5results about How to "Loss minimization" patented technology

This invention discloses a wafer release method for use in a wafer processing system and a wafer processing method. The wafer release method of this invention includes: a polarity reversal step of reversing the polarity of a voltage applied to a chuck; a first transfer step of raising a lifting pin housed in the chuck at a first transfer speed to transfer a wafer supported on the chuck to a first predetermined position; and a second transfer step of raising the lifting pin at a second transfer speed different from the first transfer speed to transfer the wafer positioned at the first predetermined position to a second predetermined position higher than the first predetermined position.

The application discloses a cold region pig house winter stratified energy-saving ventilation method and relates to the technical field of livestock breeding. In order to solve the ventilation problem of the prior art cold region pig house, the method comprises the following steps: according to the pig house space and pig growth stage, a ventilation system is laid out; real-time monitoring of pig house internal environment parameters is taken as a basis; a CFD simulation is used to optimize the air flow path, and then the operation parameters of the ventilation system are regulated; and according to the heat loss in the pig house, the operation of the ventilation system is assisted and optimized. The application provides a dynamic adjustable air supply mechanism based on the breathing height of pigs, through pig house top layer heat recovery and pig house internal air flow stratified interval ventilation, the heat energy loss is effectively reduced, more than 80% of fresh air is accurately delivered to the pig breathing area, invalid ventilation is avoided, the energy saving rate is more than 50%, the energy consumption is reduced, the air quality in the breathing area reaches more than 99% of the standard rate, and the growth environment and health level of the pigs are improved.

The invention relates to the technical field of intelligent detection of mold damage in the manufacturing industry, in particular to a mold damage identification method based on improved self-adaptive deep embedding clustering, which comprises the following steps of: firstly, acquiring a mold vibration signal or a surface defect image, and performing data enhancement preprocessing of scaling, normalization, random rotation and brightness adjustment; mapping to a low-dimensional embedding space through a deep neural network encoder containing a channel attention mechanism (SENet), optimizing an encoder and clustering center joint target, minimizing KL divergence and reconstruction loss to generate an embedding vector, and determining an optimal parameter through model evaluation; according to the method, the MNIST data set clustering accuracy reaches 99%, the NEU-DET data set defect detection rate reaches 94.2%, the precision reduction amplitude under noise interference is only 4.2%-6.3%, only 2.1 M parameters are needed, the parameter accuracy ratio is optimal, the mold damage recognition precision and robustness are effectively improved, and the method is suitable for complex industrial scenes.

An air conditioner including a refrigerant module includes a module housing and a first refrigerant chamber and a second refrigerant chamber formed in the module housing. The second refrigerant chamber is disposed adjacent to the first refrigerant chamber. The refrigerant module includes a first inflow flow path and a first discharge flow path formed in the module housing and fluidly connected to one of the first refrigerant chamber and the second refrigerant chamber. The refrigerant module also includes a second inflow flow path and a second discharge flow path formed in the module housing and fluidly connected to the other of the first refrigerant chamber and the second refrigerant chamber. The refrigerant module also includes an expansion valve disposed in the module housing and fluidly connected to the first discharge flow path, an expansion flow path formed in the module housing for the refrigerant expanded in the expansion valve to flow through, and a connection flow path formed in the module housing for fluidly connecting a compressor and a condenser.