1519 results about "Open cavity" patented technology

Methods of fabricating a Micro-Electromechanical System (MEMS) in a hermetically sealed cavity formed at a substrate level are provided. Generally, the method comprises: (i) forming a number of first open cavities in a surface of a first substrate and a number of second open cavities in a surface of a second substrate corresponding to the first open cavities; (ii) forming an actuator/sensor layer including a number of MEMS devices with electrically conductive regions therein; (iii) bonding the first substrate and the second substrate to the actuator/sensor layer so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices to form a sealed cavity around the MEMS; and (iv) electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect. Other embodiments are also described.

System for providing an open-cavity semiconductor package. The system includes a method for wire bonding a finger sensor die to an external circuit. The finger sensor die includes a sensor array having one or more die contacts that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire, forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height, and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.

Various embodiments provide semiconductor devices having cavity substrate structures for package-on-package assembly and methods for their fabrication. In one embodiment, the cavity substrate structure can include at least one top interconnect via formed within a top substrate. The top substrate can be disposed over a base substrate having at least one base interconnect via that is not aligned with the top interconnect via. Semiconductor dies can be assembled in an open cavity of the top substrate and attached to a base center portion of the base substrate of the cavity substrate structure. A top semiconductor package can be mounted over the top substrate of the cavity substrate structure.

A piezoelectric micromachined ultrasonic transducer comprising a substrate and a first dielectric film formed on the substrate. An opening having a sidewall is formed through the substrate and first dielectric film. A bottom electrode is formed on the first dielectric film spanning the opening. A piezoelectric element is formed on the bottom electrode. A second dielectric film surrounds the piezoelectric element. A conformal insulating film is formed on the sidewall of the opening. A conformal conductive film is formed in contact with the bottom electrode and on the sidewall of the opening, wherein an open cavity is maintained in the opening. A top electrode is formed in contact with the piezoelectric element.

A one-piece clamping element has two opposing clamping jaws forming a laterally open cavity to receive a rod-shaped element. A hinge is located between the jaws, arranged opposite the cavity, and connecting the clamping jaws with one another and thus allowing them to be movable with respect to one another. Each clamping jaw has one bore, aligned flush with one another. One clamping jaw has a receptacle for an anti-rotation device, so that two identical clamping elements, with the possible exception of the size of the rod receptacle, can be placed on top of one another to form an articulation element.

A helmet includes a head enclosure with an open cavity for the head of a user and a shock detector attached to the head enclosure that provides a signal when the head enclosure is subjected an impact exceeding a predetermined level.

A filtering apparatus fits adjacent to the nostrils and nose of the user and includes a rigid base for retaining a filtering material thereon through which the user may breathe. The filter material takes the form of an open-cell foam, in the form of a pad, which is removably held between retainer members carried on the rigid base. The foam pad includes a peripheral sidewall and defines an open cavity in the thickness thereof. A clamping device included in the base has an upper and lower plate that are joined together by fasteners. A supporting arrangement for facial wearing comprises a pair of elongated ear support members arranged in spaced-apart relationship and joined together to define a pivot or hinge mechanism that is captured beneath the opposing surfaces of the base plates.

A device for applying a hair product to sections of hair includes a first part having an open cavity to contain the hair product. The product is applied to the section of hair by contacting the section of hair with the product inside the cavity and moving the device relative to the section of hair. The device also includes a second part having a retention member that is movable relative to the cavity to selectively open and close the cavity. When closed, the retention member keeps the section of hair in contact with the product inside the cavity as the device moves relative to the section of hair. The retention member preferably includes a porous and/or fibrous element that can absorb or in other words be impregnated with the hair product.

An adjustable backrest has a series of adjustable straps extending across a front opening cavity of a backrest support. The straps are held in a locked, fitted position by a series of buckles at one side of the backrest which engage and lock the straps. Each strap is acted on by a bias arrangement and urges the straps to a drawn position across the front open cavity. This drawn position is an initial setup position that allows fitting of the backrest for a particular user.

A container body, comprising a single fiber structure molded into the container body having an integral bottom portion and an integral side portion; an open cavity defined by the bottom portion and the side portion; and the side portion being perpendicular to the bottom portion such that a rectangular label is mountable to the side portion without creases.

The present invention discloses a fastening system for a panel. The fastening system includes: at least two mounting rails which each has a plurality of engaging open cavities formed therein; and a plurality of engaging slide blocks respectively engaging with the engaging open cavities; wherein the panel is disposed on the mounting rails and fixedly connected with the engaging slide blocks respectively. Basing on the engagement structure, the present invention can be fastened on a surface of a mounted object via two rails and provide high tensile strength and simple installation. The present invention can fix different shapes of panel assemblies on a roof, the ground, a wall or a surface of a framework safely, quickly and stably, and the present invention has a simple structure, light weight and low total costs.

A process of recycling fibrous materials, specifically carpet and diaper remnants, or high melting polymers, specifically PET, by using low melting polymers, i.e. agricultural film and other products made from polypropylene and polyethylene, to create parts of high compressive strength. The carpet, fibrous materials, or PET and low melting polymers are ground separately and then blended in a predetermined ratio. The blend is then sent through a pellet mill and then heated until the low melt polymer is melted, or approximately 450° F. The melted mixture is then injected into a partially opened cavity mold, which is then closed without allowing the excess material to escape. Closing the mold increases the internal pressure on the molten material. The cavity mold is then rapidly cooled.

Provided are a humidity sensor and a method of manufacturing the same. The humidity sensor has high sensitivity, quick response time, improved temperature characteristics, low hysteresis and excellent durability. Moreover, for the humidity sensor, a humidity sensitive layer may be formed of various materials. The humidity sensor may be manufactured in a small size on a large scale.

The humidity sensor includes a substrate, an open cavity with an open upper portion formed to have a depth and a width in the substrate, a plurality of electrode pads formed on the substrate, a heater connected to one pad of the electrode pads at one end, and connected to another pad of the electrode pads at the other end to be suspended over the open cavity, a plurality of sensing electrodes formed on the same plane as the heater, and suspended over the open cavity to output a sensed signal to the electrode pads, a humidity sensitive layer formed on the heater and the sensing electrodes, suspended over the open cavity, and changed in characteristic according to the humidity, and an ambient temperature measurement part configured to measure the temperature around the humidity sensor, wherein the temperature is used as a reference temperature to control a heating temperature of the heater.

The invention discloses a spherical cavity type solar heat absorber with an inwardly concave glass cover. The heat absorber is mainly used for collecting sunlight and converting the sunlight into heat energy in a butterfly type solar high-temperature heat utilization system. The heat absorber mainly comprises a heat exchange coil pipe, the inwardly concave glass cover, an outer shell, an inner shell, a vacuum layer, a reflective wind shield and a heat conductive fluid. Different from the traditional opening type heat absorber and the cavity type heat absorber with the glass window at the cavity opening, the cavity type heat absorber disclosed by the invention is the opening type spherical heat absorber with the inwardly concave glass cover, therefore, the cavity type heat absorber not only has the light capturing capacity of the opening cavity type heat absorber but also has low heat loss of the cavity type heat absorber with the glass window at the cavity opening; meanwhile, the cavity type heat absorber is provided with the reflective wind shield, therefore, the capturing on deviated light can be strengthened, and the heat radiation on the inner wall and the convection heat transfer loss resulted from external natural wind can be reduced; and the cavity type heat absorber comprises the vacuum layer between the inner shell and the outer shell, therefore, the lost heat throughthe shells can be effectively reduced.

The present invention provides a sensor package, wherein the sensor package comprises a leadless frame having a plurality of inner leads and a plurality of external leads, a molded structure forming an open cavity, wherein the leadless frame forms the bottom of the open cavity, and wherein the plurality of external leads expose to the outside of the open cavity and the plurality of inner leads expose to the inside of the open cavity, a sensor die attached to the bottom of the open cavity, a plurality of bond wires electrically connecting the sensor die with the plurality of inner leads, and a filler gel filling the open cavity to encapsulate the sensor die and bond wires.