75results about "Transparent dielectrics" patented technology

The present invention provides a wiring board, module, and image display device that suppress the generation of moiré patterns and flicker caused by reflected light. [Solution] The wiring board comprises a substrate and a mesh wiring layer 20, and has an electromagnetic wave transmission and reception function. The substrate is transparent. The mesh wiring layer is configured as an antenna and has wiring 21, 22. Two or more openings 23 are formed by being surrounded by the wiring, and the planar shape of the openings is a polygon with opposing sides parallel, and when the distance between sides extending in the first direction (Y direction) in each opening is d, and the average value of the distance between sides extending in the first direction in 100 consecutively adjacent openings or all openings is D, then 95% or more of the 100 openings or all openings are 0.70D ≤ d ≤ 0.98D Does it satisfy the following relationship? 1.02D ≤ d ≤ 1.30D This relationship is satisfied.

This wiring substrate comprises a substrate and a mesh wiring layer. The wiring substrate has an electromagnetic wave transmission / reception function. The substrate has transparency. The mesh wiring layer is configured as an antenna, and has wires. Two or more openings are formed by being surrounded by the wires. The planar shape of each of the openings is a polygon in which opposing sides are paralleled to each other. The distances between the sides extending in a first direction in the respective openings are each denoted as d. The average value of the distances between the sides extending in the first direction in 100 sequentially adjacent openings or all of the openings is denoted as D. In this case, at least 95% of openings, of the 100 openings or all of the openings, satisfy the relationship of 0.70D≤d≤0.98D or the relationship of 1.02D≤d≤1.30D.

The invention describes a connection carrier (1) having a main body (2) with a metallization (3), wherein a solder resist layer (4) is applied to the metallization (3) at least at points, and the solder resist layer (4) has a thickness of at most 5 micrometres. The invention also describes a method for producing a soldered joint (12), and a component, in particular having a micro-LED.

The present invention provides a light-transmitting conductive film suitable for reducing resistance and suppressing yellowing, a transparent conductive film equipped with the light-transmitting conductive film, and an article with the transparent conductive film. [Solution] The light-transmitting conductive film 20 contains an indium-containing conductive oxide and includes a first region 21 in at least a portion of its thickness that contains krypton in a content ratio of less than 0.1 atomic percent. The light-transmitting conductive film 20 also contains an indium-containing conductive oxide and includes a second region 22 in at least a portion of its thickness that does not contain krypton.

A sensor comprising: a printed circuit board; a photosensor mounted on a first side of the printed circuit board; and a light source mounted on a second, opposite side; wherein the light source is arranged to transmit light through at least a portion of the printed circuit board, which is impermeable to air. Positioning of the light source on the opposite side of the printed circuit board from the photosensor means that the bulk of the printed circuit board lies between the light source and the photosensor, obstructing direct transmission of light from the light source to the photosensor. However, light can be transmitted through the printed circuit board itself without drilling a hole through the printed circuit board. In this way, the light source can be mounted on the opposite side of the printed circuit board from the photosensor while still transmitting light to the photosensor.

An embodiment of the present disclosure relates to a thermoformed structural electronic module 1 with an integrated electronic device 10 and a method for making the same. The module can be made by a method including providing a thermoformed stack including a thermoplastic carrier substrate 3 and an electronic device 10 with wiring and a buffer layer therebetween, and thermoforming (103) the stack at a plasticizing condition of the carrier substrate 3 and the buffer layer 2, the thermomechanical buffer layer 2 comprising a thermoplastic composition having a storage modulus within the range of 0.005%-25%, preferably 0.01-10%, most preferably 0.02-2.5% of the storage modulus of the thermoplastic carrier substrate 3 during thermoforming.

A functional multi-layer structure (100) comprising a substrate film (102) shaped or shapable to exhibit a selected shape (103) and a plurality of functional elements (110, 112, 114, 210), preferably including optical elements, mechanical elements, opto-electrical elements, electrical elements and / or in particular electronic elements, such as conductors (112), insulators (114), components (110, 210) and / or integrated circuits (110, 210), disposed on the substrate film in a certain proximity of the shape (103); wherein the substrate film (102) is further provided with structure adjustment elements (116, 316, 416, 616, 716, 816, 916, 1016), optionally including elongated shapes (316, 416), circumferential shapes (616, 716) or other selected shapes, configured to locally control induced deformations of the substrate film within the proximity of the shape, optionally including stretching, bending, compression and / or shearing. Related manufacturing methods are presented.

In one aspect, the present disclosure relates to an electronic device comprising: a plurality of electronic chip components; a plurality of liquid metal (LM) electrical interconnects coupled to the plurality of electronic chips; and a polyimine film encapsulating the plurality of electronic chip components and the plurality of LM electrical interconnects. In some embodiments, the polyimine film comprises the product of the polymerization reaction between terephthaldehyde, 3,3diamino-N-methyldipropylamine, and tris(2-aminoethyl)amine. In another aspect, the present disclosure relates to a method for manufacturing an electronic device, the method comprising: disposing a volume of LM on a polyimine substrate to form a plurality of electrical interconnects; disposing a plurality of electronic chip components onto the polyimine substrate and in contact with the plurality of electrical interconnects; and applying a layer of polyimine onto the polyimine substrate, the plurality of electrical interconnects, and the plurality of electronic chip components.

A printed circuit board structure (200) according to an embodiment may comprise: a first printed circuit board (210); an interposer (230); a second printed circuit board (220); and a mounting layer (241) having a base hole connected to the second printed circuit board; a support layer (242) provided on an opposite side of the mounting layer with respect to the second printed circuit board; and a visible layer (243) connected to the support layer and having a material having transparency.

The invention relates to an LED lighting module comprising a planar carrier equipped with several LEDs, wherein the carrier is formed from a metal sheet which has an electrically insulating coating on at least one surface side, and the several LEDs are arranged directly on the coating and electrically contacted.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

A conductive film includes a substrate, a resin layer provided on a main surface of the substrate, and a conductive part with which a groove pattern formed in at least the resin layer is filled. The resin layer is obtained using a resin composition containing a release agent containing silicon, and a resin, the resin layer includes a surface-segregated release agent layer and a main body portion provided on the substrate side of the surface-segregated release agent layer, the surface-segregated release agent layer has a first surface opposite to the main body portion, and the main body portion has a second surface on the substrate side. The thickness of the resin layer is 5100 nm or less, and in a case where the resin layer is subjected to time-of-flight secondary ion mass spectrometry in the thickness direction of the resin layer, a ratio R defined by the following Formula (1) using an intensity A1 of silicon-containing secondary ions derived from the release agent in the first surface of the main body portion and an intensity A2 of silicon-containing secondary ions derived from the release agent in the second surface of the surface-segregated release agent layer is 25% or less. RatioR=100×A2 / A1

A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.

A method for manufacturing an electronics assembly (100) comprising obtaining or creating (210) an electronics module (10) comprising a first circuit (12) on a first surface on a first side of a circuit board (11), at least one electronic component (12) on the circuit board (11) electrically connected to the first circuit (13), and at least one first connection portion (14) on the first surface and / or an adjacent side surface at the periphery of the circuit board (11), the at least one first connection portion (14) being electrically connected to or included within the first circuit (12). The method also includes disposing (220) the electronics module (10) on a second substrate (21), preferably a thermoformable film or sheet made of a plastic material, the second substrate (21) having a second connection portion (22) connected to a second circuit (23) on a surface of the second substrate (21), the second surface of the circuit board (11) being on a second side opposite the first surface and facing the second substrate (21); and disposing (230) a conductive adhesive (16) on and extending between the first connection portion (14) and the second connection portion (22) to electrically connect the electronics module (10) to the second circuit (23) via the conductive adhesive (16).

A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.

A wireless communication system includes a plurality of antennas, and a plurality of RF chips, arranged in a row and coupled to the antennas, for providing a plurality radio-frequency (RF) output signals to the antennas according to an RF signal. The wireless communication system also includes a transmission line arranged to be a straight line in parallel to the row, and to connect to the RF chips, and a resistive load, coupled to a first end of the transmission line. A second end of the transmission line is arranged to receive the RF signal.

An integrated functional multi-layer structure (100, 300, 500, 600, 700, 800, 900, 1000, 1100, 1300, 1400, 1500) comprising a flexible, preferably 3D formable, thermoplastic substrate film (102), and a lighting module (110, 400) disposed on the substrate film (102) and preferably electrically connected to a circuit design thereon, said lighting module (110, 400) comprising: a circuit board (112) for receiving electronics; and a circuit (114) disposed on the circuit board, the circuit (114) including at least one light source, and optionally including at least one LED. and a thermoplastic layer (108) comprising: a thermoplastic layer (108) at least laterally surrounding, and optionally also at least partially covering, a lighting module (110, 400), wherein a circuit (114) on a circuit board (112) of the lighting module (110, 400) including at least one light source is configured to be electrically and thermally connected by means of at least one connecting material (116A, 116B) disposed at some points to the remaining structure at the side or below the circuit board, between them, preferably disposed at least around the periphery of the circuit board (112). Related manufacturing methods are presented.

In a method for forming a conductive thin wire on a base material by an inkjet method using a conductive ink containing at least a main solvent having a boiling point equal to or lower than the boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material, the base material has surface energy of less than 40 mN / m, and conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2<θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2.

A display device includes a flexible display panel, and a roller disposed on a side of the flexible display panel to wind the flexible display panel, wherein the flexible display panel includes a first base including a first base substrate having a display area and a non-display area adjacent to each other, and a light emitting element layer including a light emitting element disposed on the display area, a second base including a second base substrate opposite to the first base substrate, and a color conversion layer disposed on the second base substrate and corresponding to each light emitting element, and an adhesive filling layer disposed in the display area to form a cell gap between the first base and the second base, and disposed in the non-display area to be in contact with the first base substrate and the second base substrate to couple and seal the first base substrate and the second base substrate.

A flexible wiring board includes an insulating layer having a support surface extending in a first direction; a first sheet adhesive terminal positioned on the support surface; and a second sheet adhesive terminal positioned on the support surface. The shape of the first sheet adhesive terminal and the shape of the second sheet adhesive terminal are point-symmetric about a point on a straight fold line on which straight guide lines extending in the first direction lie.

To provide a lighting module that applies light emitted from a plurality of light emitting devices as a line-shaped light source or a surface light source.SOLUTION: A lighting module 200 comprises: a substrate 210; a plurality of light emitting devices 105 disposed on the substrate; a first reflective layer 230 disposed on the substrate; a resin layer 220 disposed on the first reflective layer and the light emitting devices; and a second reflective layer 240 disposed on the resin layer. The resin layer comprises: a front surface S1 on which light generated from the plurality of light emitting devices is emitted; a rear surface S2 facing the front surface; and a first side surface S3 and a second side surface S4 that are opposite to each other and connect the front surface and the rear surface with each other. A distance between the first reflective layer and the second reflective layer is smaller than a distance between the front surface and the rear surface of the resin layer, and the front surface of the resin layer has a plurality of convex portions P0 convex toward the front surface from the light emitting devices and a plurality of concave portions C1, C2 recessed toward the rear surface between the plurality of convex portions.SELECTED DRAWING: Figure 1

To provide a wiring board and a manufacturing method thereof that suppress disconnection of wiring in a wiring pattern area near a power supply portion.SOLUTION: A wiring board 10 includes a transparent substrate 11, a wiring pattern region 20 disposed on the substrate 11 and including a plurality of first directional wires 21, and a power supply portion electrically connected to the plurality of first directional wires 21 in the wiring pattern region 20. The first directional wire 21 has a first region located near the power supply portion and a second region other than the first region. The line width W3 of the first directional wires 21 in the first region is larger than the line width W1 of the first directional wires 21 in the second region.SELECTED DRAWING: Figure 3

An apparatus comprising an interposer to couple conductive contacts of a substrate to conductive contacts of an integrated circuit device, wherein the interposer comprises a cavity proximate conductive contacts of the interposer, the conductive contacts of the interposer to couple to conductive contacts of a photonics integrated circuit (PIC).

To provide a technique advantageous in increasing the temperature of a bonding member effectively.SOLUTION: A manufacturing method for an electronic apparatus includes: a step of preparing a first structure in which a first electrode is disposed on a first main surface of a first substrate; a step of preparing a second structure in which a second electrode is disposed on a first main surface of a second substrate; and a curing step of making the first main surface of the first substrate and the first main surface of the second substrate face each other through a bonding member and curing the bonding member with force applied to the first structure and the second structure so that the bonding member is pressed. At least one of the first electrode and the second electrode has a window part. In the curing step, the bonding member is cured by irradiating the bonding member with light through the window part.SELECTED DRAWING: Figure 4

An integrated-circuit package includes a flexible electrical-connection element sandwiched between a first face of a first multilayer support substrate and a second face of a second multilayer support substrate. The flexible electrical-connection element laterally projects with respect to, and is in electrical contact with at least one of, the multilayer support substrates. The flexible electrical-connection element and the first multilayer support substrate include, at a first region, respectively two first mutually facing orifices defining together a first cavity. The first cavity is at least partially closed off by a first part of the second face of the second multilayer support substrate. A first component is located in the first cavity, attached at the first part of the second face of the second multilayer support substrate and in electrical contact with the flexible electrical-connection element through the second multilayer support substrate.

The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment / detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading / unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment / detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.

A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Fe+3 ions, wherein the structure comprises the metal layer comprising copper, nickel, aluminum or alloys thereof covering at least partially a transparent conductive film with conductive elements comprising silver, to expose a portion of the transparent conductive film. Etching solutions and the etched structures are also described.