2755results about "Waveguides" patented technology

The invention relates to a vehicle-mounted radar waveguide antenna structure, which is a waveguide processing piece formed by splicing an upper waveguide processing piece (51) and a lower waveguide processing piece (52) up and down, a first waveguide transmission cavity (1), a waveguide antenna cavity structure, an electromagnetic band gap structure (3) and an electromagnetic band gap avoiding area (4) are arranged in the upper waveguide machining part (51) and the lower waveguide machining part (52). Compared with a conventionally-designed terminal open-circuit waveguide antenna, the vehicle-mounted radar waveguide antenna structure has the advantages that splicing of two layers of waveguide pieces can be achieved, complex waveguide structures are horizontally laid through reasonable design, the distribution characteristics are simplified as much as possible while splicing of the two layers of waveguide pieces is achieved, the machining difficulty is greatly reduced, and the cost is reduced. The cost is reduced while the performance of the commercial vehicle-mounted radar is improved, and the influence of waveguide piece machining errors on the performance can be reduced while the wide impedance bandwidth is kept.

A waveguide antenna system, includes: an electromagnetic, EM, transition portion having a transition region having a signal feed interface and an open waveguide section, the EM transition portion configured to couple EM energy from the signal feed interface to a guided waveguide mode of EM energy to the open waveguide section via the transition region; and a leaky waveguide antenna portion configured and disposed to radiate electromagnetic energy received from the open waveguide section; wherein the EM transition portion is electromagnetically coupled to the leaky waveguide antenna portion, the EM transition portion being configured to support a transfer of electromagnetic energy from a signal feed structure to the leaky waveguide antenna portion.

A packaged RF transistor amplifier includes an RF transistor amplifier die having a first terminal, a first lead, an integrated passive device that includes a first series microstrip transmission line, a first bond wire coupled between the first terminal and the first series microstrip transmission line, and a second bond wire coupled between the first series microstrip transmission line and the first lead.

The invention discloses a high-power fast phase inversion switch based on a p-i-n diode, and relates to the technical field of high-power microwave p-i-n diode phase shifting. The inverter switch comprises a rectangular waveguide, 2N loading linear p-i-n diode phase shift circuits which are symmetrically and uniformly arranged on a narrow-side waveguide wall, and a bias power supply which provides bias voltage for the phase shift circuits. According to the invention, the loading line type p-i-n diode phase shift circuit is inserted into the waveguide structure, so that a microwave signal is transmitted along the waveguide transmission line instead of being transmitted along the metal microstrip line, the influence of the power loss of the p-i-n diode on the insertion loss of the phase shift circuit can be reduced, and the overall insertion loss is reduced; and meanwhile, phase inversion is realized by controlling the bias state of a p-i-n diode in the phase shift circuit, and nanosecond switching speed can be realized.

The invention discloses a negative group delay system based on SSPP, and belongs to the technical field of microwave communication. A fundamental mode negative group velocity is innovatively generated based on an artificial surface plasmon SSPP, and an SSPP system with negative group delay is realized. The system comprises two parts, namely an amplifier circuit and an SSPP waveguide with a negative group delay unit. The SSPP waveguide with the negative group delay characteristic comprises two coplanar waveguide parts, two transition parts and an SSPP waveguide part, the SSPP waveguide part comprises a unit for generating negative group velocity and a plurality of basic units, and further comprises a microwave dielectric substrate. The amplifier is composed of an amplifier chip, a peripheral capacitor inductor of the amplifier chip and a direct-current power supply. An input signal passes through the system, and advanced transmission of the signal can be realized. The problems of narrow bandwidth, large loss and non-adjustable structure in the prior art are effectively solved, and the antenna has wide application prospects in the fields of 5G communication, radar signal processing, array antenna systems and the like.

A vehicle comprises: vehicular glass including a transparent region and an opaque region; a transparent dielectric substrate disposed in the transparent region of the vehicular glass; a first area including an antenna on one side surface of the transparent dielectric substrate; and a second area including a power supply pattern and a ground conductive pattern electrically connected to the antenna. The antenna may comprise: a first slot formed between a signal pattern and a first ground pattern and configured to radiate a first signal having a circularly polarized wave in a first frequency band; and a second slot formed between the first ground pattern and a second ground pattern and configured to radiate a second signal having a circularly polarized wave in a second frequency band lower than the first frequency band.

The invention belongs to the field of wireless communication, and particularly relates to a low-loss leaky coaxial cable and a manufacturing method thereof. The leaky coaxial cable comprises an inner conductor, a composite insulating layer, an outer conductor and a sheath layer which are coaxially arranged in sequence, and each layer forms a concentric cylindrical structure by taking an axis as a center. The outer surface of the inner conductor and the outer surface of the outer conductor of the leaky coaxial cable are respectively roughened, so that the contact between the inner conductor and the insulating layer and the contact between the outer conductor and the sheath layer are improved, meanwhile, a solid inner skin layer originally used for bonding the inner conductor and the insulating layer is omitted, the signal transmission performance is improved, and the service life of the leaky coaxial cable is prolonged. And the transmission loss is reduced. Compared with an existing product, the leaky coaxial cable with the surfaces of the inner conductor and the outer conductor, provided by the invention, has the advantages that the attenuation index is integrally optimized by 2.6%-5.8% under multiple frequency bands of 900 MHz to 2700 MHz on the premise of meeting the test requirements of adhesive force, standing wave and insulating dielectric strength between the insulating layer and the inner conductor.

The invention discloses a conversion device for packaging a chip into a waveguide, a radio frequency device and a radar device. The conversion device is a transition structure for packaging the chip into the waveguide, which is simple in structure, low in loss and wide in impedance bandwidth. A conventional E-shaped patch conversion device has a gap, and the processing error of the gap can cause the problem of frequency offset. The conversion device has the characteristic of a wider band under the condition that the characteristic of low loss is guaranteed, RF performance deterioration caused by the design of a too narrow gap and gap processing errors is avoided, and the RF performance of a transition structure from chip packaging to waveguide is guaranteed.

A transmission coating for a waveguide is formed with multiple layers. There are steps of a) determining a first coating parameter and a coating function for each layer -3000, b) forming the multiple

The invention discloses a differential signal transmission link, a high-speed differential signal transmission composite chip and an intra-core differential signal transmission link configuration method. A strip line is arranged in a perforated cylinder in a penetrating manner, two differential microstrip lines are horizontally arranged at two ends of the perforated cylinder, one end of one differential microstrip line is connected with the upper end of the strip line, and one end of the other differential microstrip line is connected with the lower end of the strip line; the conductor strip and the two grounding strips in each differential microstrip line are arranged on the total slide glass side by side in the length direction of the total slide glass, the conductor strip is arranged between the two grounding strips, and the multiple capacitors and the multiple inductors are alternately arranged on the conductor strip in the length direction of one side of the conductor strip. The plurality of conductive blocks are uniformly arranged on the conductor belt along the length direction of the other side of the conductor belt; a high-bandwidth storage chip and a GPU chip in the high-speed differential signal transmission composite chip are horizontally arranged on a PCB composite board in parallel, and a differential signal transmission system is arranged among the PCB composite board, the high-bandwidth storage chip and the GPU chip in a penetrating mode.

The utility model discloses a millimeter wave chip packaging structure based on a substrate integrated waveguide and an artificial magnetic conductor, which relates to the technical field of millimeter wave chip packaging, and comprises a chip, a cover plate and a base, the cover plate is in sealing fit with the base, the chip is arranged in the base, and the cover plate comprises a metal flat plate and a plurality of metal columns connected below the metal flat plate and distributed in an array. The metal column is not contacted with the base; the base comprises a frame, an SIW substrate, a direct current feed terminal and a heat sink, a first groove is formed in the center of the upper surface of the heat sink, and second grooves are formed in the two sides of the first groove and communicated with the first groove. According to the utility model, the SIW substrate is adopted to replace a traditional strip line terminal to serve as the millimeter wave input end and the millimeter wave output end of the shell, and the conductive materials on the upper surface and the lower surface of the SIW substrate are titanium tungsten / nickel / gold in sequence, so that the structure is simple, the processing technology is simple, the assembly technology is simple, the price is low, and the like; and the cable also has the advantages of wide working frequency band, large bearing power, small reflection loss, small transmission loss and the like, and also has the advantages of static electricity prevention and lightning protection.

To provide a component for millimeter wave communication.SOLUTION: Disclosed herein are a component for millimeter wave communication and a related method and system.SELECTED DRAWING: Figure 5A

A filter device includes a laminate body, plate electrodes, resonators, and shield conductors. The plate electrodes are provided in the laminate body and are spaced apart from each other in a lamination direction. The resonators are between the plate electrodes and extend in a first direction. The shield conductors are on respective side surfaces of the laminate body, and connected to the plate electrodes. The resonators are within the laminate body and aligned in a second direction. The resonators each include a first end connected to the shield conductor and a second end spaced apart from the shield conductor. The resonator includes conductors laminated in the lamination direction. When the resonator is viewed in plan from the first direction, the conductors each include a first region including an end portion of the conductor and having a thickness greater than other portions of the conductor.

The invention belongs to the technical field of wireless communication, and particularly relates to a self-repairing radio frequency coaxial cable, a leaky coaxial cable and a manufacturing method thereof. On the basis of meeting the standard of the communication cable, the technical problems of electrical performance deterioration, reliability reduction and service life reduction caused by micro damage of the foaming insulating layer in the use process of the cable are further solved. Tests show that the self-repairing technology provided by the invention is suitable for a mobile communication radio frequency coaxial cable and a leaky coaxial cable (the frequency range is 0.1 GHz-6 GHz). According to the HLRCTYZ-50-22 leaky coaxial cable in the YD / T2491 standard and the HCTAYZ-50-22 radio frequency coaxial cable in the YD / T1092 standard, when the voltage standing wave ratio is smaller than or equal to 1.20 and the characteristic impedance meets 50 + / -2 ohms, the MTBF (average fault-free time) of the leaky coaxial cable and the HCTAYZ-50-22 radio frequency coaxial cable can be improved by 20%-40% compared with that before improvement.

Disclosed is a packaged semiconductor device comprising a semiconductor die comprising a MMIC having a differential output; a package substrate, comprising first second and third metal layers, and electrically connected to the semiconductor die by a plurality of pillars between the semiconductor die and the first metal layer, wherein the first and third metal layers comprise a ground plane, and the second metal layer, therebetween, comprises a single-ended stripline; wherein the differential output is galvanically connected to the first metal layer by a pair of pillars aligned along a first axis; wherein the packaged semiconductor device comprises a balun coupler between the differential output, and the single-ended stripline aligned along a second axis; wherein the balun coupler comprises an opening in the first metal layer, the opening comprising two arms extending in a first direction parallel to the second axis.

The invention belongs to the technical field of wireless communication, and more particularly relates to a low-loss high-power radio frequency coaxial cable and leaky coaxial cable, the radio frequency coaxial cable comprises an inner conductor, an insulating layer, an outer conductor layer and an outer sheath layer from inside to outside, and by optimizing the structures of the insulating layer and the conductor, the overall thermal resistivity of the cable is improved, and the overall performance of the cable is improved. And the attenuation performance of the cable and the heat resistance in a high-power application scene are improved. Compared with a high-power cable with a conventional structure, the attenuation test value of the radio-frequency coaxial cable under the specification of 3 / 8 inches is optimized by about 15% compared with the requirement on the premise of meeting the 125 DEG C temperature resistance grade; on the premise of meeting the 105 DEG C temperature resistance grade, the attenuation test value of the leaky coaxial cable under the 1 / 2 inch specification is optimized by about 17% compared with the standard requirement.

The present application provides a flexible and deformable curved waveguide tube and satellite communication equipment, which relate to the field of radio frequency communication technology, and solve the problem that the transmission loss of the waveguide in the satellite communication equipment increases due to installation errors, thereby affecting the transmission performance. The flexible and deformable curved waveguide tube of the present application can be respectively connected to the signal output module and the signal input module through the first connector and the second connector thereon. Due to the arrangement of multiple annular grooves thereon, the flexible and deformable curved waveguide tube can be flexibly deformed, thereby adapting to a larger installation error between the signal output module and the signal input module, completing the transmission of the radio frequency signal with lower transmission loss, and thus helping to improve the transmission performance.

Embodiments of this application provide a transmission line, a feed network, and an antenna apparatus. The transmission line is used for a radio frequency device. The transmission line includes a reflector, an insulation support, and a transmission structure. The transmission structure includes at least two side walls. The transmission structure is disposed on a surface of the insulation support, an included angle between two adjacent side walls of the transmission structure is greater than zero, and different side walls of the transmission structure are located on different surfaces of the insulation support. At least one surface of the transmission structure is disposed opposite to a part of a structure of the reflector, and a gap exists between the at least one surface of the transmission structure and the reflector. The transmission line has a small signal loss and occupies a small space.

A waveguide device and related products relate to the technical field of millimeter wave radars. The waveguide device comprises a first waveguide and N electromagnetic band gap units, wherein the N electromagnetic band gap units are located between the first waveguide and the antenna device, the N electromagnetic band gap units are aperiodically arranged around the first waveguide, signal transmission is carried out between the first waveguide and the antenna device, and N is an integer greater than 0. According to the waveguide device, reliable transmission of signals from the waveguide outlet of the radio frequency chip to the waveguide feed port of the antenna device can be realized through a non-periodic electromagnetic band gap unit arrangement form, and the signal transmission performance and the robustness of the waveguide outlet of the radio frequency chip and the waveguide feed port of the antenna device are improved.

An ultra-wideband hybrid structure (100) for transmitting high-frequency electrical signals, the structure comprising a substrate (110), a high-speed semiconductor substrate (105) connected to the substrate (110) of the ultra-wideband structure (100), a conductive interface (115) established between the substrate (110) and the high-speed semiconductor substrate (105), an ultrahigh speed device defining a first access port (P1) and established on the high-speed semiconductor substrate (105), a dielectric waveguide structure (DRW) defining a second access port (P2), the structure (DRW) established on the substrate (110) and on the high-speed semiconductor substrate (105), the structure (DRW) comprises a tapered end connectable to the first access port (P1) of the ultrahigh speed device, a metal waveguide structure (TSA) providing a low-pass characteristic interconnection, the structure (TSA) established on the substrate (110) and on the high-speed semiconductor substrate (105), wherein the metal waveguide structure (TSA) comprises a metal waveguide pattern defining a tapered coupler connected to the access port (P1) of the high-speed circuit or component.

The present invention relates to an antenna device and an electronic device using same, the antenna device having twice as many antennas arranged in the same area so as to be reduced in size by half and be capable of performing high power long-distance transmission. The antenna device according to the present invention comprises: a core printed circuit board having antenna circuits arranged therein; a Yagi-Uda antenna formed on a plurality of printed circuit boards arranged above the core printed circuit board, so as to transmit a single polarization signal; a monopole antenna connected to the Yagi-Uda antenna through a via; and a ground radiation unit arranged below the core printed circuit board so as to be symmetrical to the monopole antenna with respect to the core printed circuit board.

A phased antenna array in a package is provided. The phased array antenna in a package comprises an antenna array with an integrated passive beamformer network, and at least one actuation mechanism. The passive beamformer network comprises at least one phase shifter, and each of the at least one phase shifter comprises a transmission line having a slow-wave structure and a ceramic. Each of the at least one actuation mechanism comprises a magnet and an electromagnet coil, where the magnet is coupled to the ceramic. The at least one actuation mechanism configured to increase or decrease a gap between the transmission line and the ceramic.

Disclosed is a packaged semiconductor device, comprising: a semiconductor die comprising an MMIC, the MMIC having a differential output; a package substrate including a first metal layer, a second metal layer, and a third metal layer, and electrically connected to the semiconductor die through a plurality of pillars between the semiconductor die and the first metal layer, where the first metal layer and the third metal layer include a ground plane, the second metal layer between the first metal layer and the second metal layer comprises a single-ended strip line; wherein the differential output is galvanically connected to the first metal layer through a pair of struts aligned along a first axis; wherein the packaged semiconductor device comprises a balun coupler between the differential output and the single-ended stripline aligned along a second axis; wherein the balun coupler comprises an opening in the first metal layer, the opening comprising two arms extending in a first direction parallel to the second axis.

The invention provides a low-loss temperature-stable microwave composite dielectric material and a preparation method and application thereof. The preparation method comprises the following steps: firstly, uniformly mixing strontium titanate, barium titanate or calcium titanate ceramic particles into polymer resin through ultrasonic and high-speed mechanical stirring treatment to obtain a mixed solution, performing composite molding on a three-dimensional woven spacer fabric serving as a reinforcement and the polymer resin mixed solution, and adjusting the temperature coefficient of resonance frequency of the three-dimensional woven spacer fabric. Therefore, the microwave composite dielectric material with low loss and stable temperature is obtained. The microwave composite dielectric material prepared by the invention has high hollowness, can effectively reduce dielectric loss of the structure, realizes low density, low dielectric constant, low dielectric loss and low resonant frequency temperature coefficient, and can be widely used for manufacturing microwave devices such as resonators, antennas, filters and the like.

The invention provides a high-power amplitude limiting circuit based on a gallium nitride Schottky diode, and relates to the technical field of radio frequency microwave integrated circuits. Comprising an input port of a high-power amplitude limiting circuit, a capacitor C1, a post-start detection network and a pre-stage amplitude limiting network, and the pre-start detection network, a capacitor C2, a post-stage amplitude limiting network, a capacitor C3 and an output port of the high-power amplitude limiting circuit are sequentially connected in series. The front-stage amplitude limiting network comprises a plurality of first PIN diodes which are connected in parallel, the number of the rear-stage amplitude limiting networks is one or more, and the plurality of rear-stage amplitude limiting networks are connected in series; the anodes of the plurality of first PIN diodes are connected with the output end of the post-start detection network and the input end of the pre-start detection network, and the cathodes of the plurality of first PIN diodes are grounded. Therefore, the high-power amplitude limiting circuit based on the gallium nitride Schottky diode can reach a myriawatt-level amplitude limiting level, the occupied area is smaller, the power endurance capability is more stable, and the insertion loss is smaller.

The invention provides a transmission line, an oscillator, a phase shifter, a feed network, an antenna and communication equipment. The transmission line comprises a first inner core which comprises a first main body surface, and the first main body surface is perpendicular to the thickness direction of the first inner core; the floor comprises a first slotted hole penetrating through the thickness of the floor, and the inner wall of the first slotted hole is coupled with the first main body surface to form a capacitor. According to the technical scheme, the tolerance sensitivity of the transmission line impedance can be reduced, the tolerance resistance of the transmission line is improved, and therefore the stability of the transmission line impedance can be guaranteed.

A microwave filter arrangement (100) for quantum computing applications, the filter arrangement (100) comprising a first port (113) and a second port (114). The microwave filter arrangement (100) comprises a main waveguiding structure (110) arranged between the first (113) and second (114) port, where the main waveguiding structure (110) comprises an inner conductor (111) having a circular cross-section that is surrounded by a hollow outer conductor (112) having a rectangular cross-section with two opposed long sides and two opposed short sides. The waveguiding structure (110) comprises a plurality of hollow waveguides (115) extending away from one or both of the long sides of the outer conductor, the hollow waveguides (115) comprising a dielectric material (122) and being terminated by an electromagnetically absorptive material (124).

The invention belongs to the field of wireless communication, and particularly relates to a low-loss radio frequency coaxial cable and a manufacturing method thereof. The inner conductor of the radio frequency coaxial cable is subjected to surface treatment, so that the adhesive force between the inner conductor and the insulating layer is improved, the transmission loss is reduced, and the signal transmission performance is improved. After the surface of the inner conductor is subjected to proper process treatment, the contact performance can be improved, and signal reflection and loss increase can be avoided. On the premise of meeting the test requirements of insulation adhesive force, standing wave and insulation voltage resistance, the surface of the inner conductor of the radio-frequency coaxial cable is moderately processed, so that the attenuation index of the radio-frequency coaxial cable is integrally optimized by 3.3%-6.0% under the frequency bands of 900MHz, 1800MHz, 2700MHz and the like compared with that of an existing product.

A vehicle comprises: vehicular glass including a transparent region and an opaque region; a transparent dielectric substrate disposed in the transparent region of the vehicular glass; a first area including an antenna on one side surface of the transparent dielectric substrate; and a second area including a power supply pattern and a ground conductive pattern electrically connected to the antenna. The antenna may comprise: a first slot formed between a signal pattern and a first ground pattern and configured to radiate a first signal having a circularly polarized wave in a first frequency band; and a second slot formed between the first ground pattern and a second ground pattern and configured to radiate a second signal having a circularly polarized wave in a second frequency band lower than the first frequency band.

A BMS includes: a BMU that manages a battery assembly; a first CMU that monitors one or more battery cells included in the battery assembly; and a second CMU that monitors the one or more battery cells monitored by the first CMU. The first CMU includes a wireless communication circuit and a communication antenna for communicating with the BMU. The second cell monitoring circuit CMU includes a power line communication circuit, for communicating with the BMU, that uses a power line in the battery assembly.