13062 results about "Compressive strength" patented technology

A salicide layer is deposited on the source/drain regions of a PMOS transistor. A dielectric capping layer having residual compressive stress is formed on the salicide layer by depositing a plurality of PECVD dielectric sublayers and plasma-treating each sublayer. Compressive stress from the dielectric capping layer is uniaxially transferred to the PMOS channel through the source-drain regions to create compressive strain in the PMOS channel. To form a compressive dielectric layer, a deposition reactant mixture containing A1 atoms and A2 atoms is provided in a vacuum chamber. Element A2 is more electronegative than element A1, and A1 atoms have a positive oxidation state and A2 atoms have a negative oxidation state when A1 atoms are bonded with A2 atoms. A deposition plasma is generated by applying HF and LF radio-frequency power to the deposition reactant mixture, and a sublayer of compressive dielectric material is deposited. A post-treatment plasma is generated by applying HF and LF radio-frequency power to a post-treatment gas that does not contain at least one of A1 atoms and A2 atoms. Compressive stress in the dielectric sublayer is increased by treating the sublayer in the post-treatment plasma. Processes of depositing a dielectric sublayer and post-treating the sublayer in plasma are repeated until a desired thickness is achieved. The resulting dielectric layer has residual compressive stress.

In accordance with the present invention, structural and other composite materials have been developed which have superior performance properties, including high compressive strength, high tensile strength, high shear strength, and high strength-to-weight ratio, and methods for preparing same. Invention materials have the added benefits of ease of manufacture, and are inexpensive to manufacture. The superior performance properties of invention materials render such materials suitable for a wide variety of end uses. For example, a variety of substances can be applied to invention materials without melting, dissolving or degrading the basic structure thereof. This facilitates bonding invention materials to virtually any surface or substrate. Moreover, the bond between invention materials and a variety of substrates is exceptionally strong, rendering the resulting bonded article suitable for use in a variety of demanding applications. Invention materials can be manufactured in a wide variety of sizes, shapes, densities, in multiple layers, and the like; and the performance properties thereof can be evaluated in a variety of ways.

A method for forming a slot contact structure for transistor performance enhancement. A contact opening is formed to expose a contact region, and a slot contact is disposed within the contact opening in order to induce a stress on an adjacent channel region. In an embodiment, a stress inducing barrier plug is disposed within a portion of the contact opening and the remainder of the contact opening is filled with a lower resistivity contact metal. By selecting the proper materials and deposition parameters, the slot contact can be tuned to induce a tensile or compressive stress on the adjacent channel region, thus being applicable for both p-type and n-type devices.

A rigid and brittle bright metal flake is formed of a central layer of a reflective material supported on both sides by dielectric layers. In a preferred embodiment, the metal layer is aluminum having a thickness of about 100 nm and the dielectrics are either silicon dioxide or magnesium fluoride, each having a thickness of about 100 nm. The result is a very thin three-layered metal flake about 300 nm thick that exhibits a uniaxial compressive strength of about 8 times a corresponding uniaxial tensile strength. As a result, the metal flake is then afforded the benefits of rigidity and brittle fracture during the manufacturing and applicational processes which ultimately provides favorable planar and specular reflectance characteristics in the visible wavelength range.

The invention provides a ceramsite water permeable brick, which comprises the following components by weight: 80-100 parts of ceramsite, 10-15 parts of silicon sand, 20-40 parts of cement, a setting accelerator accounting for 2-4% of the weight of the ceramsite, and a water reducing agent accounting for 2-4% of the weight of the ceramsite. According to the invention, silicon sand dust made ceramsite is combined with a small quantity of cement, the setting accelerator, the water reducing agent and a silicon sand fabric to manufacture the ceramsite water permeable brick. One the one hand, the water permeable brick has a beautiful appearance, and on the other hand it combines the lightweight and high strength characteristics of ceramsite. At the same time, ceramsite is round stone rather than polygonal, and usually the gap between round objects is larger than that between polygonal objects, so that the prepared water permeable brick has good permeability effect. The water permeable brick prepared by the method has compressive strength of greater than or equal to 30Mpa and a permeability coefficient of greater than or equal to 0.05cm/s, and the other properties of the brick meet the JCT945-2005 industrial standard.

A silicon-made low-forward-voltage Schottky barrier diode is serially combined with a high-antivoltage-strength high-electron-mobility transistor made from a nitride semiconductor that is wider in bandgap than silicon. The Schottky barrier diode has its anode connected to the gate, and its cathode to the source, of the HEMT. This HEMT is normally on. The reverse voltage withstanding capability of the complete device depends upon that between the drain and gate of the HEMT.

Hollow thermoexpandable particles or microspheres are provided that contain hydrocarbon blowing agents and have a shell polymer that can be softened at the onset of the expansion temperature and solidified at a higher temperature (thermoset) in an expanded state. Preferably, the microspheres have a shell of thermally expandable and thermally crosslinkable polymer and a hollow interior that contains a hydrocarbon liquid that boils at a temperature below the heat activated crosslinking temperature of the polymer shell. The crosslinking of the shell polymer during or after expansion, which is heat activated at an elevated temperature, can solidify the shell polymer and, then, maintain the expanded volume of the microspheres. The thermoexpandable thermoset polymer particles are useful in insulation, packaging, for making foam materials such as polyurethane or polyisocyanurate rigid foams. The invented thermoset microspheres can substantially improve the close cell percentage and compressive strength of the foam materials and make the foam manufacturing less hazardous.

A method of making a rapid setting lightweight cementitious composition with improved compressive strength for products such as boards is disclosed. The method mixes fly ash, alkali metal salt of citric acid and lightweight aggregate with water. Compositions which include fly ash, alkali metal salts of citric acid and lightweight aggregate are also disclosed.

Metallic workpieces of diverse shapes having work surfaces which are deformed at the surface and adjacent sub-surface layers by surface impact from ultrasonic transducers employing freely axially moving impacting elements propelled and energized by a transducer oscillating surface vibrating periodically at an ultrasonic frequency. The impacting elements are propelled in a random aperiodic and controlled impact mode at different phases of the periodic oscillation cycles. The transducer may be portable and provides a series of mechanically interconnected stages having mechanical resonances harmonically related as a multiple of the primary ultrasonic frequency and have matched stage resistances under instantaneous loading when the impact elements are driven by the transducer oscillating surface into the surface of the workpiece. This mode of operation produces Q-factor amplification of the input ultrasonic power oscillator energy at the impact needles and high propulsion velocities making it possible to machine metallic workpiece bodies to greater depths for compressing the metal to increase compressive strength of the workpiece work surfaces to substantially the ultimate material strength. The impact machining is done at ambient temperatures.

The present invention relates to an epoxy resin composition for a fibre reinforced composite material, which is thermosetting resin composition where the glass transition temperature Tg of the cured material obtained by heating for 2 hours at 180° C. is at least 150° C., and the modulus of rigidity G'R in the rubbery plateau in the temperature region above the aforesaid Tg is no more than 10 MPa. In accordance with the present invention, it is possible to provide a fibre-reinforced composite material which is outstanding in its resistance to hot-wet environmental condition, impact resistance, and strength characteristics such as tensile strength and compression strength, and furthermore it is possible to provide a thermosetting resin composition and a prepreg outstanding in terms of their peel strength to a honeycomb core.

In order to realize the objectives stated above, the thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises the following components. (A) Thermosetting resin (B) Compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition. In accordance with the present invention, there can be obtained a thermosetting resin composition where the adhesion to reinforcing fiber by the cured material and the elastic modulus of the cured material are excellent, and by using this resin composition there can be obtained carbon fiber reinforced composite materials which are excellent in their 0° compressive strength, 90° tensile strength and interlaminar shear strength, and which also have outstanding impact resistance.

An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. The epoxy resin composition includes an aromatic epoxy resin having at least di-functionality, an aromatic amine compound and/or an alicyclic amine compound, wherein 5 minutes after the main agent comprising the epoxy resin and the curing agent comprising the aromatic amine compound and/or the alicyclic amine compound are mixed, the composition shows a viscosity at 25° C. in the range of from 1 to 1500 mPa sec, and Tc, tc, and Tg satisfy the following equation (1):wherein k=0 when 60<=Tc<90 and k=0.35 when 90<=Tc<=200;Tc is the highest temperature (°C.) during the curing process and is defined by the formula 60<=Tc<=200;tc is the retention time (min) at the highest temperature and is defined by the formula 1<=tc<=120; andTg is the glass transition temperature of the epoxy resin composition after a lapse of tc (min) at Tc (°C.).

A molding base paper used for forming paper vessels such as a cup or tray for foods and various industrial products is disclosed which satisfies the following conditions (1) to (4): (1) a tensile strength (JIS-P 8113) of at least 2.0 kN/m, (2) an elongation at break (JIS-P 8113) of at least 1.5%, (3) a critical compression stress, defined by the following formula, in the range of 1 to 10 MPa: <paragraph lvl="0"><in-line-formula>critical compression stress=A/B </in-line-formula>wherein A represents the compression strength determined by JIS-P 8126, and B represents the area of loaded part of the test piece in the determination of the compression strength, and (4) an amount of the compression deformation, caused by applying compression stress of 20 kgf/cm2in thickness direction, of at least 10 %. The paper vessels are prepared by controlling the water content of the molding base paper at 10 to 20% and then drawing the molding base paper at 100 to 150° C.

A method of cementing a wellbore in a subterranean formation, comprising formulating a cement composition that may be suitable for long-term zonal isolation of the subterranean formation by evaluating a subterranean formation, preparing a base cement composition, determining the compressive strength of the base cement composition, determining the tensile strength of the base cement composition, and adjusting the ratio of compressive strength to tensile strength as need to within a first optimizing range to form a first optimized cement composition, and placing the optimized cement composition in the wellbore.

The invention belongs to the field of building materials, relates to a use of a nano-material in a building exterior wall heat-retaining system and provides a nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick is characterized in that nano-particles are used so that compressive strength, tensile strength and bonding strength are improved. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick is prepared by adding a nano-material having a nanoscale particle size into a mixed system of cement, an auxiliary gel material, a polymer binder, an inorganic light heat-retaining material, fibers and water, uniformly mixing, carrying out pressing molding of the mixture, carrying out organic polymer crosslinking and cement hydration drying, and carrying out waterproof layer coating. The nano-material-containing high-strength high-heat insulation exterior wall inorganic heat-retaining face brick has the advantages of excellent flame resistance, high compressive strength, high tensile strength, high bonding strength and good insulation effects.

Solid proppants are coated with a coating that exhibits the handling characteristics of a pre-cured coating while also exhibiting the ability to form particle-to-particle bonds at the elevated temperatures and pressures within a wellbore. The coating includes a substantially homogeneous mixture of (i) at least one isocyanate component having at least 2 isocyanate groups, and (ii) a curing agent comprising a monofunctional alcohol, amine or amide. The coating process can be performed with short cycle times, e.g., less than about 4 minutes, and still produce a dry, free-flowing, coated proppant that exhibits low dust characteristics during pneumatic handling but also proppant consolidation downhole for reduced washout and good conductivity. Such proppants also form good unconfined compressive strength without use of an bond activator, are substantially unaffected in bond formation characteristics under downhole conditions despite prior heat exposure, and are resistant to leaching with hot water.

The invention discloses a flexible module and a flexible display panel. The flexible module comprises a first flexible module part, a second flexible module part and a bonding part. The flexible module comprises a bent region and a non-bent region. A bent shaft of the flexible module stretches in the bent region in the first direction. The bent region comprises a first bent region body and a second bent region body. In the second direction, the distance between the first bent region body and the bent shaft is smaller than the distance between the second bent region body and the bent shaft, and the first direction is vertical to the second direction. A first bonding material is adopted for the first bent region body, a second binding material is adopted for the second bent region, a third bonding material is adopted for the non-bent region, the compressive strength of the first bonding material and the compressive strength of the second bonding material are both larger than that of the third bonding material, the tensile strength of the first bonding material and the tensile strength of the second bonding material are smaller than that of the third bonding material, and the elasticity modulus of the first bonding material is smaller than that of the second bonding material. The flexible module is high in overall mechanical strength and high in anti-bending performance.

The invention discloses an alkali and chlorine-free liquid setting accelerator based on industrial polyaluminium sulfate. The liquid setting accelerator comprises the following raw materials by weight: 35-55% of polyaluminium sulfate, 5-25% of magnesium sulfate, alcohol amine accounting for 15-30% of the polyaluminum sulfate, 0-5% of an inorganic acid, 0-5% of a stabilizer, and the balance water. The liquid setting accelerator provided by the invention can be used in the wet jetting industry of sprayed concrete, belongs to alkali and chlorine-free liquid setting accelerators, has a stable period of more than 6 months, a 28d compressive strength ratio of greater than 100%, and good adaptability to different cement. When the dosage is 4.5%, the technical requirements of the JC477-2005 ''setting accelerators for sprayed concrete'' can be satisfied. The liquid alkali-free setting accelerator has superior performance, and can be widely used in tunnels, bridges, first-aid repair and other projects.