748results about "Waveguides" patented technology

A device useful as a switch including an input waveguide coupled to an output waveguide; a first diode circuit integrated with the input waveguide at a first termination; a second diode circuit integrated with the output waveguide at a second termination; and wherein the biasing the diode circuits switches the switch between an off state and an on state and achieves high isolation in the off state by absorbing input power in, reflecting the input power from, and frequency multiplying the input power using the diodes in the diodes circuits when the input power is received from the input waveguide. In one embodiment, the switch is a tunable, solid-state SPST switch for Gband radar applications.

A waveguide to transmission line coupler is provided. The waveguide can be capable of guiding electromagnetic energy and can have a plurality of coupling sets along the waveguide. The coupling set can include a non-resonant coupling aperture capable of coupling said electromagnetic energy from the waveguide to at least one output transmission line and a tuning element in the waveguide proximate to said non-resonant coupling aperture thereto, capable of tuning out residual shunt susceptance corresponding to the electromagnetic energy coupled by said non-resonant coupling aperture.

An array antenna (100) having a layered configuration. The array antenna comprises a radiation layer (110) comprising a plurality of radiation elements (111) and a distribution layer (120) facing the radiation layer. The distribution layer is arranged to distribute a radio frequency, RF, signal to the plurality of radiation elements. The distribution layer comprises at least one distribution layer feed (121) and at least one first waveguide (122) arranged to guide the RF signal between at least one distribution layer feed and at least one radiation element. The array antenna further comprises at least a second waveguide (130) connected to at least one distribution layer feed (121). Any of the first (122) and the second (130) waveguides comprises plastics with a first type of surface treatment (313), where the first type of surface treatment comprising metallization. At least one radiation element is a dummy element terminated by an attenuation section, where the attenuation section is arranged on any of the waveguides (122, 130) connected to the dummy element and that comprises plastics. The attenuation section comprises a second type of surface treatment (314) arranged to attenuate the RF signal.

Circuitry is provided that includes a matching circuit, a first mixer coupled to the matching circuit and configured to receive a signal with an oscillation frequency, a second mixer coupled to the matching circuit, a first transmission line path coupled between the matching circuit and an input of the first mixer, and one or more capacitors coupled to the input of the first mixer and configured to reject signals at a harmonic frequency of the oscillation frequency. The wireless circuitry can further include a second transmission line path coupled between the matching circuit and an input of the second mixer. The transmission line path can include a first transmission line for conveying signals between the matching circuit and the first mixer, a second transmission line for conveying signals between the matching circuit and the first mixer, and a floating transmission line interposed between the first and second transmission lines.

An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

The embodiment of the invention relates to the technical field of communication, and discloses a radar antenna and an automobile intelligent driving system.The radar antenna comprises a substrate, an electromagnetic band gap structure layer, a ridge waveguide transmission structure and an antenna radiation layer, the electromagnetic band gap structure layer is provided with a pin unit, and the pin unit forms an electromagnetic shielding area; the ridge waveguide transmission structure is arranged in the electromagnetic band gap structure layer, one end of the ridge waveguide transmission structure is connected with a chip interface, the other end of the ridge waveguide transmission structure is connected with the antenna radiation layer, and the antenna radiation layer comprises a plurality of slot antennas arranged in the longitudinal direction and a plurality of choke groove assemblies. One choke groove assembly is adjacent to one slot antenna, and the electromagnetic band gap structure layer is connected with the antenna radiation layer to form a gap waveguide transmission channel. By means of the mode, electromagnetic connection between the layers can be achieved without a welding process, and the influence of welding quality difference on the antenna performance is avoided.

To provide a spin wave excitation detection structure that has a high strength structure, a high spin wave intensity that can be excited, and a wide frequency bandwidth of the spin wave that can be excited.SOLUTION: A spin wave excitation detection structure that excites and detects spin waves includes a support substrate, a conductive film provided on the support substrate, an insulating magnetic film provided on the conductor film, and a conductor wire provided on the insulating magnetic film.SELECTED DRAWING: Figure 1

Disclosed is a filter for a communication device. According to an embodiment of the present disclosure, provided is a filter for a communication device, comprising: a housing including a cavity for frequency filtering; and at least one connector that inputs an electrical signal to the cavity or outputs the electrical signal input to the cavity to the outside of the cavity and that is disposed integrally with the filter housing, wherein the filter housing is formed by folding at least a portion of a main plate composed of a conductive plate.

A wiring board includes a base body, a signal line located at the base body, and a waveguide of a waveguide-type located at the base body. The signal line includes a first end part that is one end of the signal line in a signal transmission direction. The waveguide includes a second end part that is one end of the waveguide in the signal transmission direction, a center part in the signal transmission direction, and an intermediate part on a side of the second end part closer to the center part. The first end part and the second end part are coupled to one another. A width of the waveguide at the second end part is wider than a width of the waveguide at the intermediate part.

There is provided improved grounding for a co-planar waveguide in a superconducting chip An arrangement for a superconducting chip comprises a first substrate (102) that comprises a first conductive surface layer (106), a second substrate (104) comprising at least one conductive surface layer, and a co-planar waveguide comprising a signal line on the first substrate (102), wherein the first conductive surface layer of the first substrate (102) and the at least one conductive surface layer of the second substrate (104) are connected by bonding elements that extend in a direction that is perpendicular to a longitudinal direction of the signal line and the superconducting chip is configured to distribute coupling of the signal line to the ground the at least one conductive surface layer of the second substrate (104), the bonding elements and at least one of the following: the first conductive surface layer (108) of the first substrate (104) which is separated by a dielectric material from the signal line (116) above; or a second conductive surface layer (110) of the first substrate (104) on an opposite side of the first substrate (104) than the signal line (116).

A transmission component is provided. The transmission component includes a flexible printed circuit board including a first signal transmission section, a second signal transmission section, and a signal transmission route changing section, a first signal line provided on a first surface of the flexible printed circuit board, a first ground provided on a second surface of the flexible printed circuit board, a second signal line provided on the first surface of the flexible printed circuit board, a third signal line provided on the second surface of the flexible printed circuit board, a fourth signal line provided on the second surface of the flexible printed circuit board, and a second ground provided on the first surface of the flexible printed circuit board.

The present disclosure relates to a waveguide transition arrangement (300, 700) for coupling a signal between a transmission line (120, 320) and a waveguide aperture (112, 312, 712) The transition arrangement (300) comprises - an electrically conductive backshort (319, 719), - a first layer structure (103, 703) comprising a first dielectric carrier material (104) and a first metallization layer (105), and - a second layer structure (106, 306, 706) comprising a second dielectric carrier material (107, 307), a second metallization layer (108, 308), a trench (109, 309, 709) provided with electrically conductive trench walls (110, 111; 318), and a waveguide aperture (112, 312, 712) that is connected to the trench (109, 309, 709), comprises electrically conductive inner waveguide walls (321), and defines a waveguide that has a signal propagation extension (E) into the second layer structure (106, 306, 706). The first metallization layer (105) comprises a probe (116, 116A), a first signal conductor (113, 133A), and a pair of beamlead conductors (114A, 114B) on each side of the first signal conductor (113, 113A) and an end of the first signal conductor (113, 133A) is connected to the probe (116, 116A). The second metallization layer (108, 308) comprises trench side conductors (115A, 115B; 315A, 315B) on opposite sides along the trench (109, 309, 709), and an aperture conductor (117, 317) that partially circumvents the waveguide aperture (112, 312, 712). The beamlead conductors (114A, 114B) are connected to the respective trench side conductors (115A, 115B; 315A, 315B) such that the first signal conductor (113, 113A) runs along to the trench (109, 309, 709), and the probe (116, 116A) can couple the signal between the transmission line and a waveguide.

To provide a connection structure and waveguide that can improve characteristics. [Solution] According to the embodiment, the connection structure is provided between the first and second resonant parts. The connection structure includes a first structure. The first structure includes first and second conductive pillars, a first stripline, and a first partial conductive layer. The first conductive pillar includes a first part and a first other part and is oriented in a first direction. The second conductive pillar includes a second part and a second other part and is oriented in a first direction. The second direction from the second conductive pillar to the first conductive pillar intersects with the first direction. The direction from the first resonant part to the second resonant part is oriented in a second direction. The first stripline is electrically connected to the first other part and the second other part and is oriented in a second direction. The first partial conductive layer is electrically connected to the first part and the second part.

Coaxial interconnects formed by additive manufacturing. In one example, a method of electrically connecting an integrated circuit chip to an off-chip radio frequency (RF) waveguide includes providing an integration substrate having the integrated circuit chip and the RF waveguide mounted thereon, and printing, using an additive manufacturing apparatus, a coaxial interconnect extending between a plurality of first metal contact regions on the integrated circuit chip and a plurality of second metal contact regions on the RF waveguide, the coaxial interconnect including a metal core and a metal shield at least partially surrounding the metal core and arranged to be coaxial with the metal core.

Provided herein are high energy ion beam generator systems and methods that provide low cost, high performance, robust, consistent, uniform, low gas consumption and high current / high-moderate voltage generation of neutrons and protons. Such systems and methods find use for the commercial-scale generation of neutrons and protons for a wide variety of research, medical, security, and industrial processes.

The invention provides a radio frequency signal transmission delay adjusting device, which is characterized by comprising a first outer conductor, a second outer conductor, a first inner conductor and a second inner conductor which are coaxially arranged, the first inner conductor comprises a first step section and a second step section in the axial direction, the first step section is arranged in the first outer conductor, and the second step section is arranged in the second outer conductor; the second outer conductor internally comprises a first inner cavity and a second inner cavity along the axial direction, the first outer conductor is inserted in the first inner cavity, and the second inner conductor is arranged in the second inner cavity; one end, close to the first outer conductor, of the second inner conductor comprises a containing cavity extending in the axial direction, and at least part of the second step section is arranged in the containing cavity in a penetrating mode; an adjusting section is arranged between the end, located in the first inner cavity, of the first outer conductor and the end, close to the first inner cavity, of the second inner cavity, the first outer conductor can drive the first inner conductor to move in the axial direction relative to the second outer conductor, the length, penetrating through the containing cavity, of the second step section is changed, and therefore the length of the adjusting section is adjusted.

A probe for monitoring stents comprising: a first coupling port to launch an electromagnetic field onto a stent, such that a guided electromagnetic wave may be propagated through at least a portion of the stent; and a second coupling port to collect the electromagnetic field from the guided electromagnetic wave of the stent. Also provided is a system comprising the probe, and a method for monitoring stents comprising: sensing an input signal related to an electromagnetic field launched by the first coupling port onto the stent, and sensing an output signal related to the electromagnetic field collected by the second coupling port; obtaining a transmission coefficient between the first coupling port and the second coupling port; performing a frequency response of the transmission coefficient; and comparing the frequency response of the transmission coefficient with a reference frequency response.

Devices including a substrate structure with laterally offset ground vias and metal balls are provided. A device may include a substrate, a plurality of first ground vias, and a plurality of first metal balls. The plurality of first ground vias may be formed within the substrate and surrounding a plurality of signal vias. The plurality of first metal balls may be disposed on the substrate and electrically coupled to the plurality of first ground vias. One first metal ball may be electrically coupled to one first ground via. A part of the plurality of first ground vias may be laterally offset from a corresponding part of the plurality of first metal balls along a direction orthogonal to the substrate.

A waveguide with a curved-wall low-pass filter is described herein. The waveguide comprises a low-pass filter portion configured to allow low-frequency electromagnetic energy therethrough and reject high-frequency electromagnetic energy. The low-pass filter portion comprises an input port, an output port, and a cavity feature that is formed between the input port and the output port. The cavity feature has a greater depth than respective depths of the input port and the output port. The cavity feature comprises a bottom wall that achieves the greater depth for the cavity feature. The bottom wall comprises at least one curved portion configured to allow the cavity feature to achieve the allowance of the low-frequency electromagnetic energy and the rejection of the high-frequency electromagnetic energy. The cavity feature may allow the waveguide to have as good or better performance than traditional means while being easier to manufacture and / or taking up less space.

To provide a transmission line for pulse formation, a pulse forming circuit using the transmission line, and a pulse power supply device capable of further promoting miniaturization.SOLUTION: In the container, the flat plate conductor forming the first surface of the container, the first line conductor, and the first flat plate conductor form a first parallel line, the first flat plate conductor, the second line conductor, and the second flat plate conductor form a second parallel line, the second flat plate conductor, the third line conductor, and the flat plate conductor forming the third surface of the container form a third parallel line, and each line conductor faces the parallel conductor via the insulating fluid; The first and second line conductors and the second and third line conductors are connected by first and second connection conductors, one end of the first line conductor is connected to a signal input portion provided on the third surface of the container via a tapered connection portion, and the third line conductor is connected to a signal output portion provided on the third surface of the container via a tapered connection portion. The first and second flat conductors are connected to at least one of the fifth surface and the sixth surface (conductors) of the container, and the signal input portion and the signal output portion of the third surface are disposed at predetermined positions where creepage distances are ensured.SELECTED DRAWING: Figure 1

Disclosed in the present invention are a gap waveguide transmission device based on spoof surface plasmon polaritons and a manufacturing method therefor. The device comprises two waveguide transmission structures arranged opposite each other, wherein the two waveguide transmission structures enclose a transmission channel; a gap is provided between joining surfaces of the two waveguide transmission structures; an electrically conductive layer is provided on the inner wall of the transmission channel; corrugated grooves are provided on the outer periphery of the side wall of the transmission channel where the gap is provided; the surface of each corrugated groove facing the outer side of the side wall has protrusions and recesses arranged at periodic or quasi-periodic intervals; and an electrically conductive layer is provided on the surfaces of the protrusions and recesses of the corrugated grooves, and the electrically conductive layer is electrically connected to the electrically conductive layer on the inner wall of the transmission channel. In the present invention, by means of the provision of the corrugated grooves, when there is a gap between a first waveguide transmission structure and a second waveguide transmission structure, electromagnetic energy is confined around the corrugated grooves, thereby ensuring that the electromagnetic energy can be completely transmitted in a desired direction.

communication system arranged in a housing and comprising several communication devices (2, 4) that communicate wirelessly with each other, wherein - the multiple communication devices include a specific communication device that is arranged on a mounting surface (501); - the specific communication device has at least one antenna structure, and the at least one antenna structure contains at least one antenna (21, 41); - the at least one antenna structure is arranged between the mounting surface and a predetermined wall surface (301) of the enclosure (200), and the predetermined wall surface is one of the wall surfaces of the enclosure; - which has at least one antenna structure with an outer shell; - a gap between the outer shell of the at least one antenna structure and the predetermined wall surface of the housing is smaller than a wavelength of a radio wave used in the wireless communication of the multiple communication devices; and - the at least one antenna of the specific communication device has a directional effect in a direction parallel to the mounting surface.

The invention provides a leakage cable for suppressing a high-order mode based on symmetrical slotted holes, which comprises an inner conductor, an insulating layer, a conductor layer and an outer ring sleeve which are sequentially and coaxially nested from inside to outside, and is characterized in that a plurality of slotted hole groups are formed in the conductor layer and are distributed along the circumferential direction of the conductor layer; each slotted hole group comprises a plurality of slotted hole arrays which are arranged at intervals in the axial direction of the conductor layer, each slotted hole array comprises a plurality of >-shaped first slotted holes and a plurality of <-shaped second slotted holes, and each first slotted hole and each second slotted hole are respectively composed of two rectangular grooves. By applying the technical scheme of the invention, the problems of high-frequency attenuation and unstable signal transmission of a leaky cable in a high-frequency band in the prior art are solved.

The application discloses a metal sheet integrated waveguide structure which is a full-metal structure and is formed by stacking at least three metal substrates arranged from bottom to top, wherein air cavities filled with air are formed on at least one internal metal substrate by cutting off parts, and the metal substrates are connected to form a self-encapsulated structure. The metal sheet integrated waveguide structure technology can generate a multi-layer self-encapsulated structure, and independent circuit design can be performed on each layer to realize high-performance radio frequency, microwave and terahertz electricity; the full-metal integrated platform can fully utilize the low-loss and high-Q characteristics of the metal structure, and can create a circuit structure with good electromagnetic shielding and excellent heat dissipation performance.

According to one embodiment, a transmission line includes first and second conductive lines, first and second conductive layers and a first conductive member. At least a part of the first conductive line extends in a first direction. The second conductive line is electrically connected to the first conductive line. At least a part of the second conductive line extends along the first direction. The second conductive layer is electrically connected to the first conductive layer. The second conductive layer includes a first partial region, a second partial region, and a third partial region. A direction from the first partial region to the third partial region and a direction from the second partial region to the third partial region are along the first direction. The second conductive line is between the first conductive layer and the third partial region in a second direction crossing the first direction.

A high-frequency transmission element is provided. The high-frequency transmission element includes a connecting wire structure and an impedance matching plate structure. The connecting wire structure includes a connecting wire and a connecting pad. The connecting pad is located at an end of the connecting wire. The impedance matching plate structure includes an impedance matching plate body, an opening, and an impedance matching portion. The connecting pad is located in a projection range of the opening in a direction of orthographic projection of the impedance matching plate structure. The impedance matching portion is located in a periphery of the opening and extends in the direction from the connecting wire towards the connecting pad.

An antenna module comprises: a waveguide having an opening region; a transmission line comprising a signal pattern, a first ground pattern, and a second opening region; a conductive surface having a plurality of conductive patterns arranged in one axial direction and the other axial direction; and a via structure for perpendicularly connecting a second ground pattern and the plurality of conductive patterns of the conductive surface. A first length in one axial direction of a region where the conductive surface is arranged may be formed so as to be at least two times longer than a second length in one axial direction of the opening region. A first width in the other axial direction of the region where the conductive surface is arranged may be formed so as to be at least two times wider than a second width in the other axial direction of the opening region.

This transmission line (101) is provided with a laminate comprising: a plurality of laminated insulator layers (11, 12, 13); and a conductor layer joined to a surface along the insulator layers (11, 13). The conductor layer includes a reference ground conductor layer (21) and a signal line conductor layer (23) overlapping the reference ground conductor layer (21) when the laminate is viewed in the lamination direction. The laminate has a recess (RC) that is recessed in the lamination direction, and when the laminate is viewed in the lamination direction, the signal line conductor layer (23) is disposed at a position overlapping the recess (RC).

The present invention relates to a waveguide (1) consisting of two waveguide parts (11, 12). Each waveguide part (11, 12) has a waveguide body (111, 121) and at least one waveguide channel (10) portion (110, 120), the portions (110, 120) being arranged so that, when the two waveguide parts (11, 12) are joined, they form at least one waveguide channel (10). The opposing surfaces (112, 122) of the two waveguide parts are formed parallel to each other. Recesses (2, 23-26) are formed in the sidewalls (114, 124) of the waveguide channel (10). The width (b) and height (h) of the recesses (2, 23-26) are substantially smaller than half the wavelength of the signal for which the at least one waveguide channel (10) is designed.

The present invention relates to a microwave heat treatment apparatus capable of uniformly heating a semiconductor substrate by forming a dielectric material inside a waveguide and transmitting microwaves into a processing chamber through the dielectric material, and is characterized by comprising: a processing chamber having a predetermined space inside; a microwave generating unit installed outside the processing chamber and generating microwaves; and a waveguide having one end connected to the microwave generating unit and the other end inserted into the processing chamber, with at least one slot provided on one side of the portion inserted into the processing chamber, which transmits microwaves generated by the microwave generating unit into the processing chamber through the dielectric material formed in the internal space and at least one of the slot, thereby heating a substrate placed in the processing chamber.