146results about How to "Improve thermal reliability" patented technology

A cooling unit to cool the display apparatus including a heat generating unit to generate heat and a casing to accommodate the heat generating unit, the cooling unit includes a cooling fan to generate air flow; a duct which is coupled with the casing and forms a cooling path to connect the cooling fan and the heat generating unit; an inlet portion which is provided to one side of the casing to communicate with the duct; an inlet grill which is provided in the inlet portion to guide air to be inhaled in a direction inclined to a rear surface of the casing; an outlet portion which is provided to an other side of the casing to communicate with the duct, being spaced from the inlet portion; and an outlet grill which is provided in the outlet portion to guide air to be exhaled in a direction inclined to a rear surface of the casing, wherein the exhaled direction provided by the outlet grill is different from the air-inhaling direction provided by the inlet grill. With this configuration, the cooling path is effectively provided to enhance cooling efficiency and thermal reliability.

The invention provides an LED (Light Emitting Diode) lamp filament and a manufacturing method thereof. An LED chip is encapsulated on the edge top surface of a thin and long sheet metal support of the LED filament innovatively, meanwhile the sheet metal is inserted into a preformed transparent plastic model frame to produce a light source, and accordingly the automated continuous production of the LED lamp filament is implemented and the problem of the facing direction strength caused by the too thin and too long metal support is solved due to the transparent plastic model frame; meanwhile the lateral direction strength of the metal support is effectively utilized and accordingly the integral mechanical strength of the LED lamp filament is ensured; the heat dissipation characteristics of the metal is directly utilized, meanwhile the heat dissipation efficiency of the LED chip is maximized through the innovative encapsulation of thermal conductive coatings, and accordingly the problem of a heat dissipation bottleneck of the LED lamp filament is effectively solved, the LED lamp filament can work at the rated power for a long time, and the cost is reduced; the LED light extraction efficiency is improved, the light attenuation is reduced, the high lighting effect and ambient light of lamp filament light emission is implemented, and the market vacancy of the existing LED lamp filament is filled through innovative fluorescence encapsulation materials.

A backlight unit is provided with LEDs having a cooling structure. The backlight includes a heat pipe, which is disposed below a PCB having the LEDs thereon, and a heat sink connected with the heat pipe. Heat generated from the LEDs conducts via the PCB and the heat pipe and is then radiated by the heat sink. The cooling performance of the backlight unit is thus enhanced and the temperature increase in the light emission region is thus suppressed, so that thermal reliability of the LEDs is enhanced and light efficiency is increased to increase the brightness and to decrease the power consumption.

The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

A phosphazene compound, which can effectively enhance flame retardancy without deteriorating mechanical properties of a resin molded product, and is also less likely to deteriorate thermal reliability and dielectric properties, is represented by the formula (1) shown below. n represents an integer of 3 to 15.

wherein A represents a group selected from the group consisting of an alkoxy group, an aryloxy group and a group having a cyanato group, and at least one is a group having a cyanato group, and an example of A is a cyanatophenyl-substituted phenyloxy group represented by the formula (4) shown below, and Y in the formula (4) represents O, S, SO₂, CH₂, CHCH₃, C(CH₃)₂, C(CF₃)₂, C(CH₃)CH₂CH₃ or CO.

The invention provides a liquid thermosetting resin composition. The composition comprises the components in weight percentage: 30 to 80 percent of epoxide resin, 2 to 25 percent of firming agent, 20 to 80 percent of filling material, 0.001 to 5 percent of thixotropic agent, 0.001 to 5 percent of visbreaking dispersant, 0 to 5 percent of foam suppressor and a catalyst the weight of which is no more than 0.5 percent of the total weight of the epoxide resin and the firming agent; the components are mixed and evenly stirred; the liquid thermosetting resin composition has the advantages of good fluidity and metallic wettability, higher Tg, lower CTE and good self deaeration performance, and can overcome the defects of shrinkage in a hole, cracking in the hole, bubble in the hole and the connection of resins between holes. The invention also provides a method for manufacturing a printed circuit board by using the liquid thermosetting resin composition, which aims to improve the defects of the insufficient rubber filling after plate pressing and the cracking or the layering of resins after thermal shock and improve the credibility such as the heat reliability, etc. of the thick copper printed circuit board.

The invention discloses a thermosetting resin composition, which comprises the following components: bifunctional or multifunctional epoxy resin, styrene-maleic anhydride copolymer SMA as a curing agent with styrene/maleic anhydride molar ratio of 5-12:1, low-bromine or high-bromine BPA type epoxy resin or tetrabromo bisphenol A as a fire retardant, an accelerator and a solvent. The resin composition after curing has quite low dielectric property, higher heat reliability and better toughness, has quite low dielectric constant and dielectric loss coefficient, high Td, better toughness and excellent PCB processability with a copper-clad plate made of glass fiber cloth and other reinforcing materials, is suitable for manufacturing a copper-clad plate and a semi-cured plate for PCB, and can also be used in common application of the epoxy resin, such as molding resin, composite materials for buildings, automobiles and aviation, and the like.

The present invention relates to an unleaded compatible high-frequency clad copperplate and its preparation method, a key technology which is used to produce a resin composition and NE fiberglass cloth for producing the clad copperplateL, and an adhesive film and clad copperplate made from this technology. The resin composition has the following groups and contents: a multi-functional epoxy resin: 30 ~ 45 percents, a phosphorus-containing phenolic resin: 20 ~ 30 percents, a polytetrafluoroethylene: 20 ~ 30 percents, a solidify curing accelerator: 0.5 ~ 1.5 percents, an inorganic filler: 20 ~ 30 percents, and a solvent: an adequate percent. The clad copperplate made of this, does not contain non bromine, according to the RoHS directive requirements, and has a high thermal reliability, excellent dielectric properties, low thermal expansion coefficient and excellent flame retardant properties.

The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.

The invention discloses an intelligent cooling system based on split cooling and reverse cooling for an engine, and a control method. The cooling system comprises a cylinder cover water jacket, a body water jacket, an electronically-controlled water pump, electronic thermostats, an electronically-controlled fan, a heat dissipater, an expansion water tank, temperature sensors, motors and an electronic control unit. During a working process of the system, the electronically-controlled water pump pumps a cooling liquid in the engine, the first electronic thermostat controls the cooling liquid to enter the cylinder cover water jacket and the body water jacket according to cooling liquid temperature signals of a cylinder cover and a body respectively, flow from top down, and flow out after the cooling the cylinder cover and the body; and the second electronic thermostat distributes the flow rate of the cooling liquid entering large circulation and small circulation according to a cooling liquid temperature of a main tube, and the cooling liquid is circulated and then pumped in the engine to cool. The cooling system disclosed by the invention is capable of accurately distributing the flow rate of the cooling liquid in the cylinder body and the body of the engine, reducing the phenomenon of non-uniform cooling, and shortening the warm-up time of the engine; and the heat states of heated components are optimized through the reverse cooling.

The invention relates to an LED chip and a processing technology thereof, and belongs to the technical field of manufacturing of photoelectron devices. The technology comprises the following steps: a P-type nitride layer on an epitaxial wafer substrate is etched to expose an N-type nitride layer; a current blocking layer is manufactured under a P-type electrode bonding pad area, an insulating substance under the P-type electrode bonding pad area, an insulating substance in direct contact with an N-type electrode bonding pad, and an expanding electrode and the P-type nitride layer, and an insulating substance on the side walls of a quantum well and P-type nitride are reserved through etching; an ITO film deposits on the surface of the substrate, a current expanding layer and alloy are manufactured through photoetching, a metal layer is formed on the surface of the substrate through vapor deposition, and after a part of the metal layer is stripped, a P-type electrode bonding pad, an N-type electrode bonding pad and an N metal expanding electrode are formed. Both the P-type electrode bonding pad and the N-type electrode bonding pad of the product are positioned on a P-type light-emitting surface and are the same in height; a part or all of the N metal expanding electrode is in direct contact with the N-type nitride layer. The invention has the advantages that the routing is convenient, the light-emitting efficiency and the brightness of the LED chip on the nitride substrate can be improved.

A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

This invention relates to a resin combination and the prepreg, copper clad laminate for PCB and PCB which use the resin combination. It takes the cyanide phosphorus ester, epoxy resin, flame retardants containing helium as raw materials, adds inorganic fillers to produce the prepreg in the effect of solvent, takes NE fiberglass cloth as the substrate to immerse into prepreg producing the prepreg material, then heats and pressurized the laminated electrolytic copper foil to produce the copper clad laminate for PCB and PCB. The invention makes the products achieve reliability of high fever, excellent referral power, relatively low thermal expansion coefficient and flame retardant without halogens, phosphate, and lead.

The invention discloses a control method of a combined type air-conditioning system with a natural cooling function. The control method of the combined type air-conditioning system with the natural cooling function is characterized in that the system comprises a compressor module, an air-cooling heat exchange module, a multifunctional liquid storage device, a liquid pump, an air treatment module and control valves, wherein the air-cooling heat exchange module is composed of a heat exchanger assembly and a cooling fan; and the control method comprises the step that the three different work modes including a compression refrigeration work mode, a compression refrigeration and natural cooling coordinated operation combined refrigeration work mode and the natural cooling work mode are achieved by operating the control valves to change the flowing path of refrigeration media. According to the control method of the combined type air-conditioning system with the natural cooling function, fuzzy control is used for adjusting the refrigeration capacity, natural cooling is used for replacing compression refrigeration in low-temperature or transition seasons, natural cold resources are efficiently utilized, the control method is particularly suitable for control over the work environments of data centers, high-performance computers, communication base stations and power electronic equipment, and the energy consumption and operating cost of the air-conditioning system are greatly reduced.

The present invention provides a semiconductor device (1) which can improve the hear resistance reliability. The semiconductor device includes a wiring substrate (10, 10A), a first semiconductor chip (21) mounted on the wiring substrate, and a second semiconductor chip (22) mounted on the wiring substrate. The second semiconductor chip generates less heat than the first semiconductor chip. A heat dissipation plate (30, 30A) is arranged on the wiring substrate and partially at a higher location than the first and second semiconductor chips. The heat dissipation plate is connected to the first semiconductor chip and includes an opening (30X) formed at a location corresponding to an upper surface of the second semiconductor chip. The upper surface of the second semiconductor chip is entirely exposed from the heat dissipation plate (30, 30A) through the opening (30).

The invention discloses a low temperature co-fired ceramic-based micro-electromechanical system (MEMS) packaging method. The method comprises the following steps of: preparing an upper low temperature co-fired ceramic substrate and a lower low temperature co-fired ceramic substrate respectively and forming a three-dimensional electrically-interconnected network, an embedded micro-channel and an open cavity in the upper substrate and/or the lower substrate; aligning the upper substrate with the lower substrate for packaging, packaging components and parts in the cavity and communicating the micro-channel with the cavity and the outside of a packaged body; and connecting an external micro-tube to the outlet of the micro-channel, which leads to the outside of the package body, and realizing gas or liquid flow between the cavity and the outside through the external micro-tube. The method has the advantages of improving the integration level, the stability and the flexibility of MEMS packaging, realizing vacuum packaging and heat dissipation of the components and parts in the cavity by conveying a circulating radiating medium through the micro-channel and conveying detection samples and the like to medical, biological or chemical MEMS components and parts in the packaging cavity through the micro-channel.

Provided is a motor and a control device thereof. The motor is provided with a stator assembly 1 provided with a cooling duct in the inside, a rotor assembly 2, a coaxially installed rotary transformer stator 31, a rotary motor provided with a rear end cover assembly 3 of at least one motor winding outgoing line window 321 along the axial direction and a control device installed at the non-shaft output end of the rotary motor and extending along the axial direction. The control device is composed of a column-shaped cavity base body 4 provided with a water inlet 44 communicated with a power device module cooling cavity, a semi-arc column-shaped capacitor assembly 5 installed in the column-shaped cavity base body 4, a semi-arc column outgoing line assembly 6 including two current sensor assemblies 62 embedded in the inside, a power semiconductor device module 7 installed between the capacitor assembly 5 and the outgoing line assembly 6, a control board assembly 8 installed above the capacitor assembly 5 and the outgoing line assembly 6, an annular groove installed on the outer side of the column-shaped cavity base body 4 and provided with an installing O-shaped ring 91 on one side, an end cover 91 provided with at least one bus fastening port 921 provided with inner threads and a cover body assembly 9 of an air communicating device 94.

Disclosed herein is a semiconductor chip, including: a first substrate having a concave formed on one surface thereof and an opening formed on a bottom surface of the concave; a second substrate contacting the other surface of the first substrate; and a semiconductor chip mounted in the concave.

The embodiment of the invention discloses a temperature control system and a temperature control method of a machine cabinet. The system comprises a machine cabinet and at least one heat dissipation pipeline which is communicated with the machine cabinet and vertically penetrates through the ground. A sealed internal circulation cavity is formed in the machine cabinet, and forms internal circulation through an air driving system of the equipment in the machine cabinet; the heat dissipation pipeline comprises a first pipeline positioned in the machine cabinet and a second pipeline buried underground; the first pipeline comprises an air outlet, is positioned at the upper part of the machine cabinet and is communicated with ambient air; the second pipeline comprises an air inlet communicated with the ambient air; the inner wall of the first pipeline is a heat exchange wall, and the heat exchange between an external circulation cavity formed by the first pipeline and the internal circulation cavity is realized through the heat exchange wall; and the heat dissipation pipeline is provided with at least one air conveying device for driving the air to flow in the heat dissipation pipeline. The embodiment of the invention is suitable for the temperature control of outdoor equipment, in particular for the heat dissipation of the outdoor equipment.

An adhesive composition comprises 10 to 100 parts by weight of a first maleimide compound having a plurality of maleimide groups in a structure and having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and/or a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds based on 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in a structure. A heat resistant adhesive film formed by coating the adhesive composition on a substrate film, and a wiring film having a conductor wiring layer put between heat resistant adhesive films are also disclosed.

A rotary electrical machine incorporating an electronic module that includes a printed circuit mounted with a plurality of surface mounted electronic components and a plurality of pin-through-hole electronic components; the electrical machine includes a dissipator for dispersing the heat generated by the electronic module; the surface mounted electronic components and the pin-through-hole electronic components are mounted between the printed circuit and the dissipator; the electronic module also includes a transferring element, also mounted between the printed circuit and the dissipator, in thermal contact with at least one of the surface mounted electronic components; the transferring element is designed to disperse the heat generated by the surface mounted electronic components towards the dissipator with the aid of a thermally conductive and electrically isolating filler material inserted between the transferring element and the dissipator.

A wavelength converter is provided with a light-transmitting substrate and with a thin film that is formed on a surface of the light-transmitting substrate and that contains a phosphor. A sintered body that constitutes the light-transmitting substrate has an average particle size of 5-40 μm. The light-transmitting substrate contains at least 10-500 ppm by mass of MgO. The principal component of the phosphor is an α-sialon that is indicated by the general formula (Ca_α,Eu_β) (Si,Al)₁₂(O,N)₁₆ (provided that 1.5<α+β<2.2, 0<β<0.2, and O/N≦0.04).

The invention discloses an encapsulating structure and an encapsulating method of a combiner. The encapsulating method comprises the following steps of: 1, encapsulating a manufactured combiner product on a substrate and fixing optical fibers at the two ends of the substrate by using primary glue; 2, putting the substrate on which the combiner is arranged into a circular pipe and sealing the two ends of the circular pipe by using secondary glue; and 3, encapsulating the circular pipe into a metal box by using third glue, making an input optical fiber and an output optical fiber of the combiner extend out of the two ends of the metal box and putting gum caps into the two ends of the metal box so as to protect the optical fibers. The encapsulating method has a simple process. The encapsulated combiner has the characteristics of high long-term working stability, high radiating reliability and the like.

The invention discloses a novel engine intelligent cooling system and control method based on engine split cooling and reversed cooling. The cooling system comprises a cylinder cover water sleeve, an engine body water sleeve, an electronic control water pump, electronic thermostats, an electronic control fan, a radiator, an expansion tank, a temperature sensor, a motor and an electronic control unit. In the working process of the system, cooling liquid is pumped into an engine water sleeve through the electronic control water pump, the first electronic thermostat controls the cooling liquid to enter the cylinder cover water sleeve and the engine body water sleeve according to the rotating speed and load signals of an engine, and the cooling liquid flows from top to bottom and passes through a cooling cylinder cover and an engine body to flow out; and the second electronic thermostat distributes the flow of the cooling liquid entering large circulation and small circulation according to the temperature of the cooling liquid of a header pipe, and the cooling liquid is circulated to be pumped into the engine body of the engine to be cooled. By means of the novel engine intelligent cooling system and control method, the flow of the cooling liquid of the cylinder cover and the engine body of the engine can be accurately distributed, uneven cooling is reduced, and the heating time of the engine is shortened; and meanwhile, the heat state of heated components is optimized through reversed cooling.