heating and stirring for reaction, suction filtration and washing until filtrate is neutral, and taking out a filter cake; step 2, adding the filter cake into a hydrochloric acid solution, uniformly stirring, filtering, and taking out filtrate; and 3, mixing the filtrate with an ammonium bicarbonate solution, adjusting the pH value, carrying out a stirring reaction at 55-60 DEG C, standing for 1-2 h, carrying out suction filtration, washing for 2-3 times, and drying in an oven at 100-105 DEG C until the weight is constant, thereby obtaining the copper carbonate. According to the method for preparing the cupric carbonate from the printed circuit board alkaline etching waste liquid, the recovery rate of copper is high, the prepared cupric carbonate is high in quality, the technological process is simple, operation is convenient, the number of devices is small, and industrial production is easy to achieve.