2813results about "Printed circuit assembling" patented technology

The invention provides a pre-pressing mechanism and a corresponding full-automatic bonding machine, the full-automatic bonding machine comprises a first feeding mechanism, a second feeding mechanism, an ACF attaching mechanism, the pre-pressing mechanism, a main pressing mechanism and a carrying system which are arranged on a base, the first feeding mechanism is used for feeding panel products, the second feeding mechanism is used for feeding chip products, and the ACF attaching mechanism is used for attaching the chip products. A butt joint groove used for being connected with a punching feeding mechanism of the COF product is formed in one side of the base. A pre-pressing mechanical arm of the pre-pressing mechanism comprises a suction block, a first suction hole and a second suction hole are formed in the suction block, the first suction hole is a round hole and used for sucking COF products, and the second suction hole is a long-strip hole and used for sucking chips. By arranging the first feeding structure and the butt joint groove, feeding of the chip products or the COF products is achieved, meanwhile, the pre-pressing mechanical arm is provided with the first suction hole and the second suction hole which can grab the chip products or the COF products in a compatible mode, equipment compatibility is high, cost is low, and benefits are high.

According to the glass phased-array antenna control module and the manufacturing method thereof, a control circuit is manufactured on a glass substrate through a TFT manufacturing process, high-precision control over a phased-array antenna is achieved, the accuracy of beam pointing of the phased-array antenna and the quality of signal processing are guaranteed, and the manufacturing cost of the phased-array antenna is reduced. Through the combination of a TFT manufacturing process and a TGV technology, the layout space of a control circuit is saved, the installation space of an antenna chip is saved through a COB packaging mode, the high integration level of the phased-array antenna is achieved, the requirements for miniaturization and multi-functionalization of the phased-array antenna are met, and the application range of the phased-array antenna is widened. According to the phased-array antenna, the grounding isolation holes are formed in the periphery of the antenna chip, so that good crosstalk resistance is achieved, the stability and reliability of the phased-array antenna are improved, the performance of the phased-array antenna is comprehensively improved, the phased-array antenna has higher competitiveness in the fields of satellite communication, vehicle-mounted radars, military radars and the like, and the application prospect is wide. And the requirements of various fields on high-performance phased-array antennas can be better met.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

Provided are a solder alloy, a solder ball, a preformed solder, a solder joint, and a circuit, which are excellent in wettability and shear strength, suitable in failure mode, capable of suppressing the growth of an intermetallic compound at a bonding interface even after multiple reflow soldering, excellent in drop impact resistance, and suitable in the shape of a bump. The solder alloy has an alloy composition comprising, in mass%, 0.10 to 3.00% of Ag, 0.80 to 6.00% of Cu, 0.08 to 0.60% of Ni, 0.0010 to 0.0150% of Ge, and the balance of Sn. It is preferable that the alloy composition further contains 0.1% or less of at least one of Bi, Sb, In, Zn, Ga, Mn, Cr, Co, Si, Ti, and rare earths in total.

The invention relates to the technical field of automatic plug-in mounting equipment, in particular to a double-reference-point correction method, which comprises the following steps of: acquiring image information of a first reference point and a second reference point arranged on a lower camera module, and determining an actual coordinate when an upper camera is aligned with the first reference point based on the image information of the first reference point; comparing with a preset fixed coordinate value to generate a coordinate system translation correction parameter; calculating an included angle between a connecting line of two points and the X-axis direction based on the image information of the two datum points, and generating a coordinate system rotation correction parameter; according to the method, two correction parameters are integrated to update a plug-in machine coordinate system, a lead screw back clearance elimination operation is adopted to improve the basic positioning precision, a correction effect verification and historical data analysis mechanism is established, a double-reference-point design is adopted for the first time, the problems of coordinate system origin offset and X-axis orthogonality change are solved at the same time, and the precision of the plug-in machine is improved. And the long-term stable operation of the plug-in machine and the consistency among different machines are ensured.

A package and its manufacturing method are presented. The package includes a core having at least one through hole delimited by a wall surface which is at least partially covered with at least one electrically conductive plating material, a first layer stack on one main surface of the core, and a second layer stack on an opposing other main surface of the core. The first layer stack has electrically conductive elements with a higher integration density than further electrically conductive elements with a lower integration density of the second layer stack. The further electrically conductive elements include at least one cylindrical vertical electrically conductive connection element for contributing to the formation of an electrically conductive connection interface at a main surface of the second layer stack facing away from the core.

The invention discloses a thermistor mounting method and related equipment. The thermistor mounting method comprises the following steps: applying micro-power alternating bias excitation to a thermistor to obtain cold-state thermal resistance reference data; mounting a thermistor on the surface of the solder paste, collecting real-time resistance data in a temperature rise process, and performing normalized difference according to cold-state thermal resistance reference data to obtain a normalized dynamic resistance curve; performing derivative continuity and extreme value distribution analysis on the curve to obtain a wetting connectivity index; when the wetting connectivity index reaches a preset threshold value, executing second-order extreme value spacing analysis to obtain interface heat flux density distribution, calculating an interface thermal resistance dispersion vector field, and adjusting the transmission chain speed and furnace chamber airflow parameters according to the interface thermal resistance dispersion vector field; and a backtracking dynamic resistance curve is obtained in the cooling process, and the backtracking dynamic resistance curve and the standardized dynamic resistance curve are differentiated to obtain a curing quality factor. According to the invention, real-time identification in a defect germination stage and instant correction in a solder solidification window stage in a thermistor mounting process can be realized, and the mounting quality and reliability are improved.

The invention belongs to the technical field of PCB (printed circuit board) processing, and discloses a baking device for PCB processing, which comprises a baking box and a plurality of connecting plates, a first roller conveyor and a second roller conveyor are fixedly mounted in the baking box, two support frames are slidably connected in the baking box, a third roller conveyor is fixedly mounted in each support frame, and a plurality of third roller conveyors are fixedly mounted in the third roller conveyors. The two supporting frames are fixedly connected through a plurality of connecting plates, and a lifting mechanism used for driving the supporting frames to move up and down intermittently is arranged in the baking box. According to the PCB baking device, the two supporting frames are fixedly connected through the connecting plate, can synchronously ascend and descend and are alternately located at the feeding position and the discharging position, when PCBs on one supporting frame are baked, the other supporting frame is exactly located at the position flush with the first roller conveyor and the second roller conveyor, feeding of the next batch of PCBs or discharging of the previous batch of PCBs can be synchronously conducted, and the PCB baking efficiency is improved. Intermittent time of traditional single-channel baking, waiting and feeding is eliminated, continuous baking process is achieved, and baking efficiency is improved.

The invention relates to the technical field of PCB production, in particular to a high-precision PCB press-fit board and a warping compensation device thereof, the warping compensation device is adopted to process the PCB press-fit board, the warping compensation device comprises a supporting frame, and the supporting frame is provided with a detection unit used for detecting the edge warping degree of the PCB press-fit board; the device further comprises a compensation unit movably connected to the supporting frame, the compensation unit comprises a moving part, the two ends of the moving part are movably connected with connecting frames, the outer ends of the connecting frames are fixedly provided with frame bodies, the frame bodies are internally and movably connected with adjusting mechanisms, and the adjusting mechanisms are used for applying external force to the edges of the two sides of the PCB pressing plate to achieve warping compensation. The warping degree of the edges of the two sides of the PCB press-fit plate can be accurately detected when the PCB press-fit plate is compensated, and the subsequent extrusion force on the PCB press-fit plate can be adaptively adjusted according to the warping degrees of different PCB press-fit plates, so that accurate warping compensation of the PCB press-fit plate is realized, and the high-precision PCB press-fit plate with low warping degree is obtained.

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

This invention belongs to the field of welding fixture technology, specifically a PCB board welding fixture and its welding method; it includes a fixture table; a lifting and suspending assembly is provided on the fixture table; the lifting and suspending assembly includes a lifting square tube, which is connected through to the top of a placement frame, and the two are slidably engaged; the end of the lifting square tube near the fixture table is open and slidably connected to a lifting square column; the end of the lifting square tube away from the fixture table contacts the PCB board; an air storage rectangular frame is located on the top of the fixture table; the placement frame is located inside the air storage rectangular frame; the air storage rectangular frame is provided with a light-touch anti-damage device; it avoids displacement caused by excessively loose clamping and damage caused by excessively tight clamping, while reducing surface damage caused by excessive local pressure, reducing material consumption and production costs, and improving the welding qualification rate and effect of the PCB board, thus reducing the limitations of welding fixtures in application.

The invention discloses a thermocompression welding method and a thermocompression welding system. The thermocompression welding system comprises a thermocompression welding head used for simultaneously pressing and welding the welding ends of a plurality of wires to a plurality of bonding pads of a circuit board respectively; the distance detection device is used for detecting the distance from each bonding pad on the circuit board to a preset horizontal plane; the fitting line generator is used for generating a fitting line according to the distance of each bonding pad detected by the distance detection device and the position of each bonding pad in the horizontal direction; the distance calculation device is used for calculating the actual moving distance of the thermocompression welding head according to the generated fitting line and the preset moving distance of the thermocompression welding head; and the welding head moving device is used for driving the hot-pressure welding head to move towards the circuit board by an actual moving distance. The moving distance of the thermocompression welding head is adjusted according to the manufacturing error of the circuit board, so that the thermocompression welding head can reliably press and weld a plurality of wires onto a plurality of bonding pads of the circuit board at the same time, the problem of insufficient welding can be effectively avoided, and the product quality is improved.

The invention provides a PCB deviation detection method, and relates to the technical field of PCB detection, and the method comprises the following steps: S1, inputting a standard template; s2, acquiring a terminal area image of the to-be-detected panel, and analyzing recognizable fixed technical features; s3, comparing the associated parameters of the fixed technical features with the parameters of the standard template, and calculating an offset value; s4, judging whether the deviation value is within a qualified range or not; meanwhile, the detection method supports the combination of PCBs and FPCs with different characteristics in a terminal area, and by calculating X and Y bidirectional deviation values, the adaptive range is widened, the detection precision is improved, and the missing detection and false detection rate is reduced.

A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

An electronic component mounting device (1) comprises: an electronic component supply unit (20) that supplies an electronic component having a bump electrode (EB); a transfer stage (31) that accumulates a flux (FX); a mounting stage (41) on which a substrate (BD) is placed; a plurality of heads that can each pick up an electronic component (CP); and a control unit (10) that controls movement of the plurality of heads. The control unit (10) is configured so as to cause each of the plurality of heads to function as a dipping head that dips the bump electrode (EB) of the electronic component (CP) into the flux (FX) accumulated on the transfer stage (31), or as a bonding head that mounts the electronic component (CP) to the substrate (BD) on the mounting stage (41) with the bump electrode (EB) interposed therebetween.

The present invention relates to a printed circuit board comprising an inlay to enable simplified, robust, and cost-effective mounting of a printed circuit board (PCB) on a substrate, in particular a heat sink. Furthermore, a lighting module, in particular an interchangeable lighting module, for a motor vehicle is provided, which comprises such a printed circuit board mounted on a substrate.

The present application discloses an oxygen concentration detection system for detecting the oxygen concentration in a furnace chamber of a reflow oven, comprising: a cooling device, a filter device, and a detection device. The oxygen concentration detection system of the present application utilizes a semiconductor cooler to condense sample gas within the furnace chamber, thereby removing most of the VOC contaminants in the sample gas. Subsequently, by employing activated carbon adsorption filtration, all contaminants in the gas are basically eliminated, resulting in a more accurate detection result from the detection device. Furthermore, due to the rapid cooling capabilities of the semiconductor cooler and the relatively short sample gas flow distance, the oxygen concentration detection system of the present application is also capable of reducing the required detection time, enabling more timely detection from the detection device. Therefore, the oxygen concentration detection system of the present application is capable of timely and accurately detecting the oxygen concentration in a gas within a reflow oven furnace chamber and adjusting the oxygen content therein according to the detection result, thereby enhancing the soldering quality.

The invention discloses a method for identifying a bad plate in a substrate, belongs to the technical field, and realizes high fusion of bad plate identification and a production process through a precise marking process and a dynamic data collaboration mechanism. A high-energy laser carbonization technology is adopted, an irreversible permanent mark is formed on the surface of a substrate, and a microscopic carbonized layer structure and a base material form remarkable optical contrast. The mark can still keep stable gray scale characteristics under strong light irradiation, and the problem of misrecognition caused by the fact that a traditional ink mark is prone to falling off and pollution is solved. Meanwhile, the closed-loop control of laser parameters ensures that the marking area is only modified within the depth of 0.1 mm of the surface layer, substrate warping or inner layer circuit damage caused by diffusion of a heat affected zone is avoided, and the reliability and safety of marking of the damaged plate are guaranteed from the physical level.

The utility model discloses SMT (Surface Mount Technology) template gluing equipment, and relates to the technical field of SMT template processing. The device comprises a base, a moving component is fixedly mounted on the base, a mounting seat is fixedly mounted on a movable part of the moving component, a gluing mechanism is fixedly mounted on the mounting seat to perform gluing operation, a support is fixedly mounted on the mounting seat, and an industrial camera is fixedly inserted into the support. According to the automatic gluing device, the sizes of the screen frame, the gauze and the steel plate on the top surface of the base are visually detected through the industrial camera, the gluing route of the gluing mechanism and the cutting route of the laser cutting mechanism on the gauze are planned through the controller, and the gluing mechanism is driven to move through the mounting base to conduct gluing operation; according to the SMT template machining device, the mesh and the stainless steel plate are bonded together, the laser cutting mechanism is driven by the mounting base to move, then the mesh in the middle is cut, the SMT template machining efficiency is effectively improved, and meanwhile the machining precision and the automation degree of production are guaranteed.

The utility model discloses a welding device with an upper fixture, which relates to the field of circuit board welding and comprises a workbench, a welding platform is arranged on the upper surface of the workbench, a connecting platform is arranged below the welding platform, and a transverse moving module used for driving the welding platform to move left and right is arranged on the upper surface of the connecting platform. The welding platform can be driven to move front and back through a threaded rod, the welding platform can be driven to move left and right through a transmission belt, a connecting arm can be driven to reciprocate along a specific track through rotation of a third servo motor and cooperation of an inverted-U-shaped sliding groove (the wire can be grabbed in a reciprocating mode in a PPU mechanical arm mode), and a welding head is driven to move downwards. Meanwhile, the heating wire supply welding table is controlled to supply a proper amount of solder wires, the solder wires extend out of the end of the wire outlet pipe and move downwards, the lower end of the welding head makes contact with the welding position of the solder wires and the wires, the solder wires are melted through heat of the welding head to fix the wires and the circuit board, the whole welding process is high in automation degree, and work efficiency is improved.

Floating connectors described herein may comprise a frame, a flexible cable, and a soft mounted connector within the frame. A first portion of the frame may be configured to couple to a printed circuit board assembly, and a second portion of the frame may receive the soft mounted connector via a membrane. The flexible cable may extend between the first portion of the frame and the second portion of the frame, and may operatively couple at first and second ends with the printed circuit board assembly and the soft mounted connector, respectively. Further, the floating connectors may include a housing to provide additional electrical shielding, and / or a lock mechanism to provide positive retention between the floating connector and an external connector and / or associated housing.

The present application relates to the technical field of display, and discloses a light panel and a display device. The light panel comprises a substrate, a conductive layer, a light-emitting unit, and an electrode connection portion. An electrode pad in the conductive layer is electrically connected to an electrode of the light-emitting unit by means of the electrode connection portion. Furthermore, the electrode pad has a hollow area exposing a portion of the substrate, so that the flattened state of the electrode connection portion can be observed through the hollow area from the back surface of the substrate, thereby detecting the overlapping state between the electrode pad and the electrode. Therefore, prompt detection of a light-emitting unit having a poor connection yield can be facilitated, so that the light-emitting unit can be promptly replaced, thereby improving the yield of the light panel.

The invention relates to the technical field of earphone production, in particular to a heating and cooling integrated device for earphone parts, which comprises a storage mechanism and a heating and cooling integrated mechanism, the storage mechanism comprises an equipment shell and a drawer part in sliding fit with the inner wall of the equipment shell, and the drawer part is composed of a drawer frame, a drawer cover and a heating and cooling integrated mechanism. And the drawer panel is fixedly arranged on the front surface of the drawer frame. According to the heating and cooling integrated device for the earphone parts, the storage mechanism is arranged, a PCB needing to be heated and welded is placed on the heat conduction plate, then the top fixing part is rotated, the edge of the PCB is limited through the PCB fixing plate, and then the PCB is heated and welded through the heat conduction plate on the bottom heating part; according to the PCB welding device, a drawer type structure is adopted, a plurality of PCBs can be heated and cooled at a time, a heating and cooling integrated mechanism is reasonably arranged in a drawer frame, and the occupied space of the device is reduced.

A method is provided for assembling an apparatus. During this method, a circuit element is arranged with a circuit board. The circuit element includes an element aperture. The circuit board includes a board aperture. A plunger is moved in a first direction to pass a distal end of the plunger through the element aperture and the board aperture and into a volume adjacent the circuit board. A retainer is pivoted within the volume. The retainer is pivotally mounted to the plunger at the distal end of the plunger. The plunger is moved in a second direction to clamp the circuit board between the retainer and the circuit element.

An electronic device includes: a first circuit board; at least one electronic component module disposed on the first circuit board; one first connection member disposed on the first circuit board; and a second circuit board stacked on the one first connection member, wherein the one electronic component module includes: a third circuit board facing the first circuit board; one first electronic component disposed on the third circuit board; a fourth circuit board facing the second circuit board; one second electronic component disposed on the fourth circuit board; a first contact point disposed on the third circuit board and configured to electrically connect the first circuit board with the third circuit board; and a second contact point disposed on the fourth circuit board and configured to electrically connect the second circuit board with the fourth circuit board.

The invention belongs to the technical field of brazing, and particularly relates to a contact-shaped composite brazing filler metal and a preparation method and application thereof.The preparation method comprises the steps that a sheet made of a material A is obtained; stamping the sheet by using a stamping die so that the surface of the sheet is bent to form a plurality of trapezoidal grooves to obtain a honeycomb array structure sheet; solder paste is sprayed and printed in the trapezoidal grooves of the honeycomb array structure sheets, and the solder paste comprises brazing filler metal B and scaling powder; the honeycomb-shaped array structure sheet sprayed with the soldering paste is put into a reflow oven to be heated, the brazing filler metal B in each trapezoid-shaped groove is melted to form a protruding contact, and a contact-shaped composite brazing filler metal sheet is obtained; wherein the scaling powder is separated out in the heating process and flows to cover the outer surface of the contact-shaped composite brazing filler metal sheet; the high-strength composite welding spot can be prepared, and the characteristics of low-temperature welding and high-temperature application are achieved.

A bridge structure extending between a PCB contact pad and a component contact pad is provided. The bridge structure has a first polymer layer extending from a top surface of the PCB contact pad along with a second polymer layer extending from the first UV curable layer opposite the PCB contact pad. The bridge structure has a third polymer layer extending from the second layer opposite the first UV curable polymer layer to the component contact pad. A conductive interconnect is formed on the polymer layers and contacts the PCB contact pad and the component contact pad. Each of the polymer layers are ultraviolet (UV) curable and are illuminated with a UV light source that is spot focused. The polymer layers are formed to have a stepwise configuration where each polymer layer is cured prior to formation of the next polymer layer.

To provide a fabric hybrid electronic system that can realize multiple functions such as sensing detection and signal transmission, and also has stable performance that can withstand washing and rubbing. [Solution] The system includes a chip component, a laser-induced flexible sensor, a fabric substrate, a conductive fabric line, a physiological electrode, and a vertical interconnection via, and uses the laser's material modification ability to form a patterned sensor 131 on the surface 111 of the fabric substrate, uses the laser's micro-cutting ability to form patterned flexible electrodes and interconnection wires, and forms highly stable vertical interconnection vias by infiltrating a conductive composite into the inherent structure of the fabric, and welds the chip electronic device to form a fabric hybrid electronic integrated system.

The invention discloses on-line crimping equipment and a crimping system, which are used for improving the crimping efficiency. The crimping device comprises: an upper moving mechanism; the lower moving mechanism is positioned below the upper moving mechanism; the upper crimping module is mounted on the upper moving mechanism to move along with the upper moving mechanism; the lower crimping module is positioned below the upper moving mechanism and is mounted on the lower moving mechanism so as to move along with the lower moving mechanism; and the carrier supporting frame is used for supporting the carrier conveyed into the crimping equipment and the flexible flat piece loaded on the carrier. The upper crimping module and the lower crimping module are used for crimping a terminal on the flexible flat piece, and the upper moving mechanism and the lower moving mechanism are used for horizontally moving the upper crimping module and the lower crimping module respectively, so that the upper crimping module and the lower crimping module can be synchronously moved to any crimping position on the flexible flat piece. The flexible flat part does not need to be taken down from the carrier in the crimping process, the crimping efficiency is improved, and the size and cost of crimping equipment can be reduced.