15874 results about "Heat pipe" patented technology

A cooled electrosurgical system includes an electrosurgical device having at least one electrode for applying electrical energy to tissue. In one embodiment, the electrode includes an internal cavity in which a cooling medium such as water is contained. The internal cavity is closed at both ends of the device such that the cooling medium is contained within the electrode at the surgical site such that the cooling medium does not contact the tissue being treated. The electrosurgical device has an electrode and a heat pipe to conduct heat from the electrodes where substantially all heat conducted from the electrode through the heat pipe is dissipated along the length of the heat pipe. The heat pipe can have a thermal time constant less than 60 seconds and preferably less than 30 seconds.

The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

An LED lamp includes bare LED chips, an axle, and a lampshade. The bare LED chips are mounted on surface of the axle. The axle extends across the lampshade. A heat pipe is installed inside the axle for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.

A vapor escape membrane for use in a heat exchanging device, including a heat pipe or heat sink that runs liquid into a cooling region positioned adjacent to the heat producing device, the vapor escape membrane comprising: a porous surface for removing vapor produced from the liquid in the cooling region, the membrane configured to confine the liquid only within the cooling region. The vapor escape membrane transfers vapor to a vapor region within the heat exchanging device, wherein the membrane is configured to prevent liquid in the cooling region from entering the vapor region. The membrane is configured to include a hydrophobic surface between the membrane and the cooling region, wherein the liquid in the cooling region does not flow through the porous surface. The vapor escape membrane includes a plurality of apertures for allowing vapor to transfer therethrough, each of the apertures having a predetermined dimension.

A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly spaced from one another. A top plate covers the bottom plate with the rods compressed therebetween. Channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid. The fluid and its vapor circulate in the channels to convey heat from a warm end of the heat pipe to a cool end. The heat sink is of similar construction.

A heat pipe is partially-filled with a liquid, such as water, and is used to transfer heat from a rotating element, such as a rotor, via phase change and internal recycle of the liquid. Several heat pipes may be disposed radially around the rotating axis of the rotating element. The heat pipes may have a curved inner surface with a curvature not corresponding to the central axis of the heat pipe and positioned opposite the rotating axis so to experience greater centrifugal forces, to advance formation of a liquid film to improve heat transfer. For a rotor, the heat pipes, though individually placed as revolving heat pipes, in total exhibit behavior that approximates the favorable heat-transfer behavior of a single larger rotating heat pipe, but with heat-transfer surface area dispersed throughout the rotor, and without compromising structural integrity of the rotor shaft.

A disk drive box 10 accommodates a plurality of disk drives 20 within a case 11. A side face of each of the drives 20 is provided with a heat-absorbing part 40 including a heat pipe, corresponding to heat producing area HP. The heat taken away by the heat-absorbing part 40 is transmitted to a heat sink 50 of the rear of a backboard 30 via a heat connector 60. The heat sink 50 is cooled by cooling air flowing through an air duct 7. By cooling the drive 20 with the heat pipe, clearances between the drives 20 can be substantially eliminated, and it is made unnecessary to form an opening for air cooling in the backboard 30. Thus, size reduction is possible, and it is possible to increase the degree of freedom for a wiring pattern formed on the backboard 30.

An LED lamp conducting structure includes plate-type heat pipe of mask shape. A support plate mounted with LEDs is fixed on a plate-type heat pipe and then is placed within a lampshade. The plate-type heat pipe is made of metal with good thermal conductivity and has a plurality of through holes defined on bottom thereof. The support plate includes a plurality of electrode holes corresponding to the through holes. The anode contact and cathode contact of the LED are around the electrode hole. The contacts are exposed out of the support plate such that two screw-shaped electrode pins can be connected to the contacts after passing the electrode holes and the through holes. The electrode pins are locked to the plate-type heat pipe by screw such that the electrode pins have electrical connection with the contacts.

The within invention improves on the indirect evaporative cooling method and apparatus by making use of a working fluid that is pre-cooled with and without desiccants before it is passed through a Wet Channel where evaporative fluid is on the walls to take heat and store it in the working fluid as increased latent heat. The heat transfer across the membrane between the Dry Channel and the Wet Channel may have dry, solid desiccant or liquid desiccant and may have perforations, pores or capillary pathways. The evaporative fluid may be water, fuel, or any substance that has the capacity to take heat as latent heat. The Wet Channel or excess cooled fluid is in heat transfer contact with a Product Channel where Product Fluid is cooled without adding any humidity. An alternative embodiment for heat transfer between adjacent channels is with heat pipes.

High brightness LEDs are mounted directly on a heat pipe or are mounted on a substrate, which is mounted on the heat pipe. The heat pipe can be a common electrode for the LEDs mounted on the heat pipe. Multiple heat pipes can be arranged so that the LED arrays form a light recycling cavity to emit and reflect light. The resulting illumination system produces a higher brightness and higher total flux than any one of the individual LEDs making up the light source.

An LED lamp (100) includes a frame (12), at least one LED module (20), a heat sink (32) and a cover (50). The LED module has a plurality of LEDs (220). The heat sink is mounted on the frame. The at least one LED module is attached to a bottom of the heat sink, whereby heat generated by the LEDs can be dissipated by the heat sink. A heat pipe (35) interconnects the heat sink and the cover. Thus, the heat generated by the LEDs can also be dissipated by the cover via the heat pipe. The cover is secured so as to shield a top portion of the heat sink and space from the top portion of the heat sink.

A light-emitting diode reflector assembly having a heat pipe and a reflector body is provided. The assembly further includes a mounting member for mounting a circuit board having an array of light-emitting diodes. The mounting member and reflector body are made from a thermally-conductive polymer composition comprising: i) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite.

A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

An apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor device and provides enhanced cooling for the semiconductor device. The apparatus provides a relatively large surface area for transferring heat away from a semiconductor device, and provides for enhanced coolant flow through or around the apparatus. The apparatus includes a channel that may accommodate a heat pipe to further enhance transfer of heat away from the semiconductor device.

An LED lamp includes a transparent bulb, an LED module comprising a plurality of LEDs received in an inner space of the bulb, and a heat dissipation apparatus supporting and cooling the LED module. The heat dissipation device includes a heat sink having a hollow base and a plurality of fins extending from the base, a first heat conductor vertically supported by the heat sink, a second heat conductor horizontally mounted on the first heat conductor, and a heat pipe thermally connecting the heat sink, the first heat conductor and the second heat conductor together. The LEDs are positioned on the first heat conductor and the second heat conductor, respectively.

A heat-dissipating structure includes a heat-dissipating body and a heat pipe. The heat-dissipating body includes a first cylinder and a second cylinder provided within the first cylinder. A plurality of heat-dissipating pieces is further connected between the first cylinder and the second cylinder. A heat-dissipating path is formed between each heat-dissipating piece. The heat pipe is accommodated in the second cylinder and tightly connected thereto. With the heat conduction of the heat pipe, the heat generated by the operation of the LED lamp is absorbed and conducted to the second cylinder. Then, the heat is dissipated uniformly to the plurality of heat-dissipating pieces and the first cylinder. With the above arrangement, the present invention achieves the desired heat-dissipating effect and it is easy to grip and assemble the heat-dissipating body.

A catheter is adapted to exchange heat with a body fluid, such as blood, flowing in a body conduit, such as a blood vessel. The catheter includes a shaft with a heat exchange region disposed at its distal end. This region may include at least one balloon which is adapted to receive a remotely cooled heat exchange fluid preferably flowing in a direction counter to that of the body fluid. Embodiments including multiple balloons enhance the surface area of contact, and the mixing of both the heat exchange and the body fluid. The catheter can be positioned to produce hypothermia in a selective area of the body without cooling the entire body system. It is of particular advantage in brain surgeries where stroke, trauma or cryogenic tumors can best be addressed under hypothermic conditions. Heat pipe technology can be used to form a heat pipe heat exchange catheter. The heat pipe heat exchange catheter includes metallic bellows which allow for flexibility. The temperature control source can be portable to enable the heat pipe heat exchange catheter to be used in the ambulatory environment.

An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

This invention discloses heat dissipation devices for an LED lamp set with a plate-type heat spreader as the core unit. The plate-type heat spreader is either a flat-plate heat pipe or a metal plate embedded with heat pipes. The high-power LED lamps are thermally connected to the bottom surface of the heat spreader so that the heat generated by the LED lamps is absorbed by the evaporation region of the flat-plate heat pipe or the embedding heat pipes. The heat is spread by internal vapor motion of the working fluid toward different regions of the heat spreader. The top surface of the heat spreader is connected with a finned heat sink, where the heat is delivered to the ambient air. The hot air leaves by buoyancy through the openings on a lamp housing located above the finned heat sink. An alternative design is that the inner surface of the lamp housing is connected with the top surface of the plate-type heat spreader, with the heat dissipated out at the surface of the housing by natural convection.

A wind turbine generator includes a stator having a core and a plurality of stator windings circumferentially spaced about a generator longitudinal axis. A rotor is rotatable about the generator longitudinal axis, and the rotor includes a plurality of magnetic elements coupled to the rotor and cooperating with the stator windings. The magnetic elements are configured to generate a magnetic field and the stator windings are configured to interact with the magnetic field to generate a voltage in the stator windings. A heat pipe assembly thermally engaging one of the stator and the rotor to dissipate heat generated in the stator or rotor.