3910 results about "Dielectric substrate" patented technology

An antenna for an electromagnetic tool having a longitudinal axis and a core. The antenna includes a flexible dielectric substrate flexibly conformed about the core and an electrical conductor disposed on the dielectric substrate. The electrical conductor is disposed on the substrate such that the antenna has a dipole moment having any desired direction relative to the longitudinal axis of the tool.

A method and apparatus are provided for etching semiconductor and dielectric substrates through the use of plasmas based on mixtures of a first gas having the formula C_aF_b, and a second gas having the formula C_xH_yF_z, wherein a/b≧⅔, and wherein x/z≧½. The mixtures may be used in low or medium density plasmas sustained in a magnetically enhanced reactive ion chamber to provide a process that exhibits excellent corner layer selectivity, photo resist selectivity, under layer selectivity, and profile and bottom CD control. The percentages of the first and second gas may be varied during etching to provide a plasma that etches undoped oxide films or to provide an etch stop on such films.

An antenna, including a planar dielectric substrate and a conductive ground plane formed on the substrate. A conductive monopole is formed on the substrate and has an end point located in proximity to a feed region of the ground plane. A conductive coupling element is formed on the substrate and is coupled to the ground plane at a coupling region of the ground plane. The coupling element is folded around the monopole.

An implantable electronic medical device is compatible with a magnetic resonance imaging (MRI) scanner. The device has a housing with exterior walls, each formed by a dielectric substrate with electrically conductive layers on interior and exterior surfaces. A series of slots divide each layer into segments. Segmenting the layers provides high impedance to eddy currents produced by fields of the MRI scanner, while capacitive coupling of the segments provides radio frequency shielding for components inside the housing. Electrical leads extending from the housing have a pair of coaxially arranged conductors and traps that attenuate currents induced in the conductors by the fields of the MRI scanner.

An integrated circuit structures formed by chemical mechanical polishing (CMP) process, which comprises a conductive pathway recessed in a dielectric substrate, wherein the conductive pathway comprises conductive transmission lines encapsulated in a transmission-enhancement material, and wherein the conductive pathway is filled sequentially by a first layer of the transmission-enhancement material followed by the conductive transmission line; a second layer of transmission-enhancement material encapsulating the conductive transmission line and contacting the first layer of the transmission-enhancement material, wherein the transmission-enhancement material is selected from the group consisting of high magnetic permeability material and high permittivity material. Such integrated circuit structure may comprise a device structure selected from the group consisting of capacitors, inductors, and resistors. Preferably, the transmission-enhancement material comprises MgMn ferrites, MgMnAl ferrites, barium strontium titanate, lead zirconium titanate, titanium oxide, tantalum oxide, etc.

A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.

A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.

The present invention relates to a dual-band omnidirectional antenna for wireless LANs. The antenna has a planar dielectric substrate, and first and second conductive patterns. The planar dielectric substrate has two parallel surfaces. The first conductive pattern is arranged on one surface of the substrate, and is provided with a first feeder line arranged on a longitudinal central line of the substrate and a plurality of radiating elements connected to the first feeder line and designed such that some of them operate in a high frequency band (4.9 to 5.85 GHz frequency band), and others thereof operate in a low frequency band (2.4 to 2.5 GHz frequency band). The second conductive pattern is arranged on the other surface of the substrate, and provided with a second feeder line arranged on a longitudinal central line of the substrate and a plurality of radiating elements connected to the second feeder line arid up-down symmetrically arranged with respect to the radiating elements on the first conductive pattern.

An antenna device comprising: a feeding radiation electrode and a non-feeding radiation electrode separately disposed on a surface of a dielectric substrate; a short circuit part of the feeding radiation electrode and a short circuit part of the non-feeding radiation electrode adjacently disposed to each other on one side surface of the dielectric substrate; and an open end of the feeding radiation electrode and an open end of the non-feeding radiation electrode disposed on mutually different surface sides of the dielectric substrate other than the surface on which said short circuit parts are disposed.

A capacitive liquid level indicator having a capacitive sensor array superposed on each side of a dielectric substrate, wherein the sensor signal detection electronics are located immediately adjacent each capacitive sensor. These provisions result in high sensitivity of detection of submergence in the liquid, as well as essentially eliminating parasitic electric fields. The preferred capacitive sensors are interdigitated capacitors, and the preferred sensor signal detection circuit is an RC bridge and a comparator, wherein the comparator senses a voltage difference in the RC bridge between a sensor resistor and sensor capacitor of a first leg thereof and a reference resistor and reference capacitor of a second leg thereof. It is preferred for the capacitive liquid level indicator to be coated with a low dielectric conformal coating to thereby insulate the electronic components (inclusive of the capacitive sensors) thereof with respect to the liquid into which it is submerged. The sensitivity of the capacitive liquid level sensor according to the present invention is extremely high; as a result, a reference capacitive sensor is obviated, and there are no false indications of liquid due to any film of the liquid clinging to an exposed portion of the capacitive liquid level sensor.

An antenna apparatus includes a minute loop antenna and at least one antenna element. The minute loop antenna is provided to be electromagnetically close to a dielectric substrate including a grounding conductor, has a predetermined number N of turns and a predetermined minute length, operates as a magnetic ideal dipole when a predetermined metal plate is located closely to the antenna apparatus, and operates as a current antenna when the metal plate is located apart from the antenna apparatus. The antenna element is connected to the minute loop antenna, and operates as a current antenna. In the antenna apparatus, one end of the antenna apparatus is connected to a feeding point, and another end of the antenna apparatus is connected to the grounding conductor of the dielectric substrate.

A wiring harness and a touch sensor incorporating same are disclosed. The touch sensor includes a sensing electrode disposed in a touch sensitive area. The touch sensor further includes a plurality of auxiliary electrodes disposed on a self-supporting dielectric substrate in a border area. The auxiliary electrodes transmit a touch signal to electronics configured to use the touch signal to determine the touch location.

An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

There is presented a high frequency module, in which a recess 2a for mounting power amplifier device is formed on a lower surface of a dielectric substrate 2, and a recess 2b for mounting surface acoustic wave filter is formed on an upper surface of the dielectric substrate 2, and a power amplifier device 4 and a surface acoustic wave filter 8 are mounted through conductive bumps 3a and 3b on the recesses 2a and 2b, respectively. In addition, a through-hole conductor 11 whose one end is exposed at the lower surface of the dielectric substrate 2 is provided between the recesses 2a and 2b. The exposed end of the through-hole conductor 11 is attached to a thermal dissipation conductor 15 on an upper surface of an external electric circuit board 7 through a brazing material 13.

A catheter for insertion into a body cavity, duct, or vessel for diagnostic purposes, the catheter including a flexible conduit having a microsensor device mounted thereto that generates output data from a sensed condition. The microsensor device is operatively coupled to a data acquisition device to communicate the output data to the data acquisition device. The microsensor device is mounted to a flexible dielectric substrate carrying a lead, and the flexible dielectric substrate is separate from and carried by the flexible conduit.

A half-wave printed “patch” antenna includes, symmetrically with respect to a plane of symmetry of the antenna perpendicular to faces of the antenna, a dielectric substrate and two conductive layers on respective faces of the substrate. One face of the substrate includes a raised portion extending lengthwise of the plane of symmetry and one of the conductive layers extends over and along said raised portion. Consequently, the antenna has a small size, combined with a more open radiation diagram. The antenna includes only one raised portion for linear polarization, or two raised portions or a raised portion with axial symmetry for crossed polarizations.

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

A dual-antenna diversity antenna system that operates within a low frequency band range is disclosed. Two antennas are folded separately onto a single three dimensional dielectric substrate in a meander pattern configuration. Each antenna has an independent feed port and ground pin. The two antennas are configured within a compact mobile terminal to produce high isolation and low correlation at resonating frequencies within the 700 Megahertz frequency band.

A sensor device for monitoring bioelectric data from a human body includes a flexible dielectric substrate, a plurality of sensors (electrodes) distributed on the substrate for sensing the bioelectric data, and an electrically conductive network distributed on the substrate connecting the sensors to a terminal portion of the substrate. Integrated flexible joints permit a certain amount of elasticity in and allow relative movement between at least two of the sensors when the sensor device is placed onto the human body.

Improved feed line networks for antenna arrays operating at millimeter wave frequencies are provided for constructing planar antenna arrays printed on the surface of a dielectric substrate. A planar antenna array includes an array of planar radiator elements interconnected through a feed line network of planar coplanar transmission lines that enable high-efficiency operation, at millimeter wave operating frequencies. For example, a feed network may be formed with a network of coplanar strip line transmission lines including one or more coplanar strip line (CPS) and one or more coplanar waveguide (CPW) transmission line, which are interconnected using balun structures, to enable high efficiency operation at millimeter wave frequencies.

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.

A slot fed microstrip patch antenna (200) includes an electrically conducting ground plane (208), the ground plane (208) having at least one coupling slot (206) and at least a first patch radiator (209). An antenna dielectric substrate material (205) is disposed between the ground plane (208) and the first patch radiator (209), wherein at least a portion of the antenna dielectric (210) includes magnetic particles (214). A feed dielectric substrate (212) is disposed between a feed line (217) and the ground plane (208). Magnetic particles can also be used in the feed line (217) dielectric. Patch antennas according to the invention can be of a reduced size through use of high relative permittivity dielectric substrate portions, yet still be efficient through use of dielectrics including magnetic particles which permit impedance matching of dielectric medium interfaces, such as the feed line (217) into the slot (206).

The invention discloses an L-waveband broadband circular polarization micro-strip antenna which comprises an upper-layer radiating antenna dielectric substrate and a lower-layer feed network dielectric substrate; a radiation patch is printed on the upper surface of the upper-layer radiating antenna dielectric substrate; four coupling patches are printed on the lower surface of the upper-layer radiating antenna dielectric substrate; an earth plate is arranged on the upper surface of the lower-layer feed network dielectric substrate, and a micro-strip power dividing phase-shifting feed network with one input end and four output ends is printed on the lower surface of the lower-layer feed network dielectric substrate; an air gap is formed between the upper-layer radiating antenna dielectric substrate and the lower-layer feed network dielectric substrate; each coupling patch is connected with one output end of the micro-strip power dividing phase-shifting feed network through a metal probe. The L-waveband broadband circular polarization micro-strip antenna is simple in structure, low in cost, easy to tune, wide in impedance bandwidth and circular polarization bandwidth and suitable for application to a maritime satellite communication system and a satellite positioning navigation system terminal.

A mobile device includes a dielectric substrate, a ground element, a signal source, a first conductive frame, a second conductive frame, a third conductive frame, a shorting element, a feeding element, a first radiation element, and a second radiation element. The first conductive frame, the second conductive frame, and the third conductive frame are separate from each other. The second conductive frame is coupled through the shorting element to the ground element. The first radiation element is coupled to the feeding element. An open end of the first radiation element is adjacent to the second conductive frame. The second radiation element is coupled to the feeding element. An open end of the second radiation element is adjacent to the third conductive frame. An antenna structure is formed by the feeding element, the first radiation element, the second radiation element, the shorting element, and the second conductive frame.

Sensors and systems for monitoring structural health conditions. The present invention provides a device for monitoring structural health conditions including a dielectric substrate, a piezoelectric device for actuating and/or sensing Lamb waves, a molding layer deposited over the piezoelectric device, a cover layer deposited over the molding layer and a hoop layer surrounding the piezoelectric device and being attached to the substrate. The device further includes an optical fiber coil sensor attached to the dielectric substrate, where the coil sensor has a rolled optical fiber cable and a coating layer applied to the rolled optical fiber cable. The present invention also provides a diagnostic patch network that includes a plurality of patch sensors attached to a host structure and a bridge box connected to the patch sensors. The bridge box sends information of structural health conditions to and receive power from a ground control system using a wireless communication technique.

The present invention relates to an ultra wideband internal antenna, which is provided in a mobile communication terminal to cut off frequencies in a certain frequency band while processing ultra wideband signals. The ultra wideband internal antenna includes a first radiation part, a second radiation part, a feeding part and a ground part. The first radiation part is made of a metal plate on a top surface of a dielectric substrate and is provided with at least one cut part, formed by cutting out a lower corner portion thereof, and an internal slot. The second radiation part is formed in the slot of the first radiation part while being connected to the first radiation part, the second radiation part being conductive. In this case, the first and second radiation parts form an ultra wide band due to electromagnetic coupling therebetween using individual currents flowing into the first and second radiation parts.

An RFID tag or label in combination with a dielectric material comprises a dielectric material and a wireless communication system that is mounted in electrical proximity to the dielectric material. The wireless communication system comprises a wireless communication device associated with an antenna system that has at least one conductive tab, including one or both of the following: (a) a plurality of electrical components that are selected to form an impedance matching network, that are coupled to the conducting tab and wireless communication device. The electrical components electrically interact with the dielectric material to maintain a substantial impedance match between the antenna system and the wireless communication device; and, (b) a structural element forming a frequency selective by-pass trap circuit formed in the conducting tab and electrically interacting with the dielectric material to maintain a substantial impedance match between the antenna system and the wireless communication device. The antenna system may be directly mounted on a dielectric substrate, which serves as the dielectric material Alternatively, the antenna system may be mounted on a backing layer intermediate the dielectric substrate and the antenna system, the backing layer in turn being attached to the dielectric substrate, wherein the backing layer and the dielectric substrate collectively serve as the dielectric material.

An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.

Methods and apparatus are described for irradiating one or more substrate surfaces with accelerated gas clusters including strain-inducing atoms for blanket and/or localized introduction of such atoms into semiconductor substrates, with additional, optional introduction of dopant atoms and/or C. Processes for forming semiconductor films infused into and/or deposited onto the surfaces of semiconductor and/or dielectric substrates are also described. Such films may be doped and/or strained as well.

A circularly polarized antenna includes a dielectric substrate having a first via array in the form of a cylindrical cavity, a micro-strip circular patch antenna located at the center of the cylindrical cavity and formed on the dielectric substrate to radiate a signal, and a rectangular dielectrically loaded waveguide having a second via array and serving to feed the signal to the micro-strip circular patch antenna. Accordingly, the circularly polarized antenna prevents impedance mismatch between the micro-strip antenna and the dielectrically loaded waveguide and broadens an impedance bandwidth thereof.