The invention relates to the technical field of
electronic component detection, in particular to an IC (
integrated circuit) carrier plate detection method based on surface state
image extraction, which comprises the following steps: acquiring a gray image, analyzing structural parameters, extracting gradient features, detecting boundary disturbance, integrating the image, calculating an abnormal
score, identifying a defect position area, extracting features and outputting an identification result. According to the invention, by analyzing the structure parameters of the bonding pad in the
gray level image, calculating the edge
line segment, the center coordinate and the spacing, and constructing the two-dimensional coordinate
system, the regional positioning reference is enabled to have
geometric consistency, the
coordinate mapping is combined with the
gradient direction change frequency and the continuous aggregation point, the boundary disturbance identification precision is improved, and the image division is executed based on the disturbance region. According to the method, non-functional region mixing is effectively avoided, a clustering and
probability model is introduced after region
gray level statistics, a deviation scoring mechanism is constructed,
gray level feature abnormity is accurately recognized, the discrimination capability of small-amplitude and low-contrast defects is improved, and the selectivity and target focusing performance of
feature detection are enhanced.