932results about "Transparent dielectrics" patented technology

Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.

Apparatuses and methods are described that involve the deposition of polymer coatings on substrates. The polymer coatings generally comprise an electrically insulating layer and / or a hydrophobic layer. The hydrophobic layer can comprise fused polymer particles have an average primary particle diameter on the nanometer to micrometer scale. The polymer coatings are deposited on substrates using specifically adapted plasma enhanced chemical vapor deposition approaches. The substrates can include computing devices and fabrics.

A space-efficient substantially transparent mutual capacitance touch sensor panel can be created by forming columns made of a substantially transparent conductive material on one side of a first substantially transparent substrate, forming rows made of the substantially transparent conductive material on one side of a second substantially transparent substrate, adhering the two substrates together with a substantially transparent adhesive, bringing column connections down to the second substrate using vias, and routing both the column and row connections to a single connection area on the second substrate. In addition, in some embodiments some of the row connections can be routed to a second connection area on the second substrate to minimize the size of the sensor panel.

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

According to the present invention, a rearview mirror comprises a first substrate having a front surface and a rear surface, a reflective coating disposed on a surface of the first substrate, and an electronic circuit component secured to the rear surface of the first substrate. The mirror element may be an electrochromic mirror element comprising a transparent second substrate positioned in front of the first substrate. The electronic component secured to the rear surface may be a component of a drive circuit for the electrochromic mirror element. The rearview mirror element may further comprise electrically conductive tracings provided on the rear surface of the first substrate electrically coupled to the electrical component. The tracings may be used to electrically couple the drive circuit to the electrodes of the electrochromic mirror element. The tracings may be deposited on the rear surface using numerous methods including inkjet printing techniques.

A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.

In a module with a built-in semiconductor, higher densification is achieved by disposing inner vias close to a semiconductor device. A module which has a space 107 between a first wiring layer 102a and a built-in semiconductor device 105 is obtained by: mounting the semiconductor device 105 on a first wiring layer 102a of a wiring board 103 without using a sealing resin; stacking on the circuit board an electrically insulating substrate having a through bore (inner via) 104 filled with a conductive paste and an opening for receiving the semiconductor device, and a mold release carrier having a second wiring layer 102b in the stated order; and heating and pressurizing so that the semiconductor device 105 is incorporated in a core layer 101 which is formed by curing the electrically insulating substrate.

Metal nanowires, such as silver nanowires coated on a substrate were fused together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency. Materials formed form the fused metal nanowire networks described herein can have a transparency to visible light of at least about 85% and a sheet resistance of no more than about 100 Ohms / square or a transparency to visible light of at least about 90% and a sheet resistance of no more than about 250 Ohms / square. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. When formed into a film, materials comprising the metal nanowire network demonstrate low sheet resistance while maintaining desirably high levels of optical transparency, making them suitable for transparent electrode formation.

There is provided a lighting device and a method to manufacture such a lighting device. The inventive concept is based on manufacturing a lighting device on an at least partly flexible sheet assembly which is rolled into a tube, such that the light source of the lighting device is arranged within the tube. The flexible sheet assembly is arranged such that the tube provides a light mixing chamber and light exit surface for the lighting device. Thus, the tube shaped lighting device instantly delivers the necessary optical and mechanical properties for easy assembly and the functionality of a light engine.

An optical module. The optical module includes a printed circuit board and an opto-chip. The opto-chip includes a transparent carrier with an optoelectronic device array and an associated integrated circuit array that are flip chip attached to the transparent carrier. The optoelectronic device array and the associated integrated circuit array are interconnected via surface wiring with bond sites. In addition, the associated integrated circuit array extends beyond the transparent carrier to provide direct flip chip attachment of the opto-chip to the printed circuit board.

A first exposure treatment for irradiating a first photosensitive layer formed on one main surface of a transparent support with a first light thereby to expose the first photosensitive layer and a second exposure treatment for irradiating a second photosensitive layer formed on the other main surface of the transparent support with a second light to expose the second photosensitive layer are performed such that the first light incident on the first photosensitive layer does not substantially reach the second photosensitive layer and the second light incident on the second photosensitive layer does not substantially reach the first photosensitive layer.

The invention discloses a graphical flexibility transparent conductive film and a preparation method of the graphical flexible transparent conductive film, comprising a flexible transparent substrate, transparent embossing glue and a conductive material embedded in the transparent embossing glue from bottom to top; a graphical and communicated groove network is formed on the surface of the transparent embossing glue, the sum of the areas outside the groove network accounts for more than 80 percent of total superficial area of the film, and the depth of the groove is less than the thickness ofthe transparent embossing glue; the conductive material is respectively conductive ink and a conductive film before and after sintering, the conductive ink is uniformly filled at the bottom of the groove network and is communicated, and the thickness of the conductive film is less than the depth of the groove, and the film is provided with a conductive network covered by the conductive film and alight-transmitting area outside the groove network. Besides, in the invention, a design scheme of the conductive network is provided, and the preparation is realized based on the technologies such asembossing, conductive ink scraping and the like; the graphical flexibility transparent conductive film and the preparation method of the graphical flexible transparent conductive film have the beneficial effects that the scratching-prevention scraping-resisting characteristics of the film are greatly improved and the electric conductivity of the transparent conductive film is improved to the maximum extent.

A conductive sheet includes: a substrate having a first main surface and a second main surface; and a first electrode pattern placed on the first main surface of the substrate. The first electrode pattern is made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction. Each first conductive pattern includes, at least, inside thereof, a sub-nonconduction pattern that is electrically separated from the first conductive pattern. An area A of each first conductive pattern and an area B of each sub-nonconduction patterns satisfy a relation of 5%<B / (A+B)<97%. Accordingly, a conductive sheet and a touch panel having a high detection accuracy can be provided.

According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes depositing in a vacuum deposition chamber an electrically conductive material onto the substrate to form a base layer. Then, the method includes selectively applying an electric insulating agent on selective areas of the base layer. Then, areas of the base layer that are not covered with the insulating material are electroplated with a second electrically conductive layer. The electric insulating agent is then removed from the substrate and the base layer is chemically etched thus removing the base layer that was covered with the insulating material and selectively exposing the substrate to create the pattern of conductive objects on the substrate.

Polymer binders, e.g., crosslinked polymer binders, have been found to be an effective film component in creating high quality transparent electrically conductive coatings or films comprising metal nanostructured networks. The metal nanowire films can be effectively patterned and the patterning can be performed with a high degree of optical similarity between the distinct patterned regions. Metal nanostructured networks are formed through the fusing of the metal nanowires to form conductive networks. Methods for patterning include, for example, using crosslinking radiation to pattern crosslinking of the polymer binder. The application of a fusing solution to the patterned film can result in low resistance areas and electrically resistive areas. After fusing the network can provide desirable low sheet resistances while maintaining good optical transparency and low haze. A polymer overcoat can further stabilize conductive films and provide desirable optical effects. The patterned films can be useful in devices, such as touch sensors.

The formation of metal traces in the border areas of a touch sensor panel to provide improved reliability, better noise rejection, and lower manufacturing costs is disclosed. The metal traces can be coupled to rows on the touch sensor panel in an interleaved manner, so that any two successive rows can be coupled to metal traces in border areas on opposite sides of the touch sensor panel. In addition, by utilizing the full width available in the border areas in some embodiments, the metal traces can be formed from higher resistivity metal, which can reduce manufacturing costs and improve trace reliability. The wider traces can also provide better noise immunity from noise sources such as an LCD by providing a larger fixed-potential surface area and by more effectively coupling the drive lines to the fixed potential.

A light-emitting diode (LED) lighting apparatus includes a transparent flexible tape with a first transparent pattern and a second transparent pattern, the first transparent pattern being insulated from the second transparent pattern. A plurality of light-emitting diodes is electrically connected with the first transparent pattern. The LED lighting apparatus can also form the first transparent pattern and the second transparent pattern on two sides of the transparent flexible tape, or, furthermore, to form the first transparent pattern and the second transparent pattern stack to generate a multi-story LED lighting apparatus. Such a plane of emitting diode is applied to various display, furniture decoration and lighting.

A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process.

An LED backlight module. The LED backlight module comprises a printed circuit board, a plurality of LEDs, and a light transmissive material. The LEDs are disposed on the printed circuit board. The light transmissive material is coated on the printed circuit board. Particularly, the LEDs are embedded in the light transmissive material and arranged in a matrix.

A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, the composite material having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 μm. A fiber-reinforced composite material composed of a matrix material and a fiber aggregate impregnated therewith is provided, in which when a segment length of a bright region corresponding to a pore region of the fiber aggregate is represented by L, which is obtained by statistical analysis of a unidirectional run-length image formed from a binary image obtained by binarization of a scanning electron microscopic image of the fiber aggregate, the total length of segments that satisfy L≧4.5 μm is 30% or less of the total analyzed length. A transparent multilayered sheet, a circuit board, and an optical waveguide are provided which use a transparent substrate formed from this fiber-reinforced composite material.

The present invention provides a transparent conductive film including metal oxide microparticles having a mean particle diameter of 2 nm to 1,000 nm and silver nanowires having a minor axis diameter of 2 nm to 100 nm and an aspect ratio of 10 to 200.

An electromodulating display comprises (1) a nonconductive polymeric unitary substrate containing a plurality of patterned grooves containing an electrically-conductive material so as to form an electrical network having a switchable electric field orientation; (2) a switch for switching the electric field orientation; and (3) a medium that is optically shifted in response to the switching of the electric field orientation.

A rearview assembly comprising a rearview element, a rearview element support assembly supporting the rearview element and a mount adjacent the housing. The mount is configured to connect the rearview assembly to a windshield. At least one of the rearview element support assembly and the mount comprises a crush bracket having at least two legs adapted to be compressed as a force strikes a front of the rearview element. The crush bracket can include at least one tab contacting a heat emitting component and / or an electrically conductive component of a circuit to provide a heat sink for the heat emitting component or a ground for the electrically conductive component, respectively.

The present invention relates to a novel printable paste composition and its use in etching conductive films formed by a plurality of interconnecting silver nano-wires. After etching, the conductive film has a pattern of conductive and non-conductive areas with low visibility. The etched films are suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.

Disclosed herein is a structure of an FPC integrated touch panel. According to preferred embodiments of the present invention, a transparent substrate configured of a flexible transparent film is provided and an extension part protruded to the transparent substrate is integrally formed with the transparent substrate, such that a separate FPC needs not to be manufactured, thereby saving process time and manufacturing costs. In addition, the exemplary embodiments of the present invention bend an inactive area unnecessarily occupying an area of the transparent substrate to a side of the touch panel, thereby implementing a touch panel widening a substantial area of an active region.

A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.