782 results about "Integrated antenna" patented technology

The invention relates to the technical field of radar, in particular to a millimeter-wave quasi-optical integrated dielectric lens antenna and an array thereof. The array consists of a microstrip integrated antenna, a dielectric lens, an objective lens, an array base, a reflecting mirror, a protective cover and a beam transfer switch; one end face of the dielectric lens is a hemisphere or an ellipsoid, while the other end face is a cylindrical section; the microstrip integrated antenna is generated by an dielectric substrate, the front surface of the dielectric substrate is closely adhered tothe cylindrical section of the dielectric lens and serves as a feed source, and the back surface is grounded; the hemispherical or ellipsoidal end face of the dielectric lens is an antenna radiating surface; the length of the cylindrical part of the dielectric lens can be changed; the antenna array is arranged into a linear array or an area array; the array base and the reflecting mirror have conical quasi-optical reflecting mirror surfaces; the focus of the objective lens of the linear array or the area array aligns with the central line of the dielectric lens; the protective cover is arranged outside; and the antenna array is controlled by the beam transfer switch. The antenna structure has strong shock resistance and dust prevention, and is suitable for millimeter-wave radars for planes, automobiles and ships, and receiving/emitting sensing of communication equipment.

An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.

Antennas and antenna systems may be designed and configured for incorporation into mechanical devices, including medical devices, such as ophthalmic devices, including contact lenses. These antennas and antenna systems may be utilized to transmit data from the mechanical device to a receiver, to receive data from a transmitter, and/or to inductively charge an electromechanical cell or the like incorporated into the mechanical device.

A chip package includes a plurality of layers including conductive planes connected by vias. The layers include a first portion having an antenna formed therein and a parallel-plate mode suppression mechanism to suppress parallel-plate mode excitation of the antenna. The parallel-plate mode suppression mechanism includes a reflector offset from an antenna ground plane and first grounded vias. A second portion has an interface for connecting to an integrated circuit device wherein the first portion and the second portion are separated by the parallel-plate mode suppression mechanism.

A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.

A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity. The inner surface of the at least one feed line borders the chip-receiving cavity. An antenna patch may be provided. Planar phased array embodiments, assemblies with motherboards and heat sinks, and fabrication techniques are also disclosed.

An embodiment of the invention relates to a digital integrated antenna array system having one or more antenna modules, one or more transceiver modules each having one or more signal processing paths for transmitting data to or receiving data from the one or more antenna modules, a signal processing unit able to process data for each the one or more signal processing paths of the one or more transceiver modules such that the data transmitted from the one or more transceiver modules to the one or more antenna modules is radiated by the one or more antenna modules into one or more radiation patterns.

An integrated circuit for use in an RFID tag includes an integrated circuit die having a circuit, a radio frequency identification (RFID) interface for providing communication between the circuit and a remote RFID reader via RF signaling between the RFID interface and the remote RFID reader, and an antenna section for facilitating the RF signaling between the RFID and the remote RFID reader. A substrate is coupled to support the first integrated circuit die.

Aspects of a method and apparatus for an integrated antenna are provided. In an exemplary embodiment of the invention, a substrate may comprise one or more metal traces thereon and/or embedded therein. The substrate may be sufficiently flexible to be bent or molded into a shape that corresponds to the outer dimensions of a battery. When the substrate is bent into the shape corresponding to the outer dimensions of the battery, the one or more metal traces may form an antenna. A ferromagnetic laminate may be affixed to a first side of the substrate, and a dielectric laminate may be affixed to a second side of the substrate. The substrate may be wrapped around a battery and the battery and substrate may be integrated into a smartcard or other wireless communication device.

In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.

The present invention provides a shielding module integrating antenna and integrated circuit component, which comprises an artificial magnetic conductor board, an antenna, a common ground face, a plurality of first via holes, a shielding slot, a plurality of second via holes, and an IC component. The IC component is embedded in the shielding slot formed between the common ground face and surrounded by the plurality of second via holes of the artificial magnetic conductor board. Accordingly, the antenna is formed and shielded above the shielding slot, the plurality of second via holes, and the IC component separated by the common ground face and the plurality of first via holes of the artificial magnetic conductor board. As a result, the package area of integrated circuit component and cost is reduced while shielded from external noise and electromagnetic interference.

Antenna assemblies for an implantable medical device are disclosed. The implantable medical device comprises a hermetically sealed housing, typically formed of titanium materials, and electronics, including a transceiver, disposed therein. An antenna is disposed in an air, gas or plastic dielectric filled compartment within a header, which is attached to the housing. The header is premolded so as to create the compartment. The antenna is then placed within the compartment, which is then sealed.

In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.

An antenna system is integrated into a cover or accessory and adapted to couple to an antenna in a host device to improve transmission and reception of signals. The antenna system can be passive or active, with the active antenna system designed to amplify coupled signals on the integrated antenna elements in the cover or accessory. Single or multiple frequency bands can be improved with the integrated antenna system, and multiple antennas in the host device can be coupled to and improved. The antenna system can couple to the existing antennas in the host device by capacitive coupling, i.e. no physical contact required, or a connector can be designed into the cover or accessory containing the integrated antenna system that makes contact to electrical ground of the host device or power supply signals or other control signals.

In one aspect, the invention is a far-field power extraction circuit which includes an integrated antenna and impedance matching portion and a rectifier portion. The antenna and impedance matching portion includes an antenna configured to be responsive to a propagating electromagnetic signal and which provides a resonant response at a resonant frequency. In response to the electromagnetic signal, the antenna provides an electromagnetic output signal at an antenna port. The antenna and impedance matching portion is configured to match an antenna impedance with a remainder of the far-field power extraction circuit including the rectifier portion of the power extraction circuit coupled to the antenna and impedance matching portion. The rectifier is configured to rectify the electromagnetic output signal provided by the antenna to produce a direct current (DC) voltage at an output of the rectifier.

An embodiment of the present invention discloses a radar apparatus and an antenna apparatus, and more particularly, an integrated radar apparatus and an integrated antenna apparatus which make it possible to attain angle resolution with high definition, to decrease size and the number of devices, to integrate long and mid-range radar function and short range radar function.

Embodiments of the invention may provide for a variety of antennae structures, including the following: a) antennae structures printed directly on the sides of the radio frequency (RF) module or integrated passive device (IPD), b) printed antennae structures fabricated on preformed dielectric lids or overmolds, c) antennae structures fabricated as part of the dielectric wiring that constitutes the wireless module, d) antennae structures that are printed directly on the top of the finished RF module, and e) antennae structures printed directly on the dielectric layers adjacent to thin film wiring and embedded passive elements such as filters, diplexers and couplers.