21207 results about "Heat sink" patented technology

A method of treating a brain disorder by heat transfer from brain tissue comprising the steps of surgically cutting a heat transfer aperture into a patient's skull, thereby exposing a predetermined portion of patient's brain; surgically implanting into said heat transfer aperture a heat pump having one or more electrical sensor elements and one or more temperature sensor elements; surgically implanting a heat transfer management unit in a body cavity of said patient such that a micro controller of the heat transfer management unit is connected to one or more activity sensor elements and one or more temperature sensor elements contacting brain tissue and connecting the heat transfer management unit to said heat pump via a lead bundle. Optionally, the heat transfer unit may be located external to the patient's body. Responsive to signals from one or more activity or temperature sensor elements, mathematical algorithms of the heat transfer management unit determine abnormal brain activity, causing the heat pump to remove heat from the brain tissue into a heat sink, thereby cooling the predetermined portion of the patient's brain. This technique utilizes acute hypothermia by means of a Peltier cooler or similar device to cool the brain temperature to reduce or prevent seizure initiation and/or propagation. The method may be used in association with brain stimulation and/or drug application to acutely avoid the occurrence of a seizure episode.

A high intensity light source employs a plurality of light emitting diodes associated with a unitary reflector subassembly. The reflector subassembly defines an array of frustoconical reflectors arranged in rows and columns with the adjacent reflectors of each row being connected by a diverging slot with reflective wall surfaces. The light emitting diodes are mounted on a printed circuit board which forms a component of heat sink subassembly.

Nano-composite materials with enhanced thermal performance that can be used for thermal management in a wide range of applications, including heat sinks, device packaging, semiconductor device layers, printed circuit boards and other components of electronic, optical and/or mechanical systems. One type of nano-composite material has a base material and nanostructures (e.g., nanotubes) dispersed in the base material. Another type of nano-composite material has layers of a base material with nanotube films disposed thereon.

The present invention provides fabrics that have unique chemical, electrical, and thermal properties. The fabrics comprise layers of yarns woven together wherein the yarns further comprise carbon nanotube fibers. These carbon nanotube fibers may be either single-walled or multi-walled carbon nanotubes. The use of carbon nanotube fibers allows the fabrics to insulate, semi-conduct or super-conduct electrical charges. Additionally, the thermal properties of carbon nanotubes allow thermal energy to flow efficiently between the fabric and a heat sink or source. Additional yarns of materials other than carbon nanotubes can be integrated or woven into the fabric to provide other unique properties for the fabric. These fabrics can be layered to form unique garments or structures.

The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.

A high-powered lighting assembly includes an easily sealed continuous thermal barrier and a solid-state actively controlled closed-loop refrigeration system to maximize operational efficiencies and increase unit life. The thermal barrier prevents thermal back-flow from a heat sink plate or a housing to a lighting array while insulating a control module and a thermal sensor with improved sealing geometry. The refrigeration system is optimally positioned to controllably pump heat from the lighting array to the heat sink plate.

The present invention relates to a lighting device using an LED. One embodiment of the invention provides a lamp-shaped LED lighting device that can replace a known lighting device. The lamp-shaped LED lighting device promptly emits the heat generated by an LED element, which influences the optical output and the lifespan of the LED lighting device, through a lamp-shaped frame with a heat-ventilation structure that facilitates air circulation. In addition, the lamp-shaped LED lighting device prevents glare from an LED light source by using a lateral reflecting member, a diffusion lens and a diffusion cover and diffuses the light from the light source widely without optical attenuation. Another embodiment of the invention provides a tube and panel-shaped LED lighting devices that can be replaced with a previous tube-shaped fluorescent light and a panel-shaped lighting device. The tube and panel-shaped LED lighting devices rapidly emit the heat generated by an LED element, which influences the optical output and the life span of the LED lighting device, through a tube and panel-shaped frame with a heat-sink structure. In addition, the tube and panel-shaped LED lighting devices prevent glare from the LED light source by optically arranging a curved reflecting plate, a diffusion plate and a diffusion window which include a diffusion lens at the upper portion of the LED element. Furthermore the tube and panel-shaped LED lighting devices diffuse the light from the LED light source widely without optical attenuation.

A system for synthesizing nanostructures using chemical vapor deposition (CVD) is provided. The system includes a housing, a porous substrate within the housing, and on a downstream surface of the substrate, a plurality of catalyst particles from which nanostructures can be synthesized upon interaction with a reaction gas moving through the porous substrate. Electrodes may be provided to generate an electric field to support the nanostructures during growth. A method for synthesizing extended length nanostructures is also provided. The nanostructures are useful as heat conductors, heat sinks, windings for electric motors, solenoid, transformers, for making fabric, protective armor, as well as other applications.

An LED lamp structure with adjustable projection angle includes an aluminum extrusion lamp housing, an LED module, and a rotating rack. The lamp housing has a base, a plurality of heat sinks extended from the base, and a receiving portion formed on an external side of the base. The LED module includes a fixing base, a lampshade on a side of the fixing base, and a plurality of LED lamps in the lampshade, and the fixing base is coupled in the base of the lamp housing. The rotating rack has a hollow cylindrical body, a fixing board extended from a side of the cylindrical body, and a connecting portion formed on the fixing board and connected to the corresponding receiving portion, so that the projection angle of the LED module can be adjusted according to the illumination requirements for different positions and provide the light required for the illumination area.

An apparatus of antenna with heat slug and its fabricating process are provided, in which the antenna with heat slug can be realized with a single sheet or double sheets of metal. A dual-band antenna module with a mask cover is taken as an example to realize the apparatus. Each single sheet of metal can be achieved by simply cutting and bending a metal plate. Thereby, it is a simple and low-cost fabricating process. In the known fabricating process of integrated circuit, the heat slug and the antenna can be combined in a module at the same step. Therefore, integrating the antenna with heat slug in a fabricating process needs not to develop a new process.

A light source (10) includes a light emitting semiconductor device (12). A support substrate (14) has a generally planar reflective surface (28) that supports the semiconductor device (12). The light emitting semiconductor device heat sinks via the support substrate. A curved reflector (16) has a concave parabolic reflective surface. The light emitting semiconductor device (12) is arranged between the support substrate (14) and the curved reflector (16). The support substrate (14) and the curved reflector (16) together define a light aperture (18) through which light produced by the light emitting semiconductor device (12) passes.

An electric power steering apparatus can improve heat dissipation of a power board. A heat sink is mounted on the power board in surface contact therewith, on which power board there is mounted a bridge circuit including a plurality of semiconductor switching elements for switching an electric current supplied to an electric motor in accordance with torque assisting a steering wheel. The heat sink has a plurality of protrusions formed on a surface thereof at a side opposite to the power board.

A heat dissipating LED signal lamp emitting structure includes an isothermal board, a light emitting unit on the isothermal board, a heat conducting cylinder connected to the bottom of the isothermal board, a heat dissipating body around the periphery of the heat conducting cylinder and comprised of heat sinks, a circular cover body above the isothermal board for covering the isothermal board, a reflecting groove at the center of the cover body for passing through the light emitting unit, and a transparent lid on the cover body for covering the light emitting unit. With the heat dissipating effect of the heat dissipating body, the operating heat produced by the light emitting unit can be dissipated to the outside. The invention not only uses a single light emitting unit as a signal lamp emitting source, but also enhances the light emitting efficiency and the life expectancy of the light emitting unit.

A package allowing agile deployment of the location of each LED chip includes a heat slug to secure multiple LED chips, two lead frames, a conducting area extending along the edge of the heat slug, and a non-conductive material that connects the heat slug and the lead frame for those multiple LED chips to connect to the conducting area by means of a gold wire without being subject to the presence of the lead frame.

A LED sunken lamp includes a case and a lighting assembly. The case includes a lamp shade and a case seat. The lamp shade is wedged in the case seat. The lighting assembly also is wedged in the case seat and includes at least a LED lamp and a circuit board that are electrically connected. The case seat can be disassembled to facilitate wedging of the lamp shade and the lighting assembly in the case seat. The case seat also has a plurality of radiation fins to disperse heat energy generated by the LED lamp when in use to increase the life span of the LED lamp.

A cooling module for a battery pack assembly is disclosed. The cooling module includes a frame having a plurality of legs forming an opening through a central portion of the frame, at least one of the plurality of legs including a slot formed therethrough. A cooling fin is coupled to the frame. The cooling fin includes a corrugated plate interposed between a first plate and a second plate forming a plurality of fluid flow channels between the first plate and the second plate. The cooling modules are disposed in a stack having at least one battery cell disposed between adjacent cooling modules. The battery cell is in heat transfer communication with the cooling fin of at least one cooling module, wherein the cooling fin facilitates a transfer of heat energy between the battery cell and the flow channels formed in the cooling fin.

A DC power supply device includes transformers that operate with an enhanced efficiency and can reduce the factors that generate ripples in the output voltage to make it possible to downsize the transformers and the smoothing filters of the device, reduce the loss attributable to the switching elements during its constant power output operation and also downsize the heat sink fins so that the overall dimensions of the power supply device may be reduced. The DC power supply device also comprises a pair of switching changers, two output transformers and two rectifying/smoothing sections for rectifying the respective outputs of the switching changers. Each of the two switching changers has the same switching cycle period and the striking phases of the switching elements of one of the switching changers and those of the switching elements of the other switching changer are made variable. Then, a constant power output level is achieved by utilizing the difference of the striking phases of the two switching changers in order to isolate the switching changers from each other for operation and connect them in series or in parallel for operation.

A plasma reactor for performing plasma immersion ion implantation, dopant deposition or surface material enhancement, includes a vacuum chamber, a wafer support pedestal or electrostatic chuck having an insulated electrode underlying a wafer support surface within said chamber, a chucking voltage source coupled to the insulated electrode, a thermal sink coupled to the electrostatic chuck, an RF bias power generator coupled to said electrostatic chuck, and a process gas supply and gas inlet ports coupled to the chamber and coupled to the gas supply. The process gas supply contains either (a) a gas containing a dopant species to be ion implanted in a semiconductive material of workpiece, (b) a gas containing a dopant species to be deposited on a surface of a semiconductive material of a workpiece, or (c) a gas containing a material enhancement species to be ion implanted into a workpiece.

A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.