643results about "De-icing/drying-out arrangements" patented technology

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone, and in which the second refrigerant flow paths form independent flow paths for the liquid refrigerant by a plurality of inclined guides, which protrude in the refrigerant flow space, have surfaces that adjoin one another and are in surface contact with one another, and are provided straight and inclined toward the first refrigerant flow path so as to be physically separated from the adjacent second refrigerant flow path, and by a plurality of strength reinforcement portions respectively formed on the plurality of inclined guides, thereby significantly improving heat dissipation performance.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Liquid crystal antenna, splicing liquid crystal antenna, and method of forming liquid crystal antenna are provided. The liquid crystal antenna includes support structures, liquid crystals, a first substrate and a second substrate. The first substrate and the second substrate are arranged oppositely, the support structures are arranged between the first substrate and the second substrate, the first substrate includes first metal layers arranged on a side of the first substrate facing the second substrate, the second substrate includes a second metal layer arranged on a side of the second substrate facing the first substrate. The second metal layer includes functional part and spacers, the functional parts and the first metal layers are stacked along a first direction perpendicular to the second substrate, and the functional parts at least partially overlap the first metal layers. The support structures are arranged between the spacers and the first metal layers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

Systems and methods are provided for a digital beamformed phased array feed. The system may include a radome configured to allow electromagnetic waves to propagate; a multi-band software defined antenna array tile; a power and clock management subsystem configured to manage power and time of operation; a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and an enclosure assembly. The multi-band software defined antenna array tile may include a plurality of coupled dipole array antenna elements; a plurality of frequency converters; and a plurality of digital beamformers.

The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, the refrigerant flow space being formed in the thermal conduction panel body, in which the refrigerant flow space includes a first refrigerant flow path positioned to be adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of a liquid refrigerant to the vaporization zone, and in which the second refrigerant flow paths protrude in the refrigerant flow space and have surfaces that adjoin one another and are in surface contact with one another, and the second refrigerant flow paths form independent flow paths for the liquid refrigerant by a plurality of strength reinforcement portions provided straight and inclined toward the first refrigerant flow path.

The invention provides an air-cooled array surface structure adopting a vapor chamber frame, which comprises a vapor chamber array surface frame, an antenna cover, a receiving and transmitting assembly, an antenna, a shell, a connector, a temperature monitoring unit, an array surface distribution plate, a high-power-consumption functional module, a low-power-consumption functional module, a temperature control module, a large-air-volume axial flow fan, an internal turbulent flow fan and a semiconductor refrigerator, a semiconductor refrigerator cold end, a semiconductor refrigerator hot end, a loop heat pipe, a loop heat pipe cold end, a loop heat pipe hot end, an air duct cover plate, a rear cover plate, a rear cover plate external groove, a rear cover plate internal groove, a sealing rope, a fan protective cover, captive screws and trunnions are included. According to the design of the invention, the array surface heat dissipation mode is changed from liquid cooling to air cooling, the design requirements of light weight and low cost of the array surface structure are realized, and the effect of the heat dissipation system and the redundancy design is verified step by step in the high-temperature environment test process to meet the requirements.

The invention discloses a phased array radar antenna array plane and air-cooled uniform-temperature heat dissipation structure, which optimizes the structure and layout of a heat dissipation air duct of the antenna array plane, and overall designs component modules and the heat dissipation air duct to achieve the effect that the temperatures of components at symmetrical positions of four quadrants of the antenna array plane are consistent; an independent fan is designed for each heat dissipation air duct, and the air volume is determined according to the heat power consumption of each air duct; a heat pipe is designed on a heat exchange contact surface at the bottom of the heat dissipation air duct to reduce the temperature difference of the assembly along the air duct direction; the heat dissipation air channel is completely sealed and isolated from each functional module in the antenna array plane; the inner surface of the heat dissipation air channel is coated with the infrared ceramic radiation heat dissipation coating, salt spray corrosion can be resisted, heat dissipation is facilitated, and the outdoor environment requirement can be met. Through the design, the temperature difference of the components on the antenna array plane is reduced, and the phase consistency requirement of the antenna array plane components is met.

The present disclosure relates to an antenna apparatus, and especially comprises: a main body module in which a main board is mounted; an RF module which is fixed to the front so that an intermediate outside air layer is formed between the RF module and the main body module, and in which an RF filter unit and an antenna element unit are mounted; and an amplification unit module which is disposed so as to be exposed in the intermediate outside air layer between the main body module and the RF module, and comprises an amplification unit substrate having analog amplification elements mounted thereon, wherein heat generated from heating elements mounted on the main board is dissipated through at least any one of the front and back of the main body module, and heat generated from the amplification unit module is directly dissipated through the intermediate outside air layer, and thus the advantage of enabling maximum heat dissipation performance is provided.

The invention provides a millimeter wave tile-type phased-array antenna heat transfer-heat storage system, and the system comprises a heat transfer main body which is provided with a radiating surface, a heat conduction surface, and at least one heat dissipation surface; wherein an electrical function module of the phased-array antenna is arranged on the heat conduction surface to transfer heat generated by operation to the heat conduction surface, a heat conduction path and a phase change heat storage unit are formed in the heat conduction surface, the phase change heat storage unit is used for absorbing and storing part of heat, the heat conduction path is connected with the heat dissipation surface, and the phase change heat storage unit is connected with the heat dissipation surface. At least part of heat generated by the electrical function module is transmitted to the heat dissipation surface through the heat conduction path of the heat conduction surface for heat dissipation. The radiating surface is used as a signal radiating window of the phased-array antenna; and the phase change heat storage module is arranged outside the heat transfer main body, is connected with the heat dissipation surface and is used for absorbing heat dissipated by the heat dissipation surface. The invention provides an efficient heat transfer-heat storage technical scheme, and solves the thermal control problem of high-power work of the phased-array antenna on a platform within limited time.

The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path including a press-fitting end positioned adjacent to a press-fitting portion provided on a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having upper and lower ends coupled in a gravitational direction or coupled to be inclined with respect to the gravitational direction with respect to the press-fitting portion to define a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone other than the first refrigerant flow path and disposed and spaced apart from one another in a predetermined pattern to guide a flow of a liquid refrigerant condensed in the condensation zone.

The invention relates to a phased array antenna, in particular to a composite micro-channel radiator for a large-scale terahertz phased array, which comprises a plurality of radiating units, and a plurality of micro-channels with consistent flow directions are arranged in each radiating unit; the radiator further comprises a first-stage flow channel communicated with the multiple heat dissipation units, and the first-stage flow channel and the multiple heat dissipation units are located on the same plane. Inlets of the micro-channels in the heat dissipation units are all communicated with the first-stage channel, and outlets of the micro-channels in the heat dissipation units are all converged in the first-stage channel. After a cooling medium enters the radiator, the cooling medium firstly passes through the first-stage main flow channel and then is uniformly distributed into the four radiating units, so that redistribution of part of the cooling medium is realized, the problem of non-uniform flow in the micro-flow channel is effectively improved, and the temperature uniformity of a system is improved. Meanwhile, the first-stage flow channel comprises an inlet and an outlet, and the heat dissipation unit comprises a micro-flow channel, a flow distribution pipe and a collecting pipe which are integrally arranged on the same plane, so that the occupied longitudinal space is greatly reduced, and the packaging requirements of miniaturization and light weight of the terahertz phased array are perfectly met.

An electronic device includes a first housing including a display unit, and a second housing that includes an input unit and an antenna unit, is rotatably connected to the first housing via a connection part, and is made of a metal material. The first housing includes a support plate that constitutes a back surface of the first housing, supports the display, and is made of a metal material, and a communication path member that is provided on the support plate and is made of a resin material. The communication path member is disposed in a region facing at least a part of the antenna unit of the second housing in a closed state where the first housing and the second housing are disposed to face each other.

The invention relates to the technical field of antennas, in particular to a low-orbit satellite antenna board card. Comprising a first radiation unit, a second radiation unit and a PCB. The first radiation unit and the second radiation unit are circularly polarized antennas and respectively work in different frequency bands. The first radiation unit is of a cross-shaped structure, the second radiation unit is of a hollow structure, and the first radiation unit and the second radiation unit are both made of metal materials. The first radiation unit and the second radiation unit are nested on the PCB, the upper surface of the PCB is provided with a thermal control material, the lower surface of the PCB is provided with a heat conduction material, the antenna board card provided by the invention is suitable for being used outside a cabin, the application of the PCB to the outside of the cabin becomes possible, and thus light weight and low cost of a low-orbit satellite antenna are realized.

A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.

The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, and an active heat dissipation apparatus according to the present disclosure includes a thermal conduction panel body having therein a refrigerant flow space having a predetermined thickness, and a refrigerant with which the refrigerant flow space of the thermal conduction panel body is filled, in which the thermal conduction panel body is made of a metallic material capable of transferring heat into the refrigerant flow space from the outside, and in which the refrigerant is water that is changed in phase from a liquid state to a gaseous state or from a gaseous state to a liquid state by thermal conductivity of the thermal conduction panel body, thereby significantly improving heat dissipation performance.

Proposed are an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an amplification unit module which is arranged between a main board and an RF filter and into which at least one analog amplification element is built. The amplification unit module includes an amplification unit body, an amplification unit board seated inside the amplification unit body, a front end portion of an edge of the amplification unit board being connected to the RF filter for signal transmission and a rear end portion of the edge thereof being connected to the main board for signal transmission, an amplification unit cover provided in such a manner as to cover the amplification unit board, and a vapor chamber positioned between the amplification unit body and the amplification unit board or between the amplification unit cover and the amplification unit board and serving as a medium for transferring heat generated from analog amplification elements mounted on the amplification unit board.

An external connection device including a ventilation mechanism and an antenna; the ventilation mechanism includes a housing assembly and a fan arranged inside the housing assembly; wherein the housing assembly is provided with a first through hole and a second through hole, and the fan is connected with a fan cable extending out of the housing assembly from the first through hole; and the antenna is arranged on an outer wall of the housing assembly, and the antenna is connected with the antenna cable, and the antenna cable extends into the housing assembly from the second through hole and extends out of the housing assembly from the first through hole.

Composite materials for simultaneous thermal management and electromagnetic interference screening of radiofrequency-based electronic systems are provided. The materials contain a phase change material and one or more electrically and thermally conductive filler particles. The materials provide a passive system for thermal management and EMI shielding that is lightweight, does not contain moving parts, and does not require an external power supply.

Example embodiments relate to frequency selective structures for automotive radar. A system may include a frequency selective structure that is coupled to a radome and configured to optimize a desired band-pass for specific performance by one or more antennas. The frequency selective structure may comprise arrays of micro-wires forming a plurality of intersections and one or more patches positioned at one or more intersections of the plurality of intersections. In some cases, at least one patch of the one or more patches may be positioned with an offset relative to a corresponding intersection of the one or more intersections and the frequency selective structure has a rotational angle with respect to an antenna polarization of the one or more antennas. The frequency selective structure may be connected to a current source that can modify the temperature of the structure to melt rain or snow off the radome.