Light-emitting
assembly (100), comprising: an arrangement of light-emitting
diode (LED) devices (115); and an arrangement of microcontrol units (110) for switching and operating the arrangement of LED devices (115), wherein the arrangement of LED devices (115) and the arrangement of microcontrol units (110) are bonded to the same side of a substrate, the number of microcontrol units (110) in the arrangement of microcontrol units (110) is less than the number of LED devices (115) in the arrangement of LED devices (115), and each microcontrol unit (110) in the arrangement of microcontrol units (110) is in electrical contact with a plurality of pixels comprising the arrangement of LED devices (115); wherein each
microcontroller (110) is a microchip and comprises a plurality of
microcontroller LED outputs; wherein each plurality of pixels comprises a plurality of groups of LED devices (115) and each
microcontroller LED output is coupled to a corresponding group of LED devices (115); and wherein each group of LED devices (115) is coupled in parallel to a corresponding microcontroller LED output.