22 results about "Loop heat pipe" patented technology

The application relates to a new energy automobile "three-electricity" thermal control system based on a loop heat pipe in the technical field of new energy automobile thermal management, which comprises three-electricity components and a loop heat pipe; the three-electricity components comprise an electric drive, an electric control and a battery pack; the loop heat pipe comprises an evaporator assembly, a main condenser, a secondary condenser, a cold plate assembly, a pipeline system and a stop valve; the cold plate assembly comprises an electric control cold plate group and a battery pack cold plate group. The loop heat pipe in the application forms a self-adapting passive phase change heat transfer two-phase fluid loop in the three-electricity components, does not need to provide additional power consumption by a pump, has better energy-saving effect, only needs to control the temperature of a liquid accumulator, and has simple control logic; the system thermal resistance is small, and the temperature uniformity can be guaranteed to be within 1 DEG C.

This invention provides a heat dissipation system with a tertiary loop heat pipe, comprising a cooling tower, a heat exchange unit, an immersion cooling chamber, and a heat source. The cooling tower and the heat exchange unit are thermally connected via a primary loop, the heat exchange unit and the immersion cooling chamber are thermally connected via a secondary loop, and the immersion cooling chamber and the heat source are thermally connected via a tertiary loop. The tertiary loop is a loop heat pipe, wherein the evaporator end of the loop heat pipe is thermally connected to the heat source to absorb heat, and the condenser end of the loop heat pipe is located within the immersion cooling chamber. This invention's heat dissipation system adds a tertiary gas-liquid circulation pipeline, allowing the heat exchange unit inside the immersion cooling chamber to be immersed within the chamber, enhancing heat transfer and improving overall heat dissipation efficiency.

The utility model relates to a kind of high-pressure visual loop heat pipe condensers in loop heat pipe heat dissipation technical field, including bottom plate, glass plate, polytetrafluoroethylene gasket, stainless steel gasket, elastic pad, bolt, bolt hole sealing ring, outer ring sealing ring, flow passage sealing ring, import pipe and export pipe.The utility model is in bottom plate and is opened out serpentine flow channel groove and the sealing groove of surrounding flow channel, using the thicker glass plate of equal size with condenser, utilize bolt fixed glass plate and bottom plate, and using sealing ring sealing flow channel around prevents working medium leakage.The condenser of the utility model has high-pressure characteristic and vapor-liquid two-phase full domain visual monitoring capability, while maintaining high-efficiency heat dissipation and structural stability, and has important value to improve the design precision of loop heat pipe, fault diagnosis capability and dynamic control level.

The utility model relates to the field of chip heat dissipation, especially a high performance loop heat pipe heat dissipation device for chip heat dissipation, the evaporator is composed of evaporation end cover, evaporation bottom surface and sintered porous capillary core, the sintered porous capillary core divides the inner chamber of evaporator into the liquid storage cavity of upper part and the evaporation area of lower part, the inner surface of evaporation bottom surface is equipped with micron level micro channel structure, and the sintered porous capillary core is welded on evaporation bottom surface. In the utility model, through the synergistic effect of micro channel structure in the evaporator and sintered porous capillary core, cooperate the double-sided fine capillary condensing structure on the condenser, strengthen the phase change heat transfer process, to realize the heat dissipation performance of extremely low thermal resistance, super high heat flow density and big total heat transfer quantity, the heat dissipation capacity is greatly promoted compared with the existing liquid cooling technology, can satisfy the severe heat dissipation demand of high performance chip, and the system operation is stable and reliable, improves the heat dissipation effect of high heat density chip.

This utility model discloses a loop heat pipe cooling system for a coronagraph, including an equipment mounting plate, a heat collection plate, a main loop heat pipe evaporator, and a backup loop heat pipe evaporator. The equipment mounting plate and the heat collection plate are connected by channeled heat pipes. Several discrete heating devices are mounted on the equipment mounting plate. The outer surface of the heat collection plate has a main evaporator mounting surface and a backup evaporator mounting surface. The main loop heat pipe evaporator is mounted to the heat collection plate via the main evaporator mounting surface, and the backup loop heat pipe evaporator is mounted to the heat collection plate via the backup evaporator mounting surface. The cooling system of this utility model features a backup evaporator design, which improves the on-orbit reliability of the loop heat pipe system. Redundancy is used to address potential failure risks. The system is equipped with two loop heat pipe evaporators connected to the heat source mounting surface, meeting special requirements such as good thermal conductivity of the evaporator mounting surface, temperature uniformity, and a small temperature difference between the main and backup mounting surfaces.

The present disclosure provides a loop heat pipe temperature control method and device for in-orbit refueling gas tank. The present disclosure is connected with the controlled gas tank in heat conduction, and the loop heat pipe is provided with a liquid accumulator. The outer wall of the liquid accumulator is provided with a refrigeration fin. The temperature control method comprises the following steps: in the case that the measured temperature of the controlled gas tank is greater than the preset target temperature of the controlled gas tank, the effective over-temperature amount of the controlled gas tank is determined based on the measured temperature, the preset target temperature and the preset upper limit of temperature dead zone; in the case that the effective over-temperature amount is greater than zero, the two-phase region temperature adjustment amount of the liquid accumulator is determined based on the effective over-temperature amount and the preset proportional compensation coefficient, and the two-phase region temperature adjustment amount is converted into the target net refrigeration power of the refrigeration fin; the refrigeration fin is started and controlled to operate at the target net refrigeration power until the measured temperature of the controlled gas tank falls below the sum of the preset target temperature and the preset upper limit of temperature dead zone. The temperature control method of the present disclosure can improve the temperature control stability and accuracy of the in-orbit refueling gas tank.

A loop heat pipe one-way circulation device includes a lower cover plate and an upper casing closely connected to the lower cover plate. The upper casing includes a fluid inlet, a fluid outlet, a joint surface, a heat absorption area and a gas discharge cavity. The joint surface is in close contact with the lower cover plate, and the heat absorption area is formed between the fluid inlet and the fluid outlet. In addition, the heat absorption area includes a heat absorption area inner surface height, and the gas discharge cavity has a gas discharge cavity height, and the gas discharge cavity height is greater than the heat absorption area inner surface height.

A three-dimensional loop heat spreader includes a plate heat spreader and a plurality of U-shaped heat pipes. The plate heat spreader includes an upper case, a lower case, and a capillary structure, wherein the capillary structure is disposed between the upper case and the lower case, and a heat absorption region and a heat dissipation region are formed in the plate heat spreader, and the capillary structure includes a capillary structure cavity located in the heat absorption region. The upper case located in the heat absorption region has a plurality of first openings, and the upper case located in the heat dissipation region has a plurality of second openings. An inlet end and an outlet end of each U-shaped heat pipe are fixed to the corresponding first opening and second opening of the upper case of the plate heat spreader. In addition, a heat dissipation device with a three-dimensional loop heat spreader is also disclosed.

The present application belongs to the technical field of electronic component thermal management, and particularly relates to an electronic component heat dissipation system and method with thermal shock buffering. The electronic component heat dissipation system comprises: an evaporator for adhering to an electronic component chip heat generating module; a liquid cooling plate with a surface adhering to the evaporator; a thermal buffering water cooling row; a water pump; and a water pipe, which connects the liquid cooling plate, the water pump and the thermal buffering water cooling row in series to form a closed liquid circulation loop; wherein the evaporator is internally provided with a loop heat pipe, which is configured to transfer heat to the liquid cooling plate through phase change after absorbing heat in the evaporator. The electronic component heat dissipation method comprises the following steps: S1, heat conduction and phase change circulation; S2, liquid cooling heat exchange; S3, graded buffering and heat dissipation; and S4, circulation backflow step.

The application relates to a loop heat pipe evaporation section structure and a loop heat pipe system, wherein the loop heat pipe evaporation section structure comprises a capillary core, an outer surface of the capillary core is provided with a composite channel system for working medium flow, the composite channel system comprises a plurality of axial straight channels and spiral channels, a cross section shape of the spiral channels changes along an axial direction of the capillary core, so that the capillary core generates a non-uniform capillary pumping force distribution along the axial direction, and the capillary core is used for adaptively matching a heat flux density distribution of the evaporation section in the axial direction; a metal shell is sleeved on the outer side of the capillary core, and the capillary core is in interference fit with the metal shell; an interface layer is arranged between the capillary core and the metal shell, the interface layer is composed of a flexible material with a thermal expansion coefficient between that of the capillary core material and that of the metal shell material, is used for dynamically compensating expansion differences of the two when temperature changes, and maintains close contact of the interface; a saddle is sleeved on the outer side of the metal shell, and a prefabricated thermal interface material layer is arranged between the saddle and the metal shell.

This invention specifically relates to a loop heat pipe assisted by a piezoelectric micropump, belonging to the field of loop heat pipe technology. This loop heat pipe assisted by a piezoelectric micropump includes an evaporation assembly, a condensation assembly, a vapor pipeline, a liquid pipeline, and a piezoelectric micropump. The vapor pipeline connects the steam outlet of the evaporation assembly and the steam inlet of the condensation assembly, the liquid pipeline connects the liquid outlet of the condensation assembly and the liquid inlet of the evaporation assembly, and the piezoelectric micropump is disposed in the vapor pipeline. In this device, the driving force of the piezoelectric micropump can drive the working fluid circulation, improving the working fluid circulation power of the loop heat pipe.

The application discloses a flat-plate loop heat pipe and application thereof. The flat-plate loop heat pipe comprises a liquid accumulator shell, a wick and an evaporator shell; the wick is arranged between the liquid accumulator shell and the evaporator shell; the liquid accumulator shell is provided with a boss structure matched with the outer periphery of the wick, the wick is connected with the liquid accumulator shell through the boss structure, and a liquid storage chamber is formed between the wick and the liquid accumulator shell; at least one liquid inlet is formed on the liquid accumulator shell; a plurality of plate rib structures are arranged on the side surface of the liquid accumulator shell close to the wick; the evaporator shell is internally provided with a gas collecting cavity and a plurality of evaporator grooves; the wick is tightly arranged on the evaporator grooves; and the gas collecting cavity is arranged at the side wall surface of the evaporator shell. The design of the flat-plate loop heat pipe can reduce heat leakage, reduce thermal resistance, improve heat conduction efficiency, has high rigidity and durability, can inhibit pressure fluctuation impact, can guarantee long-term stable operation of the heat pipe and can improve heat transfer response speed.

The application provides an evaporator component, which comprises an evaporator, a first liquid reservoir, a second liquid reservoir and a capillary core, the first liquid reservoir and the second liquid reservoir are arranged at the left and right ends of the evaporator, the evaporator is filled with the capillary core, the capillary core extends from the middle of the evaporator to the inside of the first liquid reservoir and the second liquid reservoir at the left and right sides, a liquid inlet is arranged at the left side of the first liquid reservoir and the right side of the second liquid reservoir respectively, and two steam outlets are arranged at the upper end of the evaporator. The evaporator is provided with double circuits, adopts a double-inlet and double-outlet form to make the two circuits operate simultaneously, compared with the double liquid reservoir single-inlet and single-outlet evaporator, the two circuits of the evaporator are completely same in the path length of supplementing the working medium, so that the supplement of the working medium is more stable.

The present invention relates to an evaporator (100) for a loop heat pipe (300). The evaporator (100) includes a first porous structure (110) and a second porous structure (112) disposed on a substrate (120). The evaporator (100) also includes a housing (140) surrounding the first porous structure (110) and the second porous structure (112) to form a first chamber (150) and a second chamber (152) separated by the first porous structure (110) and the housing (140). The first chamber (150) is coupled to a condenser (200) via an input port (160) and is used to receive cooling fluid (F) from the condenser (200). The second chamber (152) is coupled to the condenser (200) via an output port (162) and is used to supply the cooling fluid (F) to the condenser (200). Furthermore, the present invention also relates to a loop heat pipe (300) comprising an evaporator (100) according to an embodiment of the present invention.

This invention relates to a mass-producible through-hole capillary wick loop heat pipe evaporator in the field of radiator technology. The evaporator includes a capillary wick, a shell, a vapor end cap, and a liquid end cap. The outer surface of the capillary wick has steam channels. The capillary wick has a through-hole extending from front to back. The vapor end cap includes a steam pipe connector, a steam passage, an end sealing surface, and a first limiting groove in the shell. The liquid end cap includes a second limiting groove in the shell, a liquid reservoir interface, and a liquid inlet. This invention designs the capillary wick as a through-hole structure, sealing it as a blind hole through the end sealing surface of the vapor end connector. The evaporator can be designed in a standardized manner with mass production of spare parts. Technical solutions adapted to specific application scenarios only require selection of evaporator specifications and limited development of other structures. Modular assembly, system filling, and performance testing can then be performed according to actual needs, enabling mass production of loop heat pipes and significantly reducing manufacturing costs.

A cooling device for cooling one or more electronic components is disclosed. The cooling device includes a substrate having a front wall (110a), a rear wall (110b), and a substrate cavity (110c), and further includes a plurality of cooling fins (120a). Each cooling fin (120a) defines a cooling fin cavity (124) and is attached to the front wall (110a) of the substrate such that the cooling fin cavity (124) is in fluid communication with at least a portion of the substrate cavity (110c). The substrate and each of the plurality of cooling fins (120a) define a loop heat pipe (LHP) for circulating a coolant, wherein the coolant includes a liquid coolant and a vapor coolant. The LHP includes an LHP evaporation zone (A) within the substrate cavity (124), an LHP compensation zone (B) within the cooling fins (120a), and core elements (122a, 122b). The core elements (122a, 122b) are arranged within the substrate cavity (110c) to extend at least partially between the LHP evaporation zone (A) and the LHP compensation zone (B), and are used to absorb and transport the liquid coolant to separate the LHP evaporation zone (A) from the LHP compensation zone (B).

This utility model belongs to the field of heat dissipation technology, specifically relating to a loop heat pipe structure, including an evaporator, a condenser, and a liquid receiver. A liquid pipeline connects the condenser, liquid receiver, and evaporator, and the liquid pipeline contains a working fluid that circulates within the loop heat pipe structure. The evaporator is also connected to the condenser via a steam pipeline. A spiral guide vane is provided on the inner wall of the steam pipeline, and a cooling pipeline is coaxially fitted on the outer side of the steam pipeline to form a cooling channel. The cooling pipeline is connected to a cooling device and a circulating pump via a coolant pipeline. This utility model reduces steam flow resistance and improves condensation efficiency by setting spiral guide vanes within the steam pipeline. Especially in vertical pipe sections, it avoids localized overheating caused by steam stagnation. Furthermore, the cooling channel actively dissipates heat, preventing heat accumulation on the pipe wall and reducing the range of steam temperature fluctuations.

The application discloses a loop heat pipe heat exchanger, which comprises an evaporation plate, a gas collecting plate and a plurality of condensing pipes, the evaporation plate is formed with an evaporation cavity, the gas collecting plate is formed with a gas collecting cavity, the condensing pipes are provided with condensing cavities, the evaporation cavity, the condensing cavities and the gas collecting cavity are communicated to form a closed loop, the closed loop is provided with refrigerant, heat exchange channels are formed between adjacent condensing pipes, the condensing pipes are provided with fins to separate the condensing pipes, the fins are inwardly recessed to form inner recesses, a plurality of inner recesses are arranged at intervals, outer recesses are formed between adjacent inner recesses, and windows are arranged between adjacent inner recesses and outer recesses to communicate the inner recesses and the outer recesses. The application can make the refrigerant flow following the principle of gravity through the windows, realize the gravity power condition of the evaporation and condensation process, improve the circulation efficiency of the loop heat pipe heat exchanger and improve the heat exchange effect.

The application discloses a sunken pavement snow-melting and ice-melting loop heat pipe installation structure and belongs to the technical field of pavement ice-melting, and solves the problems of large working medium resistance, short effective snow-melting, high cost and low reliability caused by the need of adding a heat source due to long-distance laying of the existing heat pipe. The sunken pavement snow-melting and ice-melting loop heat pipe installation structure comprises a road snow-melting unit, a heat supply unit and a heat exchanger. The loop heat pipe of the road snow-melting unit comprises a heating loop and an evaporator. The heating loop comprises an evaporation pipe, a heating pipe and a liquid return pipe. The heating pipe is buried in a pavement or a bridge deck. The evaporation pipe and the liquid return pipe are respectively arranged at the top and the bottom of the evaporator to form a closed loop. The heat supply station is arranged at the side of the road and is communicated with the heat exchanger through a pipeline. The heat exchanger is lower than the heating loop. The height difference between the liquid return pipe and the evaporation pipe in the evaporator is 0.8-1.5 m. The effective snow-melting length is proportional to the height difference. The application utilizes the height difference to form a gravity driving force, and can prolong the effective snow-melting length and reduce the cost without an additional heat source. The application is suitable for different installation scenes of long-distance bridge decks and pavements.

The utility model relates to a kind of test bench of multiple heat source air-cooled radiator based on loop heat pipe in the test technical field of loop heat pipe air-cooled radiator, including multiple heat source air-cooled radiating module, N heat source, temperature acquisition instrument, air duct, air parameter acquisition instrument, power adapter and support;The multiple heat source air-cooled radiating module includes steam header, liquid header, radiator and N group of radiating unit;The radiating unit includes evaporator, steam pipeline and liquid pipeline.The utility model has multiple heat source scene simulation ability, test working condition flexible adjustable, and can realize the multiple heat source air-cooled radiator test bench based on loop heat pipe of multidimensional data monitoring, it has important significance to accurately evaluate radiator performance, accelerate product development process.

The utility model provides a kind of loop heat pipe radiator, including mounting seat, the recess is opened in the mounting seat inside near left and right sides, mounting plate is fixedly installed in the recess inside, two the annular heat pipe is fixedly installed in the inner wall of mounting plate, annular baffle is fixedly installed in the inner wall of mounting seat and is located mounting plate front and back sides, the limit port is opened in the front and back sides of mounting plate, the limit hole is opened in the inner side of mounting plate and is located limit port side, heat dissipation component is arranged in the inner side of mounting seat, under the mutual cooperation of heat dissipation component and limiting component, the installation and replacement of heat dissipation component can be completed without complex operation steps, reduce maintenance difficulty, reduce part damage risk, save maintenance time and cost, through the setting of clamping groove and clamping block, staff can flexibly increase or reduce the number of heat dissipation fins according to heat dissipation demand, or adjust fin spacing.