The invention relates to the technical field of semiconductors, in particular to an ultrasonic
chip and an ultrasonic module. The ultrasonic
chip comprises a circuit layer, a piezoelectric layer and an
electrode layer; the circuit layer comprises a substrate, an on-
chip circuit of an ultrasonic transmitting circuit is arranged in the substrate, a first bonding pad, a second bonding pad and a first
electrode are arranged on the substrate, and the
electrode layer comprises a second electrode; the first electrode, the second electrode and the piezoelectric layer are used for forming an ultrasonic
transducer; the on-chip circuit is used for generating an
electric signal and transmitting the
electric signal to the first bonding pad, the first bonding pad is used for transmitting the
electric signal to an off-chip circuit of the ultrasonic transmitting circuit, and the off-chip circuit is used for generating an
excitation signal according to the electric
signal and transmitting the
excitation signal to the second bonding pad; the second bonding pad is used for transmitting an
excitation signal to the second electrode so as to drive the ultrasonic
transducer to emit ultrasonic
waves, and the on-chip circuit is located in an area outside an ultrasonic area. According to the embodiment of the invention, the integration level of the ultrasonic chip can be improved.