1423results about "Waveguides" patented technology

The invention discloses a differential signal transmission link, a high-speed differential signal transmission composite chip and an intra-core differential signal transmission link configuration method. A strip line is arranged in a perforated cylinder in a penetrating manner, two differential microstrip lines are horizontally arranged at two ends of the perforated cylinder, one end of one differential microstrip line is connected with the upper end of the strip line, and one end of the other differential microstrip line is connected with the lower end of the strip line; the conductor strip and the two grounding strips in each differential microstrip line are arranged on the total slide glass side by side in the length direction of the total slide glass, the conductor strip is arranged between the two grounding strips, and the multiple capacitors and the multiple inductors are alternately arranged on the conductor strip in the length direction of one side of the conductor strip. The plurality of conductive blocks are uniformly arranged on the conductor belt along the length direction of the other side of the conductor belt; a high-bandwidth storage chip and a GPU chip in the high-speed differential signal transmission composite chip are horizontally arranged on a PCB composite board in parallel, and a differential signal transmission system is arranged among the PCB composite board, the high-bandwidth storage chip and the GPU chip in a penetrating mode.

The present invention relates to an antenna device and an electronic device using same, the antenna device having twice as many antennas arranged in the same area so as to be reduced in size by half and be capable of performing high power long-distance transmission. The antenna device according to the present invention comprises: a core printed circuit board having antenna circuits arranged therein; a Yagi-Uda antenna formed on a plurality of printed circuit boards arranged above the core printed circuit board, so as to transmit a single polarization signal; a monopole antenna connected to the Yagi-Uda antenna through a via; and a ground radiation unit arranged below the core printed circuit board so as to be symmetrical to the monopole antenna with respect to the core printed circuit board.

A microwave filter arrangement (100) for quantum computing applications, the filter arrangement (100) comprising a first port (113) and a second port (114). The microwave filter arrangement (100) comprises a main waveguiding structure (110) arranged between the first (113) and second (114) port, where the main waveguiding structure (110) comprises an inner conductor (111) having a circular cross-section that is surrounded by a hollow outer conductor (112) having a rectangular cross-section with two opposed long sides and two opposed short sides. The waveguiding structure (110) comprises a plurality of hollow waveguides (115) extending away from one or both of the long sides of the outer conductor, the hollow waveguides (115) comprising a dielectric material (122) and being terminated by an electromagnetically absorptive material (124).

A device useful as a switch including an input waveguide coupled to an output waveguide; a first diode circuit integrated with the input waveguide at a first termination; a second diode circuit integrated with the output waveguide at a second termination; and wherein the biasing the diode circuits switches the switch between an off state and an on state and achieves high isolation in the off state by absorbing input power in, reflecting the input power from, and frequency multiplying the input power using the diodes in the diodes circuits when the input power is received from the input waveguide. In one embodiment, the switch is a tunable, solid-state SPST switch for Gband radar applications.

A semiconductor device has an amplifier and common mode suppression (CMS) circuit formed on a common substrate. The CMS circuit has a first input and second input coupled for receiving an input signal and further has a first output coupled to a first input of the amplifier and a second output coupled to a second input of the amplifier to reduce common mode. The CMS circuit further has a ground plane, a first conductive trace disposed over the ground plane and coupled between the first input and first output, second conductive trace disposed over the ground plane and coupled between the second input and second output, and third conductive trace disposed over the ground plane with a first end of the third conductive trace coupled to the ground plane and a second end of the third conductive trace open circuit to form a resonator.

An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and / or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

A waveguide to transmission line coupler is provided. The waveguide can be capable of guiding electromagnetic energy and can have a plurality of coupling sets along the waveguide. The coupling set can include a non-resonant coupling aperture capable of coupling said electromagnetic energy from the waveguide to at least one output transmission line and a tuning element in the waveguide proximate to said non-resonant coupling aperture thereto, capable of tuning out residual shunt susceptance corresponding to the electromagnetic energy coupled by said non-resonant coupling aperture.

A sensor system comprises an optical sensor which includes an imaging device and a detection device which defines a rear side of the optical sensor, a radar transceiver unit for generating radar waves to be transmitted and for receiving radar waves to be detected, and at least one antenna element configured to transfer radar waves from the radar transceiver unit to an exterior of the sensor system and from the exterior of the sensor system to the radar transceiver unit. The radar transceiver unit is located at the rear side of the optical sensor.

An antenna apparatus can include a coaxial cable with one end of the coaxial cable forming a remote antenna and the other end of the coaxial cable comprising a local coupler, wherein both ends of the coaxial cable are over-molded protection in a water meter installation. The local coupler can snap-on to a communications module and is operable across wideband RF frequencies ranging from, for example, 790MHz to 1900MHz. The antenna apparatus may also be implemented with an alternative RF coupler design, with two metal planes secured by an IP68 plastic housing with the provision of the coaxial cable to interface with a coupler and the remote antenna. The coupler can operate with low losses of less than, for example, 10 dB. In addition, the remote antenna can be installed on a water pit lid and in some cases, the coaxial cable itself can act as a remote antenna.

An array antenna (100) having a layered configuration. The array antenna comprises a radiation layer (110) comprising a plurality of radiation elements (111) and a distribution layer (120) facing the radiation layer. The distribution layer is arranged to distribute a radio frequency, RF, signal to the plurality of radiation elements. The distribution layer comprises at least one distribution layer feed (121) and at least one first waveguide (122) arranged to guide the RF signal between at least one distribution layer feed and at least one radiation element. The array antenna further comprises at least a second waveguide (130) connected to at least one distribution layer feed (121). Any of the first (122) and the second (130) waveguides comprises plastics with a first type of surface treatment (313), where the first type of surface treatment comprising metallization. At least one radiation element is a dummy element terminated by an attenuation section, where the attenuation section is arranged on any of the waveguides (122, 130) connected to the dummy element and that comprises plastics. The attenuation section comprises a second type of surface treatment (314) arranged to attenuate the RF signal.

An electronic device is provided. The electronic device includes a first housing comprising a first space and comprising a conductive portion, a second housing comprising a second space and slidably coupled to the first housing, a flexible display disposed to be supported by the first housing and the second housing and having a display area expanding when being transitioned from a slide-in state to a slide-out state, and a wireless communication circuit disposed in the first space and configured to transmit or receive a wireless signal in a designated frequency band via the conductive portion, wherein the electronic device comprises a conductive stub disposed in the second housing and disposed to be connectable through capacitive coupling to at least a part of the conductive portion in the slide-in state.

Power-combining devices and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and / or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and / or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and / or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and / or various combinations thereof.

An FPC cable is provided that includes a first ground trace on a first side of an insulator substrate and a second ground trace on the first side of the insulator substrate spaced from the first ground trace. A plurality of signal lines are located between the first ground trace and the second ground trace. A ground reference layer is located on a second side of the insulator substrate, with the ground reference layer comprising a plurality of ground reference layer segments spaced from one another. Each of the ground reference layer segments is connected with a via to the first ground trace and the second ground trace.

A flexible waveguide device, of the bellows type, for guiding a radio frequency signal at a given frequency range. The device includes: a core including outer and inner side walls, the inner walls delimiting a waveguide channel; two fixing flanges connected to or integral with respective ends of the core, and at least one flexible corrugated portion formed on a part of the outer side walls of the core and including a plurality of circumferential ribs adjacent to each other. Each rib is devoid of corrugation along its circumference. Also, a method of manufacturing the flexible waveguide device.

Circuitry is provided that includes a matching circuit, a first mixer coupled to the matching circuit and configured to receive a signal with an oscillation frequency, a second mixer coupled to the matching circuit, a first transmission line path coupled between the matching circuit and an input of the first mixer, and one or more capacitors coupled to the input of the first mixer and configured to reject signals at a harmonic frequency of the oscillation frequency. The wireless circuitry can further include a second transmission line path coupled between the matching circuit and an input of the second mixer. The transmission line path can include a first transmission line for conveying signals between the matching circuit and the first mixer, a second transmission line for conveying signals between the matching circuit and the first mixer, and a floating transmission line interposed between the first and second transmission lines.

Localized heating can be provided using fixed-frequency planar transmission line resonators arranged along a main-line, and tuning an electromagnetic input signal frequency applied to the main line to selectively address and energize one or more planar resonators for also addressing and energizing one or more correspondingly located active substrate transducer heat sources for depositing heat in an adjacent active substrate. More generally, adjusting input signal frequency to select one or more planar resonators arranged along a main line can be used to selectively address and energize an electromagnetic-to-heat, an electromagnetic-to-vibration, or other transducer to controllably direct energy toward a desired transducer load.

An electronic device may include signal transmission circuitry having a signal path and a signal source that transmits a signal on the signal path. First and second signal couplers may be coupled to the signal path. Control circuitry may use the first signal coupler to measure the signal at a first reference plane and may use the second signal coupler to concurrently measure the signal at a second reference plane. The signal measurements may include power wave, forward wave, reverse wave, impedance, and / or delivered power measurements. Terminations in the signal couplers may be adjusted to dynamically shift the reference planes. The first and second signal couplers may be formed from first and third metallization layers on a stacked dielectric substrate, where the signal path is formed from a second metallization layer. Additional signal couplers may be coupled to the signal path for concurrently measuring additional reference planes.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

The embodiment of the invention relates to the technical field of communication, and discloses a radar antenna and an automobile intelligent driving system.The radar antenna comprises a substrate, an electromagnetic band gap structure layer, a ridge waveguide transmission structure and an antenna radiation layer, the electromagnetic band gap structure layer is provided with a pin unit, and the pin unit forms an electromagnetic shielding area; the ridge waveguide transmission structure is arranged in the electromagnetic band gap structure layer, one end of the ridge waveguide transmission structure is connected with a chip interface, the other end of the ridge waveguide transmission structure is connected with the antenna radiation layer, and the antenna radiation layer comprises a plurality of slot antennas arranged in the longitudinal direction and a plurality of choke groove assemblies. One choke groove assembly is adjacent to one slot antenna, and the electromagnetic band gap structure layer is connected with the antenna radiation layer to form a gap waveguide transmission channel. By means of the mode, electromagnetic connection between the layers can be achieved without a welding process, and the influence of welding quality difference on the antenna performance is avoided.

An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and / or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

A system for efficiently generating or originating a tailored electromagnetic (EM) wave having a lower velocity than the speed of electromagnetic waves in free space includes a coaxial waveguide which extends linearly and a sinewave current generator. The coaxial waveguide includes a tubular outer body and a tailored emitting antenna disposed coaxially within the tubular outer body. The tubular outer body is formed of a first conductive material and defines a space therein which may be maintained as vacuum. The tailored emitting antenna is constructed physically and electrically by at least three phase-shifted sub-antennas connected in series, each of the sub-antennas being formed of a second conductive material which is less conductive than the first conductive material. The sinewave current generator generates multiple phase-shifted sinewave currents which are respectively input to the sub-antennas.

To provide a converter that can couple a derivative waveguide to a coaxial wire with low loss.SOLUTION: A converter 10 that electromagnetically couples a dielectric waveguide 3 and a coaxial line 2 comprises a shaft-shaped waveguide member 7 made of a dielectric and having a conical shaped part 71 at one end portion in an axial direction, a taper slot antenna 6 disposed to face a conical surface 71a of the conical shaped part 71, a housing 4 that accommodates the waveguide member 7 and the taper slot antenna 6, and a support member 8 that supports the waveguide member 7 with respect to the housing 4, wherein the coaxial line 2 is connected to the taper slot antenna 6 and the dielectric waveguide 3 is connected to the waveguide member 7. The support member 8 contacts a part in a circumferential direction of an outer peripheral surface 7a of the waveguide member 7 to support the waveguide member 7 with respect to the housing 4, and a gap is formed between another part in the circumferential direction of the outer peripheral surface 7a of the waveguide member 7 that is not contacted by the support member 8 and an inner surface 4a of the housing 4.SELECTED DRAWING: Figure 6

A microwave component (40), said component comprising: - at least one waveguide (42) comprising a propagation zone (48) of an electromagnetic wave, said propagation zone extending along a propagation axis; - a support substrate (44) of dielectric material adapted to ensure the mechanical rigidity of said component; - said support substrate comprising a first layer made of dielectric material having a first upper electrically conductive surface (44.1) and a first lower electrically conductive surface (44.2) respectively covering an upper and a lower face of said support substrate; - at least one absorption zone (47) extending into the support substrate to guide the propagation of electromagnetic waves from said waveguide into the substrate in order to absorb or attenuate the energy of the waves, said absorption zone being delimited by the first upper electrically conductive surface (44.1), the first lower electrically conductive surface (44.2) and two spaced lateral boundaries (46) designed to prevent the passage of an electromagnetic wave; - a feed element (49.1, 49.2) positioned at the entrance of said absorption zone (47) and configured to take at least a portion of the electromagnetic wave from said propagation zone (48) of said at least one waveguide and inject it into said absorption zone (47). Abstract figure: Figure 5.

The utility model belongs to the technical field of wires and cables, and particularly relates to a longitudinal water-blocking radio frequency coaxial cable, which comprises an inner conductor, an insulating layer, a shielding layer and a sheath layer which are sequentially sleeved from inside to outside, the inner conductor, the insulating layer, the shielding layer and the sheath layer are coaxially arranged, and a first bonding layer is arranged between the inner conductor and the insulating layer; a second bonding layer is arranged between the insulating layer and the shielding layer; and a third bonding layer is arranged between the shielding layer and the sheath layer. According to the utility model, the inner conductor, the insulating layer, the shielding layer and the sheath layer are bonded pairwise through the bonding layer, air gaps do not exist, liquid such as water vapor, moisture and water can be effectively prevented from further diffusing into the cable after the liquid exists, longitudinal sealing and water blocking are realized, and the service life of the cable is prolonged. And the whole cable is prevented from penetrating and influencing the quality and performance indexes of the whole cable.

To provide a spin wave excitation detection structure that has a high strength structure, a high spin wave intensity that can be excited, and a wide frequency bandwidth of the spin wave that can be excited.SOLUTION: A spin wave excitation detection structure that excites and detects spin waves includes a support substrate, a conductive film provided on the support substrate, an insulating magnetic film provided on the conductor film, and a conductor wire provided on the insulating magnetic film.SELECTED DRAWING: Figure 1

Disclosed is a filter for a communication device. According to an embodiment of the present disclosure, provided is a filter for a communication device, comprising: a housing including a cavity for frequency filtering; and at least one connector that inputs an electrical signal to the cavity or outputs the electrical signal input to the cavity to the outside of the cavity and that is disposed integrally with the filter housing, wherein the filter housing is formed by folding at least a portion of a main plate composed of a conductive plate.

A wiring board includes a base body, a signal line located at the base body, and a waveguide of a waveguide-type located at the base body. The signal line includes a first end part that is one end of the signal line in a signal transmission direction. The waveguide includes a second end part that is one end of the waveguide in the signal transmission direction, a center part in the signal transmission direction, and an intermediate part on a side of the second end part closer to the center part. The first end part and the second end part are coupled to one another. A width of the waveguide at the second end part is wider than a width of the waveguide at the intermediate part.

A circuit-board interposer includes contacts on a top surface and a bottom surface and includes a millimeter-wave coaxial transition structure formed using contacts on the top surface and vias extending into the interposer. A first via extends into the interposer to a first depth and is surrounded by additional vias that penetrate the interposer to a second depth smaller than the first depth. The interposer also includes a hollow conductive waveguide structure formed within the interposer that extends from the second depth to a third depth that has a first end and a second end. The first via extends into the waveguide at the first end and an aperture is present at the second end. The coaxial transition and the waveguide together are configured to couple millimeter-wave energy from a feed contact on the top surface of the interposer and direct it to the aperture.

An ultra-wideband hybrid structure (100) for transmitting high-frequency electrical signals, the structure comprising a substrate (110), a high-speed semiconductor substrate (105) connected to the substrate (110) of the ultra-wideband structure (100), a conductive interface (115) established between the substrate (110) and the high-speed semiconductor substrate (105), an ultrahigh speed device defining a first access port (P1) and established on the high-speed semiconductor substrate (105), a dielectric waveguide structure (DRW) defining a second access port (P2), the structure (DRW) established on the substrate (110) and on the high-speed semiconductor substrate (105), the structure (DRW) comprises a tapered end connectable to the first access port (P1) of the ultrahigh speed device, a metal waveguide structure (TSA) providing a low-pass characteristic interconnection, the structure (TSA) established on the substrate (110) and on the high-speed semiconductor substrate (105), wherein the metal waveguide structure (TSA) comprises a metal waveguide pattern defining a tapered coupler connected to the access port (P1) of the high-speed circuit or component.

There is provided improved grounding for a co-planar waveguide in a superconducting chip An arrangement for a superconducting chip comprises a first substrate (102) that comprises a first conductive surface layer (106), a second substrate (104) comprising at least one conductive surface layer, and a co-planar waveguide comprising a signal line on the first substrate (102), wherein the first conductive surface layer of the first substrate (102) and the at least one conductive surface layer of the second substrate (104) are connected by bonding elements that extend in a direction that is perpendicular to a longitudinal direction of the signal line and the superconducting chip is configured to distribute coupling of the signal line to the ground the at least one conductive surface layer of the second substrate (104), the bonding elements and at least one of the following: the first conductive surface layer (108) of the first substrate (104) which is separated by a dielectric material from the signal line (116) above; or a second conductive surface layer (110) of the first substrate (104) on an opposite side of the first substrate (104) than the signal line (116).