5173results about "Electrical connection printed elements" patented technology

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

An electronic device has a substrate, a signal wiring and a heat radiating wiring. The substrate has one surface and the other surface opposite to the one surface. The signal wiring is formed on an insulating layer of the substrate. The heat radiating wiring is formed on the insulating layer and thermally connected to the signal wiring on a same plane as the signal wiring.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure / s within urban settings, each configured to operate by a processor / controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data / instruction / s processing the inputs with resident code parameters generating outputs that are configured to mitigate / avert intermittent environmental events harmful / hazardous to humans. The IDS's include a launch and charging pad that hosts a UAV, which patrols an area within communication range of at least one of the IDSs so the UAV, perhaps with AI-engine assistance, can detect events in the area patrolled by the UAV.

The invention discloses a stamp hole and LGA combined board card, and relates to the technical field of embedding. Comprising a core board and a bottom board, the bottom board is provided with a bonding pad corresponding to the core board in position, and the bonding pad is used for welding the core board and the bottom board; the core board comprises a board card body, and the board card body is provided with a plurality of stamp holes, a plurality of LGA packaging pads, a plurality of LGA special pads, a positioning hole and a shielding cover welding module. The mode of combining the stamp hole and the LGA is used as the connection mode of the core board, and the advantages of the stamp hole and LGA packaging are achieved at the same time.

An electronic device and method are disclosed. The electronic device includes a first and second housing movable relative to each other. The second housing supports a flexible display which may be at least partially exposed to an exterior, and at least partially stowed within the first housing based on the movement of the housings. A processor implements the method including detecting movement of the housings such that a visible display area of the display is changed, detecting whether the resizing meets a predetermined condition, and if resizing does not meet the predetermined condition, executing image processing on a portion of the resized visible display area.

A method for electrically connecting a first electronic component of a battery system with a second electronic component of the battery system is provided. The first electronic component includes a flexible printed circuit (FPC) including: a pin formed by folding a connection portion of the FPC; and a conductive strip on an outer surface of the folded connection portion. The second electronic component includes a printed circuit board (PCB) having a through-hole configured to receive the pin of the FPC and includes an electrically conductive plating adjacent to the through-hole. The method includes: attaching the FPC to a first side of the PCB such that the pin of the FPC is received in the through-hole in the PCB; and soldering the pin of the FPC to the conductive plating on the PCB to electrically interconnect the FPC and the PCB.

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.

A memory module has pads on the top and bottom surfaces of a module printed circuit board (PCB). The pads match the pin layout of one or more memory devices to be mounted on the memory module. The pads on one surface of the PCB electrically interconnect to the memory device(s), and the pads on the other surface electrically interconnect to pads on a system board, such as a motherboard. With the pad layout on the memory module, the pad layout of the system board can be the same for a memory-down implementation and for a removable memory module. The pad layout provides good signal-to-noise performance and can enable a memory module for low power double data rate (LPDDR) memory, double data rate (DDR) memory, and graphics double data rate (GDDR) memory.

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

A display device includes a display panel, a flexible circuit board, and a driving chip. The display panel includes a display area and a non-display area bent to the back of the display area. The driving chip is bonded and connected to the display panel in the non-display area. The flexible circuit board includes a bonding area bonded to the non-display area, and a first flat area, a bending area, and a second flat area arranged in sequence in a direction away from the bonding area. The flexible circuit board is at the back of the display area. The second flat area is between the first flat area and the display area. A first electromagnetic shielding layer is provided on at least a portion of the surface, close to the display area, of the second flat area.

A wiring module is to be attached to a battery cell stacked body in which a plurality of battery cells having an electrode terminal and being elongated in a front-rear direction are arranged in a horizontal direction, and is electrically connected to the battery cells, the wiring module including: a bus bar that is connected to the electrode lead; an FPC that is connected to the bus bar and extends in the front-rear direction; and a protector that holds the bus bar and the FPC, wherein the FPC includes: a plurality of extension parts that extend in the front-rear direction; an intersection part that extends in the horizontal direction; and a bending part, the extension parts are respectively coupled to two end portions of the intersection part in the horizontal direction, one of the extension parts includes the bending part in the vicinity of the intersection part.

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a charging interface, a first circuit board, a metal reinforcing piece and a support assembly. The first circuit board comprises a connecting end. The connecting end is provided with a grounding terminal. The connecting end is electrically connected with the charging interface. The metal reinforcing member and the connecting end are arranged in a stacked manner. The metal reinforcing member is electrically connected with the grounding terminal. The support assembly comprises a metal support and a conductive part. At least part of the connecting end is located in the metal support. The metal support comprises a main body part and a grounding part. The grounding part is electrically connected with the main body part. And the metal reinforcing piece and the main body part are electrically connected with the conductive piece respectively. The grounding part is used for grounding. According to the electronic equipment provided by the embodiment of the invention, the structural design difficulty is reduced, and the assembly difficulty and the production cost are reduced.

The embodiment of the invention provides a printed circuit board, a processing method, a test system and electronic equipment. The printed circuit board comprises a plurality of metal layers, a first metal transmission hole, a signal transmission line and a first signal interface. Wherein the plurality of metal layers form a board body structure of the printed circuit board. The first metal transmission hole is arranged in the board body structure, and the first end of the first metal transmission hole extends from the interior of the board body structure to the upper board surface side of the board body structure so as to be coupled with the first signal interface. The signal transmission line is arranged on a first metal layer in the plurality of metal layers, and a first end of the signal transmission line is coupled with a first contact point on the first metal transmission hole in the plate body structure. And a transmission path distance with a first length exists between the first contact point of the first metal transmission hole and the second end of the first metal transmission hole, so that the transmission impedance of the first via hole connecting part is improved. According to the embodiment, the process complexity and the design difficulty are reduced, and the impedance matching degree of the printed circuit board and an external device or structure is improved.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

A quasi-planar transformer can include a first winding comprising one or more turns of wire, a second winding comprising one or more turns of a conductive trace disposed on a printed circuit board, and a magnetic core positioned with respect to the first and second windings so as to provide a magnetic flux path coupling the first and second windings. The first winding can be a primary winding having a first half wound in a clockwise direction on a first side of the printed circuit board and a second half wound in a counterclockwise direction on a second side of the printed circuit board, wherein the first and second halves are formed of a single continuous wire. The single continuous wire can pass through an opening in the printed circuit board. The first and second halves of the primary winding can be secured to the printed circuit board.

A semiconductor package includes a package substrate having first and second substrate pads thereon, a first semiconductor chip on the package substrate and including a first chip pad, a second semiconductor chip on the first semiconductor chip and including a second chip pad on a lower surface of the second semiconductor chip, a first bonding wire contacting the first substrate pad and the first chip pad, and a second bonding wire contacting the second substrate pad and the second chip pad. An uppermost portion of the second bonding wire is lower than or coplanar with the lower surface of the second semiconductor chip.

The invention relates to the technical field of printed circuit boards, and discloses an asymmetric PCB manufacturing method and an asymmetric PCB, and the asymmetric PCB manufacturing method comprises the steps: providing a substrate, the substrate comprises an embedded layer, a first dielectric layer and a first conductive layer, the embedded layer is internally provided with a power module, and the substrate is also provided with a first connecting hole; the substrate is electroplated to obtain a first conductive part, a first electroplated layer and a second electroplated layer, the first conductive part fills the first connecting hole, the electronic element and the first conductive layer are both connected with the first conductive part, the first electroplated layer covers the first conductive part and the first conductive layer, the first electroplated layer and the first conductive layer form a first circuit layer, and the second electroplated layer covers the second conductive layer; the second electroplated layer covers one surface, deviating from the first dielectric layer, of the embedded layer. The manufacturing method of the asymmetric PCB and the asymmetric PCB provided by the invention are used for solving the problem that a circuit board embedded with a power module is easy to warp in the manufacturing process in the related technology.

A connection body comprises a body having upper and lower surfaces, a first path and a second path. The first path has a first wired portion configured to be connected to a first core wire of a cable structure and a first terminal portion coupled to the first wired portion by a first coupling portion. The first wired portion, the first terminal portion and the first coupling portion are formed on the upper surface of the body. The second path has a second wired portion configured to be connected to a second core wire of the cable structure and a second terminal portion coupled to the second wired portion by a second coupling portion. The second wired portion is formed on the upper surface of the body. The second terminal portion is formed on the lower surface of the body.

The invention relates to the technical field of circuit board manufacturing, and discloses a PCB manufacturing method and a PCB.The PCB manufacturing method comprises the steps that a PCB is provided, the PCB comprises a base material, the base material is provided with a connecting face, the connecting face is provided with a circuit, an OSP bonding pad and a to-be-plated part, the PCB is provided with a solder mask layer, the solder mask layer is provided with a first window, a sunken part and a second window, the OSP bonding pad is exposed out of the first window, and the OSP bonding pad is exposed out of the sunken part; a first character is arranged in the concave part, and the second window exposes the to-be-plated part; a protective layer is arranged on the solder mask layer, the protective layer shields the first window and shields the sunken part, the protective layer and the first character are arranged at intervals in the direction perpendicular to the connecting face, the protective layer is provided with a third window, and the to-be-plated part is exposed out of the third window; performing electrogilding treatment on the to-be-plated part; and removing the protective layer. According to the PCB manufacturing method and the PCB provided by the invention, the problem that the OSP bonding pad is easily gilded after the gold finger and the like are subjected to electrogilding in the related technology can be improved.

An information handling system main printed circuit board having a CPU couples to a graphics printed circuit board having a GPU with an interposer that includes contacts and wirelines that communicate signals between the separate boards. For example, an interposer couples to an upper and lower side of the main and graphics printed circuit boards to align spring contacts with contact pads of the main and graphics printed circuit so that signals are transferred through the interposer, which also provides a physical structure to define a motherboard with the assembly of the main and graphics printed circuit boards into a single piece.

The invention discloses an optimized high-speed differential via hole structure, which is characterized in that high-speed differential via holes are arranged in each wiring layer, each wiring layer is provided with a corresponding anti-pad, and corresponding wires are laid in the high-speed differential via holes; marking the part of the wire in each suspension area outside the corresponding anti-bonding pad close to the wiring layer as a suspension wire, marking the part of the wire in the high-speed differential via hole as a via hole wire, thickening the suspension wire, and controlling the suspension wire to be thicker than the via hole wire; and reducing the size of the anti-bonding pad in each non-adjacent wiring layer, and controlling the size of the anti-bonding pad in each non-adjacent wiring layer to be smaller than the size of the anti-bonding pad in each adjacent wiring layer. According to the invention, through combined use of the thickened suspension line, reduction of the non-adjacent wiring layer anti-bonding pad and increase of the adjacent wiring layer anti-bonding pad, the impedance of each part is effectively adjusted, and the impedance requirement of high-speed signal transmission is met; and the optimized mode is high in universality, simple and efficient.

The invention relates to the technical field of PCB (Printed Circuit Board) processing, and discloses a method for removing lead warped copper by deep drilling in a gold finger gold plating process, which comprises the following steps of: optimizing the position and the shape of a gold-plated lead: changing the gold-plated lead from a short side of a gold finger to a side wall of the gold finger, and optimizing the shape of the gold-plated lead to be elliptical; the widest part R of the center of the ellipse satisfies Rlt by taking mil as a unit; x-R is larger than or equal to 4 mil, and X is the diameter of a deep drilling point; according to high-precision photosensitive wet film protection, before a gold-plated lead is removed through deep drilling, a photosensitive wet film is adopted to cover a gold finger lead area, the wet film is accurately positioned and printed through drilling positioning holes in the four corners, the protective area covers the gold finger lead and extends outwards by Y mil, and Y is larger than or equal to 4 mil. The method for removing the warped copper of the lead through deep drilling in the gold-plating process of the golden finger aims at solving the problem that the copper is prone to being warped when the gold-plated lead is removed through deep drilling in the gold-plating process of the golden finger.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a manufacturing method of a printed circuit board and the printed circuit board, and the manufacturing method of the printed circuit board comprises the steps: providing a substrate which comprises a dielectric layer and a metal layer, and arranging a first region and a BGA region on one surface, deviating from the dielectric layer, of the metal layer, the metal layer corresponding to the first area is provided with a plurality of shunting grooves, and the metal layer corresponding to the BGA area is provided with a plurality of BGA holes; the substrate is electroplated, an electroplated layer is formed, the electroplated layer comprises a first electroplated part, a plurality of second electroplated parts and at least one third electroplated part, the first electroplated part is located on the inner wall of the BGA hole, and the diversion grooves are filled with the second electroplated parts; and carrying out thinning treatment on the third electroplating part. According to the manufacturing method of the printed circuit board and the printed circuit board provided by the invention, the problem that the plated copper in the BGA area is not easy to remove when the surface copper thickness of the BGA area is increased by adopting a local thickening process in the related technology can be improved.

The invention relates to the technical field of flexible electronic integrated systems, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multi-layer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stacked mode, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible base material. The flexible base material and the flexible substrate layer in the flexible conductive layer have tensile properties. The metal nanowire aerogel is in lap joint in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel enables the flexible conductive layer to have good electrical stability, namely resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer deforms, the resistance does not change obviously. Due to the stacked structure design, the mechanical stretchable upper limit of the multi-layer flexible circuit is remarkably improved, the resistance change rate under the same deformation is remarkably reduced, and the resistance change is low after long-term use.

A wiring module is directed to a wiring module configured to be attached to a plurality of power storage elements having electrode terminals. The wiring module includes: a plurality of busbar units: and wires connected to the busbar units. Each of the busbar units includes: a busbar connected to the electrode terminals; a circuit board; and a fixing means configured to fix the circuit board to the busbar. A conductive path is routed on the circuit board, and the conductive path includes: a connection land electrically connected to the busbar; and a wire land soldered to the corresponding wire. The busbar includes a crimping part that fixes the wire, and the wire is interposed between the crimping part and the circuit board.

The utility model relates to the technical field of printed circuit boards, and provides a connection structure for improving the current-carrying capability from a terminal to a PCB, the PCB and an automobile, the connection structure comprises the PCB and a fisheye terminal, the PCB comprises a plurality of copper-clad layers, the PCB is provided with at least one plug-in hole, the periphery of each plug-in hole is provided with at least one conductive hole, the plug-in hole vertically penetrates through the PCB, and the fisheye terminal is arranged in the fisheye terminal. The conductive layer is conductively connected with at least one copper-clad layer through conductive holes around the conductive layer; and the fisheye terminal is inserted into one plug-in hole of the PCB. According to the utility model, the periphery of the plug-in hole where the fisheye terminal is contacted with the PCB is provided with at least one conductive hole to connect the PCB multilayer copper-clad layer, so that the diversion area from the fisheye terminal to the PCB end is increased, and the current-carrying capability of the PCB is improved.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.