Plate loop heat pipe (I)

Abstract

The plate loop heat pipe includes at least one annular loop plate inside a hollow casing to form at least one loop including successively connected evaporating area, steam channel, condensing area and fluid returning channel. Proper amount of fluid is filled inside the casing, the fluid returning channel is independent form the steam channel, the cover of the annular loop is provided with capillary structure, and the flow resistance of the steam channel is smaller than that of the fluid returning channel. The fluid is heated in the evaporating area, heat dissipated in the condensing area and made to flow stably in one direction, and thus the non-coagulating gas in the loop has less effect on the temperature homogeneity of the loop. The heat pipe has high heat homogeneity and large heat transferring amount.

Description

technical field [0001] The invention belongs to a flat plate loop heat pipe, in particular to a heat exchange structure with large heat transfer, good temperature uniformity, and little influence on the characteristics of the loop system for the non-condensable gas existing in the plate heat pipe. Background technique [0002] Existing heat pipes have been widely used in heat dissipation components of electronic components due to their relatively good heat transfer properties. Usually, heat pipe-type heat dissipation components have a heat pipe 1 and a heat conducting block 11 at the end of the electronic component. The heat conducting block 11 is connected to one end of the heat pipe 1, and the other end of the heat pipe 1 can be connected to the heat exchange device through another heat conducting block, or the other end of the heat pipe 1 is directly sandwiched with several cooling fins 12. figure 1 Shown in, namely is the heat pipe of radiating fin 12 formula. [0003] ...

AI Technical Summary

Problems solved by technology

[0005] When one end of the heat pipe 1 is heated and the liquid in the heat pipe evaporates, the vapor flows toward the condensation area and condenses into a liquid, and the liquid returns to the evaporation area through the capillary tissue. Since the fluid return circuit of the heat pipe is set in the same channel, the vapor will The flow directions of the liquid flow and the liquid flow conflict with each other in the channel, which reduces the heat transfer, and the remaining non-condensable gas in the channel is stored in the condensation area, forming an area with a large temperature difference, which reduces the temperature uniformity and heat transfer performance. Therefore, it is also greatly reduced. Therefore, traditionally, the manufacturing conditions and maintenance of heat pipes are strictly required, so the cost is greatly increased, and the selling price is increased, which is quite uneconomical. To solve the problem of poor heat transfer of existing heat pipes

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