12results about How to "Improve thermal reliability" patented technology

The utility model discloses a control box device for fresh air handling unit belongs to fresh air system control equipment technical field. The device includes the box body of installing in the one -way air duct of fresh air handling unit, and the opening direction of box body is perpendicular with the wind direction and has the outer open box door of hinged, and the door opening direction of box is the adverse wind direction, and the door closing assembly contains the vertical pressure -bearing plate, and one end is fixed to the outside of box door, and the other end is inclined to the direction of away from the box body and forms the pressure -bearing surface. The component of force that the airflow acts on the inclined pressure -bearing surface generates is converted into the door closing moment, realizes the automatic locking of box door. The problem that the control box in the air duct leads to the sealing failure of air flow impact, the operation difficult problem is solved, and the box door is locked by wind energy, and the sealing reliability is improved significantly, and the stability of equipment under the vibration, high pressure difference working condition is enhanced.

This invention relates to the field of electronic packaging composite materials technology, and particularly to a thermally conductive epoxy encapsulation material, its preparation method, and its application. The invention uses Fe3O4 nanospheres and sodium polyacrylate solution as raw materials to prepare polyacrylic acid-modified Fe3O4 nanospheres; these are then blended with adipic acid and epoxy resin, and a thermally conductive epoxy encapsulation material is prepared through a curing reaction. The thermally conductive epoxy encapsulation material prepared by the method of this invention exhibits uniform dispersion of Fe3O4 nanospheres, good interfacial compatibility, and high thermal conductivity, demonstrating excellent thermal conductivity, interfacial reliability, and mechanical properties, making it well-suited for electronic chip packaging applications.

A data center cooling system control method and device based on a constraint neural network, the method comprising: acquiring thermodynamic parameters of a data center cooling system in real time, and constructing an original database; preprocessing data in the original database to obtain a power consumption dataset and a chip temperature dataset; training a power consumption prediction neural network using the power consumption dataset and a penalty function; training a chip temperature prediction neural network using the chip temperature dataset and the penalty function; the penalty function for temperature prediction adopts an adaptive penalty function, and a penalty factor is introduced when the model predicted temperature is lower than the actual temperature, so that the model predicted temperature is always higher than the actual temperature; and taking the minimum power consumption of the system as an optimization objective, and taking the actual temperature of the chip being less than the upper limit of the chip temperature as a constraint condition, the optimal control parameters under different environmental temperature and humidity and heat load are optimized. The optimization control result can be maintained within the critical temperature of the chip, and the energy saving of the data center is maximized.

The invention relates to a semiconductor structure, a preparation method thereof and electronic equipment. The semiconductor structure includes: an oxide semiconductor layer; the source / drain electrode is arranged around the oxide semiconductor layer; and the induction layer is positioned between the source / drain electrode and the oxide semiconductor layer and is used for inducing the oxide semiconductor layer to be converted into a crystalline structure from an amorphous structure. The thermal stability and reliability of the oxide transistor can be effectively improved.

The invention discloses a rapid heat dissipation double-layer battery pack and a control method thereof.The rapid heat dissipation double-layer battery pack comprises a double-layer protective shell, a plurality of battery cells are evenly distributed on orientation rotating assemblies, and synchronous driving gear assemblies used for driving the orientation rotating assemblies to rotate synchronously are arranged among the orientation rotating assemblies; the plurality of battery cells on the orientation rotating assembly and the plurality of battery cells on the adjacent orientation rotating assembly are arranged in a staggered and meshed manner in the rotating process, so that compact layout is realized; the inner wall of the protective shell is provided with an air-cooling heat dissipation assembly for blowing and heating the plurality of battery cells positioned on the outer side; the problems that heat dissipation of inner and outer side battery cores of an existing double-layer battery pack is unbalanced, compact layout contradicts with heat dissipation efficiency, heat dissipation response lags behind in a high-temperature scene, and transmission and heat dissipation channels are prone to being interrupted after layering separation are solved, self-adaptive balanced heat dissipation is achieved, the working stability and safety of the battery pack are improved, and the service life of the battery pack is prolonged.

The application provides a vehicle-mounted air conditioner temperature control system and a vehicle. The vehicle-mounted air conditioner temperature control system comprises a vehicle-mounted air conditioner system, wherein the vehicle-mounted air conditioner system comprises an air outlet pipeline; and a gravity heat pipe assembly, wherein one end of the gravity heat pipe assembly is arranged in the air outlet pipeline, and the other end of the gravity heat pipe assembly is arranged on a vehicle-mounted controller for an entertainment host; and wherein when the vehicle-mounted air conditioner system is working, the gas generated by the vehicle-mounted air conditioner system exchanges heat with the gravity heat pipe assembly at the air outlet pipeline. The vehicle-mounted air conditioner temperature control system adopts gravity capillary action for passive heat dissipation, and the heat in the vehicle-mounted controller for the entertainment host is exchanged by the gravity heat pipe assembly, so that the heat is transferred to the heat dissipation part in the air conditioner channel, and the cold air in the air conditioner channel carries away the heat of the heat dissipation part, thereby achieving heat dissipation of the controller.

This invention discloses a silicon-based RC chip co-packaging structure for power devices and its fabrication method. The co-packaging structure includes, from bottom to top, a heat dissipation substrate, a common substrate, a power chip, a silicon-based RC buffer chip, an interconnect structure, power terminals, and auxiliary terminals. The fabrication method includes the following process flows: S100 substrate fabrication, S200 chip mounting, S300 interconnect assembly, and S400 substrate and terminal assembly. This invention achieves high compatibility with existing power module packaging processes, eliminating the need for additional dedicated equipment or significant production line modifications. While reducing manufacturing costs, improving production yield, and shortening production cycles, it ensures consistent performance in mass production through standardized processes. Overall, this invention optimizes parasitic parameters, achieves compact structure, integrates thermal management, and stabilizes performance in power modules, making it suitable for various high-voltage, high-frequency, and high-power-density power electronics applications.

A method of manufacturing a glass lens disclosed in an embodiment of the present invention includes: providing a mixture by mixing glass particles, a polymer filled between the glass particles, and an additive; injection molding the mixture through a mold assembly having a lens shape; debinding the polymer from a lens-molded piece injection-molded into the lens shape; sintering the glass particles of the debound polymer-molded piece; and machining the sintered molded piece to be provided as a glass lens, wherein at least one of an object-side surface and an image-side surface of the glass lens can have an inflection point.

This invention discloses a multi-powered combined unmanned aerial vehicle (UAV) intelligent cooling system, specifically comprising a core control unit, a power unit, an execution layer unit, a perception layer unit, and a decision-making layer unit. The physical components of each unit are integrated into a frame to form a flight module. The core control unit coordinates the operating conditions of the power unit and the cooling actions of the execution layer unit via a data bus. Temperature sensors in the perception layer unit collect real-time temperature data from the engine block, radiator, and main cooling channel. The decision-making layer unit dynamically generates drive signals based on the temperature data and the engine ECU's requirements. The system innovatively uses hollow tubing within the frame to form the main coolant channel, combining a liquid-cooled engine with an air-cooled radiator to form a composite cooling circuit. Intelligent flow regulation is achieved through solenoid valves and a circulating water pump, providing three modes: basic coordination, differential temperature control, and fuel preheating. This invention upgrades the UAV cooling system from passive heat dissipation to active thermal management, improving the operational efficiency and reliability of multi-powered UAVs.

The invention provides a low-power-consumption infrared detector system and a working method, and solves the technical problems that an existing infrared detector is large in size and high in power consumption, and long-time stable communication of a laser communication system is restricted. The PCB circuit board comprises a first PCB circuit board and a second PCB circuit board. The top of the first PCB is provided with an infrared detector chip, the bottom of the first PCB is connected with the top of the second PCB through an internal connector, the bottom of the second PCB is provided with an external high-speed connector, and the external high-speed connector is used for transmitting infrared image data to the main control processor. The method can be widely applied to the technical field of laser communication.

The utility model belongs to the technical field of electronic device heat management, disclose a kind of power management integrated circuit device with radiating fin structure, including base, chip main body and lower heat-conducting sheet, chip main body and lower heat-conducting sheet are connected in the top of base, the scheme is through optimizing heat dissipation structure, using the combination of integrally formed lower heat-conducting sheet, radiating fin and upper heat-conducting sheet, the thermal resistance between each component is effectively reduced, the efficiency that heat spreads and releases from chip main body outward is improved, make structure simplify and facilitate installation;Through using heat-conducting film, docking block and serpentine cooling channel etc. Design, further improve heat transfer efficiency and heat dissipation capacity;Through the connection with external cooling liquid circulating system, can actively assist heat dissipation, enhance the thermal stability and reliability under high-power operation, ensure that chip can work stably under high heat flux density condition, with significant heat dissipation performance and structural advantages.

The utility model relates to the field of big horsepower tractor, more particularly to a kind of tractor expansion space arrangement structure and tractor, it includes: main use expansion water tank and standby expansion water tank, respectively set in the different height of tractor and main use expansion water tank higher than standby expansion water tank;Overflow pipe, overflow port is set in the top of main use expansion water tank, one end of overflow pipe is connected with main use expansion water tank, and the other end is communicated with standby expansion water tank;Wherein, water inlet is set on main use expansion water tank, water inlet is connected with engine water tank by water pipe, for receiving the cooling liquid overflow when engine water tank expansion.It can effectively solve the contradiction between the expansion space demand of big horsepower tractor and the limited space of whole machine, improve the heat dissipation reliability of engine, optimize space layout, reserve more space for other components arrangement of tractor, improve the overall performance and reliability of tractor.