The invention discloses an
electroplating manufacturing process, comprising the following steps of: A, utilizing a
plasma degumming
machine to carry out degumming treatment on residual resin in a back-drilled
blind hole of a circuit board; B, carrying out primary
copper deposition treatment on the back-drilled
blind hole of the circuit board and then carrying out secondary
copper deposition treatment to form a
copper layer with the thickness of 0.3-0.5 microns in the back-drilled
blind hole; and C, carrying out hole-filling
electroplating on the circuit board to lead the thickness of the copper layer in the back-drilled blind hole to be more than 18 microns. According to the invention, by utilizing a
plasma degumming way to treat the residual resin in the back-drilled blind hole of the circuit board, the problem that a chemical degumming speed is lower is solved, and the
plasma degumming way has a good degumming effect and no residues; two times of
copper deposition solve the problems that the thickness of deposited copper generated by the primary
copper deposition is thin, and hollow copper depositing
layers, broken copper or an open circuit is easy to generate in a process of storing or electrically pre-treating a board; and the thickness of the copper layer in the blind hole can reach to be more than 18 microns through the hole-filling
electroplating, so that the thickness requirement of the back-drilled blind hole is met. Compared with the prior art, the electroplating manufacturing process provided by the invention effectively overcomes the quality defects that: the back-drilled blind hole cannot be completely degummed, the
binding force is poor, and the copper in the hole is thinner and the like.