3530results about "Electrical connection printed elements" patented technology

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

The invention relates to the technical field of printed circuit boards, and discloses an asymmetric PCB manufacturing method and an asymmetric PCB, and the asymmetric PCB manufacturing method comprises the steps: providing a substrate, the substrate comprises an embedded layer, a first dielectric layer and a first conductive layer, the embedded layer is internally provided with a power module, and the substrate is also provided with a first connecting hole; the substrate is electroplated to obtain a first conductive part, a first electroplated layer and a second electroplated layer, the first conductive part fills the first connecting hole, the electronic element and the first conductive layer are both connected with the first conductive part, the first electroplated layer covers the first conductive part and the first conductive layer, the first electroplated layer and the first conductive layer form a first circuit layer, and the second electroplated layer covers the second conductive layer; the second electroplated layer covers one surface, deviating from the first dielectric layer, of the embedded layer. The manufacturing method of the asymmetric PCB and the asymmetric PCB provided by the invention are used for solving the problem that a circuit board embedded with a power module is easy to warp in the manufacturing process in the related technology.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

The invention relates to the technical field of flexible electronic integrated systems, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multi-layer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stacked mode, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible base material. The flexible base material and the flexible substrate layer in the flexible conductive layer have tensile properties. The metal nanowire aerogel is in lap joint in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel enables the flexible conductive layer to have good electrical stability, namely resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer deforms, the resistance does not change obviously. Due to the stacked structure design, the mechanical stretchable upper limit of the multi-layer flexible circuit is remarkably improved, the resistance change rate under the same deformation is remarkably reduced, and the resistance change is low after long-term use.

A wiring module is directed to a wiring module configured to be attached to a plurality of power storage elements having electrode terminals. The wiring module includes: a plurality of busbar units: and wires connected to the busbar units. Each of the busbar units includes: a busbar connected to the electrode terminals; a circuit board; and a fixing means configured to fix the circuit board to the busbar. A conductive path is routed on the circuit board, and the conductive path includes: a connection land electrically connected to the busbar; and a wire land soldered to the corresponding wire. The busbar includes a crimping part that fixes the wire, and the wire is interposed between the crimping part and the circuit board.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

The present application provides a vertical power supply system. The vertical power supply system comprises a processor, a main board, and a vertical power circuit. The vertical power circuit comprises a PB carrier board and PB modules. The processor is connected to a first surface of the main board by means of a plurality of first fixing members, and the PB carrier board is connected to a second surface of the main board by means of a plurality of second fixing members. The plurality of second fixing members are in one-to-one correspondence with the plurality of first fixing members, and the second fixing members are connected to the first fixing members corresponding thereto by means of via holes in the main board. Each PB module is connected to the PB carrier board by means of a plurality of third fixing members, and the PB module is used for converting an input power source into a target power source. The target power source passes through the plurality of third fixing members, the PB carrier board, the plurality of second fixing members, the via holes in the main board, and the plurality of first fixing members to supply power to the processor. By means of the technical solution of the present application, transmission loss during power supply can be reduced, thereby achieving good heat dissipation for the power supply system.

The utility model discloses an FPC, CCS subassembly, battery module and vehicle, said FPC includes FPC body and FPC branch, said FPC branch includes and at least one connecting portion, one end of said connecting arm is conductively connected with said FPC body, the other end of said connecting arm overhangs and is equipped with NTC fixed portion, said connecting arm is bent to form at least one bending portion, and said bending portion is equipped with the NTC fixed portion. The orthographic projection of the connecting part in the thickness direction of the FPC body covers the FPC body, and at least one bending part is connected with at least one connecting part. According to the FPC provided by the utility model, the orthographic projection in the thickness direction of the FPC body covers the FPC body, so that the connecting part can be connected with the FPC body, and the FPC body can be used for limiting the warping problem of the bending part. Therefore, the risk of warping of the FPC branches can be reduced, and the reliability of the battery module is improved.

A connection system comprises a printed circuit board. The printed circuit board comprises a top face and a bottom face. The printed circuit board also comprises a first edge that is normal to the top face and bottom face. The printed circuit board also comprises a second edge that is normal to the top face and bottom face. The first edge face and second edge face intersect at an angle that is not a straight angle. The connection system also comprises a coplanar card-edge socket on the printed circuit board. The socket comprises a top section that interfaces with the top face of the printed circuit board along the first and second edge faces of the printed circuit board. The socked also comprises a bottom section that interfaces with the bottom face of the printed circuit board along the first and second edge faces of the printed circuit board.

Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and / or a pitch distance ranging from 1 to 100 micrometers (μm).

The utility model provides a management function board applied to a mobile phone battery, which belongs to the technical field of mobile phone battery function boards and comprises a battery management module, a battery management module and a battery management module. An FPC flexible circuit layer and a PCB hard circuit layer; the through hole windows are formed in the upper end of the FPC flexible circuit layer, line conduction is achieved through alignment of the multiple layers of through hole windows, the overall mechanical stability of the provided mobile phone battery management function board is remarkably enhanced by adopting the integrated forming and pressing design of the FPC flexible circuit layer and the PCB rigid circuit layer, the FPC and the PCB are tightly combined through the pressing technology, and the reliability of the mobile phone battery management function board is improved. Compared with the prior art, the power management system has the advantages that the interlayer separation risk caused by long-term use or external impact is reduced, the durability and reliability of the whole power management system are improved, in addition, the high reliability of electrical connection is ensured through the accurate via hole windowing design and the SMT high-temperature processing technology, signal transmission is more stable, and power transmission is more efficient.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

To provide a laminated substrate capable of ensuring a long-term reliability by preventing stress from being applied to a conductive paste for electrical connection when the laminated substrate is manufactured by laminating a plurality of multilayer substrates.SOLUTION: In a laminated substrate 100 formed by laminating a plurality of multilayer substrates 10, in each multilayer substrate 10, a through hole 30 penetrating through each multilayer substrate 10 and having an inner wall surface plated and filled with a resin 32 therein, and bonding lands 34 electrically connected to the through hole 30 are formed on an upper surface and a lower surface of the through hole 30. An insulating adhesive layer 40 and a conductive paste via 50 for electrically connecting the bonding lands 34 of the opposed multilayer substrates to each other by a conductive paste filled in a through hole 46 formed in the insulating adhesive layer 40 are provided between the multilayer substrates 10, and the conductive paste via 50 is provided at a position different from the position where the through hole 30 is formed.SELECTED DRAWING: Figure 1

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The signal transmission device includes first, second and third chips. The first and second chips includes respectively: a first input pad; an ADC that converts a first analog signal inputted to the first input pad into a first digital signal; a first transmission circuit that generates a first pulse signal in correspondence to the first digital signal; a first output pad that outputs the first pulse signal; a second input pad; a first reception circuit that generates a second digital signal in correspondence to a second pulse signal inputted to the second input pad; a DAC that converts the second digital signal into a second analog signal; and a second output pad that outputs the second analog signal. The third chip, upon receiving the first pulse signal from the first output pad of the first chip, outputs the second pulse signal to the second input pad of the second chip.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

A semiconductor package according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer and including a first pad; a first molding layer disposed on an upper surface of the first insulating layer; a through electrode including a first conductive coupling part disposed on the first pad and having a first width and a through part disposed on the first conductive coupling part and having a second width smaller than the first width, and passing through of the first molding layer; and a second conductive coupling part disposed on the through part of the through electrode; wherein the first width of the first conductive coupling part is smaller than a third width of the second conductive coupling part.

A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.

A strain gauge includes a flexible substrate, a resistor, and electrodes. Each electrode includes first patterns juxtaposed at predetermined intervals and electrically connected to each other. Second patterns of which longitudinal directions are toward a same direction as a longitudinal direction of each of the first patterns are disposed between opposing electrodes. The second patterns are electrically floating dummy patterns. The second patterns of which the longitudinal directions are toward a same direction as the longitudinal direction of each first pattern are disposed, the second patterns being interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode. The plurality of second patterns are interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode.

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

Described herein are methods and systems for additive manufacturing of parts comprising electrolytic deposits and electrophoretic deposits. Such methods and methods provide various new ways for integrating different materials into composite parts. Specifically, an additive manufacturing system comprises an electrode array with individually-addressable electrodes. Each individually-addressable electrode is coupled to a separate deposition control circuit, which selectively connects this electrode to a power supply. When forming a composite part, the electrode array can control the location of each electrolytic deposit (by controlling the current flow through each individually-addressable electrode) and each electrophoretic deposit (by controlling the electric field distribution). An electrolyte solution or an electrophoretic suspension is provided between the electrode array and deposition electrode to form corresponding deposits. In addition to the electrode-array provided control, alternating the electrolytic and electrophoretic deposition operations can be used to locate the corresponding deposits within a composite part.

A phased array antenna system includes a flexible printed circuit board formed of a flexible material. The flexible printed circuit board includes a component layer, an antenna layer, and a phase matching layer between the component layer and the antenna layer. A control unit is coupled to the component layer. A plurality of antenna elements are coupled to the antenna layer. A plurality of signal paths extend through the component layer, the phase matching layer, and the antenna layer. Each of the plurality of signal paths connects the control unit to a respective one of the plurality of antenna elements. The control unit provides an independent phase controllable source, which allows beams emitted from the antenna elements to be steered.

A circuit assembly includes first and second circuit carriers and a semiconductor component arranged between the circuit carriers and having first and second load terminals. The first load terminal has a first load terminal surface which faces the first circuit carrier and around which an electrically insulating edging structure is arranged. The second load terminal has a second load terminal surface which faces the second circuit carrier and is larger than the first load terminal surface. The first circuit carrier has a first through-contact which electrically connects the first load terminal surface to a first conductor path, which runs inside the first circuit carrier or on a top side of the first circuit carrier facing away from the semiconductor component. The second circuit carrier has a top side facing the semiconductor component and formed by a first electrically conductive layer that is electrically connected to the second load terminal surface.