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24925results about "Efficient power electronics conversion" patented technology

Power semiconductor devices and methods of manufacture

Various embodiments for improved power devices as well as their methods of manufacture, packaging and circuitry incorporating the same for use in a wide variety of power electronic applications are disclosed. One aspect of the invention combines a number of charge balancing techniques and other techniques for reducing parasitic capacitance to arrive at different embodiments for power devices with improved voltage performance, higher switching speed, and lower on-resistance. Another aspect of the invention provides improved termination structures for low, medium and high voltage devices. Improved methods of fabrication for power devices are provided according to other aspects of the invention. Improvements to specific processing steps, such as formation of trenches, formation of dielectric layers inside trenches, formation of mesa structures and processes for reducing substrate thickness, among others, are presented. According to another aspect of the invention, charge balanced power devices incorporate temperature and current sensing elements such as diodes on the same die. Other aspects of the invention improve equivalent series resistance (ESR) for power devices, incorporate additional circuitry on the same chip as the power device and provide improvements to the packaging of charge balanced power devices.
Owner:SEMICON COMPONENTS IND LLC

Power semiconductor devices and methods of manufacture

Various embodiments for improved power devices as well as their methods of manufacture, packaging and circuitry incorporating the same for use in a wide variety of power electronic applications are disclosed. One aspect of the invention combines a number of charge balancing techniques and other techniques for reducing parasitic capacitance to arrive at different embodiments for power devices with improved voltage performance, higher switching speed, and lower on-resistance. Another aspect of the invention provides improved termination structures for low, medium and high voltage devices. Improved methods of fabrication for power devices are provided according to other aspects of the invention. Improvements to specific processing steps, such as formation of trenches, formation of dielectric layers inside trenches, formation of mesa structures and processes for reducing substrate thickness, among others, are presented. According to another aspect of the invention, charge balanced power devices incorporate temperature and current sensing elements such as diodes on the same die. Other aspects of the invention improve equivalent series resistance (ESR) for power devices, incorporate additional circuitry on the same chip as the power device and provide improvements to the packaging of charge balanced power devices.
Owner:SEMICON COMPONENTS IND LLC

Frequency modulation type wirelss power supply and charger system

A frequency modulation type wireless power supply and charger system includes a power supply base unit consisting of a first microprocessor, a power circuit, a power switch driver circuit, a first resonant circuit, a first coil, a detection module and a power input interface, and a wireless power supply and charge receiver unit consisting of a secondary coil, a second resonant circuit, a rectifier filter circuit, a detection and protection module, a second microprocessor, a temperature sensor, a charging module and a power output interface and adapted for receiving electrical power from the power supply base unit wirelessly for charging an external electronic device. The detection and protection module of the wireless power supply and charge receiver unit detects the supply of the electrical power, and the second microprocessor sends a feedback signal to the power supply base unit through the signal generator circuit and the second resonant circuit subject to the detection of the detection and protection module for enabling the power supply base unit to control the power switch driver circuit to regulate its output power automatically, thereby minimizing power transmission loss and the load of the internal components of the wireless power supply and charge receiver unit.
Owner:FU TONG TECH

Power semiconductor devices and methods of manufacture

Various embodiments for improved power devices as well as their methods of manufacture, packaging and circuitry incorporating the same for use in a wide variety of power electronic applications are disclosed. One aspect of the invention combines a number of charge balancing techniques and other techniques for reducing parasitic capacitance to arrive at different embodiments for power devices with improved voltage performance, higher switching speed, and lower on-resistance. Another aspect of the invention provides improved termination structures for low, medium and high voltage devices. Improved methods of fabrication for power devices are provided according to other aspects of the invention. Improvements to specific processing steps, such as formation of trenches, formation of dielectric layers inside trenches, formation of mesa structures and processes for reducing substrate thickness, among others, are presented. According to another aspect of the invention, charge balanced power devices incorporate temperature and current sensing elements such as diodes on the same die. Other aspects of the invention improve equivalent series resistance (ESR) for power devices, incorporate additional circuitry on the same chip as the power device and provide improvements to the packaging of charge balanced power devices.
Owner:SEMICON COMPONENTS IND LLC
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