178 results about "Loop heat pipe" patented technology

The invention discloses a loop heat pipe and water heat storage coupling system and a working method, and belongs to the technical field of heat storage. The system has the modes of light gathering of the light-following trough heat collector, heat conduction of the loop heat pipe, heat storage of the water storage tank and warm water irrigation by using the stored heat water. When sunlight is sufficient in the daytime, the system converts solar energy into sensible heat of water in the heat storage water tank and stores the sensible heat, and the sensible heat is insulated by soil to slow down heat loss; when plants need to be irrigated, warm water in the irrigation water tank is used for irrigation; at night or in the absence of illumination, warm water in the heat storage water tank exchanges heat with air in the greenhouse, so that a lasting and stable heat supply source is provided for the greenhouse. Solar energy collected by the heat collecting groove is efficiently transmitted into the water tank through the loop heat pipe driven by temperature difference to be converted into sensible heat of water to be stored, the sensible heat is used for increasing the greenhouse temperature and irrigating plants when heat is needed at night, and the purposes of efficiently storing heat in the daytime and continuously supplying heat at night are integrally achieved.

The invention discloses a loop heat pipe structure, and relates to the technical field of heat pipes, the loop heat pipe structure comprises an evaporator shell, and the evaporator shell communicates with a steam pipeline; the liquid storage device comprises a first liquid storage chamber and a second liquid storage chamber, and the first liquid storage chamber and the second liquid storage chamber are arranged at the two ends of the evaporator shell correspondingly; the wick is arranged in the evaporator shell; the liquid pipeline comprises a liquid phase pipe and a guide pipe which are communicated with each other, and the guide pipe sequentially penetrates through the first liquid storage chamber, the liquid absorption core and the second liquid storage chamber; wherein a first nozzle and a second nozzle are arranged on the guide pipe; the guide pipe is slidably sleeved with a sleeve, and the sleeve can slide along the guide pipe under the action of gravity and seal the first nozzle or the second nozzle. The device is not driven by external energy, the working medium is moved to the two ends of the wick by utilizing the structural design of the working medium pipeline and the sleeve, and the working medium can be in good contact with the wick under various placement conditions, so that the wick is infiltrated, and the running stability of the device is improved.

The invention relates to a solar PV / T circulating system integrating thermochemical adsorption cold storage and radiation cooling. The solar PV / T circulating system comprises loop heat pipe circulation which comprises an integrated radiation cooling PV / T assembly, a photovoltaic controller and a working medium pump. The PV / T assembly is of a turnover structure, the front face of the PV / T assembly is used for absorbing sunlight radiation, and the back face of the PV / T assembly is used for radiation heat exchange to cool the refrigerant. The vapor compression refrigeration cycle comprises a direct-current variable-frequency compressor, a condenser, a first evaporator and a plate heat exchanger; the thermochemical adsorption cold storage cycle comprises an adsorption cold storage unit, a liquid ammonia storage tank and a second evaporator; wherein an adsorbent capable of adsorbing ammonia gas and desorbing and releasing the ammonia gas is loaded in the adsorption cold storage unit. Compared with the prior art, the solar PV / T circulating system has the advantages that collaborative operation of solar photovoltaic cold supply and photo-thermal cold storage can be achieved, the solar energy utilization rate is increased, and all-weather and stable cold supply of the data center can be guaranteed.

The invention provides a loop heat pipe and electronic equipment, relates to the technical field of electronic equipment, and aims at solving the problems that an existing loop heat pipe is long in starting time and low in response speed. The loop heat pipe comprises a shell and a first wick. Wherein an evaporation cavity, a plurality of condensation cavities and a plurality of circulation channels are formed in the shell, the first wick is arranged in the evaporation cavity, each circulation channel is provided with one condensation cavity, and each condensation cavity communicates with the evaporation cavity through the corresponding circulation channel, so that each circulation channel can conduct evaporation condensation circulation. According to the loop heat pipe, on the premise that the size is not changed, the path length of each evaporation and condensation circulation is shortened (equivalently, the length of each circulation channel is shortened), steam can rapidly reach the condensation cavity to be condensed, a liquid working medium obtained through condensation can rapidly flow back into the evaporation cavity, and the evaporation efficiency is improved. Therefore, the starting response speed of the loop heat pipe is accelerated.

The invention provides an air-cooled array surface structure adopting a vapor chamber frame, which comprises a vapor chamber array surface frame, an antenna cover, a receiving and transmitting assembly, an antenna, a shell, a connector, a temperature monitoring unit, an array surface distribution plate, a high-power-consumption functional module, a low-power-consumption functional module, a temperature control module, a large-air-volume axial flow fan, an internal turbulent flow fan and a semiconductor refrigerator, a semiconductor refrigerator cold end, a semiconductor refrigerator hot end, a loop heat pipe, a loop heat pipe cold end, a loop heat pipe hot end, an air duct cover plate, a rear cover plate, a rear cover plate external groove, a rear cover plate internal groove, a sealing rope, a fan protective cover, captive screws and trunnions are included. According to the design of the invention, the array surface heat dissipation mode is changed from liquid cooling to air cooling, the design requirements of light weight and low cost of the array surface structure are realized, and the effect of the heat dissipation system and the redundancy design is verified step by step in the high-temperature environment test process to meet the requirements.

The invention relates to the technical field of high-precision thermometer calibration, in particular to a high-precision thermometer calibration device based on a low-temperature loop heat pipe. Comprising a vacuum cover, an evaporator, a soaking block, a refrigerator and a flexible pipe, a first-stage cold shield, a second-stage cold shield and a third-stage cold shield are arranged in the vacuum cover from outside to inside; the upper end of the evaporator is communicated with the gas storage tank; the soaking block is arranged in the third-stage cold shield, a low-temperature loop heat pipe is embedded in the soaking block, the low-temperature loop heat pipe is connected with the evaporator and the liquid storage device through pipelines to form a closed loop, and the soaking block is provided with an installation structure used for fixing a platinum resistance thermometer; a cold head of the refrigerating machine extends into the vacuum cover; one end of the flexible pipe is connected with the cold head, and the other end is connected with the soaking block for transferring cold energy and isolating vibration. According to the invention, rapid and stable heat conduction of the soaking block is realized, the calibration accuracy of the high-precision thermometer in a low-temperature environment is improved, and the problem of measurement stability caused by temperature fluctuation is solved.

The invention provides a multifunctional integrated array plane frame for air cooling heat dissipation, which comprises a soaking cold plate, a plurality of partition plates and loop heat pipes, the plurality of partition plates are arranged on the soaking cold plate at intervals, a plurality of cavities are defined by the plurality of partition plates and comprise a plurality of mounting cavities and a plurality of air duct cavities, and the mounting cavities and the air duct cavities are arranged in a staggered manner; the loop heat pipe is arranged on the partition plate, one end of the loop heat pipe is provided with pipeline cooling fins extending into the air duct cavity, and the other end of the loop heat pipe is located in the installation cavity and attached to the device unit in the installation cavity. According to the integrated array plane frame, the integration degree and the space utilization rate of an antenna array plane can be improved, the weight and the size are reduced, the heat dissipation capacity of the antenna array plane can be improved, the temperature difference loss caused by conduction thermal resistance can be reduced, and the air channel space for air cooling heat exchange can be efficiently utilized; according to the invention, precise and intelligent heat dissipation can be carried out on the antenna sub-array units and the functional module units, and the temperature consistency of the antenna sub-array units can be well ensured.

The invention belongs to the technical field of heat exchange, particularly provides a mixed closed type reversible heat exchange assembly and an energy storage cabinet, and aims at solving the problem that a liquid cooling plate of an existing conventional heat exchange system is an open type component, and large potential safety hazards exist. Therefore, the mixed closed type reversible heat exchange assembly comprises an L-shaped heat exchange plate, an L-shaped heat pipe and a loop heat pipe, the L-shaped heat exchange plate comprises a driving section and a heat exchange section, the L-shaped heat pipe is arranged on the L-shaped heat exchange plate, and the L-shaped heat pipe can conduct heat dissipation and cooling on the heat exchange section under the condition that the driving section serves as a cold end; and the loop heat pipe is arranged on the L-shaped heat exchange plate, can assist the L-shaped heat pipe to dissipate heat and cool the heat exchange section under the condition that the driving section serves as a cold end, and can heat the heat exchange section under the condition that the driving section serves as a hot end. According to the mixed closed type reversible heat exchange assembly, the safety problem caused by liquid leakage and condensation does not exist, safety is high, the heat exchange effect is good, and cost is low.

The invention provides an intelligent temperature control system and method based on chip heat energy guiding. The method comprises the steps of obtaining running state information of a target chip set; the working mode of the loop heat pipe is determined according to the operation state information of the target chip set, and stepped energy recovery is conducted on conduction heat of the loop heat pipe through the recovery heat pump; thermal state information of the target chipset and energy recovery information of the recovery heat pump in different historical time windows are obtained, correlation verification analysis is carried out according to the thermal state information and the energy recovery information, and an intermittent boiling threshold value of the loop heat pipe is determined; acquiring operation instruction stream data of the chip, and performing dynamic power consumption prediction according to the operation instruction stream data to obtain a dynamic power consumption prediction value; when the dynamic power consumption predicted value is higher than the intermittent boiling threshold value, the liquid return rate of the loop heat pipe is adjusted based on the dynamic power consumption predicted value, the liquid return rate in the heat transfer process can be controlled according to dynamic power consumption prediction, and the heat energy guiding and recycling efficiency is improved.

The invention discloses a gravity loop heat pipe based on a vein type flow channel and a radiator. The gravity loop heat pipe based on the vein type flow channel comprises an evaporation assembly, an installation support, a condensation assembly, a medium injection opening communicated with the evaporation assembly, an input copper pipe and a backflow copper pipe. A medium is input into the evaporation assembly through the medium injection port, forms steam after absorbing heat, flows into the condensation assembly through the input copper pipe, and flows back to the evaporation assembly through the backflow copper pipe after completing heat exchange in the condensation assembly. By means of the vein vapor chamber, the condensation efficiency is remarkably improved, the size of the condensation assembly is reduced, the working medium backflow path is prolonged, and more sufficient heat exchange is achieved. The external water cooling structure improves the heat dissipation efficiency, is not limited by the interior of the case, and is flexible to install. In addition, due to different structural designs of the gas pipeline and the liquid pipeline, the problems of backflow in advance and drying of a working medium in the evaporation box body are effectively avoided, and the operation efficiency and reliability of the heat pipe are integrally improved.

The invention provides a loop heat pipe condenser and a preparation method thereof, the loop heat pipe condenser is applied to the technical field of radiators with large heat and high heat flux density, a channel path on a condensation plate is accurately arranged to be matched with the shape and the size of a condensation pipeline, efficient brazing connection of the condensation pipeline and the condensation plate is achieved, and the heat dissipation efficiency is improved. Therefore, the stability of the structure and the high efficiency of heat conduction are ensured. Besides, path self-adaptive bending shaping and fin customized assembly are combined, the contact tightness of the condensation pipeline and the condensation plate is remarkably enhanced, deformation of traditional welding is reduced, the risk of serious oxidation to the inner wall of the pipeline during other high-temperature welding is eliminated, and the interior of the pipeline is easier to clean. And efficient cooperative heat dissipation of the fins and the condensation plates is achieved through the modular riveting design, the heat dissipation efficiency and the overall performance of the condenser are improved, the manufacturing process is simplified, and the cost is reduced.

Disclosed is a loop heat pipe having an evaporator, a condenser, a vapor line connected between the evaporator and the condenser through which a vapor-phase working fluid flows, a liquid line connected between the condenser and the evaporator through which a liquid-phase working fluid flows, and a wick having an elasticity and provided inside the evaporator in a compressed and deformed state. The liquid-phase working fluid permeates into the wick, and a boundary between the liquid phase working fluid and the vapor phase working fluid is formed in the wick. A stress generated in the wick due to compressive deformation is greater than a pressure loss that occurs during circulation of the working fluid from the vapor-phase side of the boundary via the condenser back to the liquid-phase side of the boundary.

The utility model discloses a loop heat pipe heat dissipation device, relates to loop heat pipe heat dissipation technical field, the loop heat pipe heat dissipation device comprises a plurality of evaporators, a plurality of pipeline structures and a condenser, each evaporator is provided with a liquid storage chamber and a steam chamber which are communicated along the thickness direction of the evaporator, the liquid storage chamber is used for storing cooling medium, and the steam chamber is used for storing steam. The steam cavities are used for storing steam formed by evaporation of a cooling medium, each pipeline structure comprises a liquid pipeline and a steam pipeline, the steam pipeline is communicated with the multiple steam cavities, and the liquid pipeline is communicated with the multiple liquid storage cavities; the condenser is provided with an air inlet and a liquid outlet which are arranged at intervals, the air inlet is communicated with the steam pipeline, and the liquid outlet is communicated with the liquid pipeline; wherein steam discharged by the steam cavities is collected and enters the condenser, and cooling media generated by condensation of the condenser are mixed and then fed into the liquid storage cavities. Heat dissipation cooperation can be carried out on a plurality of heating devices, and the stability of multiple chips under a high-load operation condition is ensured. Meanwhile, the occupied space of the evaporator is reduced.

The utility model relates to the technical field of temperature control, in particular to a flow loop heat pipe high-stability temperature control device which comprises a shell, the shell comprises a base, an outer frame is fixedly connected to the upper surface of the base, a heat dissipation assembly is fixedly connected to the interior of the outer frame and comprises a condenser, and a liquid pipe is fixedly connected to the lower end of the condenser. One end of the liquid pipe is fixedly connected with a compensation tank, the upper surface of the compensation tank is fixedly connected with a water pump, one end of the water pump is fixedly connected with a water feeding pipe, one end of the water feeding pipe is fixedly connected with an evaporator, the evaporator heats and gasifies cooling liquid after absorbing heat, and the other end of the evaporator is fixedly connected with a steam pipe. By accurately controlling the working temperature of the flow loop heat pipe, it is ensured that a working medium in the heat pipe operates under the optimal phase change condition, heat can be efficiently transmitted to a radiator from a heat source, and at the evaporator end, stable temperature control ensures that the working medium fully absorbs the heat and is rapidly vaporized.

The invention discloses a loop heat pipe reactor heat exchange system with an ejector, and belongs to the technical field of nuclear energy system heat exchange. The system comprises a reactor, a heat exchanger, an ejector, a steam inlet valve, a liquid inlet valve and a liquid return pipe, a saturated liquid outlet of the reactor is connected with a liquid inlet of the ejector through the heat exchanger and the liquid inlet valve, the heat exchanger is connected with the reactor through a loop heat pipe, and heat generated by the reactor is transmitted; a saturated steam outlet of the reactor is connected with a steam inlet of the ejector through a loop heat pipe and a steam inlet valve; an outlet of the ejector is connected with a reactor inlet through a liquid return pipe; efficient heat transfer without pump driving is achieved through phase change circulation of a working medium. The ejector adopts a Laval nozzle to accelerate a high-temperature working medium, a low-pressure area is formed in a mixing chamber to drive a low-temperature working medium to be sucked, the pressure of the working medium is increased through a diffuser pipe, and circulation stability is maintained. The system abandons a traditional mechanical pump, drives circulation through a heat pipe, and has the advantages of simple structure, reliable operation, flexible arrangement and the like.

The invention discloses a loop heat pipe and a heat dissipation method of an AI all-in-one machine, and relates to the field of AI. The loop heat pipe comprises a two-phase cold plate, a steam pipeline, a liquid pipeline and a cold discharge heat exchanger, an evaporator is arranged in the two-phase cold plate and comprises a porous fine hair structure, and the steam outlet end of the evaporator of the two-phase cold plate is connected with one end of the steam pipeline; one end of the liquid pipeline is connected with the liquid outlet end of the cold discharge heat exchanger, and the other end of the liquid pipeline is connected with the liquid inlet end of the evaporator of the two-phase cold plate; the two-phase cold plate is used for being tightly attached to a heat dissipation component of the AI all-in-one machine. And the cold discharge heat exchanger is in communication connection with the AI all-in-one machine. According to the AI all-in-one machine, when the heat dissipation part of the AI all-in-one machine is subjected to heat dissipation, a fully-closed heat dissipation structure is adopted, the liquid leakage risk is effectively reduced, the fully-closed heat dissipation structure achieves heat dissipation through two-phase circulation, movement in the internal heat dissipation process is self-driven, and any external force such as a water pump is not needed.

The application discloses a loop heat pipe system for a hypersonic aircraft, and relates to the technical field of electronic thermal protection, comprising at least two loop heat pipe structures, a loop track and a liquid metal cabin; the loop heat pipe structures are connected through connecting strips to keep the relative positions fixed, and are used for heat protection of electronic devices of the hypersonic aircraft through working medium circulation; the loop track is located at the top of the two loop heat pipe structures, and is slidably connected with the two loop heat pipe structures respectively, so that the two loop heat pipe structures move along the circumference of the loop track; the liquid metal cabin is arranged between the two loop heat pipe structures and the electronic devices, and is used for conducting the heat generated by the electronic devices. The loop heat pipe system sets multiple loop heat pipe structures on the loop track, so that the heat management devices of the aircraft can be adaptively adjusted in position under different attitudes or vibration conditions, thereby effectively improving the heat management efficiency.

The invention relates to the field of electronic equipment, and particularly discloses a loop heat pipe which comprises a first shell, a second shell, a cavity supporting assembly and a capillary core. The peripheral edges of the first shell and the second shell are connected in a sealed mode, the first shell and / or the second shell are / is provided with a groove to form a circulation loop, the circulation loop comprises an evaporation cavity, a condensation cavity, a gas channel and a liquid channel, and the gas channel and the liquid channel are communicated between the evaporation cavity and the condensation cavity respectively. The first shell and the second shell at least partially corresponding to the gas channel and the liquid channel are provided with corrugated structures; the capillary cores are respectively arranged in the evaporation cavity and the condensation cavity; the cavity supporting assembly is arranged on the circulation loop; the first shell and the second shell are both made of flexible metal plastic composite materials. The loop heat pipe provided by the invention is simple in structure, is beneficial to miniaturization, lightening and thinning of the loop heat pipe, and can be better applied to a bending scene. The invention further discloses electronic equipment which also has the technical effects.

The present invention relates to a loop heat pipe structure and a power device, comprising an evaporator, wherein the evaporator is rotatably connected to an inner ring, the inner ring is rotatably connected to an outer ring, and the outer ring is rotatably connected to a support frame. The inner ring and the outer ring are concentrically arranged, the inner ring adopts a hollow structure and is connected to the evaporator, and the interior of the inner ring is filled with a capillary core at a position corresponding to the liquid inlet end of the evaporator, so that the working medium can circulate between the evaporator and the inner ring; the relative rotation axis between the evaporator and the inner ring is a first axis, the relative rotation axis between the inner ring and the outer ring is a second axis, and the relative rotation axis between the outer ring and the support frame is a third axis. The first axis is perpendicular to the second axis, and the second axis is perpendicular to the third axis. The loop heat pipe structure of the present invention can work stably under a bumpy state.

The application relates to a new energy automobile "three-electricity" thermal control system based on a loop heat pipe in the technical field of new energy automobile thermal management, which comprises three-electricity components and a loop heat pipe; the three-electricity components comprise an electric drive, an electric control and a battery pack; the loop heat pipe comprises an evaporator assembly, a main condenser, a secondary condenser, a cold plate assembly, a pipeline system and a stop valve; the cold plate assembly comprises an electric control cold plate group and a battery pack cold plate group. The loop heat pipe in the application forms a self-adapting passive phase change heat transfer two-phase fluid loop in the three-electricity components, does not need to provide additional power consumption by a pump, has better energy-saving effect, only needs to control the temperature of a liquid accumulator, and has simple control logic; the system thermal resistance is small, and the temperature uniformity can be guaranteed to be within 1 DEG C.

The utility model discloses a loop heat pipe device which comprises an annular pipeline, a plurality of grooves distributed in the circumferential direction are formed in the inner side wall of the annular pipeline, and the grooves extend along the center line of the annular pipeline. Groove teeth are formed between any two adjacent grooves. The grooves are formed in the inner side wall of the annular pipeline, when the loop heat pipe operates at low power, gas of the evaporator is cooled into liquid in the condenser, the grooves can damage the surface tension of the liquid and reduce the flowing resistance of the liquid, and the liquid in the annular pipeline cannot be accumulated and only flows to the lower position under the influence of gravity, so that the heat pipe is not prone to falling off. Circulation can be formed only through pushing of a small amount of evaporation gas, the problem that liquid blocking is easily formed at the position of a condenser through a loop heat pipe device is effectively solved, the heat dissipation area of an annular pipeline can be increased through the groove teeth, the heat dissipation capacity is improved, and the heat dissipation effect is improved. And the loop heat pipe device can adapt to a standby low-power operation scene of the high-power chip, and the number of operation scenes which can be adapted to the loop heat pipe device is increased.

The utility model relates to the technical field of radiators, and discloses a circulating type heat pipe radiator which comprises radiating fins, a fan arranged in the middle of the radiating fins, a spacer fixedly connected with one side of the radiating fins and a heat absorption plate fixedly connected through a heat pipe, and an air cooling radiating mechanism and a water cooling dust removal mechanism are arranged on the outer sides of the radiating fins. The air-cooling heat dissipation mechanism is arranged on the left side of the water-cooling dust removal mechanism and comprises an air box, the air box is fixedly connected to one sides of heat dissipation fins, one side of the air box is fixedly connected with an air barrel, one side of the air barrel is fixedly connected with an air window, and an air inducing motor is fixedly connected to the interior of the air window; the air cooling heat dissipation mechanism can be matched with the water cooling dust removal mechanism to conduct water filtration on airflow in the process of transferring heat to the heat pipe, the water cooling dust removal mechanism is used for transferring liquid, dust filtration is conveniently conducted on air provided by the air cooling heat dissipation mechanism, and meanwhile the liquid can be transferred to absorb heat absorbed by the heat dissipation fins.

The application discloses a kind of multi-channel loop heat pipe and radiator, comprising: heat pipe body and heat pipe cover, heat pipe cover is set in the open side of heat pipe body cavity;Heat pipe body has evaporation cavity and multiple condensation cavities, multiple condensation cavities are evenly distributed in the outer circumferential side of evaporation cavity, each condensation cavity is communicated with evaporation cavity by corresponding steam passage and liquid passage, to form multiple circulation heat dissipation structure, each condensation cavity and each liquid passage are provided with liquid storage cavity between.The application adopts new type loop heat pipe of multiple condensation cavities sharing an evaporation cavity, not only compact overall structure, small space occupation, and, compared with single loop, heat dissipation effect can be increased by 3-4 times, greatly improve heat dissipation capacity;And can adapt to different orientation in gravitational field and acceleration field, can be applied in high-power computing power module heat dissipation and aerospace field heat dissipation.

The utility model relates to a loop heat pipe-based compact liquid cooling radiator for a high-density server in the technical field of chip heat dissipation. The loop heat pipe-based compact liquid cooling radiator comprises at least one evaporator, a shell-and-tube condenser, at least one steam pipeline, at least one liquid pipeline, a first quick connector and a second quick connector, the evaporator is connected with the shell-and-tube condenser through a steam pipeline and a liquid pipeline; the first quick connector and the second quick connector are arranged on the shell-and-tube condenser; the first quick connector is used for cooling water to enter the shell-and-tube condenser; the second quick connector is used for cooling water to flow out of the shell type condenser; the evaporator comprises a capillary wick; the steam pipeline and the liquid pipeline are flexible pipelines. Under the limitation of a small space, the ultrahigh heat flux density requirement can be met, the liquid leakage risk is avoided, the noise influence and vibration damage are reduced, the service life is long, and the reliability is high; the evaporator and the shell-and-tube condenser are connected through a flexible pipeline, and convenience is provided for miniaturization design of electronic components.

This invention provides a heat dissipation system with a tertiary loop heat pipe, comprising a cooling tower, a heat exchange unit, an immersion cooling chamber, and a heat source. The cooling tower and the heat exchange unit are thermally connected via a primary loop, the heat exchange unit and the immersion cooling chamber are thermally connected via a secondary loop, and the immersion cooling chamber and the heat source are thermally connected via a tertiary loop. The tertiary loop is a loop heat pipe, wherein the evaporator end of the loop heat pipe is thermally connected to the heat source to absorb heat, and the condenser end of the loop heat pipe is located within the immersion cooling chamber. This invention's heat dissipation system adds a tertiary gas-liquid circulation pipeline, allowing the heat exchange unit inside the immersion cooling chamber to be immersed within the chamber, enhancing heat transfer and improving overall heat dissipation efficiency.

The present application discloses a loop heat pipe structure, which relates to the technical field of heat pipes and includes an evaporator housing communicated with a steam pipeline; a liquid reservoir including a first liquid storage chamber and a second liquid storage chamber, the first liquid storage chamber and the second liquid storage chamber are respectively arranged at two ends of the evaporator housing; a wick arranged in the evaporator housing; a liquid pipeline including a liquid phase pipe and a lead pipe communicated with each other, the lead pipe sequentially penetrates through the first liquid storage chamber, the wick and the second liquid storage chamber; wherein, a first nozzle and a second nozzle are arranged on the lead pipe; a sleeve is slidably sleeved on the lead pipe, and the sleeve can slide along the lead pipe under the action of gravity to close the first nozzle or the second nozzle. This device does not require external energy drive. By using the structural design of the working fluid pipeline and the sleeve, the working fluid is moved to both ends of the wick, realizing that the working fluid can be in good contact with the wick under various placement conditions, thereby infiltrating the wick and improving the running stability of the device.

The utility model relates to the field of loop heat pipes, in particular to an evaporator loop heat pipe which comprises an evaporator, a condenser and a liquid storage device, a capillary core is arranged in the evaporator and divides the interior of the evaporator into an upper cavity and a lower cavity, and the liquid storage device is communicated with the upper cavity through a liquid pipeline. According to the loop heat pipe of the evaporator, the size of the channel can be changed by changing the number of the filling strips blocking the water flow grooves, namely, the capacity of liquid flowing into the capillary core in unit time is changed, namely, the storage capacity between the capillary core and the upper cavity is reduced, and therefore the heat exchange efficiency of the evaporator is improved. The liquid flows through the capillary core before vaporization, the working medium phase change time of the liquid is prolonged, and the service life of the loop heat pipe is prolonged. And the flow of the liquid can be adjusted according to various air temperature environments, so that the liquid can flow through the capillary core before being vaporized. And meanwhile, the filling strips can also achieve the effects of thickening the outer wall and blocking heat, so that the heat directly acting on the liquid is reduced.

A cooling device includes an enclosure housing, a primary cooling system including a loop heat pipe like (LHPL) device that rejects heat to an external coolant. The LHPL device including an evaporator module, condenser module, vapor line, liquid return path including a liquid return line, one or more compensation chambers, optional inline storage chambers, a working fluid having a liquid and vapor phase and an optional pump in either the vapor or the liquid return line. The evaporator module including a porous wick that transfers heat from the evaporator shell to the wick including escape channels that help to generate the delta P that drives the working fluid about the cooling loop at the same time helping to prevent the switch from nucleate to transition boiling that takes place on flat surfaces and which makes it possible for an LHPL device to cool heat loads with hot spots releasing more than 100 Watts per square cm.

The utility model relates to a kind of high-pressure visual loop heat pipe condensers in loop heat pipe heat dissipation technical field, including bottom plate, glass plate, polytetrafluoroethylene gasket, stainless steel gasket, elastic pad, bolt, bolt hole sealing ring, outer ring sealing ring, flow passage sealing ring, import pipe and export pipe.The utility model is in bottom plate and is opened out serpentine flow channel groove and the sealing groove of surrounding flow channel, using the thicker glass plate of equal size with condenser, utilize bolt fixed glass plate and bottom plate, and using sealing ring sealing flow channel around prevents working medium leakage.The condenser of the utility model has high-pressure characteristic and vapor-liquid two-phase full domain visual monitoring capability, while maintaining high-efficiency heat dissipation and structural stability, and has important value to improve the design precision of loop heat pipe, fault diagnosis capability and dynamic control level.

The present invention relates to a capillary core, an evaporator, a loop heat pipe, a cooling device, an electronic device, and a capillary core manufacturing method. The present invention aims to provide a capillary core, an evaporator, a loop heat pipe, a cooling device, an electronic device, and a capillary core manufacturing method that can improve the long-term stability of the hydrophilicity of the capillary core. The capillary core of the present invention is a capillary core of a porous elastomer that is permeated by a working fluid in a liquid phase, which is provided inside an evaporator that changes the working fluid in the liquid phase to a gas phase. The porous elastomer includes composite voids having communication holes at portions where a plurality of spherical voids partially overlap each other. The surface of the voids of the porous elastomer is coated with a hydrophilic polymer having a betaine group and a molecular weight of 10,000 or more of a polymer brush structure.