12results about "Transparent dielectrics" patented technology

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

The present invention provides a light-transmitting conductive film suitable for reducing resistance and suppressing yellowing, a transparent conductive film equipped with the light-transmitting conductive film, and an article with the transparent conductive film. [Solution] The light-transmitting conductive film 20 contains an indium-containing conductive oxide and includes a first region 21 in at least a portion of its thickness that contains krypton in a content ratio of less than 0.1 atomic percent. The light-transmitting conductive film 20 also contains an indium-containing conductive oxide and includes a second region 22 in at least a portion of its thickness that does not contain krypton.

A sensor comprising: a printed circuit board; a photosensor mounted on a first side of the printed circuit board; and a light source mounted on a second, opposite side; wherein the light source is arranged to transmit light through at least a portion of the printed circuit board, which is impermeable to air. Positioning of the light source on the opposite side of the printed circuit board from the photosensor means that the bulk of the printed circuit board lies between the light source and the photosensor, obstructing direct transmission of light from the light source to the photosensor. However, light can be transmitted through the printed circuit board itself without drilling a hole through the printed circuit board. In this way, the light source can be mounted on the opposite side of the printed circuit board from the photosensor while still transmitting light to the photosensor.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

To provide a technique advantageous in increasing the temperature of a bonding member effectively.SOLUTION: A manufacturing method for an electronic apparatus includes: a step of preparing a first structure in which a first electrode is disposed on a first main surface of a first substrate; a step of preparing a second structure in which a second electrode is disposed on a first main surface of a second substrate; and a curing step of making the first main surface of the first substrate and the first main surface of the second substrate face each other through a bonding member and curing the bonding member with force applied to the first structure and the second structure so that the bonding member is pressed. At least one of the first electrode and the second electrode has a window part. In the curing step, the bonding member is cured by irradiating the bonding member with light through the window part.SELECTED DRAWING: Figure 4

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

To provide a wiring board and a method for manufacturing the wiring board that suppresses the difficulty of current flow in a mesh wiring layer.SOLUTION: A wiring board (10) has a substrate (11) and a mesh wiring layer (20) that is disposed on the substrate (11) and includes a plurality of wires (21, 22). The substrate (11) has a transmittance of 85% or more for light rays of wavelengths from 400 nm to 700 nm. The wiring (21, 22) includes a surface roughness Ra, and the surface roughness Ra is equal to or less than 100 nm.SELECTED DRAWING: Figure 2

A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.

A flexible foil printed circuit board substrate is provided. The flexible foil printed circuit board substrate includes at least first and second lands and a flex foil area between pairs of the at least first and second lands. Each of the first and second lands can receive a placement of one or more surface mounting technology components. The flex foil area can include at least two layers including conductive portions connecting the at least first and second lands. The flex foil area can include one or more curved shapes. Outermost ends of the flex foil area can be integrated into the at least first and second lands.

Disclosed are a method of manufacturing a cover window for a display device and a method of manufacturing a flexible display device, the method of manufacturing a cover window for a display device including: providing a glass substrate having a bendable region and a flat region; modifying the bendable region by irradiating the glass substrate with a beam; and etching the bendable region to have a thickness thinner than the flat region. Due to the modification of the bendable region, the bendable region can have a faster etching rate than the flat region.

To provide a transparent conductive substrate and a double-side photolithographic method using the same.SOLUTION: The present invention provides a transparent conductive substrate, sequentially including a first resist layer, a first transparent conductive layer, a transparent core, a second transparent conductive layer and a second resist layer; where the first resist layer comprises a UV-light sensitive composition (C1); and the second resist layer comprises a visible-light sensitive composition (C2). The present invention provides a double-side photolithographic method for manufacturing transparent conductive laminates. The transparent conductive laminates manufactured by the method may be incorporated into touch panels.SELECTED DRAWING: Figure 1