The invention belongs to the technical field of
monocrystalline silicon wafer degumming, and particularly relates to
monocrystalline silicon wafer degumming equipment which comprises a
machine body used for containing degumming liquid and a plurality of bearing assemblies used for supporting
monocrystalline silicon wafers, and further comprises a support installed in the
machine body in a sliding mode and used for containing a
crystal support; the two telescopic rods are symmetrically installed in the
machine body, the bearing
assembly is installed on the telescopic rods, and the bearing
assembly comprises a first semi-ring plate, a second semi-ring plate, a third semi-ring plate and a fourth semi-ring plate, the connecting plate is fixedly mounted on the first semi-ring plate; the wiping block is installed on the first semi-ring plate and comprises a fixing plate and a
sponge block, and the
sponge block is installed on the side, close to the
silicon wafer, of the fixing plate; by arranging the
sponge block, the problem that glue flows to the surface of the
silicon wafer in the
softening process is avoided, and due to the influence of
adhesive force between the
silicon wafer and the glue, compared with the mode that the glue flows to the surface of the silicon wafer, the mode reduces the influence of the
adhesive force between the silicon wafer and the glue, and the degumming efficiency of the
crystal support and the silicon wafer can be improved.