6503results about "Printed circuit assembling" patented technology

The invention discloses a PCBA circuit board welding spot detection method based on multi-modal data fusion, and relates to the technical field of electronic manufacturing quality detection.The PCBA circuit board welding spot detection method comprises the steps that a distributed sensing network is constructed, multi-modal data are collected, welding spot information is obtained in an omnibearing mode, and time-space alignment of the multi-modal data is carried out; performing feature extraction on the multi-modal data, dynamically weighting each modal feature through an attention mechanism, and highlighting key defect characterization; a welding spot spatial topological graph is constructed by using a graph neural network, and a spatial relationship between welding spots is modeled. By integrating optical, X-Ray, thermal, mechanics, electricity and other multi-dimensional data, the information limitation of single-mode detection is broken through, the complementation of different mode data is utilized, the attention mechanism is combined to dynamically weight each mode feature, the complex defect is accurately identified, the graph neural network is utilized to model the welding spot space topological relation, the associated defect is further captured, and the defect detection accuracy is improved. And the defect classification accuracy is improved.

The invention relates to the technical field of electronic manufacturing equipment, in particular to an adaptive thermal compensation system and method for a high-precision mounting head of a chip mounter, and the system comprises a temperature-deformation sensing unit, a thermal-mechanical coupling analysis unit, a dynamic compensation control unit, and a closed-loop execution unit. The temperature-deformation sensing unit collects temperature and deformation data of multiple parts of the mounting head in real time, the thermal-mechanical coupling analysis unit reconstructs a three-dimensional temperature field based on a finite element algorithm, the thermal expansion distribution quantity is dynamically calculated, the problem of rough model of traditional single-point temperature measurement is solved, and the measurement precision is improved. The dynamic compensation control unit predicts the thermal drift amount in the future 5 ms through online parameter identification and a long-short-term memory network model, a compensation strategy is adaptively adjusted in combination with the motion working condition, the closed-loop execution unit decomposes the compensation amount into displacement and torsion correction instructions, accurate offset of thermal deformation is achieved, and a whole-process thermal compensation closed loop is constructed. The precision stability of the mounting head in a complex thermal environment is improved, and the production efficiency is improved.

The invention relates to the technical field of PCB detection, and discloses an online defect detection method and system in the PCB production process and computer equipment, the detection accuracy can be improved by combining production parameters, image information and a design circuit diagram, potential defects can be found in the early stage, the PCB is divided into a plurality of areas, and the detection efficiency is improved. According to the PCB, each area can be independently welded and detected, the complexity of the whole PCB is reduced, the PCB is divided into a plurality of areas which are detected one by one, a specific defect area can be effectively positioned, through the regionalized detection and maintenance process, the unqualified area can be locally processed, the production efficiency is improved, and the production cost is reduced. By adopting the strategy based on multi-round detection, feedback and regional repair, through accurate positioning, local repair, detection efficiency improvement and automatic processing, the rejection rate of unqualified products is greatly reduced, the maintenance success rate is improved, and the problems of difficulty in PCB defect detection and resource waste in the prior art can be effectively solved.

The invention discloses a fine circuit pattern anti-diffusion agent as well as a preparation method and a use method thereof, and relates to the technical field of printed circuit board manufacturing. The fine circuit pattern anti-diffusion agent is prepared from the following components in percentage by mass: 0.05 to 0.3 percent of an oleophobic agent, 0.1 to 0.6 percent of a bonding agent, 0.2 to 1.5 percent of an adhesion promoter, 0.5 to 4.0 percent of a wetting agent, 0.5 to 5.0 percent of a cosolvent and the balance of water, the oleophobic agent is a fluorophenylethylamine derivative, the bonding agent is a carbonyl chloride derivative, the adhesion promoter is a sulfur heterocyclic alkane derivative, the wetting agent is a methylsiloxane silane derivative, and the cosolvent is a sulfonyl ketone derivative. According to the fine circuit pattern anti-diffusion agent, an organic layer can be formed on the copper surface of a circuit board, the binding force between the copper surface and printing ink is enhanced, jet printing printing ink is prevented from diffusing on the copper surface, and the product percent of pass of a jet printing solder mask process is improved.

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.

The invention relates to the technical field of automatic assembly, and discloses automatic circuit board welding equipment which comprises a welding mechanism, a clamping mechanism and a driving mechanism, the welding mechanism is provided with a wave soldering station, and the wave soldering station is used for conducting wave soldering on a passing circuit board; the driving mechanism comprises a driving belt, a guide rail, a driving part and a fixing frame, at least part of the fixing frame is located above the wave soldering station, the driving belt is arranged on the outer surface of the fixing frame in a sleeving mode, and the driving part is arranged on the guide rail. According to the automatic welding equipment for the circuit board, the driving belt and the guide rail are adopted for cooperative transmission, the guide rail and the driving belt are rigidly connected through the fixing frame, and a closed conveying groove is formed; the inner surface part of the guide rail and the outer surface of the driving belt form a guide space for the clamping mechanism to move along with the driving belt inside, and meanwhile rigid support is formed by means of the guide rail.

A method for electrically connecting a first electronic component of a battery system with a second electronic component of the battery system is provided. The first electronic component includes a flexible printed circuit (FPC) including: a pin formed by folding a connection portion of the FPC; and a conductive strip on an outer surface of the folded connection portion. The second electronic component includes a printed circuit board (PCB) having a through-hole configured to receive the pin of the FPC and includes an electrically conductive plating adjacent to the through-hole. The method includes: attaching the FPC to a first side of the PCB such that the pin of the FPC is received in the through-hole in the PCB; and soldering the pin of the FPC to the conductive plating on the PCB to electrically interconnect the FPC and the PCB.

An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.

The invention discloses an automatic tin plating device for circuit board chip welding, and relates to the technical field of chip welding, the automatic tin plating device comprises a tin liquid pool, a chip feeding workbench, a four-way conveying mechanism and a thermal resistance mechanism, a chip stacking cylinder is vertically installed on the chip feeding workbench, the thermal resistance mechanism comprises a rack, a lifting seat, a finger air cylinder and a cold sheet, and the lifting seat is connected with the finger air cylinder. The lifting seat is installed on the rack, a finger air cylinder is installed at one end of the lifting seat, two clamping jaws of the finger air cylinder are each provided with a cold piece, cold air is introduced into the cold pieces, the four-way conveying mechanism comprises a portal frame, a three-way conveying mechanism and an overturning plate, and the three-way conveying mechanism is installed on the portal frame; the three-direction conveying mechanism has moving freedom degrees in the X direction, the Y direction and the Z direction in a space coordinate system, the overturning plate is rotationally installed on the three-direction conveying mechanism, a rotating disc is rotationally installed at the bottom of the overturning plate, and a negative pressure suction cup is arranged on the rotating disc. And the cold sheet can isolate high temperature from being transmitted to the chip, so that the chip can be well protected from being influenced in the tin plating process.

An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.

The invention relates to the technical field of chip mounting, in particular to an automatic adjusting method and system for a chip clamp, and the method comprises the following steps: monitoring and automatically calibrating the pressure applied by the clamp in real time to ensure that the pressure meets the chip mounting standard, analyzing a to-be-mounted chip by using a camera, optimizing the shape recognition, and adjusting the track of the clamp to correct the offset. And analyzing the correlation between the pressure and the mounting quality according to the data after mounting, and establishing an optimized control closed loop. According to the invention, through real-time monitoring and automatic adjustment of pressure parameters, the dependence on manual adjustment is reduced, the automation level of the production process is improved, through detailed pressure adjustment, each chip is ensured to be accurately processed in the mounting process, the product quality is improved, the rejection rate is reduced, and the production efficiency is improved. The application of the image analysis technology allows the chip to be accurately evaluated before mounting, and the distance between the clamps is automatically adjusted, so that the mounting precision is improved, and the requirements of various chip shapes and sizes are met.

The invention discloses a positioning calibration method of surface mounting equipment, equipment, a medium and a product, and relates to the technical field of printed circuit boards, a first position of a bonding pad on a circuit board and a second position of an element pin of an element to be mounted are obtained through recognition by using an image recognition model, the confidence coefficient is recorded, and when matching calculation is carried out, the positioning calibration accuracy is improved. And carrying out position transformation calculation on the positions of the bonding pad and the element pin matched in the current iteration, calculating a transformed position error in combination with the confidence coefficient, and outputting a final matching result of the bonding pad and the element pin and a corresponding final space mapping parameter after a first iterative calculation condition is met. According to the method, the influence of a low-confidence-coefficient position detection result on space mapping parameter calculation is effectively reduced, the stability and reliability of the final space mapping parameter are ensured, compared with traditional position error calculation, the method has higher anti-interference capability, and the accuracy of positioning matching of high surface mounting equipment is improved.

The invention relates to the technical field of semiconductor packaging, and provides a semiconductor packaging process which comprises the following steps: obtaining a circuit board, and preprocessing the circuit board; performing SMT assembly operation on the bottom surface of the circuit board; silk-screening solder paste on the top surface of the circuit board; a tin cap of the flip chip is dipped with a soldering flux; mounting a flip chip and other elements on the top surface of the circuit board; performing reflow soldering operation on the top surface of the circuit board; according to the semiconductor packaging process provided by the embodiment of the invention, the tin cap of the flip chip can be dipped with the soldering flux before confluence welding operation is carried out on the flip chip, so that in the reflow soldering process, the soldering flux can effectively protect the tin cap and a PCB bonding pad and prevent oxidation, the collapsed tin cap can recover the original state of the tin cap to the greatest extent during reflow soldering, and the reliability of the flip chip is improved. The tin cap can be in contact with the PCB bonding pad more effectively, good welding is formed, the wettability is improved, oxidation is reduced, the welding strength is enhanced, and the problems of pseudo soldering, open circuit and the like are reduced.

The objective of the present invention is to reduce the effort and burden required to obtain an identification means serving as an AI model, and to enable the identification means to be commonly used even when the sizes of lands are different. Reconstructed image data are acquired by inputting inspection image data based on image data acquired by a camera 32d into AI models 101, 102 generated by training a specific neural network using only image data relating to non-defective solder fillets as training data, and the quality of a solder fillet is determined by comparing the inspection image data and the reconstructed image data. The training data are obtained by providing one solder fillet image in an image frame having a size larger than the size of the one solder fillet image. The inspection image data are obtained by providing one solder fillet image extracted from the image data acquired by the camera 32d in an image frame having the same size as the image frame of the training data.

The invention provides a pre-pressing mechanism and a corresponding full-automatic bonding machine, the full-automatic bonding machine comprises a first feeding mechanism, a second feeding mechanism, an ACF attaching mechanism, the pre-pressing mechanism, a main pressing mechanism and a carrying system which are arranged on a base, the first feeding mechanism is used for feeding panel products, the second feeding mechanism is used for feeding chip products, and the ACF attaching mechanism is used for attaching the chip products. A butt joint groove used for being connected with a punching feeding mechanism of the COF product is formed in one side of the base. A pre-pressing mechanical arm of the pre-pressing mechanism comprises a suction block, a first suction hole and a second suction hole are formed in the suction block, the first suction hole is a round hole and used for sucking COF products, and the second suction hole is a long-strip hole and used for sucking chips. By arranging the first feeding structure and the butt joint groove, feeding of the chip products or the COF products is achieved, meanwhile, the pre-pressing mechanical arm is provided with the first suction hole and the second suction hole which can grab the chip products or the COF products in a compatible mode, equipment compatibility is high, cost is low, and benefits are high.

The invention relates to the technical field of circuit board welding, and in particular to a circuit board fixing device for PCB circuit board welding, comprising a main body plate, an upper end of the main body plate is provided with an adjustable grinding and welding mechanism for drilling and welding the circuit board at any curvature, the adjustable grinding and welding mechanism comprises two first limit grooves symmetrically arranged on the upper end of the main body plate, a transmission shaft end of a third motor is fixedly connected with a second fixing body, a side surface of the second fixing body is fixedly connected with a first rotating shaft, an end of the first rotating shaft is rotatably arranged with a second connecting plate, and a clamping and fixing mechanism for clamping and adjusting a flexible circuit board is provided at the upper end of the main body plate; a support body at a telescopic end of a fourth electric telescopic rod has the same curvature as that of the circuit board installation, and then the first motor drives a roller to tighten the circuit board, so as to ensure that the circuit board can be completely fitted on the upper ends of a plurality of support bodies, and to ensure that the circuit board can be drilled and electronic components can be welded according to the curvature during installation.

A method for a system includes receiving with a first transceiver of an identity reader device, an ephemeral ID from a first smart device, outputting with the first transceiver, identity reader data to the first smart device, wherein the identity reader data comprises a first identifier and a challenge, receiving with the first transceiver, responsive data from the first smart device, wherein the responsive data comprises token data and contact tracing status of the first smart device, determining in a processor of the identity reader device, whether the first smart device is authorized in response to the ephemeral ID or the token data, and the contact tracing status, and directing with the processor, a peripheral device coupled to the identity reader device to perform a user-perceptible action in response to the processor determining that the first smart device is authorized.

The invention belongs to the technical field of integrated circuit manufacturing, and particularly relates to a PCB welding machine which comprises a workbench, a supporting table is fixedly connected to the upper end of the workbench, a welding head is installed at the upper end of the supporting table in a sliding mode, a feeding assembly is arranged on one side of the supporting table, and the feeding assembly comprises two first rectangular strips arranged at the upper end of the workbench in a sliding mode. A plurality of sets of clamping assemblies are arranged between the two first rectangular strips, each clamping assembly comprises two L-shaped clamping strips, third round holes are formed in the middles of the L-shaped clamping strips, the multiple L-shaped clamping strips can slide on the outer side of a third cylindrical strip through the third round holes, the third cylindrical strip is arranged between the two first rectangular strips, and the clamping assemblies are arranged between the two first rectangular strips. An electric wire is clamped by driving the L-shaped clamping strip and then moved to a welding point of the PCB for welding, so that a worker does not need to approach a welding head of a welding machine in the welding process, and high-temperature scalding is prevented.

The invention discloses a method for manufacturing a flexible circuit board with a high-precision induction circuit, and the method comprises the steps: taking a flexible copper-clad plate to manufacture a first coil circuit pattern and a bonding pad pattern, and carrying out the AOI detection, and forming a first flexible core board; windowing the first cover film corresponding to the bonding pad pattern, and attaching the first cover film to the first flexible core plate to form an attached plate; a single-face copper-clad plate is taken to manufacture a second coil circuit pattern, and a second flexible core plate is formed; the first coil circuit pattern corresponds to the second coil circuit pattern; manufacturing an adhesive layer for a second flexible core plate, and attaching the second flexible core plate to the attaching plate to form a flexible back attaching plate; carrying out induction circuit testing and post-process processing to form a flexible circuit board; aOI detection and a four-wire circuit testing machine are combined to form dual detection, so that the comprehensiveness and the accuracy of detection are improved; the glue layer is arranged to bond the second flexible core plate and the attaching plate, a physical supporting effect is provided for the detection process, and a processing basis is provided for subsequent depth-controlled laser cutting board splitting structure operation.

The invention discloses an efficient heat dissipation system of a new energy automobile circuit board, and the system comprises a composite heat dissipation substrate which is formed by compounding a ceramic substrate layer, a graphene heat conduction layer and a copper alloy supporting layer through vacuum hot pressing, and the surface of the graphene heat conduction layer is provided with a micron-sized groove array; the dynamic heat dissipation assembly comprises a thermoelectric refrigeration module and a temperature sensor which are embedded in the composite heat dissipation substrate, the thermoelectric refrigeration module is linked with the temperature sensor through a PID controller, and active refrigeration based on temperature rise of the circuit board is achieved; the multi-layer heat dissipation channel comprises a micro-channel and a bionic fin structure, the micro-channel vertically penetrates through the composite heat dissipation substrate, the bionic fin structure covers the surface of the substrate, and the micro-channel is filled with a phase change material and is communicated with an external liquid cooling circulation system; the airflow adjusting module comprises a rotatable flow guide plate and a piezoelectric fan array, the flow guide plate dynamically adjusts the heat dissipation airflow direction according to the vehicle speed, and the frequency response range of piezoelectric fans is larger than or equal to 100 Hz.

The invention provides a welding device for assembling an electric guitar, and relates to the technical field of welding. The welding device for assembling the electric guitar comprises an erecting chassis, four sets of clamping motors are fixedly connected to the inner side of the erecting chassis, the output ends of the clamping motors are fixedly connected with clamping threaded rods, the outer surfaces of the clamping threaded rods are in threaded connection with a transverse moving frame, the upper end of the transverse moving frame is fixedly connected with a limiting frame, and the lower end of the limiting frame is fixedly connected with a corner motor; the output end of the corner motor is fixedly connected with a corner frame, the corner frame is rotationally connected to the inner side of the limiting frame, and the upper end of the corner frame is fixedly connected with a feeding compensation motor. According to the welding device for assembling the electric guitar, the clamping plate is arranged for clamping and erecting the assembly mainboard, and the welding mechanism is arranged for welding below the assembly mainboard, so that the assembly mainboard does not need to be overturned in the welding process, and a welded circuit is not pulled and broken; the problem that when the assembly mainboard is welded, the lower space is small, overturning is needed, and a circuit is prone to being pulled apart is solved.

The invention discloses an anti-deviation circuit board chip welding device and method, and relates to the field of chip welding, the anti-deviation circuit board chip welding device comprises a welding workbench, a welding robot is installed on the welding workbench, a welding positioning groove is formed in the welding workbench, a hot melting mechanism is arranged on the welding workbench, and the hot melting mechanism comprises a horizontal sliding seat, a vertical plate and a hot melting plate; the horizontal sliding seat is arranged on the welding workbench in a sliding mode, the sliding direction of the horizontal sliding seat is parallel to the welding positioning groove, the vertical plate is fixed to the horizontal sliding seat, the hot melting plate is arranged on the vertical plate in a sliding mode, a rectangular groove is formed in the middle of the hot melting plate in a penetrating mode, and a plurality of hot fuses are arranged on the two opposite inner walls of the rectangular groove at equal intervals in the horizontal direction; in the welding process, tin is plated on the chip welding holes of the circuit board through the welding robot, the thermal fuse is located between every two adjacent welding holes and used for enabling tin to be in a hot melting state, it is guaranteed that the chip cannot move in the welding process, the welding reject ratio is greatly reduced, and the welding quality is improved.

The invention discloses wave-soldering equipment based on visual inspection, and relates to the technical field of wave-soldering equipment, the wave-soldering equipment comprises a case, a clamping unit, a spraying unit, a preheating unit, a welding unit and an adjusting unit, the case is used for installing and fixing the clamping unit, the spraying unit, the preheating unit, the welding unit and the adjusting unit, the clamping unit is used for clamping a PCB, and the adjusting unit is used for adjusting the spraying unit. The spraying unit is used for coating soldering flux, the preheating unit is used for evaporating moisture in the soldering flux, the welding unit is used for welding pins of the PCB, the adjusting unit is used for adjusting wave crests, the PCB is clamped through the clamping unit in the transportation process of the PCB, and after the soldering flux is sprayed to the PCB through the spraying unit, the PCB is conveyed to the welding unit through the adjusting unit. The preheating unit evaporates moisture in the soldering flux, the PCB is welded through the welding unit, and the wave crest height is adjusted through the adjusting unit during welding, so that the welding quality is improved.

The invention relates to a membrane removing and collecting integrated device suitable for SMT mounting, a connector is mounted on a circuit board, a membrane is attached to the connector from the top surface, the membrane protrudes out of the connector from the edge of one side, and the integrated device comprises a transmission line; a film uncovering device; provided is a waste film collecting device. On the one hand, on the basis of cooperation of the driving part and the power device, the upper clamping jaw and the lower clamping jaw accurately clamp a membrane with one side face of the connector as the reference and conduct uncovering, transferring and collecting, the stable and continuous membrane uncovering and collecting procedures are achieved, and efficiency is effectively improved; on the other hand, a traditional discharging mode is abandoned, the material belt with the adhesive layer is adopted, the waste film is placed on the adhesive layer along with the clamping component, the waste film is pressed and pasted to the adhesive layer through the pressing rod, and the waste film transferring success rate and the waste film collecting rate are greatly increased.

An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.

The invention discloses a tin soldering device for integrated circuit board production, and relates to the technical field of welding equipment.The tin soldering device comprises a base, a supporting frame is arranged at the upper end of the base, a movable seat is arranged in the supporting frame, a mounting frame is arranged at the bottom end of the movable seat, a welding head is arranged in the mounting frame, a feeding pipe is arranged in the mounting frame, and a conical cavity is formed in the feeding pipe; according to the device, scaling powder can be uniformly smeared on the outer wall of the tin bar through the auxiliary mechanism, the tin bar is conveyed through the conveying mechanism while uniform smearing is achieved, meanwhile, the phenomenon that impurities are attached to the surface of a tin wire can be reduced through the sweeping mechanism, and therefore the welding quality of the tin wire is improved. According to the device, the tin bars are conveyed, smeared and cleaned through the linkage mechanism, the welding quality is further improved, the extra power requirement is reduced, and the cost and complexity of equipment are reduced.

According to the glass phased-array antenna control module and the manufacturing method thereof, a control circuit is manufactured on a glass substrate through a TFT manufacturing process, high-precision control over a phased-array antenna is achieved, the accuracy of beam pointing of the phased-array antenna and the quality of signal processing are guaranteed, and the manufacturing cost of the phased-array antenna is reduced. Through the combination of a TFT manufacturing process and a TGV technology, the layout space of a control circuit is saved, the installation space of an antenna chip is saved through a COB packaging mode, the high integration level of the phased-array antenna is achieved, the requirements for miniaturization and multi-functionalization of the phased-array antenna are met, and the application range of the phased-array antenna is widened. According to the phased-array antenna, the grounding isolation holes are formed in the periphery of the antenna chip, so that good crosstalk resistance is achieved, the stability and reliability of the phased-array antenna are improved, the performance of the phased-array antenna is comprehensively improved, the phased-array antenna has higher competitiveness in the fields of satellite communication, vehicle-mounted radars, military radars and the like, and the application prospect is wide. And the requirements of various fields on high-performance phased-array antennas can be better met.

A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.

The invention relates to the technical field of element bonding pad matching, in particular to a method for automatically matching a component and a bonding pad, which comprises the following steps of: directly and dynamically calculating a coverage area according to the size of the component, and detecting a bonding pad layer in real time without pre-storing a mapping relation; the electrical feasibility verification that the number of bonding pads is greater than or equal to the number of pins is increased to solve the risk of insufficient solder or solder skips; the coordinate correction is matched with the mean correction coordinate of the central point of the bonding pad, and the angle correction is realized by identifying a silk-screen polarity identifier through AI to realize a dual-stage correction technology; polarity identification consistency verification is newly added, so that the installation correctness of a high-reliability device is ensured, and polarity direction guarantee is realized; the workload of a client for pre-storing the template is reduced, and the matching precision is improved through dynamic detection and closed-loop correction.