9918 results about "Heat sink" patented technology

The mass concrete curing method based on the intelligent temperature control system comprises the following steps that concrete is divided into a top layer, a bottom layer and a middle layer, each layer is provided with an independent temperature control pipeline, and temperature monitoring points are designed; constructing a three-dimensional thermal field finite element model containing a hydration heat release function, temperature control pipeline heat sink and boundary conditions, and generating data by using a calculation result of the finite element model to train a neural network prediction model; a temperature control pipeline and a temperature monitoring point are installed before mass concrete is poured, and heat preservation is covered after pouring; data is collected in real time and input into the prediction model, the predicted temperature of each temperature monitoring point is output, if the temperature difference control threshold value or the temperature reduction control threshold value is exceeded, temperature control pipeline parameters and heat preservation measures of the corresponding layer are adjusted, and a temperature control strategy is executed after calculation is repeated till the requirement is met. The concrete temperature field is accurately controlled, temperature difference over-limit is effectively avoided, and the mass concrete curing quality is improved.

The invention provides a multi-parameter collaborative optimization battery charging and discharging management system integrated with a thermal management technology, and aims to improve the charging and discharging efficiency and safety of a battery and prolong the service life of the battery. The system monitors key parameters such as the temperature, the voltage, the current and the internal resistance of the battery in real time through a high-precision sensor, and the parameters are comprehensively analyzed through the data fusion technology. A core optimization algorithm adopts a genetic algorithm or deep learning, a charging and discharging strategy is dynamically adjusted, and battery performance maximization is achieved. The thermal management module effectively controls the temperature of the battery through a cooling fin, a liquid cooling system or a phase change material, overheating and supercooling are prevented, and the safety and stability of the battery are improved. The user interface is friendly, the battery state is convenient to monitor and adjust, and the system has wide application prospects in the fields of electric automobiles, renewable energy storage and the like.

The invention relates to the technical field of insulated metal-enclosed switchgear, and discloses an environment-friendly gas-insulated ring main unit, which comprises a cabinet body, the cabinet body comprises a pressure relief chamber and a primary loop insulation chamber, a heat dissipation cylinder is fixedly arranged at the bottom in the pressure relief chamber, the top of the heat dissipation cylinder is fixedly connected with a pressure relief pipe, and the pressure relief pipe is fixedly connected with the primary loop insulation chamber. A first electromagnetic valve is fixedly arranged on a pipe body of the pressure relief pipe, and an air storage mechanism is arranged in the heat dissipation cylinder. A plurality of cabinet bodies are combined to form a ring main unit group, when the temperature of one ring main unit is abnormally increased, a corresponding first electromagnetic valve is opened, a sliding plate moves under the action of air pressure in a corresponding primary loop insulation chamber to form a gas storage cavity, insulation gas loss is avoided while pressure relief is performed, and cooling is performed; and the plurality of heat dissipation cylinders can be communicated in sequence, so that the air pressure in the primary circuit insulation chamber can be further improved to achieve a closed pressure relief effect in a cabinet deformation pressure and bursting pressure interval.

The invention relates to a high-efficiency circulating cooling device for mechanical seal, comprising a gland, a stationary ring assembly mounted on the gland, a dynamic ring assembly rotating with a rotating shaft and a pumping ring rotating with the dynamic ring assembly. The gland is provided with a flow-guiding heat sink for guiding flushing liquid entering from a flushing liquid inlet to the matching end faces of the stationary ring assembly and the dynamic ring assembly. The heat-conducting heat sink can force the flushing liquid to be introduced into the end faces of the stationary ring assembly and the dynamic ring assembly to forcibly take away the heat. Meanwhile, the heat-conducting heat sink can also conduct heat quickly to ensure that the sealing heat is taken away in time, and a stable and reliable liquid film can be formed on the end face. Meanwhile, the flow groove is optimized and improved on the ordinary flow channel, adopts an eccentric circle, and is divided into several sections to form a flow channel, which has the effect of significantly increasing fluid pressure and reducing flow resistance, and the pumping groove is a double-crescent-shaped structure. The pumping ring of this shape has the best pressure and flow rate among all closed pumping rings, and the flow rate is 2 to 3 times that of other structures under the same size.

The invention belongs to the technical field of solid-liquid phase change heat dissipation, and discloses a memory alloy-based phase change expansion buffer structure, which comprises an elastic structure, a supporting structure, a thin wall, a cavity, a flaring, an electronic device, a heat sink, fins, a connecting structure and a phase change material, the thin wall is made of shape memory alloy and separates the internal cavity and the external phase-change material, the internal cavity is communicated with the external environment through the flaring, and in the flying process of the aerospace vehicle, external airflow flows into the flaring to take away heat stored by the phase-change material continuously. Based on the shape memory function of the memory alloy, additional space expansion buffering can be provided for the phase change material when the temperature changes, and stress damage caused by phase change expansion is avoided. The memory alloy thin wall and the elastic supporting structure are combined, the structure is simple, no moving part exists, circulating work in the high-temperature environment and the low-temperature environment can be achieved, local hot spots caused by internal gap movement of the phase change material in the circulating phase change process are reduced, and heat transfer deterioration is avoided.

The invention relates to the technical field of electric control cabinets, and discloses an electric control cabinet and a using method and application thereof in crane construction, the electric control cabinet comprises a shell assembly, the shell assembly comprises a cabinet body and a mounting assembly arranged in the cabinet body, one side of the mounting assembly is provided with a heat dissipation adjusting assembly, and the heat dissipation adjusting assembly is arranged on the other side of the cabinet body. The installation assembly comprises a fixing frame, the fixing frame is connected with the inner wall of the cabinet body, damping springs are arranged at the four corners of the surface of the fixing frame, and an installation frame is arranged at the end, away from the damping springs, of the fixing frame. Through cooperation of the mounting assembly and the heat dissipation adjusting assembly, the interval between every two adjacent heat dissipation fins is adjusted in real time according to different temperatures of different positions, the ventilation quantity between an adjusting plate and a ventilation groove is adjusted, and therefore rapid heat dissipation is achieved, the vibration amplitude of the mounting frame is reduced when external wind power is too large, and normal operation of electrical elements is ensured.

The micro-channel liquid cooling heat dissipation device comprises a power device and a micro-channel liquid cooling heat dissipation plate, the micro-channel liquid cooling heat dissipation plate is used for dissipating heat of the power device, and the power device is attached to the surface of the micro-channel liquid cooling heat dissipation plate through heat conduction silicone grease. The micro-channel liquid cooling heat dissipation plate comprises a water inlet, a water outlet, cooling liquid, a water channel, fins and a water pump, the water channel is of a micro-channel structure and is connected with the water inlet and the water outlet, the water pump is used for driving the cooling liquid to circularly flow, the cooling liquid is injected into the water channel from the water inlet and is discharged from the water outlet, and the fins are of angle-adjustable structures and are arranged in the water channel. And the fin angle is optimized through finite element simulation. The micro fins are added in the channels, the fin angle is optimized by combining finite element simulation, the temperature uniformity between heating sources is improved, the design cost is greatly reduced on the basis of the accurate result, and finally the purposes of improving the heat transfer efficiency of the liquid cooling plate, reducing the junction temperature of a chip of a power device and improving the use reliability of the power device are achieved.

The invention belongs to the technical field of battery maintenance, and discloses a new energy automobile battery maintenance device which comprises a base, mounting grooves are formed in the upper surface of the base at equal intervals, clamping grooves are symmetrically formed in the front side and the rear side of the bottom of each mounting groove, a mounting shell is fixedly mounted on the upper surface of the base, and a plurality of guide grooves are formed in the upper surface of the mounting shell at equal intervals. Side grooves are symmetrically formed in the side faces of the guide groove, and electric heating plates fixedly sleeve the middles of the front side groove and the rear side groove. Mercury in the telescopic sleeve is heated to expand, so that the expanded mercury in the telescopic sleeve pushes the telescopic end of the telescopic sleeve to move upwards, the telescopic end of the telescopic sleeve drives the heat conducting plate to move upwards through the electric plate to be in contact with the heat dissipation plate, and at the moment, the heat dissipation plate dissipates heat of the battery through the sleeve column and the heat conducting plate; therefore, the problems that the charging and discharging efficiency of the battery is low and the service life is shortened when the battery works in a high-temperature or low-temperature environment are solved.

The embodiment of the invention provides a closed-loop control method for power driving and protection, and the method comprises the steps: constructing a voltage feedback type circuit through a high-speed operational amplifier, and forming a closed-loop gain structure through a feedback network of the voltage feedback type circuit; the load current of the output end of the voltage feedback type circuit is monitored in real time, and when the load current exceeds a first set threshold value, a protection mechanism is triggered to turn off the output stage; the power-on surge current is limited through the soft start control circuit; phase information of a load reflection coefficient is obtained, an inductance / capacitance combination of the variable dynamic impedance matching network is selected according to phase information table look-up, inductance / capacitance parameters are switched through a relay, and the transmission standing-wave ratio between the power amplifier and a load is optimized; monitoring the temperature of the radiating fin of the power tube, and dynamically adjusting the resistance value of the feedback network; and performing cooperative control of short-circuit protection, over-temperature protection and surge suppression according to the priority. According to the embodiment of the invention, the performance bottleneck in a load fluctuation scene is broken through.

The invention relates to the technical field of motors, and provides a multi-cooling permanent magnet synchronous variable frequency motor which comprises a shell, a stator and a rotor and further comprises a plurality of cooling fins, a cooling fan, a water cooling mechanism and a driving mechanism, the cooling fins are fixedly connected to the outer portion of the shell, the cooling fan is coaxially and fixedly connected with the rotor, and the water cooling mechanism is fixedly connected with the stator. An air outlet is formed in the shell, the water cooling mechanism is used for conducting water cooling on the shell and comprises a cold water pipe and a heat dissipation pipe network, the cold water pipe penetrates through the multiple cooling fins, the top of the heat dissipation pipe network communicates with the top of the cold water pipe through a water supply pipe, and the bottom of the heat dissipation pipe network communicates with the bottom of the cold water pipe through a water return pipe; the heat dissipation pipe network is located outside the shell and corresponds to the air outlet in position, and the driving mechanism is used for driving cold water to circularly flow in the cold water pipe and the heat dissipation pipe network. By means of the technical scheme, the problem that in the prior art, a single cooling mode is limited in cooling effect is solved.

The invention discloses a heat dissipation method for a high-power device in a logging instrument, and relates to the technical field of heat dissipation of logging instruments. The heat dissipation management system is realized based on a heat dissipation management system, and the heat dissipation management system comprises a heat conduction module which adopts a heat pipe or a heat plate made of a high-heat-conductivity-coefficient material and is used for rapidly conducting heat generated by a high-power device to a heat dissipation module; and the heat dissipation module comprises a plurality of heat dissipation fins and / or fans which work in parallel, the heat dissipation fins improve the heat dissipation efficiency by increasing the heat dissipation area, and the fans enhance air flow through forced convection to promote heat exchange. The heat pipe or the heat plate made of the high-heat-conductivity-coefficient material is adopted, heat is quickly conducted to the heat dissipation module, and accumulation of the heat at a source is effectively reduced; the control module dynamically adjusts a heat dissipation strategy according to real-time temperature monitoring data, such as the fan rotating speed and fluid circulation, and it is ensured that the heat dissipation effect is matched with the actual requirement.

The invention discloses a phase change alloy heat sink structure for heat dissipation of an electronic device and a use method of the phase change alloy heat sink structure. The heat sink structure comprises an aluminum alloy shell and at least two independent cavities arranged in the shell, and the cavities are sequentially arranged in the direction from the hot end to the cold end of a heat sink. The cavities are filled with phase change alloy heat storage materials respectively, and the phase change alloy heat storage materials are sequentially filled into the cavities from the hot end to the cold end of the heat sink according to the sequence of the phase change temperatures from high to low. Through the design of the packaging structure and the optimized combination of multiple phase change heat storage alloys, the temperature gradient of the heat sink from the hot end to the cold end is reduced, the multiple phase change alloys are made to continuously generate solid-liquid phase change from the cold end to the hot end in a short time, the heat storage capacity of the phase change materials in a limited space is fully exerted, and the heat storage efficiency of the phase change materials is improved. The temperature equalization and temperature control capabilities of the phase change heat sink are greatly improved, and the phase change heat sink is suitable for heat dissipation of electronic components in aircrafts with strictly limited working spaces.

The invention discloses a cable with a liquid cooling heat dissipation function. The cable comprises a closed cable section, an input cable section and an output cable section, the closed cable section is a completely-sealed cable section and is mainly used for liquid cooling heat dissipation of the cable; the input cable section is mainly used for transition connection between a power supply end and the closed cable section; and the output cable section is mainly used for transition connection between the closed cable section and a power utilization end. Through the synergistic effect of the insulating liquid cooling oil, the annular cooling fins, the complete through holes, the one-way through holes and the like, heat generated by operation of the cable can be rapidly absorbed and dissipated, local overheating is avoided, stable operation of the cable is ensured, and the heat dissipation efficiency is improved; compared with a mode of additionally arranging a spiral metal tube on the whole cable, the material and transportation cost is reduced, and the flexibility is not sacrificed; the high-quality material selection and the reasonable structural design ensure the electrical insulation performance, reduce the faults caused by the heat dissipation problem, and prolong the service life of the cable.

The invention relates to the technical field of chip heat dissipation, and discloses a bare chip cooling fin and an installation method thereof, and the cooling fin comprises a heat dissipation substrate, through hole supporting columns, a mixed fixing assembly and a heat dissipation fin array. The heat dissipation substrate is made of high-thermal-conductivity copper alloy, and the surface of the heat dissipation substrate is plated with a nano oxide layer to improve the heat radiation efficiency; the height of the through hole supporting column is matched with that of elements around the chip, and the bottom is provided with an anti-skid rubber pad to prevent installation inclination and buffer mechanical stress; the mixed fixing assembly comprises screw fixing holes distributed diagonally and plastic buckle fixing holes distributed diagonally, a plastic buckle can rotate by 0-90 degrees, a limiting spring is arranged in the plastic buckle to provide tactile feedback, and rapid installation and damage-free disassembly are achieved; the radiating fin array adopts a gradient height design, is matched with heat source distribution of the chip and optimizes an airflow channel. Through the dual-redundancy fixing structure and the gradient heat dissipation design, the heat dissipation efficiency and the installation reliability are remarkably improved, and the heat dissipation device is suitable for high-vibration and high-heat-dissipation-demand scenes such as data centers and automatic driving.

A self-heat dissipation gate valve, comprising a valve body (1), a valve cover (2), a gate plate (3), and a valve rod (4). The valve body comprises a channel (11) and a valve seat (12) located on the channel. The valve cover is fixedly connected to the valve body, and a plurality of cooling fins (21) are arranged at intervals on the outer side wall of the valve cover. The gate plate is located in an inner cavity of the valve body. One end of the valve rod is connected to the gate plate, and the other end of the valve rod extends upwards until the other end of the valve rod partially extends out of the valve cover. The gate plate is configured to be driven by the valve rod to move to be mated with the valve seat to block the channel or is configured to be driven by the valve rod to move in a direction away from the valve seat to unblock the channel. During use, the high-temperature medium in the channel of the valve body can transfer heat to the valve body and the valve cover, and the plurality of cooling fins arranged on the valve cover can diffuse heat into the surrounding environment, so that the working performance of the gate valve is prevented from being affected by the excessively high temperature of the gate valve.

The invention relates to a novel semiconductor laser side pumping structure, and belongs to the field of semiconductor laser stack packaging, a side pumping module A comprises a sub-module heat sink A, a side pumping module B comprises a sub-module heat sink B, and the middle parts of the sub-module heat sinks A and B are provided with semicircular grooves for placing crystals. The side pumping module A and the side pumping module B are provided with semicircular grooves, the semicircular grooves penetrate through the length direction of the sub-module heat sink A / the sub-module heat sink B, N three-side sub-pumping modules are arranged on the sub-module heat sink A, N + 1 three-side sub-pumping modules are arranged on the sub-module heat sink B, the side pumping module A and the side pumping module B are oppositely arranged, and the three-side sub-pumping modules on the side pumping module A and the side pumping module B are arranged in a staggered mode. The single trilateral pumping sub-module can realize 180-degree irradiation, and the bar of the trilateral pumping sub-module is not in contact with the crystal after the trilateral pumping sub-module is installed. While realizing pumping, the crystal synchronously realizes heat dissipation, so that the problems of complicated structure, poor consistency and non-uniform light beam distribution caused by a water-cooled laser are effectively solved.

The invention aims to provide the plant efficient growth LED light source modular light supplementing equipment, system and method which are reasonable in structure and capable of realizing accurate regulation and control of illumination parameters, aiming at the problems that the spectrum and the light intensity cannot be flexibly adjusted, the equipment structure is inconvenient, the heat dissipation performance is insufficient and the like in the existing plant light supplementing technology, and the invention provides the plant efficient growth LED light source modular light supplementing equipment, system and method which are reasonable in structure and capable of realizing accurate regulation and control of the illumination parameters. The equipment adopts a modular design and internally comprises a plurality of LED light source modules capable of adjusting light intensity and spectrum output so as to meet the illumination requirements of plants in different growth stages. The control system can monitor and adjust the illumination intensity and the spectrum proportion in real time through an adjustable button, and it is ensured that the plants obtain the optimal illumination condition in each growth stage. The equipment is provided with an efficient heat dissipation system which comprises a heat dissipation sheet, a heat dissipation ring and a heat dissipation net, so that heat dissipation of the LED lamp beads is optimized, the service life of the lamp is prolonged, and the luminous efficiency of the LED light source module is improved. The light supplementing system comprises an illumination regulation and control system, a control system and a power supply module, can automatically regulate illumination intensity and spectrum output, meets the requirements of plants in different growth stages, has an energy-saving mode, and reduces energy consumption. The light supplementing method comprises the steps of initializing the system, presetting spectrum and intensity, adjusting illumination in real time, and promoting healthy growth of plants.

The invention provides a flat heat dissipation axial magnetic flux motor which comprises a heat dissipation assembly, and the heat dissipation assembly comprises a rotor disc, a rotor shaft, an inner core, a first flow channel, a second flow channel, a piston, an oil storage box, cooling fins, fan blades, a flow guide pipe, a sealing plate, a mounting disc and a magnetic block. And the rotor shaft is fixedly connected to the interior of the rotor disc. The rotor shaft drives the mounting disc to rotate, cooling oil flows into the first flow channel on the right side, then sequentially flows through the right flow guide groove, the left flow guide groove, the first flow channel on the left side, the second flow channel and the flow guide pipe and finally circulates into the oil storage box, the cooling oil circulates along with continuous rotation of the rotor disc, and then heat dissipation of the rotor can be achieved; cooling oil flowing into the oil storage box from the flow guide pipe makes contact with the cooling fins, the cooling oil can be cooled through the cooling fins, efficient cooling of the rotor is achieved by adopting an internal circulation mode of the cooling oil, and installation and use of the motor are not affected.

The invention relates to the technical field of cables, and provides a low-voltage power supply cable which comprises a plurality of conductive cables, each conductive cable comprises a plurality of stranded conductors, and each stranded conductor is coated with an insulating layer; the plurality of insulating layers are arranged on the inner side of the inner lining layer, the plurality of stranded conductors are all arranged inside the inner lining layer, the space between the inner lining layer and the plurality of insulating layers is filled with a filling layer, the outer part of the inner lining layer is coated with a sheath layer, the end part of each sheath layer is slidably sleeved with the butt-joint cylinder, the stringing assembly is arranged on the butt-joint cylinder, and the heat dissipation assembly is arranged on the inner lining layer. A conductive frame is arranged between every two opposite butt joint cylinders, a conductive assembly is installed on each conductive frame, and a heat dissipation assembly is installed on each conductive assembly. Through the above technical scheme, the problems that in the prior art, due to the fact that high current density is prone to occurring at the butt joint position of two cables, the local temperature of a contact point rises, and the heat dissipation effect is poor are solved. And a gap is generated between the two cables, so that the current transmission performance is influenced.

An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a multiaxial thermal shoe having a thermal interface material and configured to thermally couple the endcap of the Dewar to the heat sink via one of at least two axial surfaces. The multiaxial thermal shoe is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. The multiaxial thermal shoe may be configured to hold the thermal interface material against the endcap. The multiaxial thermal shoe may couple to the heat sink via a first axial surface in-line with an optical centerline or a second axial surface crosswise to the optical centerline.

The invention discloses an S-shaped micro-channel heat dissipation device with a double-layer turbulent flow structure and a use method, belongs to the field of liquid cooling heat dissipation, and is suitable for heat dissipation of a high-heat-flux device or a heat conduction device. The device comprises a base, a cover plate, a micro-channel body, turbulent flow columns, a flow guide structure, O-shaped sealing rings and quick-screwing connectors, the micro-channel body is provided with S-shaped channels which are vertically symmetrical, the turbulent flow columns are evenly arranged in the centers of the channels, and the top ends of the turbulent flow columns are flush with the end face of the micro-channel body. The turbulent flow columns can be rectangular columns or water-drop-shaped columns which are arranged in a single row or multiple rows at equal intervals and are matched with the flow guide structure to achieve efficient flow division of cold and hot fluid and interlayer heat interaction. Fluid mixing is strengthened through the centrifugal force of the S-shaped channel, a heat boundary layer is destroyed by the turbulent flow columns, and the problems that a traditional straight channel is low in heat exchange efficiency and uneven in temperature distribution are solved. Deionized water or nanofluid is selected as cooling liquid, closed circulation is formed by entering and exiting of the cooling liquid through the quick-screwing connector, and the adaptive scene and the comprehensive performance of the device are further expanded through the multiple rows of turbulent flow columns or the water-drop-shaped turbulent flow columns.

The invention provides a self-adaptive distribution transformer for an active power distribution network. The transformer design comprises a transformer shell, and cooling fins are arranged on the periphery of the shell to improve the cooling efficiency. An air guide plate is arranged on one side of each cooling fin and composed of a first inclined plate, a second inclined plate and an arc-shaped turning plate, the first inclined plate and the second inclined plate are arranged in an inclined mode, and therefore air flow is enhanced, and air conduction loss is reduced. Water-cooling assemblies are arranged on the two sides of the transformer, rainwater is collected through a fixed water tank, and water-cooling heat dissipation is achieved through a bottom rainwater conveying assembly. By means of the design, the transformer can automatically adjust the heat dissipation mode according to environment changes, and the safety and energy efficiency of outdoor operation are improved.

A charging inlet (1) comprises: a rear case (40) that is connected to an inlet housing (20) retaining a plurality of terminals (10); and a filling section (80). The rear case (40) comprises a rear case body (40a) that has a housing section (41) housing at least base sections (12) of the plurality of terminals (10) and a plurality of inner terminals (70), and fins (46) that are provided so as to be exposed to the outside of the rear case body (40a). The filling section (80) is molded or formed from an insulating filler material with which the remaining portion of the housing section (41) is filled. The material of the rear case (40a) is an electrically insulating, thermally conductive resin resulting from filling a thermoplastic resin with a carbon-based or ceramic-based filler. The fins (46) are formed from a metal material, and are integrated with the rear case body (40a) by insert molding.

A work machine includes a tank of secondary battery coolant to act as a heat sink to cool a secondary battery. When a power unit is available for use to provide electrical power to the work machine, a secondary battery cooling system is used. The secondary battery cooling system includes a tank used to store secondary battery coolant. The secondary battery coolant stored in the tank is maintained within a temperature range using the refrigerant of an HVAC system that used to cool the cab of the work machine. When the power unit is available for use, the HVAC system is fluidically disconnected from cooling the secondary battery coolant stored in the tank. Thereafter, the secondary battery is cooled using the secondary battery coolant stored in the tank. Thus, the secondary battery coolant stored in the tank acts as a heat sink to remove heat from the secondary battery until the power unit is available for use.

The invention discloses a packaging method and device of a vertical cavity surface emitting laser, and belongs to the field of semiconductor laser chip packaging processes. The packaging heat dissipation cover is additionally arranged on the top of the VCSEL chip, the VCSEL chip is surrounded up and down by the packaging heat dissipation cover, the supporting connecting block and the bottom heat sink component, and the heat dissipation mode of the top of the device is adjusted from low-efficiency heat radiation to air to heat conduction through a high-heat-conductivity solid material. Compared with the prior art, the heat conduction capability of a medium near the center of a heat source can be effectively improved, and the blocking effect of a top DBR material on heat is remarkably reduced. In addition, the transverse component of heat flow at the top is further increased by using a chamfering structure in the through hole and a two-dimensional transparent heat conduction material, and the efficiency of the heat of the VCSEL chip flowing to the two sides of the top is improved.

The invention relates to the technical field of chip heat dissipation, and discloses a heat dissipation plate and a heat dissipation system.The heat dissipation plate comprises a plate body and a flow channel structure, and the plate body is provided with a water inlet and a water outlet which are oppositely arranged; the flow channel structure is formed on the plate body and arranged between the water inlet and the water outlet, the flow channel structure comprises a plurality of main flow channels and a plurality of branch flow channels, all the main flow channels, all the branch flow channels and all the main flow channels and all the branch flow channels are communicated, part of the main flow channels are communicated with the water inlet and the water outlet, and part of the branch flow channels are communicated with the water inlet and the water outlet. A cooling medium flows into the main flow channels through the water inlet and flows out of the main flow channels through the water outlet, and all the main flow channels and all the branch flow channels are formed on the plate body in a vein net shape; the flow channel structure is provided with a plurality of concentration parts configured to have a first number and a plurality of dispersion parts configured to have a second number, the concentration parts and the dispersion parts are arranged at intervals, and the first number is larger than the second number; the heat dissipation efficiency and the heat dissipation uniformity of the plate body can be improved.

The invention relates to the field of semiconductors, in particular to a heat dissipation structure, a preparation method thereof and an IGBT (Insulated Gate Bipolar Translator) module. The preparation method of the heat dissipation structure provided by the invention comprises the steps of obtaining a to-be-combined heat sink based on a blind groove formed in one surface of the heat sink in the thickness direction; laminating and laminating the metal sheet and the ceramic substrate, firing, and metalizing the ceramic substrate; patterning processing is carried out based on the surface of the metal layer in the thickness direction, so that an exposed surface is formed on the ceramic layer in the thickness direction, and a metal boss capable of being matched with the blind groove is formed on the metal layer on the exposed surface; and the metal boss on the to-be-combined substrate is installed in the blind groove of the to-be-combined heat sink, the exposed face is attached to the surface of the to-be-combined heat sink to form a combined body, the combined body is sintered and cured, and the heat dissipation structure is obtained. The heat dissipation structure prepared by the preparation method can effectively reduce the number of thermal resistance interface layers, improve the heat dissipation efficiency of the IGBT chip, and significantly reduce the production cost and the process complexity.

The invention belongs to the technical field of heat exchange, and particularly relates to a liquid metal enhanced heat exchange pipeline which comprises a pipeline body, an auxiliary heat exchange cavity and liquid metal. One end of the auxiliary heat exchange cavity is arranged on the pipeline body, and the other end of the auxiliary heat exchange cavity is far away from the pipeline body; the auxiliary heat exchange cavity is filled with the liquid metal. The auxiliary heat exchange cavity is filled with the liquid metal, and compared with a traditional cooling medium, the liquid metal can transfer heat more quickly by means of the ultrahigh heat conductivity of the liquid metal, the heat resistance is reduced, and the overall heat exchange efficiency is improved. In addition, due to the high thermal conductivity of the liquid metal and the optimized heat exchange structure, efficient heat exchange can be achieved in a more compact space, and the requirement for additional cooling fins or heat exchange assemblies is reduced. And compared with a traditional heat exchanger, the heat exchange power density of unit volume is higher, the heat exchanger is suitable for high-power electronic equipment, spaceflight heat dissipation systems and new energy heat exchange equipment, and the requirements for miniaturization and efficient heat dissipation are met.