10358results about "Printed circuit assembling" patented technology

The invention discloses a PCBA circuit board welding spot detection method based on multi-modal data fusion, and relates to the technical field of electronic manufacturing quality detection.The PCBA circuit board welding spot detection method comprises the steps that a distributed sensing network is constructed, multi-modal data are collected, welding spot information is obtained in an omnibearing mode, and time-space alignment of the multi-modal data is carried out; performing feature extraction on the multi-modal data, dynamically weighting each modal feature through an attention mechanism, and highlighting key defect characterization; a welding spot spatial topological graph is constructed by using a graph neural network, and a spatial relationship between welding spots is modeled. By integrating optical, X-Ray, thermal, mechanics, electricity and other multi-dimensional data, the information limitation of single-mode detection is broken through, the complementation of different mode data is utilized, the attention mechanism is combined to dynamically weight each mode feature, the complex defect is accurately identified, the graph neural network is utilized to model the welding spot space topological relation, the associated defect is further captured, and the defect detection accuracy is improved. And the defect classification accuracy is improved.

The invention relates to the technical field of electronic manufacturing equipment, in particular to an adaptive thermal compensation system and method for a high-precision mounting head of a chip mounter, and the system comprises a temperature-deformation sensing unit, a thermal-mechanical coupling analysis unit, a dynamic compensation control unit, and a closed-loop execution unit. The temperature-deformation sensing unit collects temperature and deformation data of multiple parts of the mounting head in real time, the thermal-mechanical coupling analysis unit reconstructs a three-dimensional temperature field based on a finite element algorithm, the thermal expansion distribution quantity is dynamically calculated, the problem of rough model of traditional single-point temperature measurement is solved, and the measurement precision is improved. The dynamic compensation control unit predicts the thermal drift amount in the future 5 ms through online parameter identification and a long-short-term memory network model, a compensation strategy is adaptively adjusted in combination with the motion working condition, the closed-loop execution unit decomposes the compensation amount into displacement and torsion correction instructions, accurate offset of thermal deformation is achieved, and a whole-process thermal compensation closed loop is constructed. The precision stability of the mounting head in a complex thermal environment is improved, and the production efficiency is improved.

The invention relates to the technical field of PCB detection, and discloses an online defect detection method and system in the PCB production process and computer equipment, the detection accuracy can be improved by combining production parameters, image information and a design circuit diagram, potential defects can be found in the early stage, the PCB is divided into a plurality of areas, and the detection efficiency is improved. According to the PCB, each area can be independently welded and detected, the complexity of the whole PCB is reduced, the PCB is divided into a plurality of areas which are detected one by one, a specific defect area can be effectively positioned, through the regionalized detection and maintenance process, the unqualified area can be locally processed, the production efficiency is improved, and the production cost is reduced. By adopting the strategy based on multi-round detection, feedback and regional repair, through accurate positioning, local repair, detection efficiency improvement and automatic processing, the rejection rate of unqualified products is greatly reduced, the maintenance success rate is improved, and the problems of difficulty in PCB defect detection and resource waste in the prior art can be effectively solved.

Disclosed in the present invention is a packaging structure of a half-bridge power module. The packaging structure comprises an insulating and thermal conductive plate, a multi-layer circuit board, a plastic package body and a bridge arm switch. Further disclosed in the present invention is the use of a packaging structure of a half-bridge power module in an OBC power source converter, a DCDC isolated converter, a non-isolated power source converter, a cardiac arrest awakening apparatus, and a circuit module formed by means of combining multiple half bridges such as ANPC, TNPC and Heric. Further disclosed in the present invention is a manufacturing method for a packaging structure of a half-bridge power module. The method comprises: performing assembling; providing an overflow region; and synchronously performing filling and grinding to remove the overflow region. In the present invention, a minimum size and a low impedance are achieved by means of DBC, flexible pin leading-out and welding are realized by means of a PCB, the reliability, safety and heat dissipation of modules are supported by means of a plastic packaging body, and the extension of a temperature monitoring unit and a decoupling capacitor is supported.

The invention discloses a fine circuit pattern anti-diffusion agent as well as a preparation method and a use method thereof, and relates to the technical field of printed circuit board manufacturing. The fine circuit pattern anti-diffusion agent is prepared from the following components in percentage by mass: 0.05 to 0.3 percent of an oleophobic agent, 0.1 to 0.6 percent of a bonding agent, 0.2 to 1.5 percent of an adhesion promoter, 0.5 to 4.0 percent of a wetting agent, 0.5 to 5.0 percent of a cosolvent and the balance of water, the oleophobic agent is a fluorophenylethylamine derivative, the bonding agent is a carbonyl chloride derivative, the adhesion promoter is a sulfur heterocyclic alkane derivative, the wetting agent is a methylsiloxane silane derivative, and the cosolvent is a sulfonyl ketone derivative. According to the fine circuit pattern anti-diffusion agent, an organic layer can be formed on the copper surface of a circuit board, the binding force between the copper surface and printing ink is enhanced, jet printing printing ink is prevented from diffusing on the copper surface, and the product percent of pass of a jet printing solder mask process is improved.

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.

The invention relates to the technical field of automatic assembly, and discloses automatic circuit board welding equipment which comprises a welding mechanism, a clamping mechanism and a driving mechanism, the welding mechanism is provided with a wave soldering station, and the wave soldering station is used for conducting wave soldering on a passing circuit board; the driving mechanism comprises a driving belt, a guide rail, a driving part and a fixing frame, at least part of the fixing frame is located above the wave soldering station, the driving belt is arranged on the outer surface of the fixing frame in a sleeving mode, and the driving part is arranged on the guide rail. According to the automatic welding equipment for the circuit board, the driving belt and the guide rail are adopted for cooperative transmission, the guide rail and the driving belt are rigidly connected through the fixing frame, and a closed conveying groove is formed; the inner surface part of the guide rail and the outer surface of the driving belt form a guide space for the clamping mechanism to move along with the driving belt inside, and meanwhile rigid support is formed by means of the guide rail.

Disclosed in the present invention is a method for improving the UPH of SMT mounting, the method comprising: on the basis of task information, determining information of a first component to be mounted; on the basis of the information of said first component and component information and nozzle information in a component database, analyzing parameters of influence factors, so as to determine efficiency-reducing influence factors on the basis of the parameters of the influence factors; on the basis of parameters of the efficiency-reducing influence factors, determining information of a second component to be mounted; on the basis of the information of said second component, filling an analysis report; and sending the analysis report to a user, and receiving information of a third component to be mounted that is determined on the basis of the analysis report. In the method provided in the present invention, parameters of influence factors that influence the UPH are automatically analyzed on the basis of component information of components to be mounted, so as to quickly determine efficiency-reducing influence factors, and an analysis report determined on the basis of parameters of the efficiency-reducing influence factors is sent to a user. The method can increase the speed of determining efficiency-reducing influencing factors, thereby improving the UPH and achieving the aims of energy conservation and emission reduction.

The invention relates to the technical field of electronic packaging, and discloses a method for controlling welding of a welding hole plug-in by using a prefabricated welding flux, and the method comprises the following steps: S1, dehumidifying and drying: drying a substrate by using a drying oven; s2, a solder column is manufactured, specifically, based on an original welding hole site in the substrate to be welded, the soldering tin amount Vt between the welding hole site and the plug-in is calculated, the size of the solder column is calculated according to the value of the soldering tin amount Vt, and the solder column is manufactured; s3, welding preparation is conducted, specifically, the plug-in, the substrate and the welding flux column are sequentially installed on the clamp body; and S4, reflow soldering. The soldering tin amount is calculated according to the size of a welding hole site needing to be welded and the size of a plug-in, a solid solder column of a fixed mass is manufactured in advance through the calculated soldering tin amount, the soldering tin amount is accurately controlled so as to accurately fill a weld joint, the situation that tin is too much or too little after welding is avoided, the welding quality is improved, and meanwhile the welding quality is improved. During welding, the amount of solder paste does not need to be controlled, and the efficiency can be greatly improved by directly using the solder column and placing the solder column on the plug-in.

A method for electrically connecting a first electronic component of a battery system with a second electronic component of the battery system is provided. The first electronic component includes a flexible printed circuit (FPC) including: a pin formed by folding a connection portion of the FPC; and a conductive strip on an outer surface of the folded connection portion. The second electronic component includes a printed circuit board (PCB) having a through-hole configured to receive the pin of the FPC and includes an electrically conductive plating adjacent to the through-hole. The method includes: attaching the FPC to a first side of the PCB such that the pin of the FPC is received in the through-hole in the PCB; and soldering the pin of the FPC to the conductive plating on the PCB to electrically interconnect the FPC and the PCB.

An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.

The invention discloses an automatic tin plating device for circuit board chip welding, and relates to the technical field of chip welding, the automatic tin plating device comprises a tin liquid pool, a chip feeding workbench, a four-way conveying mechanism and a thermal resistance mechanism, a chip stacking cylinder is vertically installed on the chip feeding workbench, the thermal resistance mechanism comprises a rack, a lifting seat, a finger air cylinder and a cold sheet, and the lifting seat is connected with the finger air cylinder. The lifting seat is installed on the rack, a finger air cylinder is installed at one end of the lifting seat, two clamping jaws of the finger air cylinder are each provided with a cold piece, cold air is introduced into the cold pieces, the four-way conveying mechanism comprises a portal frame, a three-way conveying mechanism and an overturning plate, and the three-way conveying mechanism is installed on the portal frame; the three-direction conveying mechanism has moving freedom degrees in the X direction, the Y direction and the Z direction in a space coordinate system, the overturning plate is rotationally installed on the three-direction conveying mechanism, a rotating disc is rotationally installed at the bottom of the overturning plate, and a negative pressure suction cup is arranged on the rotating disc. And the cold sheet can isolate high temperature from being transmitted to the chip, so that the chip can be well protected from being influenced in the tin plating process.

The invention belongs to the technical field of manufacturing of electrical element assemblies, and particularly relates to a connection stock bin device for SMT feeding and a feeding method thereof.The device comprises a connection bin body, a feeding mechanism, a feeding mechanism, a feeding mechanism, a feeding mechanism, a feeding mechanism and a discharging mechanism, and the top of the connection bin body is provided with an opening and a conveying rail; the side, facing the conveying track, of the belt drawing mechanism is provided with a belt replacing assembly. The belt replacing assembly comprises a belt drawing wheel and a belt conveying wheel which are sequentially arranged in the conveying direction of the material belt. And a plurality of air extraction grooves are formed in the circumferential direction of the belt extraction wheel. According to the connecting bin, the belt conveying wheel is arranged for conveying the material belt, the belt drawing wheel is arranged for drawing out the material belt as soon as possible while conveying is kept, and redundant material belt is put into the connecting bin body for subsequent conveying of the belt conveying wheel. Due to the fact that the air exhaust groove is formed in the belt drawing wheel, after the material belt is drawn, the fold at the tail end of the material belt is adsorbed by the air exhaust groove, the tail end of the material belt is adsorbed by the air exhaust groove, and the air exhaust groove rotates reversely, so that the fold of the material belt rotates reversely around the belt drawing wheel, and the fold is rolled to be flat.

An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.

A method for a system includes receiving with a first transceiver of a first smart device, an advertisement signal from a stationary beacon, outputting with the first transceiver of the first smart device, a first ephemeral ID that is not permanently associated with the first smart device, to the stationary beacon, receiving with the first transceiver of the first smart device, a beacon identifier from a stationary beacon, outputting with a second transceiver of the first smart device, the first ephemeral ID, a first user identifier and the beacon identifier to an authentication service, storing in an association log in the authentication service, the first ephemeral ID, the first user identifier and the beacon identifier, and storing in a beacon log in the authentication service, a log of the stationary beacon including the first ephemeral ID.

The utility model discloses a surface-mounted component turnover device, which belongs to the technical field of surface-mounted component welding and comprises a base, a first turnover clamping plate and a second turnover clamping plate, the first turnover clamping plate and the second turnover clamping plate are rotatably connected above the base, the first turnover clamping plate is driven by a first stepping motor, and the second turnover clamping plate is driven by a second stepping motor. The rotating shafts of the two turn-over clamping plates are coaxially arranged, so that unfolding and mutual closing can be realized; and when the first turn-over clamping plate and the second turn-over clamping plate are rotated to be mutually closed, the closed surfaces of the two turn-over clamping plates clamp the patch element. According to the patch component turnover device, through cooperation of the first turnover clamping plate and the second turnover clamping plate which are rotatably connected above the base, the patch component can be turned over quickly and automatically, no matter which turnover clamping plate the patch component is placed on, the turnover operation can be completed, and the turnover efficiency is improved. And the turnover device can adapt to surface-mounted components of different models and sizes, helps operators to quickly turn over the surface-mounted components, and improves the production efficiency.

A high-frequency high-power packaging module comprises at least one power conversion bridge arm, at least one high-frequency capacitor, a circuit layer, an insulating heat-conducting plate, and a plastic package body. The front surface of the semiconductor power device is electrically connected with the first surface of the circuit layer, and the back surface of the semiconductor power device is thermally connected with or electrically connected with the lower surface of the insulating heat-conducting plate. The high-frequency capacitor is electrically connected with the first surface of the circuit layer or the second surface of the circuit layer or the lower surface of the insulating heat-conducting plate, and at least one electrode of the high-frequency capacitor is electrically connected with at least one electrode of the at least one semiconductor power device through the inner-layer electric connection layer.

The invention relates to the technical field of chip mounting, in particular to an automatic adjusting method and system for a chip clamp, and the method comprises the following steps: monitoring and automatically calibrating the pressure applied by the clamp in real time to ensure that the pressure meets the chip mounting standard, analyzing a to-be-mounted chip by using a camera, optimizing the shape recognition, and adjusting the track of the clamp to correct the offset. And analyzing the correlation between the pressure and the mounting quality according to the data after mounting, and establishing an optimized control closed loop. According to the invention, through real-time monitoring and automatic adjustment of pressure parameters, the dependence on manual adjustment is reduced, the automation level of the production process is improved, through detailed pressure adjustment, each chip is ensured to be accurately processed in the mounting process, the product quality is improved, the rejection rate is reduced, and the production efficiency is improved. The application of the image analysis technology allows the chip to be accurately evaluated before mounting, and the distance between the clamps is automatically adjusted, so that the mounting precision is improved, and the requirements of various chip shapes and sizes are met.

The invention discloses a positioning calibration method of surface mounting equipment, equipment, a medium and a product, and relates to the technical field of printed circuit boards, a first position of a bonding pad on a circuit board and a second position of an element pin of an element to be mounted are obtained through recognition by using an image recognition model, the confidence coefficient is recorded, and when matching calculation is carried out, the positioning calibration accuracy is improved. And carrying out position transformation calculation on the positions of the bonding pad and the element pin matched in the current iteration, calculating a transformed position error in combination with the confidence coefficient, and outputting a final matching result of the bonding pad and the element pin and a corresponding final space mapping parameter after a first iterative calculation condition is met. According to the method, the influence of a low-confidence-coefficient position detection result on space mapping parameter calculation is effectively reduced, the stability and reliability of the final space mapping parameter are ensured, compared with traditional position error calculation, the method has higher anti-interference capability, and the accuracy of positioning matching of high surface mounting equipment is improved.

The invention relates to a tin immersion production system for electronic components, which comprises a machine table, the top surface of the machine table is provided with a material conveying mechanism, a clamping mechanism, an impurity removal mechanism and a welding aid mechanism, and the clamping mechanism comprises a mounting plate, a mounting seat and two clamping plates which are symmetrically distributed; the impurity removing mechanism comprises a tin slag groove, a support, a first reciprocating pushing mechanism and a scraper blade. According to the technical scheme, the electronic component can be conveyed through the material conveying component, the clamping mechanism is controlled through the mechanical arm to clamp the conveyed electronic component, then the clamped electronic component makes contact with the weld-aid component, and then the mechanical arm is controlled to make the clamped electronic component make contact with tin liquid in the tin bath for tin immersion operation; and after tin immersion is completed, residual tin oxide on the tin liquid is removed through the impurity removal mechanism, the purposes of optimizing the whole tin immersion process and improving the tin immersion efficiency and the tin immersion treatment quality are achieved, multiple electronic components can be clamped through the clamping mechanism for tin immersion, and the working efficiency of tin immersion is further improved.

The invention relates to the technical field of semiconductor packaging, and provides a semiconductor packaging process which comprises the following steps: obtaining a circuit board, and preprocessing the circuit board; performing SMT assembly operation on the bottom surface of the circuit board; silk-screening solder paste on the top surface of the circuit board; a tin cap of the flip chip is dipped with a soldering flux; mounting a flip chip and other elements on the top surface of the circuit board; performing reflow soldering operation on the top surface of the circuit board; according to the semiconductor packaging process provided by the embodiment of the invention, the tin cap of the flip chip can be dipped with the soldering flux before confluence welding operation is carried out on the flip chip, so that in the reflow soldering process, the soldering flux can effectively protect the tin cap and a PCB bonding pad and prevent oxidation, the collapsed tin cap can recover the original state of the tin cap to the greatest extent during reflow soldering, and the reliability of the flip chip is improved. The tin cap can be in contact with the PCB bonding pad more effectively, good welding is formed, the wettability is improved, oxidation is reduced, the welding strength is enhanced, and the problems of pseudo soldering, open circuit and the like are reduced.

The invention discloses a circuit board tin pick-up device and a tin pick-up method, and belongs to the technical field of circuit board processing. A circuit board to be subjected to tin pick-up is inserted into a loading frame body, and the loading frame body drives the circuit board to rotate by 60 degrees, so that the circuit board directly faces the upper part of a tin liquid box; a circuit board in a loading frame is pushed by a pushing assembly to make contact with tin liquid in a tin liquid box to complete tin dipping work, then a connecting block drives a shifting rod to slide into a sliding hole outside a driving disc again and drives the driving disc and a supporting shaft to rotate, in the same way, a supporting plate drives a downward pressing assembly and the loading frame to rotate, and tin dipping work is completed. The circuit board to be tinned is located above the tin liquid box, so that the circuit board in the loading frame body is intermittently and automatically fed, the tinning work of the circuit board can be continuously carried out, and the traditional mode that the circuit board is loaded on a single clamp and then the tinning work is carried out in a frequent disassembly and assembly mode is abandoned; therefore, the efficiency of tinning work of batch circuit boards is improved, and the continuity of the tinning work of the circuit boards is ensured.

The objective of the present invention is to reduce the effort and burden required to obtain an identification means serving as an AI model, and to enable the identification means to be commonly used even when the sizes of lands are different. Reconstructed image data are acquired by inputting inspection image data based on image data acquired by a camera 32d into AI models 101, 102 generated by training a specific neural network using only image data relating to non-defective solder fillets as training data, and the quality of a solder fillet is determined by comparing the inspection image data and the reconstructed image data. The training data are obtained by providing one solder fillet image in an image frame having a size larger than the size of the one solder fillet image. The inspection image data are obtained by providing one solder fillet image extracted from the image data acquired by the camera 32d in an image frame having the same size as the image frame of the training data.

A substrate includes a core substrate that has a first surface, a second surface facing away from the first surface, and a cavity portion therein; at least two electronic components provided in the cavity portion; and an encapsulating material that is provided between the cavity portion and the at least two electronic components and between the at least two electronic components and includes a resin and fillers, in which an average of distances between the at least two electronic components is less than a shortest distance between a wall surface of the cavity portion and some of the electronic components that are adjacent to the wall surface.

The utility model discloses a chip and substrate welding device with a positioning function, and relates to the technical field of welding devices, the chip and substrate welding device comprises a welding workbench, a rotating mechanism is installed at the center position of the upper surface of the welding workbench in a penetrating mode, and a substrate positioning and clamping mechanism is fixedly installed at the movable end of the rotating mechanism. A first side plate and a second side plate are symmetrically and fixedly connected to the two sides of the upper surface of the welding workbench, and a three-axis moving mechanism is installed on the outer surface of the first side plate in a penetrating mode. The position of the substrate can be changed, a user can weld different positions of the substrate conveniently, through the three-axis moving mechanism, a fourth motor and a vacuum chuck, a chip can be adsorbed and fixed, the chip can be driven to rotate, and therefore the chip can be positioned and welded conveniently.

The utility model provides LED lamp panel repairing equipment which is used for repairing an LED lamp panel, the LED lamp panel comprises a circuit board and at least one bad lamp bead located on the circuit board, and the LED lamp panel repairing equipment comprises a feeding assembly, a removing and die bonding assembly, a tin dispensing assembly, a surface mounting assembly and a lightening detection assembly. The feeding assembly is used for obtaining position information of bad lamp beads and bearing and conveying LED lamp panels. The rejecting and die bonding assembly is used for heating and desoldering the bad lamp beads and rejecting the bad lamp beads and the molten solder so as to expose the bonding pads corresponding to the bad lamp beads; the tin dispensing assembly is used for dispensing solder paste on the bonding pad; the surface mounting assembly is used for attaching good lamp beads to the solder paste; the laser is further used for heating and die bonding of the good lamp beads so that the good lamp beads can be installed on the circuit board. The lightening detection assembly is used for conducting lightening detection on the circuit board provided with the good lamp beads. The problem that the production efficiency of the lamp panel cannot be improved when the existing lamp panel repairing equipment is used for repairing the lamp panel is solved.

The invention belongs to the technical field of SMT reflow soldering, and particularly relates to a reflow soldering device and method for SMT. Comprising a reflow soldering furnace and a steel mesh, a telescopic air cylinder is arranged on the side face of the reflow soldering furnace, a U-shaped base plate is installed at the output end of the telescopic air cylinder, guide rails are arranged on the opposite faces of the U-shaped base plate, and printing equipment is arranged on the guide rails in a sliding mode. The U-shaped base plate is further provided with a locking actuating assembly. The locking actuating assembly comprises a rectangular frame, and the steel mesh is located in the rectangular frame. A T-shaped clamping plate is installed on the outer side wall of the rectangular square frame, a take-up roller is installed at the interlayer of the T-shaped clamping plate, and an energy dissipation anti-movement mechanism is arranged on the take-up roller; different types of steel meshes required by printing can be quickly replaced through the locking actuation assembly, so that different types of PCBs can be printed by using matched steel meshes, the reflow soldering effect of the device on SMT boards is improved, and the limitation of the device in use is reduced.

A method of manufacturing an electronic device includes providing a substrate with a predetermined first-hole region, a first surface, and a second surface. The second surface is opposite the first surface. The method includes laser processing the predetermined first-hole region from the first surface to form a first laser track and laser processing the predetermined first-hole region from the first surface to form a second laser track. The first laser track does not overlap the second laser track. The method further includes etching the predetermined first-hole region to form a first-hole.