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17188 results about "Converters" patented technology

Converting companies are companies that specialize in combining raw materials such as polyesters, adhesives, silicone, adhesive tapes, foams, plastics, felts, rubbers, liners and metals, as well as other materials, to create new products.

Power converters

The present invention provides a power converter that can be used to interface a generator that provides variable voltage at variable frequency to a supply network operating at nominally fixed voltage and nominally fixed frequency and including features that allow the power converter to remain connected to the supply network and retain control during supply network fault and transient conditions. The power converter includes a generator bridge electrically connected to the stator of the generator and a network bridge. A dc link is connected between the generator bridge and the network bridge. A filter having network terminals is connected between the network bridge and the supply network. A first controller is provided for controlling the operation of the semiconductor power switching devices of the generator bridge. Similarly, a second controller is provided for controlling the operation of the semiconductor power switching devices of the network bridge. The first controller uses a dc link voltage demand signal VDC_NET* indicative of a desired dc link voltage to control the semiconductor power switching devices of the network bridge to achieve the desired level of dc link voltage that corresponds to the dc link voltage demand signal VDC_NET*. The second controller uses a power demand signal P* indicative of the level of power to be transferred from the dc link to the supply network through the network bridge, and a voltage demand signal VTURB* indicative of the voltage to be achieved at the network terminals of the filter to control the semiconductor power switching devices of the network bridge to achieve the desired levels of power and voltage that correspond to the power and voltage demand signals P* and VTURB*.
Owner:GE POWER CONVERSION

Electrically-driven ultra-large-displacement well cementation equipment

The invention discloses electrically-driven ultra-large-displacement well cementation equipment. The electrically-driven ultra-large-displacement well cementation equipment comprises a first loading body and a second loading body; an auxiliary motor, a main motor, a clear water module, a pumping module, a control module, a hydraulic module and a mixing module are fixedly loaded on the first loading body; and a frequency converter module is fixedly loaded on the second loading body. The electrically-driven ultra-large-displacement well cementation equipment has the beneficial effects that the main motor is adopted to drive a plunger pump, torque converters are reduced, the layout space of the whole vehicle is increased, the auxiliary motor is adopted to drive a whole vehicle hydraulic system, and the number of driving motors is reduced; the frequency converter module and the well cementation equipment are loaded separately, the loading requirement is lowered, the structure is simpler, the occupied space is reduced, one frequency converter module can supply power to all the modules on the multiple first loading bodies at the same time, and use is flexible; and the main motor, the auxiliary motor and the hydraulic heat dissipation device are intensively distributed on the front portion of the first loading body, wiring is simple, connection is convenient, heat dissipation of equipment is intensively achieved, scalding accidents of workers in the operation process are avoided, and operation safety is improved.
Owner:YANTAI JEREH PETROLEUM EQUIP & TECH CO LTD

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20050062492A1High performance functional testingHigh-temperature burnElectrical measurement instrument detailsManufacture of electrical instrumentsConvertersContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
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