The invention relates to a method for reducing a long-term change (∆P) in a form (P) of an
optical surface (25a) of an optical element (Mi), preferably a mirror, in particular an EUV mirror. The method comprises
processing the optical element (Mi), preferably an in particular transparent substrate (25) of the optical element (Mi), outside the
optical surface (25a) in order to reduce surface damage, in particular in order to reduce a
surface roughness Ra, of the optical element (Mi) outside the
optical surface (25a). During
processing, material is removed from the substrate (25) of the optical element (Mi) preferably by brushing by means of at least one brushing tool (27). The invention also relates to an optical element (Mi), comprising: an optical surface (25a), preferably for reflecting
radiation, in particular for reflecting EUV
radiation. The optical element (Mi), preferably an in particular transparent substrate (25) of the optical element (Mi), has a
surface roughness Ra of 5 µm or less, preferably of 3 µm or less, particularly preferably of 1.5 µm or less, on a partial surface or on multiple partial surfaces outside the optical surface (25a) and / or the partial surface or the multiple partial surfaces are transparent. The invention also relates to an
system for
semiconductor lithography, which has at least one optical element (Mi) of this type, which is preferably arranged in a projection optical unit (10).