6923 results about "Heat sink" patented technology

The mass concrete curing method based on the intelligent temperature control system comprises the following steps that concrete is divided into a top layer, a bottom layer and a middle layer, each layer is provided with an independent temperature control pipeline, and temperature monitoring points are designed; constructing a three-dimensional thermal field finite element model containing a hydration heat release function, temperature control pipeline heat sink and boundary conditions, and generating data by using a calculation result of the finite element model to train a neural network prediction model; a temperature control pipeline and a temperature monitoring point are installed before mass concrete is poured, and heat preservation is covered after pouring; data is collected in real time and input into the prediction model, the predicted temperature of each temperature monitoring point is output, if the temperature difference control threshold value or the temperature reduction control threshold value is exceeded, temperature control pipeline parameters and heat preservation measures of the corresponding layer are adjusted, and a temperature control strategy is executed after calculation is repeated till the requirement is met. The concrete temperature field is accurately controlled, temperature difference over-limit is effectively avoided, and the mass concrete curing quality is improved.

The invention belongs to the technical field of solid-liquid phase change heat dissipation, and discloses a memory alloy-based phase change expansion buffer structure, which comprises an elastic structure, a supporting structure, a thin wall, a cavity, a flaring, an electronic device, a heat sink, fins, a connecting structure and a phase change material, the thin wall is made of shape memory alloy and separates the internal cavity and the external phase-change material, the internal cavity is communicated with the external environment through the flaring, and in the flying process of the aerospace vehicle, external airflow flows into the flaring to take away heat stored by the phase-change material continuously. Based on the shape memory function of the memory alloy, additional space expansion buffering can be provided for the phase change material when the temperature changes, and stress damage caused by phase change expansion is avoided. The memory alloy thin wall and the elastic supporting structure are combined, the structure is simple, no moving part exists, circulating work in the high-temperature environment and the low-temperature environment can be achieved, local hot spots caused by internal gap movement of the phase change material in the circulating phase change process are reduced, and heat transfer deterioration is avoided.

The embodiment of the invention provides a closed-loop control method for power driving and protection, and the method comprises the steps: constructing a voltage feedback type circuit through a high-speed operational amplifier, and forming a closed-loop gain structure through a feedback network of the voltage feedback type circuit; the load current of the output end of the voltage feedback type circuit is monitored in real time, and when the load current exceeds a first set threshold value, a protection mechanism is triggered to turn off the output stage; the power-on surge current is limited through the soft start control circuit; phase information of a load reflection coefficient is obtained, an inductance / capacitance combination of the variable dynamic impedance matching network is selected according to phase information table look-up, inductance / capacitance parameters are switched through a relay, and the transmission standing-wave ratio between the power amplifier and a load is optimized; monitoring the temperature of the radiating fin of the power tube, and dynamically adjusting the resistance value of the feedback network; and performing cooperative control of short-circuit protection, over-temperature protection and surge suppression according to the priority. According to the embodiment of the invention, the performance bottleneck in a load fluctuation scene is broken through.

The invention relates to the technical field of chip heat dissipation, and discloses a bare chip cooling fin and an installation method thereof, and the cooling fin comprises a heat dissipation substrate, through hole supporting columns, a mixed fixing assembly and a heat dissipation fin array. The heat dissipation substrate is made of high-thermal-conductivity copper alloy, and the surface of the heat dissipation substrate is plated with a nano oxide layer to improve the heat radiation efficiency; the height of the through hole supporting column is matched with that of elements around the chip, and the bottom is provided with an anti-skid rubber pad to prevent installation inclination and buffer mechanical stress; the mixed fixing assembly comprises screw fixing holes distributed diagonally and plastic buckle fixing holes distributed diagonally, a plastic buckle can rotate by 0-90 degrees, a limiting spring is arranged in the plastic buckle to provide tactile feedback, and rapid installation and damage-free disassembly are achieved; the radiating fin array adopts a gradient height design, is matched with heat source distribution of the chip and optimizes an airflow channel. Through the dual-redundancy fixing structure and the gradient heat dissipation design, the heat dissipation efficiency and the installation reliability are remarkably improved, and the heat dissipation device is suitable for high-vibration and high-heat-dissipation-demand scenes such as data centers and automatic driving.

The invention aims to provide the plant efficient growth LED light source modular light supplementing equipment, system and method which are reasonable in structure and capable of realizing accurate regulation and control of illumination parameters, aiming at the problems that the spectrum and the light intensity cannot be flexibly adjusted, the equipment structure is inconvenient, the heat dissipation performance is insufficient and the like in the existing plant light supplementing technology, and the invention provides the plant efficient growth LED light source modular light supplementing equipment, system and method which are reasonable in structure and capable of realizing accurate regulation and control of the illumination parameters. The equipment adopts a modular design and internally comprises a plurality of LED light source modules capable of adjusting light intensity and spectrum output so as to meet the illumination requirements of plants in different growth stages. The control system can monitor and adjust the illumination intensity and the spectrum proportion in real time through an adjustable button, and it is ensured that the plants obtain the optimal illumination condition in each growth stage. The equipment is provided with an efficient heat dissipation system which comprises a heat dissipation sheet, a heat dissipation ring and a heat dissipation net, so that heat dissipation of the LED lamp beads is optimized, the service life of the lamp is prolonged, and the luminous efficiency of the LED light source module is improved. The light supplementing system comprises an illumination regulation and control system, a control system and a power supply module, can automatically regulate illumination intensity and spectrum output, meets the requirements of plants in different growth stages, has an energy-saving mode, and reduces energy consumption. The light supplementing method comprises the steps of initializing the system, presetting spectrum and intensity, adjusting illumination in real time, and promoting healthy growth of plants.

An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a multiaxial thermal shoe having a thermal interface material and configured to thermally couple the endcap of the Dewar to the heat sink via one of at least two axial surfaces. The multiaxial thermal shoe is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. The multiaxial thermal shoe may be configured to hold the thermal interface material against the endcap. The multiaxial thermal shoe may couple to the heat sink via a first axial surface in-line with an optical centerline or a second axial surface crosswise to the optical centerline.

The invention discloses an S-shaped micro-channel heat dissipation device with a double-layer turbulent flow structure and a use method, belongs to the field of liquid cooling heat dissipation, and is suitable for heat dissipation of a high-heat-flux device or a heat conduction device. The device comprises a base, a cover plate, a micro-channel body, turbulent flow columns, a flow guide structure, O-shaped sealing rings and quick-screwing connectors, the micro-channel body is provided with S-shaped channels which are vertically symmetrical, the turbulent flow columns are evenly arranged in the centers of the channels, and the top ends of the turbulent flow columns are flush with the end face of the micro-channel body. The turbulent flow columns can be rectangular columns or water-drop-shaped columns which are arranged in a single row or multiple rows at equal intervals and are matched with the flow guide structure to achieve efficient flow division of cold and hot fluid and interlayer heat interaction. Fluid mixing is strengthened through the centrifugal force of the S-shaped channel, a heat boundary layer is destroyed by the turbulent flow columns, and the problems that a traditional straight channel is low in heat exchange efficiency and uneven in temperature distribution are solved. Deionized water or nanofluid is selected as cooling liquid, closed circulation is formed by entering and exiting of the cooling liquid through the quick-screwing connector, and the adaptive scene and the comprehensive performance of the device are further expanded through the multiple rows of turbulent flow columns or the water-drop-shaped turbulent flow columns.

A charging inlet (1) comprises: a rear case (40) that is connected to an inlet housing (20) retaining a plurality of terminals (10); and a filling section (80). The rear case (40) comprises a rear case body (40a) that has a housing section (41) housing at least base sections (12) of the plurality of terminals (10) and a plurality of inner terminals (70), and fins (46) that are provided so as to be exposed to the outside of the rear case body (40a). The filling section (80) is molded or formed from an insulating filler material with which the remaining portion of the housing section (41) is filled. The material of the rear case (40a) is an electrically insulating, thermally conductive resin resulting from filling a thermoplastic resin with a carbon-based or ceramic-based filler. The fins (46) are formed from a metal material, and are integrated with the rear case body (40a) by insert molding.

The invention relates to the technical field of chip heat dissipation, and discloses a heat dissipation plate and a heat dissipation system.The heat dissipation plate comprises a plate body and a flow channel structure, and the plate body is provided with a water inlet and a water outlet which are oppositely arranged; the flow channel structure is formed on the plate body and arranged between the water inlet and the water outlet, the flow channel structure comprises a plurality of main flow channels and a plurality of branch flow channels, all the main flow channels, all the branch flow channels and all the main flow channels and all the branch flow channels are communicated, part of the main flow channels are communicated with the water inlet and the water outlet, and part of the branch flow channels are communicated with the water inlet and the water outlet. A cooling medium flows into the main flow channels through the water inlet and flows out of the main flow channels through the water outlet, and all the main flow channels and all the branch flow channels are formed on the plate body in a vein net shape; the flow channel structure is provided with a plurality of concentration parts configured to have a first number and a plurality of dispersion parts configured to have a second number, the concentration parts and the dispersion parts are arranged at intervals, and the first number is larger than the second number; the heat dissipation efficiency and the heat dissipation uniformity of the plate body can be improved.

The invention belongs to the technical field of heat exchange, and particularly relates to a liquid metal enhanced heat exchange pipeline which comprises a pipeline body, an auxiliary heat exchange cavity and liquid metal. One end of the auxiliary heat exchange cavity is arranged on the pipeline body, and the other end of the auxiliary heat exchange cavity is far away from the pipeline body; the auxiliary heat exchange cavity is filled with the liquid metal. The auxiliary heat exchange cavity is filled with the liquid metal, and compared with a traditional cooling medium, the liquid metal can transfer heat more quickly by means of the ultrahigh heat conductivity of the liquid metal, the heat resistance is reduced, and the overall heat exchange efficiency is improved. In addition, due to the high thermal conductivity of the liquid metal and the optimized heat exchange structure, efficient heat exchange can be achieved in a more compact space, and the requirement for additional cooling fins or heat exchange assemblies is reduced. And compared with a traditional heat exchanger, the heat exchange power density of unit volume is higher, the heat exchanger is suitable for high-power electronic equipment, spaceflight heat dissipation systems and new energy heat exchange equipment, and the requirements for miniaturization and efficient heat dissipation are met.

The invention relates to the technical field of transformers, in particular to a transformer with a high-temperature early warning device, which comprises a base and a transformer body fixedly mounted on the base, and further comprises a temperature control system, and the temperature control system is used for monitoring the temperature of the transformer body and dynamically analyzing the transformer body. A plurality of sets of cooling fins are fixedly connected to the outer portion of the transformer body, and a plurality of sets of mounting frames are fixedly connected to the base. In the invention, aiming at the defect of incomplete monitoring of a traditional temperature sensor, the temperature control system can realize comprehensive temperature monitoring and dynamic operation analysis of the transformer body, accurately capture internal complex temperature field distribution, and avoid the problem of insulation aging acceleration caused by local high-temperature leak detection; compared with an existing single threshold value control mode, intelligent early warning is achieved through a dynamic analysis technology, a control strategy can be adjusted according to real-time temperature changes, and the limitation that a traditional method lacks state perception is overcome.

The invention discloses a low-loss double-reverse-star rectifier transformer for a hydrogen production system, and relates to the technical field of double-reverse-star rectifier transformers, the low-loss double-reverse-star rectifier transformer comprises a box body, cooling fins, a coil, a connector lug, a supporting box and a cooling module, the cooling fins are installed on the outer wall of the box body, the coil is installed on the inner wall of the box body, the connector lug penetrates through the top of the box body, and the supporting box is arranged in the box body. One end of the connector lug is connected with the outer wall of the coil, and a supporting box is installed on the outer wall of the box body. The oil pump is started to suck transformer oil in the box body into the continuous bow-shaped pipe, at the moment, the first fan is started to generate wind power to blow to the surface of the continuous bow-shaped pipe, so that the transformer oil in the continuous bow-shaped pipe is cooled, and the cooled transformer oil enters the box body again through the discharge head; at the moment, a first motor rotates to drive a first beating head to rotate, the first beating head rotates to drive a T-shaped frame to move, the T-shaped frame moves to drive a first spring to move, and the first spring moves to enable the T-shaped frame to drive a ram to move.

The invention relates to a copper-aluminum composite heat dissipation plate forging and pressing manufacturing process and a copper-aluminum composite heat dissipation plate. The process comprises the steps that S1, assembling is conducted, specifically, an aluminum plate and a copper plate are stacked, and a double-layer plate is obtained; s2, welding is conducted, specifically, the aluminum plate and the copper plate are compounded in a diffusion welding mode, the junction position of the aluminum plate and the copper plate is welded to form a diffusion layer, and a double-layer welded plate is obtained; the double-layer welding plate is extruded and stretched through a hydraulic machine to form the copper-aluminum composite heat dissipation plate, forming holes are formed in a template, facing an aluminum plate, of the hydraulic machine, the aluminum plate is extruded through the forming holes, heat dissipation protrusions of an aluminum-clad copper structure are formed on the copper-aluminum composite heat dissipation plate, the width of the heat dissipation protrusions is larger than 1.5 mm, and the heat dissipation protrusions are arranged on the aluminum plate; and the thickness of the aluminum layer on the surface of the heat dissipation bulge is not less than 0.1 mm. The copper-aluminum composite heat dissipation plate is manufactured through the process. According to the technology, the copper-aluminum composite heat dissipation plate can be obtained through a simple manufacturing method, the high heat conductivity of copper and the corrosion resistance of aluminum are compatible, and connection at the copper-aluminum interface is reliable.

The invention relates to the technical field of thermal management optimization, and discloses an active cooling and power optimization system of a plateau turbine generator, which comprises a multi-physics field modeling module, a reinforcement learning decision module, a strategy optimization training module and an edge execution control module, and is used for resolving a temperature field / flow field / stress field coupling state in real time, providing environment dynamic characterization, and optimizing the power of the plateau turbine generator. According to the method, multi-source sensing data is processed, a cooling liquid flow rate and cooling fin angle control instruction is generated, strategy iteration optimization is carried out in a digital twin environment, the physical rationality and energy efficiency optimality of a control algorithm are ensured, a lightweight strategy network is deployed, and sub-second-level real-time response and fault safety protection are achieved. Through intelligent control and multi-physical field cooperation, the temperature adjusting precision and the system response speed are improved, efficient power output of the turbine is kept under different altitudes and climate conditions through a self-adaptive strategy, and a reliable clean energy solution is provided for high-altitude areas in combination with multiple safety protection mechanisms.

The invention relates to the technical field of graphene, and more particularly discloses an automatic processing system and method for a graphene cooling fin, and the method comprises the steps: obtaining the specification and shape parameters of the cooling fin, a monitoring video, a slicing pressure value and other information, extracting a slicing process change feature vector, a cooling fin parameter correlation feature vector and a pressure feature vector, and obtaining a graphene cooling fin; the feature vectors are classified through a classifier, and whether the pressure value at the current time point needs to be increased or decreased is judged. In this way, automatic machining of the graphene cooling fins is achieved, and the machining applicability and quality are improved.

A refrigerator including a main body; a storage room inside the main body; a thermoelectric module including a module plate including an element mounting portion, a heat dissipation sink on a first side of the module plate, a cooling sink on a second side of the module plate, and a thermoelectric element positioned in the element mounting portion such that a first surface of the thermoelectric element contacts the heat dissipation sink and a second surface of the thermoelectric element contacts the cooling sink; and a coupling member penetrating the module plate of the thermoelectric module to couple the thermoelectric module to an upper surface of the main body.

The invention relates to a heat dissipation optimization method and system for an air conditioner control panel, and belongs to the technical field of energy-saving air conditioner heat dissipation. Comparing the real-time temperature data with a preset temperature threshold value, and determining a heat dissipation mode; when the real-time temperature data is lower than a first threshold value, a first-stage heat dissipation mode is started, a heat dissipation fan is controlled to operate at the lowest rotating speed, and a basic heat conduction path of a cooling fin is activated; when the real-time temperature data is between a first threshold value and a second threshold value, a second-stage heat dissipation mode is started, the rotating speed of a heat dissipation fan is adjusted to be in linear proportion to the real-time temperature data, and an expansion heat conduction path of a cooling fin is started to increase the heat dissipation area; and when the real-time temperature data exceeds a second threshold value, starting a three-stage heat dissipation mode, switching to phase change material auxiliary heat dissipation, controlling a heat dissipation fan to operate at the maximum rotating speed, dynamically adjusting the heat conduction efficiency of a heat dissipation sheet through a pulse width modulation signal, and triggering a temperature alarm signal.

The utility model discloses a millimeter wave chip packaging structure based on a substrate integrated waveguide and an artificial magnetic conductor, which relates to the technical field of millimeter wave chip packaging, and comprises a chip, a cover plate and a base, the cover plate is in sealing fit with the base, the chip is arranged in the base, and the cover plate comprises a metal flat plate and a plurality of metal columns connected below the metal flat plate and distributed in an array. The metal column is not contacted with the base; the base comprises a frame, an SIW substrate, a direct current feed terminal and a heat sink, a first groove is formed in the center of the upper surface of the heat sink, and second grooves are formed in the two sides of the first groove and communicated with the first groove. According to the utility model, the SIW substrate is adopted to replace a traditional strip line terminal to serve as the millimeter wave input end and the millimeter wave output end of the shell, and the conductive materials on the upper surface and the lower surface of the SIW substrate are titanium tungsten / nickel / gold in sequence, so that the structure is simple, the processing technology is simple, the assembly technology is simple, the price is low, and the like; and the cable also has the advantages of wide working frequency band, large bearing power, small reflection loss, small transmission loss and the like, and also has the advantages of static electricity prevention and lightning protection.

The invention relates to the field of equipment verification, in particular to a thermostatic bath and a thermostatic method. The constant temperature bath comprises at least one constant temperature bath unit, the magnetic stirrer is rotationally arranged at the inner bottom of the tank body, the cooling fan is arranged at the outer bottom of the tank body, the magnet is arranged on the cooling fan and rotates along with the cooling fan, the semiconductor chilling plate wraps the periphery of the tank body and the periphery of the cooling fan, and the cooling fin is attached to the semiconductor chilling plate. The size of the calorimeter temperature sensor calibrating device is reduced, the operation efficiency and the automation degree are improved, and the temperature can be uniformly controlled.

The invention relates to a packaging structure and packaging method for an optical module and an optical chip, and the packaging structure comprises a receiving end assembly, a stepped metal heat sink, and a silicon-based optical interconnection assembly which is pasted on the stepped metal heat sink. The silicon-based optical interconnection assembly comprises a laser, a silicon light beam splitter, a lens group, a light transmission compensation gasket, a silicon light modulator and an optical fiber array; coplanar coupling is formed between the laser and the silicon light beam splitter. The silicon light beam splitter and at least part of the collimating lens in the lens group are fixed on the light transmission compensation gasket; the optical fiber array and the silicon light modulator realize waveguide matching in an active coupling mode; the silicon light modulator and the receiving end assembly are separately arranged at least at a preset interval, and the optical fiber array and / or the receiving end assembly are / is covered with a metal isolation cover. According to the invention, the problems of high cost of multiple light sources, easy pollution of an open light path and yield bottleneck caused by low-reliability glue in the prior art are solved, and finally, a packaging scheme which is compact in structure, stable in process and high in mass production is formed.

A power conversion apparatus is disclosed. The power conversion apparatus according to one aspect of the present disclosure may include: a housing including an upper part, a lower part disposed in parallel with the upper part, a first side part connecting the upper part with the lower part, and a second side part disposed in parallel with the first side part; a plurality of transistors disposed adjacent to the first side part inside the housing; a heat sink disposed on one side of the plurality of transistors and providing a passage through which air introduced from the outside moves; and a plurality of capacitors disposed in front of the heat sink, wherein the plurality of capacitors may be disposed to be spaced apart from each other so that air introduced from the outside of the housing moves to the heat sink.

The invention relates to the technical field of transformers, in particular to pole-mounted transformer platform complete equipment convenient to maintain, which comprises a transformer box, a distribution box is mounted at the bottom of the transformer box, a mounting bracket is mounted on one side, opposite to the distribution box, of the transformer box, and circular brackets are mounted on the left side and the right side of the mounting bracket. A plurality of cooling fins which are evenly distributed in the horizontal direction are installed on the front side and the rear side of the transformer box correspondingly, movable mechanisms are arranged on the upper sides and the lower sides of the cooling fins correspondingly, and a first cleaning mechanism is arranged on the side, away from the distribution box, of one movable mechanism; and a plurality of mounting mechanisms which are uniformly distributed in the horizontal direction are mounted on one side, far away from the distribution box, of the transformer box. Through mutual cooperation of the movable mechanism and the displacement assembly, the cooling fins rotate around the rotating center shaft, and the problem that the cooling performance is affected by dust and impurities on the peripheries of the cooling fins is solved.

The invention relates to the field of nuclear fusion devices, and discloses a fastening device and a mounting structure of a fusion reactor divertor system heat sink structure, and the fastening device of the fusion reactor divertor system heat sink structure is used for connecting the heat sink structure and a main body structure, and comprises a first connecting piece, a supporting disc, a second connecting piece, a first elastic piece and a third connecting piece, a first thread part is arranged on the outer side of the first connecting piece; the supporting disc is arranged in the first groove and is in clearance arrangement with the peripheral groove wall of the first groove; the second connecting piece penetrates through the second hole and is provided with a third groove; the first elastic piece is arranged in the second groove and elastically abuts against the skirt edge part. And the third connecting piece is arranged in the third groove and is in clearance arrangement with the peripheral groove wall of the third groove. A thermal expansion deformation space is reserved in the fastening device of the fusion reactor divertor system heat sink structure, damage to internal parts can be avoided, and the reliability of the fastening device of the fusion reactor divertor system heat sink structure is improved.

The invention relates to the technical field of clean energy power generation, in particular to power generation equipment based on wind, light and heat multi-energy coupling. The power generation equipment comprises a vertical axis wind power generation and heat dissipation device, a photovoltaic and temperature difference power generation composite device, a double-axis tracking device and a tower type supporting frame. The vertical axis wind power generation and heat dissipation device captures wind energy through the impeller assembly so as to drive the driving assembly and drive the heat dissipation assembly to rotate at a high speed, and active heat dissipation is provided for the photovoltaic and thermoelectric power generation composite device. The photovoltaic and thermoelectric power generation composite device comprises a monocrystalline silicon photovoltaic cell, a first annular plate, a second annular plate and a plurality of aluminum extrusion type cooling fins, light energy can be effectively utilized, and waste heat collection and thermoelectric power generation are achieved. According to the power generation equipment, structural support is provided by the tower type supporting frame, and the comprehensive utilization efficiency of energy in unit space is remarkably improved through coupling utilization of wind energy, light energy and heat energy.

The invention provides a three-period minimal curved surface change heat exchanger for airborne intermittent high-heat-flux surface heat dissipation, and belongs to the technical field of phase change heat storage. According to the technical key points, the flow channels are divided into hot fluid flow channels allowing hot fluid to pass through and preventing cold fluid from flowing and cold fluid flow channels allowing cold fluid to pass through and preventing hot fluid from flowing, and the hot fluid flow channels and the cold fluid flow channels intersect in direction and are alternately arranged to form effective heat exchange channels. A phase change material is packaged in a hot fluid flow channel by adopting a three-period extremely-small curved surface structure, and the structure is used as a primary heat exchange surface, so that rapid heat exchange between the phase change material and hot fluid is promoted, and the heat storage rate is increased; cooperative disturbance structures matched with the three-period extremely-small curved surfaces are arranged in the cold fluid flow channels, heat exchange between the phase-change materials and the cold fluid is further promoted, and the heat dissipation rate is increased. The device has the advantages of being compact in structure and high in heat storage / release rate, and the requirements of high-power equipment in the instantaneous heat storage and dissipation process are effectively met.

The terminal equipment comprises a shell, a circuit board, a heating device, an air duct, a heat dissipation piece and a fan device. The shell is provided with an air inlet hole and an air outlet hole. The circuit board is arranged in the shell, the heating device is arranged on the circuit board, the air duct is arranged between the shell and the circuit board, the air duct comprises an air inlet and an air outlet, the air inlet is communicated with the air inlet hole, and the air outlet is communicated with the air outlet hole. The heat dissipation piece is arranged in the air channel and close to the air outlet and used for receiving heat conducted by the heating device. The fan device is arranged at the position, close to the air inlet, in the air channel and used for guiding air flow to the heat dissipation piece so that heat of the heat dissipation piece can be dissipated to the outside of the shell through the air outlet and the air outlet holes in sequence through the air flow. According to the terminal equipment, the heat dissipation system comprising the heat dissipation piece, the fan device, the air duct and the like is arranged in the terminal equipment, active heat dissipation can be achieved, the purpose of efficiently cooling a heating device is achieved, and the terminal equipment can obtain good performance when running in a high-load scene.

The invention belongs to the technical field of metering boxes, and particularly relates to a multifunctional electric energy metering box which comprises a box body, a metering unit, a monitoring unit, a protection unit and an anti-theft unit. The mounting plate is arranged at the position close to the bottom of the box body, a fan is arranged at the bottom of the mounting plate, the mounting plate and the bottom of the box body form a sealed space, cooling liquid is stored at the bottom of the box body, and air suction pipes are evenly arranged on the two sides of the box body; the water pump is started to pump the cooling liquid into the water bag corresponding to the high-temperature area, the water bag begins to swell until the water bag swells to the maximum, the cooling liquid in the water bag is sprayed out through the nozzle, the nozzle sprays the mist cooling liquid to the cooling fins, water mist sprayed out of the nozzle is composed of a large number of tiny water drops, the surface area is larger compared with large water drops, and the cooling effect is better. According to the metering box, the contact area with air in the box body is wider, the evaporation speed is higher, heat of the surrounding environment can be absorbed in a short time, the heat dissipation capacity of individual electric appliances is improved in a targeted mode through a detection mode, and therefore the heat dissipation effect of the metering box is improved.

The invention relates to the technical field of heat dissipation materials, and discloses a graphite cooling fin of a multi-layer composite structure and a manufacturing process of the graphite cooling fin of the multi-layer composite structure. 15 to 25 parts of artificial graphite powder; 3 to 8 parts of an aniline-p-phenylenediamine copolymer; 2 to 6 parts of antimony oxide nano particles; 2 to 5 parts of urea; 1 to 3 parts of polyvinylpyrrolidone; the preparation method comprises the following steps: carrying out heat treatment on the artificial graphite film, and then carrying out mechanical pulverization; mixing the graphite oxide with an ethanol or water mixed solvent containing ammonia water; mixing the raw materials; performing vacuum defoamation and then coating on a base material; and performing carbonization treatment on the graphene film crude product, and performing lamination calendering treatment to form a final product. According to the technical scheme, the antimony oxide nano particles are adopted to synergistically adjust the heat conductivity, the effect of remarkably improving the transverse heat conductivity of the film body is achieved, the heat conductivity is enhanced, and material embrittlement caused by overfilling is avoided.

The utility model relates to the technical field of inverters, and discloses a small-size inversion device, which effectively satisfies miniaturization and has better heat dissipation performance by improving a shell structure and a semiconductor device. The device comprises a mounting shell and a semiconductor assembly arranged in the mounting shell, the mounting shell comprises a bottom plate and a first surrounding plate arranged along the upper edge of the bottom plate by a circle, and a mounting cavity is formed in the middle of the bottom plate; the semiconductor assembly comprises a PCB (Printed Circuit Board), and the PCB is fixedly arranged above the mounting cavity; a three-phase rectification integration module and an IGBT integration module are arranged on the side, close to the installation cavity, of the PCB, the three-phase rectification integration module and the IGBT integration module are connected with the bottom plate through a heat conduction layer, and cooling fins are arranged below the bottom plate.