In the present invention, a first switching element, a second switching element, a first rectifying element, and a second rectifying element are each composed of an even number of surface-mounted power
semiconductor elements. In a planar direction orthogonal to the lamination direction in a multilayer circuit board, the first switching element and the second switching element are mounted at positions symmetrical to the first rectifying element and the second rectifying element with respect to the configuration position of a dual
resonance transformer. The first switching element, the second switching element, the first rectifying element, and the second rectifying element are arranged respectively at upper, lower, left, and right positions on a plane with respect to the configuration position of the dual
resonance transformer. The first switching element, the second switching element, the first rectifying element, and the second rectifying element, which are each composed of the even number of power
semiconductor elements, are: mounted on the top surface and the bottom surface of the multilayer circuit board; overlapped when viewed in the lamination direction; connected in parallel through via conductors for power
semiconductor connection; and thermally coupled in the lamination direction. The ON periods of the first rectifying element and the second rectifying element are set to the ON periods of the first switching element and the second switching element, respectively. The first switching element, the second switching element, the first rectifying element, and the second rectifying element change the occurrence of
power loss over time vertically and horizontally with respect to the configuration position of the dual
resonance transformer in the planar direction, thereby evenly dispersing the
heat generation and uniformizing and integrating the
heat distribution.