The invention discloses a substrate pretreatment process applied to an integrated
electrode material, and belongs to the technical field of
electrode material preparation. The process sequentially comprises the steps of substrate pretreatment, micro-
etching, rough
nickel deposition and embroidered ball array skeleton electrodeposition, and a micron-sized rough structure is constructed on the surface of a
nickel-based
porous substrate through micro-
etching so as to provide more
nucleation sites; on the basis that rough
nickel is deposited on the
rough surface of a base body, a compact
amorphous metal nickel
transition layer is formed, strong mechanical
interlocking with the base body is achieved, and high
corrosion resistance and
high conductivity are achieved; and finally, growing a vertically-oriented
nanowire array framework on the
metal nickel
transition layer by utilizing electro-deposition. Through the synergistic effect of micro-
etching, rough
nickel deposition and electro-deposition, a complete, stable and efficient three-dimensional conductive carrier from a macroscopic matrix to a microcosmic active skeleton is finally constructed, and the
binding force between the integrated
electrode material and the matrix, the interface stability and the
mass transfer capacity are fundamentally improved.