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14results about How to "Improve degumming efficiency" patented technology

Method for removing photoresist on wafer and semiconductor process equipment

The invention provides a method for removing photoresist on a wafer and semiconductor process equipment, and the method comprises the steps: obtaining the corresponding spectral intensities of emitted light generated by a specific element in a cavity at different sampling moments in the process of removing the photoresist after ion implantation; according to the spectral intensities corresponding to the two adjacent sampling moments, determining the change characteristic quantity of the spectral intensity at each sampling moment; and when the change characteristic quantity corresponding to the current sampling moment meets a preset condition, determining that the hardened layer removal process is close to an end point and controlling the wafer to descend from the current position to the direction of the heating base according to a preset relation so as to remove the hardened layer of the photoresist. The spectral intensity of the emitted light generated by the specific element is acquired, whether the hardened layer removal process is close to the end point or not is judged according to whether the change characteristic quantity of the spectral intensity meets the preset condition or not, and the wafer is controlled to descend for heating when the hardened layer removal process is close to the end point, so that the hardened layer is prevented from bursting at high temperature.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Bacillus inaquosimilis strain and application thereof in ramie degumming

The present application relates to a strain of Inhernia Bacillus and its application in ramie degumming, the strain is preserved in Guangdong Microbial Culture Collection Center on September 15, 2025, and the preservation number is GDMCC NO: 66966. When the strain is applied to ramie degumming, the degumming reaction can be carried out at a higher temperature, the degumming efficiency of ramie is effectively improved, the fiber is not damaged, the quality of the fiber is improved, and the strain has high application value in ramie degumming.
Owner:YICHUN UNIVERSITY

An integrated process device and method for degumming of apocynum venetum

PendingCN122503953Areduce pollutionPrecise control of process parameters
This invention relates to an integrated process apparatus and method for degumming Apocynum venetum, comprising a raw material pretreatment unit, a microwave-ultrasound synergistic pretreatment unit, a composite enzyme gradient degumming unit, a post-treatment unit, and an enzymatic hydrolysis product recovery unit connected in sequence. Each unit is connected via a sealed conveying mechanism. The invention also includes a central control system electrically connected to each unit to regulate its process parameters. A waste liquid conveying pipeline connects the composite enzyme gradient degumming unit and the enzymatic hydrolysis product recovery unit. The output of the enzymatic hydrolysis product recovery unit is connected to the composite enzyme gradient degumming unit via a reflux pipeline, enabling the recycling of biological enzymes. The method of this invention is simple, convenient to operate, and achieves good degumming effect. It yields high-quality Apocynum venetum fiber with high extraction rate, retains a large number of natural active ingredients, and realizes the high-value utilization of Apocynum venetum fiber.
Owner:XINJIANG XINGBO SILK ROAD CLOTHING CO LTD

Supporting mechanism for wafer photoresist removal

The utility model discloses a supporting mechanism for wafer degumming, which comprises a shell, an arc-shaped box and a coupler, a rotating motor is fixed on the outer wall of one side of the shell through a bolt, a driving bevel gear is arranged on an output shaft of the rotating motor, and a rotating rod is rotatably connected on the outer wall of the shell through a rotating shaft. A driven bevel gear is arranged at one end of the rotating rod and meshed with the driving bevel gear, a sliding groove is formed in the arc-shaped box, a sliding column is slidably connected into the sliding groove, a lower fixing clamp is arranged at one end of the sliding column, and an upper fixing clamp is arranged on the outer wall of the top of the lower fixing clamp. The lead screw is inserted into the threaded hole in a threaded mode, the wafer is fixed through the sliding fixing clamp, the function of fixing the wafer is achieved, the sliding column moves in the sliding groove, the sliding column extrudes the sliding spring, impact of the wafer on the inner wall is relieved during rotation, and the function of protecting the wafer is achieved; the driving bevel gear and the driven bevel gear rotate in a meshed mode.
Owner:TIANJIN WEIPUTAIKE SCI & TECH DEV

Monocrystalline silicon wafer degumming equipment

The invention belongs to the technical field of monocrystalline silicon wafer degumming, and particularly relates to monocrystalline silicon wafer degumming equipment which comprises a machine body used for containing degumming liquid and a plurality of bearing assemblies used for supporting monocrystalline silicon wafers, and further comprises a support installed in the machine body in a sliding mode and used for containing a crystal support; the two telescopic rods are symmetrically installed in the machine body, the bearing assembly is installed on the telescopic rods, and the bearing assembly comprises a first semi-ring plate, a second semi-ring plate, a third semi-ring plate and a fourth semi-ring plate, the connecting plate is fixedly mounted on the first semi-ring plate; the wiping block is installed on the first semi-ring plate and comprises a fixing plate and a sponge block, and the sponge block is installed on the side, close to the silicon wafer, of the fixing plate; by arranging the sponge block, the problem that glue flows to the surface of the silicon wafer in the softening process is avoided, and due to the influence of adhesive force between the silicon wafer and the glue, compared with the mode that the glue flows to the surface of the silicon wafer, the mode reduces the influence of the adhesive force between the silicon wafer and the glue, and the degumming efficiency of the crystal support and the silicon wafer can be improved.
Owner:LINTON KAYEX TECH CO LTD

Fiber ceramic ferrule cylindrical surface degumming device

ActiveCN224794073Uavoid damageImprove degumming efficiency
The utility model discloses a kind of with fibre pottery ceramic ferrule cylindrical surface degumming device, including scraping glue support seat, insert core support seat, top into mobile assembly and top out mobile assembly, scraping glue support seat top is connected with scraping glue car spare by fixed structure, scraping glue hole is formed in scraping glue car spare for ceramic ferrule to wear into and carry out friction scraping glue;The insert core support seat is arranged below scraping glue car spare one end and is formed with accommodating groove thereon, and the insert core support seat is connected with height adjusting assembly for driving it to move along vertical direction;The top into mobile assembly is connected with insert core top block;The top out mobile assembly is connected with top out rod located outside another end of scraping glue hole;For driving top out rod to slide into scraping glue hole and top out ceramic ferrule to accommodating groove;Compared with prior art, improve degumming efficiency;And 360 degrees degumming is realized to ceramic ferrule, and degumming effect is enhanced;While greatly reduce the probability of damage on ceramic ferrule surface.
Owner:HONGYA CHUANGJIE COMM

Low-toxicity environment-friendly neodymium-iron-boron magnet surface magnetic material glue removal liquid and removal process

The invention provides a low-toxicity environment-friendly neodymium-iron-boron magnet surface magnetic material glue removal liquid and a removal process. The removal liquid comprises the following components in parts by mass: 7 parts of dimethyl carbonate and 3 parts of acetone. The removal process comprises the following steps: S1, washing a to-be-treated magnet with deionized water and putting the to-be-treated magnet into a hollow tool basket; s2, removing liquid is added into an ultrasonic cleaning machine, the hollowed-out tool basket containing the to-be-treated magnet is completely immersed into the removing liquid, the ultrasonic cleaning machine is started to conduct degumming cleaning on the to-be-treated magnet to form a treated magnet, the degassing and frequency conversion functions of the ultrasonic cleaning machine are started, the ultrasonic frequency ranges from 35 kHz to 45 kHz, the ultrasonic power ranges from 300 W to 500 W, and the magnet to be treated is obtained; the cleaning time ranges from 15 min to 25 min, and the cleaning temperature ranges from 25 DEG C to 30 DEG C; s3, the treated magnet is washed with deionized water; and S4, drying treatment is conducted on the treated magnet through drying equipment. The degumming device can improve the degumming treatment efficiency.
Owner:BAOTOU INST MAGNETIC NEW MATERIALS CO LTD

Method for removing photoresist on wafer and semiconductor process equipment

The application provides a method for removing photoresist on a wafer and a semiconductor process device. In a process for removing photoresist after ion implantation, the spectrum intensity of the emission light generated by a specific element in the chamber at different sampling moments is obtained; the change characteristic quantity of the spectrum intensity at each sampling moment is determined according to the spectrum intensity corresponding to two adjacent sampling moments; when the change characteristic quantity corresponding to the current sampling moment meets a preset condition, it is determined that the hardening layer removal process is close to the end point, and the wafer is controlled to descend from the current position to the direction of the heating base according to a preset relationship to remove the hardening layer of the photoresist. By obtaining the spectrum intensity of the emission light generated by the specific element, whether the hardening layer removal process is close to the end point is determined according to whether the change characteristic quantity of the spectrum intensity meets the preset condition, and the wafer is controlled to descend for heating only when the hardening layer removal process is close to the end point, so that the hardening layer is prevented from bursting at high temperature.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

A rapeseed oil degumming device

The utility model relates to degumming device technical field discloses a rapeseed oil degumming device. Rapeseed oil crude oil passes through filter and enters preheater, the output of preheater is connected with the input of first static mixer, the output of first static mixer is connected with the feed port of acidification jar, the upper portion of first static mixer is connected with the acid inlet pipe, the bottom of acidification jar is provided with the discharge gate, the discharge gate of acidification jar is connected with the input of second static mixer, the upper portion of second static mixer is connected with hot water pipeline, the electric water heater is connected second static mixer through hot water pipeline, the output of second static mixer is connected with the feed port of hydration jar, the bottom of hydration jar is provided with the discharge gate, the discharge gate of hydration jar is communicated with the feed port of butterfly centrifuge, the light phase export is connected with the oil storage tank of external installation, the heavy phase export is connected with the oil foot jar of external installation. The utility model has solved the problem of uneven mixing, inaccurate control and low separation efficiency in traditional degumming process.
Owner:HAINAN AUSKA INT GRAIN & OIL CO LTD

A method for green degumming of ramie by acid-alkali synergistic biological enzyme

The present application relates to ramie degumming process technical field, specifically is a kind of acid-base synergic biological enzyme assisted ramie green degumming method, the method uses NaOH-H2SO4 Synergic treatment system, by acid dipping-alkali dipping two-step method synergistic effect, acid dipping stage is treated with 1%-5% H2SO4 Solution adding surfactant etc., alkali boiling stage is treated with 2%-6% NaOH solution adding sodium silicate etc., combined with biological enzyme auxiliary treatment, realize efficient degumming, the present application acid-base synergic biological enzyme assisted ramie green degumming method, gum removal rate is >90%, reduce 20%-30% alkali dosage, fiber breaking strength is increased by 20%-25%, wettability is significantly improved, residual glue rate is as low as 2% or less, and reduce production cost and wastewater treatment cost, adapt to existing production line, can satisfy high-end textile demand.
Owner:YANGTZE NORMAL UNIVERSITY

Green water-saving flax degumming method

The invention provides a green and water-saving flax degumming method which comprises the following steps: A) taking part of flax original stems from flax original stems to be degummed, pre-soaking, sealing, placing, washing with water, and recovering eluent; b) wetting the rest of the flax original stems to obtain wetted flax original stems; and C) spraying the eluent onto the wetted flax stems, and sealing and degumming to obtain degummed flax. According to the method provided by the invention, the water consumption is greatly reduced, and a large amount of water sources are not needed; hot water can be provided without heating and consuming energy; a large amount of waste water and waste gas are not generated, so that water-saving and green degumming is realized; the degumming time is within the industrial acceptable range, and the degumming can be accelerated by adjusting the temperature. Compared with rain and dew degumming, the method also does not cause environmental pollution. But the degumming efficiency is greatly improved, so that the degumming time is controllable and is not obviously influenced by weather, the occupied land area is greatly reduced, and the production efficiency and the product quality are guaranteed.
Owner:INST OF BAST FIBER CROPS CHINESE ACADEMY OF AGRI SCI +1

Glue removing machine for alloy resistor plate

The invention relates to an alloy resistor plate degumming machine which is provided with a rack, a degumming mold is arranged in the middle of the rack, the two sides of the degumming mold are each provided with a material taking mechanism and a material changing bin assembly, and the material taking mechanisms are used for moving plates between the degumming mold and the material changing bin assemblies. During use, the material claws of the material taking mechanism grab a plate and move and place the plate into the degumming mold, degumming is achieved through downward pressing of the degumming mold, after degumming of the mold is completed, the material taking mechanism moves to the material changing bin assembly, the four material claws fixedly simulate the index finger and the thumb of a worker to grab a material piece, the plate cannot be damaged, and the degumming efficiency is greatly improved; according to the material changing bin assembly, the two material changing bins are arranged on the supporting base, the material changing bin mechanism can move the two material changing bins to conduct discharging and discharging, the jacking mechanism can adapt to the height of the clamping jaw, a material plate on the uppermost portion in the material changing bins is jacked to the height suitable for grabbing of the clamping jaw, use is convenient, and the glue removing efficiency is greatly improved through mutual cooperation of the mechanisms.
Owner:GUOBANG ELECTRONIC TECH (JIANGSU) CO LTD

Wafer photoresist removing method and wafer photoresist removing device

PendingCN121857253AImprove degumming efficiencyReduce glue residuePhotosensitive material processingWaferEngineering
The invention provides a wafer photoresist removing method and a wafer photoresist removing device. The method comprises the following steps: putting a wafer into a high-temperature photoresist removing cavity, and performing photoresist removing for the first time; the wafer is transferred from the high-temperature photoresist removing cavity to a low-temperature photoresist removing cavity, secondary photoresist removing is carried out, and the temperature of the high-temperature photoresist removing cavity is higher than that of the low-temperature photoresist removing cavity; and transferring the wafer from the low-temperature photoresist removing cavity to a cooling cavity for cooling, wherein the temperature of the low-temperature photoresist removing cavity is higher than that of the cooling cavity.
Owner:BOE HUACAN OPTOELECTRONICS (GUANGDONG) CO LTD

Silicon wafer degumming material frame

The utility model provides a silicon wafer degumming material frame, which is used in the technical field of silicon wafer degumming and comprises a frame main body and a bottom support component, the bottom supporting assembly comprises a fixing piece, a horizontal longitudinal rod and an adjusting piece. The fixing piece is connected with the frame body. The two ends of the horizontal longitudinal rod are fixed to the fixing pieces through the adjusting pieces correspondingly. The adjusting piece is provided with a first end and a second end which are opposite, the first end is provided with a first hole, and the horizontal longitudinal rod is selectively fixed in the first hole; a clamping groove is formed in the second end, and the fixing piece is embedded into the clamping groove. According to the utility model, the mounting height and the position of the horizontal longitudinal rod are adjusted by arranging the adjusting piece, so that the height and the size of the bearing surface are adjusted, silicon wafers are tidily dropped, the operation of manual pressing is omitted, the degumming efficiency is improved, the probability that the silicon wafers are crushed and dropped and damaged is effectively reduced, and the quality of the silicon wafers is ensured.
Owner:INNER MONGOLIA ZHONGHUAN SOLAR MATERIAL CO LTD