10191 results about "Heat sink" patented technology

A method of treating a brain disorder by heat transfer from brain tissue comprising the steps of surgically cutting a heat transfer aperture into a patient's skull, thereby exposing a predetermined portion of patient's brain; surgically implanting into said heat transfer aperture a heat pump having one or more electrical sensor elements and one or more temperature sensor elements; surgically implanting a heat transfer management unit in a body cavity of said patient such that a micro controller of the heat transfer management unit is connected to one or more activity sensor elements and one or more temperature sensor elements contacting brain tissue and connecting the heat transfer management unit to said heat pump via a lead bundle. Optionally, the heat transfer unit may be located external to the patient's body. Responsive to signals from one or more activity or temperature sensor elements, mathematical algorithms of the heat transfer management unit determine abnormal brain activity, causing the heat pump to remove heat from the brain tissue into a heat sink, thereby cooling the predetermined portion of the patient's brain. This technique utilizes acute hypothermia by means of a Peltier cooler or similar device to cool the brain temperature to reduce or prevent seizure initiation and/or propagation. The method may be used in association with brain stimulation and/or drug application to acutely avoid the occurrence of a seizure episode.

A high intensity light source employs a plurality of light emitting diodes associated with a unitary reflector subassembly. The reflector subassembly defines an array of frustoconical reflectors arranged in rows and columns with the adjacent reflectors of each row being connected by a diverging slot with reflective wall surfaces. The light emitting diodes are mounted on a printed circuit board which forms a component of heat sink subassembly.

Nano-composite materials with enhanced thermal performance that can be used for thermal management in a wide range of applications, including heat sinks, device packaging, semiconductor device layers, printed circuit boards and other components of electronic, optical and/or mechanical systems. One type of nano-composite material has a base material and nanostructures (e.g., nanotubes) dispersed in the base material. Another type of nano-composite material has layers of a base material with nanotube films disposed thereon.

The present invention provides fabrics that have unique chemical, electrical, and thermal properties. The fabrics comprise layers of yarns woven together wherein the yarns further comprise carbon nanotube fibers. These carbon nanotube fibers may be either single-walled or multi-walled carbon nanotubes. The use of carbon nanotube fibers allows the fabrics to insulate, semi-conduct or super-conduct electrical charges. Additionally, the thermal properties of carbon nanotubes allow thermal energy to flow efficiently between the fabric and a heat sink or source. Additional yarns of materials other than carbon nanotubes can be integrated or woven into the fabric to provide other unique properties for the fabric. These fabrics can be layered to form unique garments or structures.

The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.

A high-powered lighting assembly includes an easily sealed continuous thermal barrier and a solid-state actively controlled closed-loop refrigeration system to maximize operational efficiencies and increase unit life. The thermal barrier prevents thermal back-flow from a heat sink plate or a housing to a lighting array while insulating a control module and a thermal sensor with improved sealing geometry. The refrigeration system is optimally positioned to controllably pump heat from the lighting array to the heat sink plate.

The present invention relates to a lighting device using an LED. One embodiment of the invention provides a lamp-shaped LED lighting device that can replace a known lighting device. The lamp-shaped LED lighting device promptly emits the heat generated by an LED element, which influences the optical output and the lifespan of the LED lighting device, through a lamp-shaped frame with a heat-ventilation structure that facilitates air circulation. In addition, the lamp-shaped LED lighting device prevents glare from an LED light source by using a lateral reflecting member, a diffusion lens and a diffusion cover and diffuses the light from the light source widely without optical attenuation. Another embodiment of the invention provides a tube and panel-shaped LED lighting devices that can be replaced with a previous tube-shaped fluorescent light and a panel-shaped lighting device. The tube and panel-shaped LED lighting devices rapidly emit the heat generated by an LED element, which influences the optical output and the life span of the LED lighting device, through a tube and panel-shaped frame with a heat-sink structure. In addition, the tube and panel-shaped LED lighting devices prevent glare from the LED light source by optically arranging a curved reflecting plate, a diffusion plate and a diffusion window which include a diffusion lens at the upper portion of the LED element. Furthermore the tube and panel-shaped LED lighting devices diffuse the light from the LED light source widely without optical attenuation.

A system for synthesizing nanostructures using chemical vapor deposition (CVD) is provided. The system includes a housing, a porous substrate within the housing, and on a downstream surface of the substrate, a plurality of catalyst particles from which nanostructures can be synthesized upon interaction with a reaction gas moving through the porous substrate. Electrodes may be provided to generate an electric field to support the nanostructures during growth. A method for synthesizing extended length nanostructures is also provided. The nanostructures are useful as heat conductors, heat sinks, windings for electric motors, solenoid, transformers, for making fabric, protective armor, as well as other applications.

An LED lamp structure with adjustable projection angle includes an aluminum extrusion lamp housing, an LED module, and a rotating rack. The lamp housing has a base, a plurality of heat sinks extended from the base, and a receiving portion formed on an external side of the base. The LED module includes a fixing base, a lampshade on a side of the fixing base, and a plurality of LED lamps in the lampshade, and the fixing base is coupled in the base of the lamp housing. The rotating rack has a hollow cylindrical body, a fixing board extended from a side of the cylindrical body, and a connecting portion formed on the fixing board and connected to the corresponding receiving portion, so that the projection angle of the LED module can be adjusted according to the illumination requirements for different positions and provide the light required for the illumination area.

An apparatus of antenna with heat slug and its fabricating process are provided, in which the antenna with heat slug can be realized with a single sheet or double sheets of metal. A dual-band antenna module with a mask cover is taken as an example to realize the apparatus. Each single sheet of metal can be achieved by simply cutting and bending a metal plate. Thereby, it is a simple and low-cost fabricating process. In the known fabricating process of integrated circuit, the heat slug and the antenna can be combined in a module at the same step. Therefore, integrating the antenna with heat slug in a fabricating process needs not to develop a new process.

A light source (10) includes a light emitting semiconductor device (12). A support substrate (14) has a generally planar reflective surface (28) that supports the semiconductor device (12). The light emitting semiconductor device heat sinks via the support substrate. A curved reflector (16) has a concave parabolic reflective surface. The light emitting semiconductor device (12) is arranged between the support substrate (14) and the curved reflector (16). The support substrate (14) and the curved reflector (16) together define a light aperture (18) through which light produced by the light emitting semiconductor device (12) passes.

An electric power steering apparatus can improve heat dissipation of a power board. A heat sink is mounted on the power board in surface contact therewith, on which power board there is mounted a bridge circuit including a plurality of semiconductor switching elements for switching an electric current supplied to an electric motor in accordance with torque assisting a steering wheel. The heat sink has a plurality of protrusions formed on a surface thereof at a side opposite to the power board.

A heat dissipating LED signal lamp emitting structure includes an isothermal board, a light emitting unit on the isothermal board, a heat conducting cylinder connected to the bottom of the isothermal board, a heat dissipating body around the periphery of the heat conducting cylinder and comprised of heat sinks, a circular cover body above the isothermal board for covering the isothermal board, a reflecting groove at the center of the cover body for passing through the light emitting unit, and a transparent lid on the cover body for covering the light emitting unit. With the heat dissipating effect of the heat dissipating body, the operating heat produced by the light emitting unit can be dissipated to the outside. The invention not only uses a single light emitting unit as a signal lamp emitting source, but also enhances the light emitting efficiency and the life expectancy of the light emitting unit.

A LED sunken lamp includes a case and a lighting assembly. The case includes a lamp shade and a case seat. The lamp shade is wedged in the case seat. The lighting assembly also is wedged in the case seat and includes at least a LED lamp and a circuit board that are electrically connected. The case seat can be disassembled to facilitate wedging of the lamp shade and the lighting assembly in the case seat. The case seat also has a plurality of radiation fins to disperse heat energy generated by the LED lamp when in use to increase the life span of the LED lamp.

A cooling module for a battery pack assembly is disclosed. The cooling module includes a frame having a plurality of legs forming an opening through a central portion of the frame, at least one of the plurality of legs including a slot formed therethrough. A cooling fin is coupled to the frame. The cooling fin includes a corrugated plate interposed between a first plate and a second plate forming a plurality of fluid flow channels between the first plate and the second plate. The cooling modules are disposed in a stack having at least one battery cell disposed between adjacent cooling modules. The battery cell is in heat transfer communication with the cooling fin of at least one cooling module, wherein the cooling fin facilitates a transfer of heat energy between the battery cell and the flow channels formed in the cooling fin.

A DC power supply device includes transformers that operate with an enhanced efficiency and can reduce the factors that generate ripples in the output voltage to make it possible to downsize the transformers and the smoothing filters of the device, reduce the loss attributable to the switching elements during its constant power output operation and also downsize the heat sink fins so that the overall dimensions of the power supply device may be reduced. The DC power supply device also comprises a pair of switching changers, two output transformers and two rectifying/smoothing sections for rectifying the respective outputs of the switching changers. Each of the two switching changers has the same switching cycle period and the striking phases of the switching elements of one of the switching changers and those of the switching elements of the other switching changer are made variable. Then, a constant power output level is achieved by utilizing the difference of the striking phases of the two switching changers in order to isolate the switching changers from each other for operation and connect them in series or in parallel for operation.

A plasma reactor for performing plasma immersion ion implantation, dopant deposition or surface material enhancement, includes a vacuum chamber, a wafer support pedestal or electrostatic chuck having an insulated electrode underlying a wafer support surface within said chamber, a chucking voltage source coupled to the insulated electrode, a thermal sink coupled to the electrostatic chuck, an RF bias power generator coupled to said electrostatic chuck, and a process gas supply and gas inlet ports coupled to the chamber and coupled to the gas supply. The process gas supply contains either (a) a gas containing a dopant species to be ion implanted in a semiconductive material of workpiece, (b) a gas containing a dopant species to be deposited on a surface of a semiconductive material of a workpiece, or (c) a gas containing a material enhancement species to be ion implanted into a workpiece.

A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.

A dynamic heat sink engine including a storage vessel having a working fluid outlet and a working fluid inlet. The lower portion of the storage vessel contains a cryogenic working fluid, such as liquid hydrogen, at a temperature at near its boiling point. The engine further includes a working fluid circuit extending between the working fluid outlet and the working fluid inlet of the storage vessel. The working fluid circuit includes the serial connection of the following components from the working fluid outlet to the working fluid inlet: a fluid pump; a vaporizer having a liquid line passing therethrough; a heater; an expansion engine having a rotary output shaft; an electrical generator connected to the rotary output shaft of the expansion engine; a vapor line passing through the vaporizer, the vaporizer including a heat exchanger providing thermal communication between the liquid line and the vapor line.

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

A disposable simultaneous stereo endoscope system is disclosed. The disposable endoscope does not include image relay. Instead, two electronic imaging sensors and solid illumination lighting are arranged inside the endoscope. A demultiplexing beam splitter is used for splitting the two imaging light beams to the two imaging devices. A wedged multi-facet illumination window is used to create an illumination field that is larger than the field of view of the imaging optics. An electrically conductive heat sink is engaged for dissipating the heat generated by the solid light source and also for shielding end side of the endoscope. The disposable endoscope is shielded from electromagnetic interferences. A repeater unit is used to electrically connect the disposable endoscope with a remote receiver and to increase the data transfer rate. An electrical isolation means is provided between the endoscope and an image processing and power conditioning unit to protect the endoscope against electric shock.

A light valve such as an active matrix LCD between crossed polarizers, utilizing, for instance, individual transistors to control each "pixel area" of the LCD and storage elements to store video signal data for each pixel, with optically shielded "dead spaces" between pixels to eliminate electric field cross-talk and non-information-bearing light bleed-through, is illuminated with a bright independent light source which creates a video image projected via specialized projection optics onto an internal or external screen without distortions, regardless of the angle of projection onto the screen. Use of heat sinks, IR reflective coatings, heat absorbing optics, optional fluid and a thermistor controlled pixel transistor bias voltage injection servo circuit stabilizes image performance, maintaining accurate color and contrast levels as the LCD changes temperature. In one embodiment of the invention, use of a multi-color LCD with a stepped cavity, producing different thicknesses of LCD for the different wavelengths that pass through it, allows a linear correspondence between the wavelengths passing through the LCD to produce true black, high contrast and CRT-like color rendition. A dichroic mirror arrangement is used to overlap differently colored pixels in the projected image. Use of striped mirrors duplicate pixels, where necessary, eliminating spaces between pixels, creating a continuous image with no apparent stripes or dots. A special venetian-blind type of screen is also disclosed and methods for using the system to view three-dimensional video are also explained.

A portable personal headlamp utilizes an array of light-emitting diodes on the front face of a circuit board. Arc-shaped projections on the front face of a finned heat sink are in heat-conducting relationship with printed conductors on the rear face of the circuit board, which partially surround one lead of each light-emitting diode.

An LED lamp module designed to be easily retrofitted into existing incandescent based light fixtures with minimum modification is provided. The LED lamp module includes a generally circular metal core board including a first surface and a second surface; at least one LED disposed centrally on the first surface of the metal core board; and a flat annular printed circuit board including a current driver circuit for powering the at least one LED, the annular printed circuit board being disposed around the at least one LED and electrically coupled to the at least one LED, wherein the second surface of the metal core board is configured to contact a host fixture and heat generated by the at least one LED is conducted to the host fixture. The LED lamp module uses the host light fixture as a heat sink to transfer and dissipate heat to the external environment.

An apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor device and provides enhanced cooling for the semiconductor device. The apparatus provides a relatively large surface area for transferring heat away from a semiconductor device, and provides for enhanced coolant flow through or around the apparatus. The apparatus includes a channel that may accommodate a heat pipe to further enhance transfer of heat away from the semiconductor device.

An LED lamp includes a transparent bulb, an LED module comprising a plurality of LEDs received in an inner space of the bulb, and a heat dissipation apparatus supporting and cooling the LED module. The heat dissipation device includes a heat sink having a hollow base and a plurality of fins extending from the base, a first heat conductor vertically supported by the heat sink, a second heat conductor horizontally mounted on the first heat conductor, and a heat pipe thermally connecting the heat sink, the first heat conductor and the second heat conductor together. The LEDs are positioned on the first heat conductor and the second heat conductor, respectively.

A heat-dissipating structure includes a heat-dissipating body and a heat pipe. The heat-dissipating body includes a first cylinder and a second cylinder provided within the first cylinder. A plurality of heat-dissipating pieces is further connected between the first cylinder and the second cylinder. A heat-dissipating path is formed between each heat-dissipating piece. The heat pipe is accommodated in the second cylinder and tightly connected thereto. With the heat conduction of the heat pipe, the heat generated by the operation of the LED lamp is absorbed and conducted to the second cylinder. Then, the heat is dissipated uniformly to the plurality of heat-dissipating pieces and the first cylinder. With the above arrangement, the present invention achieves the desired heat-dissipating effect and it is easy to grip and assemble the heat-dissipating body.

A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat sink plate connecting direct current electrodes of the elements with one of terminals of the power source, and phase heat sink plates connecting respective alternating current electrodes of the elements with respective multiphase terminals of a motor. The elements of each module correspond to all phases of an alternating current. Each common heat sink plate forms a principal surface of the corresponding module, and the phase heat sink plates of each module forms another principal surface. The principal surfaces of each module face each other along the stacking direction.

Light emitting diodes are provided with electrode and pad structures that facilitate current spreading and heat sinking. A light emitting diode may be formed as a die with a stacked structure having a first region and a mesa projecting from a surface of the first region. A first electrode may substantially cover the mesa and have a plurality of pads disposed thereon maximizing a contact area in relation to the first electrode. A second electrode may be disposed as a trace on the surface of the first region, the trace having a spiral, segmented/interdigitated, loop or pattern. Optionally, the trace includes corner spikes projecting outwardly toward edges of the first electrode.

A recessed LED light fixture without need for a bulky, finned, metal heat sink. The recessed LED light fixture includes a Metal Core Printed Circuit Board (MCPCB) holding an array of LEDs that are arrange at the center thereof, and mounted to the printed circuit board using patterns of electrical and thermal conductors used to conduct a current and radiate heat. A mounting bracket holds the entire assembly for the light fixture together while spacing the LED driver and printed circuit board apart for further cooling, and wherein the upper side of the printed circuit board is exposed to the ambient air inside the housing.