The application discloses a plating
solution system for an ultrahigh-
phosphorus chemical
nickel plating layer, which comprises A agent, B agent and C agent, wherein the A agent comprises the following components: 250-350 g / L of
nickel sulfate, 30-60 g / L of a complexing agent, 10-25 g / L of a buffer, 0.1-2 mg / L of a stabilizer, and the rest is deionized water; the B agent comprises the following components: 200-300 g / L of
sodium hypophosphite, 5-15 g / L of an accelerator, 0.5-2 g / L of
ammonia water, and the rest is deionized water; the C agent comprises the following components: 400-600 g / L of
sodium hypophosphite, 10-25 g / L of an accelerator, 0.5-2 g / L of
ammonia water, and the rest is deionized water; the A agent and the B agent are mixed at a volume ratio of 1:4-5, and then diluted by 3 times to form a working plating solution. During immersion plating, the aluminum
alloy base material is first treated, then immersed into the working plating solution, and a chemical
nickel plating reaction is carried out at 82-87 DEG C; and the A agent and the C agent are dynamically added during the nickel plating process; after the reaction is completed, the finished product is obtained through
water washing and
drying. Through the above manner, the content of
phosphorus elements in the plating layer can be stably provided to be more than 12%, so that the use requirements of special working conditions are met.