2869results about "Electrical connection printed elements" patented technology

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

The invention relates to the technical field of printed circuit boards, and discloses an asymmetric PCB manufacturing method and an asymmetric PCB, and the asymmetric PCB manufacturing method comprises the steps: providing a substrate, the substrate comprises an embedded layer, a first dielectric layer and a first conductive layer, the embedded layer is internally provided with a power module, and the substrate is also provided with a first connecting hole; the substrate is electroplated to obtain a first conductive part, a first electroplated layer and a second electroplated layer, the first conductive part fills the first connecting hole, the electronic element and the first conductive layer are both connected with the first conductive part, the first electroplated layer covers the first conductive part and the first conductive layer, the first electroplated layer and the first conductive layer form a first circuit layer, and the second electroplated layer covers the second conductive layer; the second electroplated layer covers one surface, deviating from the first dielectric layer, of the embedded layer. The manufacturing method of the asymmetric PCB and the asymmetric PCB provided by the invention are used for solving the problem that a circuit board embedded with a power module is easy to warp in the manufacturing process in the related technology.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

The invention relates to the technical field of flexible electronic integrated systems, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multi-layer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stacked mode, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible base material. The flexible base material and the flexible substrate layer in the flexible conductive layer have tensile properties. The metal nanowire aerogel is in lap joint in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel enables the flexible conductive layer to have good electrical stability, namely resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer deforms, the resistance does not change obviously. Due to the stacked structure design, the mechanical stretchable upper limit of the multi-layer flexible circuit is remarkably improved, the resistance change rate under the same deformation is remarkably reduced, and the resistance change is low after long-term use.

A wiring module is directed to a wiring module configured to be attached to a plurality of power storage elements having electrode terminals. The wiring module includes: a plurality of busbar units: and wires connected to the busbar units. Each of the busbar units includes: a busbar connected to the electrode terminals; a circuit board; and a fixing means configured to fix the circuit board to the busbar. A conductive path is routed on the circuit board, and the conductive path includes: a connection land electrically connected to the busbar; and a wire land soldered to the corresponding wire. The busbar includes a crimping part that fixes the wire, and the wire is interposed between the crimping part and the circuit board.

Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and / or a pitch distance ranging from 1 to 100 micrometers (μm).

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

To provide a laminated substrate capable of ensuring a long-term reliability by preventing stress from being applied to a conductive paste for electrical connection when the laminated substrate is manufactured by laminating a plurality of multilayer substrates.SOLUTION: In a laminated substrate 100 formed by laminating a plurality of multilayer substrates 10, in each multilayer substrate 10, a through hole 30 penetrating through each multilayer substrate 10 and having an inner wall surface plated and filled with a resin 32 therein, and bonding lands 34 electrically connected to the through hole 30 are formed on an upper surface and a lower surface of the through hole 30. An insulating adhesive layer 40 and a conductive paste via 50 for electrically connecting the bonding lands 34 of the opposed multilayer substrates to each other by a conductive paste filled in a through hole 46 formed in the insulating adhesive layer 40 are provided between the multilayer substrates 10, and the conductive paste via 50 is provided at a position different from the position where the through hole 30 is formed.SELECTED DRAWING: Figure 1

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.

A strain gauge includes a flexible substrate, a resistor, and electrodes. Each electrode includes first patterns juxtaposed at predetermined intervals and electrically connected to each other. Second patterns of which longitudinal directions are toward a same direction as a longitudinal direction of each of the first patterns are disposed between opposing electrodes. The second patterns are electrically floating dummy patterns. The second patterns of which the longitudinal directions are toward a same direction as the longitudinal direction of each first pattern are disposed, the second patterns being interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode. The plurality of second patterns are interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode.

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

Described herein are methods and systems for additive manufacturing of parts comprising electrolytic deposits and electrophoretic deposits. Such methods and methods provide various new ways for integrating different materials into composite parts. Specifically, an additive manufacturing system comprises an electrode array with individually-addressable electrodes. Each individually-addressable electrode is coupled to a separate deposition control circuit, which selectively connects this electrode to a power supply. When forming a composite part, the electrode array can control the location of each electrolytic deposit (by controlling the current flow through each individually-addressable electrode) and each electrophoretic deposit (by controlling the electric field distribution). An electrolyte solution or an electrophoretic suspension is provided between the electrode array and deposition electrode to form corresponding deposits. In addition to the electrode-array provided control, alternating the electrolytic and electrophoretic deposition operations can be used to locate the corresponding deposits within a composite part.

A circuit assembly includes first and second circuit carriers and a semiconductor component arranged between the circuit carriers and having first and second load terminals. The first load terminal has a first load terminal surface which faces the first circuit carrier and around which an electrically insulating edging structure is arranged. The second load terminal has a second load terminal surface which faces the second circuit carrier and is larger than the first load terminal surface. The first circuit carrier has a first through-contact which electrically connects the first load terminal surface to a first conductor path, which runs inside the first circuit carrier or on a top side of the first circuit carrier facing away from the semiconductor component. The second circuit carrier has a top side facing the semiconductor component and formed by a first electrically conductive layer that is electrically connected to the second load terminal surface.

The invention relates to a flexible circuit board and a manufacturing method thereof, the manufacturing method of the flexible circuit board comprises a typesetting step, an electroplating step, a through hole step and an insulation step, the typesetting step is to provide a base material and form a bottom layer circuit on the base material; in the electroplating step, the bottom layer circuit is electroplated so as to thicken or widen the bottom layer circuit into a conductive circuit; in the through hole step, a through hole is formed in a port of the conductive circuit or at a position adjacent to the port, the through hole penetrates through the base material and the conductive circuit, and a section is formed on the conductive circuit at the through hole; in the insulation step, an insulation structure is provided, the insulation structure is arranged on the base material to cover the conductive circuit, and part of the insulation structure is located in the through hole and covers the fracture surface; therefore, the use of an etching process can be avoided to reduce environmental pollution, metal consumption and power consumption, and the conductive circuit can be effectively prevented from being exposed to influence reliability.

A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.

The utility model relates to a flexible circuit board, which comprises a flexible circuit board body, a wrapping part and an insulating protective layer, and a first accommodating cavity is formed among the wrapping part, the insulating protective layer and the flexible circuit board body. When a corrosion medium permeates into the edge of the flexible circuit board, the corrosion medium flows into the first accommodating cavity along the space between the insulating protection layer and the flexible circuit board body, and the surface, far away from the component, of the wrapping part can block the corrosion medium. A corrosion medium is prevented from corroding a bonding pad of a component and a connecting layer between the bonding pad and the welding surface of the flexible circuit board body, and poor conduction of the flexible circuit board is prevented. The utility model also provides a display module comprising the flexible circuit board, and a display device comprising the display module.

The invention is suitable for the technical field of laser processing, and provides a hole structure processing method of a ceramic substrate, a controller, equipment and a ceramic circuit board. The hole structure processing method of the ceramic substrate comprises the following steps: acquiring processing parameters of a hole structure; processing a hole structure with a hole outer contour and a target processing depth at the hole position; wherein the hole structure machining process is multi-time layered machining, and the machining process of a first layer in the multi-time layered machining comprises the steps that first laser is used for conducting laser winding cutting machining along a machining path matched with the outer contour of a hole according to the first machining depth, second laser is used for conducting laser scanning machining along the defined area of the outer contour of the hole according to the second machining depth smaller than the first machining depth; after multi-time layered machining, the accumulated value of the first machining depth is larger than or equal to the target machining depth, and the accumulated value of the second machining depth is larger than or equal to the target machining depth. According to the embodiment of the invention, the pore structure meeting the requirements can be effectively processed on the ceramic material layer.

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

The invention provides an electric wiring component, a consumable chip and an ink box, and relates to the technical field of integrated circuit manufacturing and integrated circuit design. The electrical wiring member includes a plurality of contact points for contacting a contact pin of the image forming apparatus; the plurality of contact points comprise a plurality of corner contact points and a plurality of non-corner contact points; at least two corner contacts are suspended contacts, and the suspended contacts are in contact with the contact pins but are not electrically connected with the printing head chip; according to the invention, at least two corner contacts are suspended contacts, so that the number of corner contacts electrically connected with the imaging equipment is reduced, and the problems that the corner contacts cannot be normally and electrically connected with corresponding contact pins due to pollution, so that the contact between the consumable chip side and the terminal of the imaging equipment main body side is insufficient, and the service life of the imaging equipment is prolonged are solved. And the consumable chip and the imaging equipment cannot be in normal contact and electrical connection.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

An impact-resistant reinforced carrier includes a substrate, a rigid insulated carrier sheet, metal pillars, a resin layer, and first and second circuit layers. The substrate has first through holes penetrating through upper and lower surfaces of the substrate. The rigid insulated carrier sheet has second through holes penetrating through first and second surfaces of the rigid insulated carrier sheet. The metal pillars are respectively in the second through holes. The resin layer covers the rigid insulated carrier sheet and the upper surface and has openings. The first circuit layer is on a portion of a surface of the resin layer, in the openings, and connected to the metal pillars. The second circuit layer is on a portion of the lower surface, in the first through holes, and connected to the metal pillars.

The invention discloses a waterproof capacitive touch screen based on a PCB (printed circuit board) bonding pad and a transparent conductive film, which belongs to the technical field of touch screens and comprises a cover plate, a transparent conductive film sensor, a printed circuit board, an integrated connecting structure and a main sealing structure. The transparent conducting film sensor comprises a transparent base material, a capacitive sensing electrode pattern formed on the transparent base material, and a transparent conducting film bonding pad array which is electrically connected with the capacitive sensing electrode pattern and located in a non-visual area. And all electrical connection points are firmly packaged by the anisotropic conductive material and the main sealing structure, so that water vapor and electrolyte are fundamentally prevented from eroding channels, and the protection grade of IP67 and above is easily realized.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

The present disclosure provides an electronic device. The electronic device includes a circuit structure, an electronic component, a flexible conductive layer, and a conductive element. The circuit structure has a first surface and a second surface opposite to the first surface. The electronic component is under the first surface. The flexible conductive layer is over the second surface. The conductive element extends toward a direction far away from the second surface and connected to the flexible conductive layer. The conductive element is embedded within at least two different materials.

To provide a fabric hybrid electronic system that can realize multiple functions such as sensing detection and signal transmission, and also has stable performance that can withstand washing and rubbing. [Solution] The system includes a chip component, a laser-induced flexible sensor, a fabric substrate, a conductive fabric line, a physiological electrode, and a vertical interconnection via, and uses the laser's material modification ability to form a patterned sensor 131 on the surface 111 of the fabric substrate, uses the laser's micro-cutting ability to form patterned flexible electrodes and interconnection wires, and forms highly stable vertical interconnection vias by infiltrating a conductive composite into the inherent structure of the fabric, and welds the chip electronic device to form a fabric hybrid electronic integrated system.