140results about "Dielectric materials" patented technology

To provide a solid composition which achieves both a low dielectric constant and a low coefficient of linear expansion.SOLUTION: A solid composition contains a fluorine resin, and a fibrous anisotropic filler, where a reduction rate of a coefficient of linear expansion at 20°C to 200°C of the solid composition to a coefficient of linear expansion at 20°C to 200°C of the fluorine resin is 50% or more.SELECTED DRAWING: None

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

A polymer composition including particles having a ratio of an average particle diameter D90 to an average particle diameter D50 of 2.3 or less, and a polymer having a dielectric loss tangent of 0.01 or less, and applications thereof.

There is described a product (100), in particular a component carrier, comprising: i) an electrically insulating layer structure (102); ii) an electrically conductive layer structure (104); and iii) at least one glass barrier layer (150), at least partially sandwiched between the electrically insulating layer structure (102) and the electrically conductive layer structure (104). The at least one glass barrier layer (150) comprises two main surfaces (150a, 150b), wherein the two main surfaces (150a, 150b) comprise a different adhesion property. Further, a manufacture method is described.

In one aspect, the present disclosure relates to an electronic device comprising: a plurality of electronic chip components; a plurality of liquid metal (LM) electrical interconnects coupled to the plurality of electronic chips; and a polyimine film encapsulating the plurality of electronic chip components and the plurality of LM electrical interconnects. In some embodiments, the polyimine film comprises the product of the polymerization reaction between terephthaldehyde, 3,3diamino-N-methyldipropylamine, and tris(2-aminoethyl)amine. In another aspect, the present disclosure relates to a method for manufacturing an electronic device, the method comprising: disposing a volume of LM on a polyimine substrate to form a plurality of electrical interconnects; disposing a plurality of electronic chip components onto the polyimine substrate and in contact with the plurality of electrical interconnects; and applying a layer of polyimine onto the polyimine substrate, the plurality of electrical interconnects, and the plurality of electronic chip components.

A printed wiring board substrate according to one embodiment is provided with: a base material layer; and a copper foil which is laminated, directly or indirectly, over at least some part of one or both surfaces of the base material layer. The base material layer includes a matrix consisting mainly of a fluororesin and one or a plurality of reinforcing material layers included in the matrix. When the average thickness of the base material layer is represented by A, and the average distance between the copper foil surface facing the matrix, and the reinforcing material layer surface closest to said surface and facing the copper foil is represented by B, the ratio B / A is 0.003 to 0.37.

A substrate structure including a dielectric substrate, an adhesion promotion layer (APL), a conductive material, at least one dielectric layer and at least one pad. The dielectric substrate has an upper surface and a lower surface opposite to each other, and at least one through-hole passing through the dielectric substrate and connected to the upper surface and the lower surface. The APL is disposed on the upper surface, on the lower surface, and on an inner wall of the through-hole of the dielectric substrate. The conductive material fills the through-hole to define at least one conductive through-hole. The dielectric layer is disposed on the APL and has at least one opening exposing the conductive through-hole. A diameter of the opening is greater than a diameter of the conductive through-hole. The pad is disposed in the opening, extends onto the dielectric layer, and electrically connected to the conductive through-hole.

To provide a resin composition which can suppress warping of a cured product and has excellent adhesion to a load in the vertical direction of a cured product film after environmental testing. The solution is a resin composition containing (A) an epoxy resin, (B) a (meth)acrylic polymer which is in a liquid state at 25°C, (C) a curing agent, and (D) an inorganic filler, wherein the (A) component contains (A-1) a glycidyl amine type epoxy resin.

Provided is a method for producing a copper-clad laminate in which a copper foil and a resin are joined with high heat-resistant adhesion even if a fluororesin belonging to a low dielectric constant thermoplastic resin is used. The method includes a step of preparing a surface-treated copper foil having a copper foil and a zinc-containing layer provided on at least one side of the copper foil, and a step of obtaining a copper-clad laminate by attaching a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil, thereby obtaining a copper-clad laminate. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200°C or higher. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), the content of Zn is 10% by weight or less, and the weight ratio of the content ratio of Zn to the content of the transition element M, i.e., Zn / M, is 0.2 or more and 0.6 or less.

Disclosed are a copper-clad laminate having a low dielectric constant, low dielectric loss, and high thermal conductivity properties, and a method for manufacturing the same, wherein an insulator substrate having a low dielectric constant, low dielectric loss and high thermal conductivity values is laminated onto a copper-foil layer and a portion of the copper-foil layer is patterned using selective etching such that a circuit pattern having a line width of 40 μm or smaller is designed, such that the copper-clad laminate is used as a digital substrate.

A printed circuit board comprises: a base material with a first main surface and a second main surface opposite the first main surface; and a first dielectric layer with a first adhesive layer placed on the first main surface and a first fluorinated resin layer placed on the first adhesive layer.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The purpose of the present invention is to reduce AC resistance. In a multilayer substrate (100), a plurality of ground electrodes (41-44) are separated from each other in the thickness direction (D1) of a laminated substrate (1), and are adjacent to a plurality of signal lines (21-24) in the width direction of the plurality of signal lines (21-24). In a first transmission line region where the maximum line width of the plurality of signal lines (21-24) is minimum, the plurality of signal lines (21-24) do not overlap with any one of the plurality of ground electrodes (41-44) in the thickness direction (D1) of the laminated substrate (1). In a second transmission line region (102) in which the maximum line width of the plurality of signal lines (21-24) is the largest, one ground electrode (41) among the plurality of ground electrodes (41-44) overlaps with signal lines (22-24) other than the signal line (21) adjacent to the one ground electrode (41) among the plurality of signal lines (21-24).

The invention provides a wiring substrate and a method for manufacturing the same, which are a technique for suppressing the generation of voids between wirings. A wiring board according to an embodiment includes: a conductive layer including a parallel wiring portion in which a plurality of wires are arranged in parallel; and an insulating layer laminated on the conductive layer and containing a resin and an inorganic filler, in which a plurality of wirings of the parallel wiring portion are covered with an adhesive film, the insulating layer having a single layer including: a first structure portion filled between the wirings of the parallel wiring portion; and a second structural part located above the parallel wiring part, the second structural part having a higher content of the inorganic filler than the first structural part.

A dielectric that has excellent electrical characteristics and causes no blistering of a copper foil during production of a copper-clad laminate using the dielectric, and a method for producing the same are provided. Further, a copper-clad laminate using the dielectric, and a method for producing the same are provided. The dielectric has a residual organic matter content of 500 μg / g or less. The metal-clad laminate has the dielectric and a metal foil.

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

A printed circuit board includes a bendable portion. The bendable portion is bendable in a bending direction in plan view and has a first dielectric layer, a signal pattern, a second dielectric layer, a cloth, and a ground pattern. The first dielectric layer has a first main surface. The signal pattern is arranged on the first main surface. The second dielectric layer has a second main surface and a third main surface opposite to the second main surface, and the second main surface is arranged to face the first main surface. The cloth includes a plurality of first reinforced fibers extending in a first direction in plan view and a plurality of second reinforced fibers extending in a second direction inclined with respect to the first direction in plan view, the plurality of first reinforced fibers and the plurality of second reinforced fibers being knitted together in a cloth form.

A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 µm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

Provided is a laminate having excellent adhesion between a copper-containing substrate and a perfluoropolymer film. Also provided is a method for forming a laminate having excellent adhesiveness as described above. The laminate is characterized in that the laminate comprises a copper-containing base material and a coating film containing a perfluoropolymer, the adhesion strength between the base material and the coating film is 0.2 N / mm or more, and the surface roughness of the coating film is less than 15 [mu] m.

A dielectric that reduces frequency dependency of a dielectric constant in terahertz high-frequency bands (110 to 330 GHz) of the dielectric constant and a method for producing the same, are provided. The dielectric having a slope of a dielectric constant (Dk) with respect to frequencies from 220 GHz to 330 GHz of 0.00001 or more and 0.0005 or less, as measured with a Fabry-Perot resonator J-band.

A dielectric that has excellent electrical characteristics and causes no blistering of a copper foil during production of a copper-clad laminate using the dielectric, and a method for producing the same are provided. Further, a copper-clad laminate using the dielectric, and a method for producing the same are provided. A dielectric has a moisture content of 1000 µg / g or less. The metal-clad laminate has the dielectric and a metal foil.

A fluororesin sheet according to the present invention includes a fluoropolymer and an inorganic filler. The fluoropolymer is oriented in a surface direction of the fluororesin sheet. The inorganic filler is a surface-treated degreased sheet. A metal-clad laminate according to the present invention includes the above fluororesin sheet with a metal foil attached to at least one surface of the fluororesin sheet. A method according to the present invention includes a step of mixing an aqueous dispersion of a fluoropolymer and a pre-surface-treated inorganic filler to form a compound, and press-molding the compound to form a sheet, a step of laminating the sheet and press-molding the sheet to form a sheet, a step of rolling and thereafter drying the resulting sheet, and a step of degreasing the resulting sheet at a temperature of 200°C or more and below 300°C for 5 to 24 hours. A fluororesin sheet with good handleability by itself is thereby provided.

A dielectric that has excellent electrical characteristics and causes no blistering of a copper foil during production of a copper-clad laminate using the dielectric, and a method for producing the same are provided. Further, a copper-clad laminate using the dielectric, and a method for producing the same are provided. The dielectric has a residual organic matter content of 500 µg / g or less. The metal-clad laminate has the dielectric and a metal foil.

Provided is a resin composition capable of producing a molded article with excellent impact strength. The resin composition contains an amorphous resin (A) belonging to super engineering plastics and a fluorine-containing copolymer (B), the amorphous resin (A) or the fluorine-containing copolymer (B) having an average dispersed particle size r1 and an average dispersed particle size r2 that is determined after measuring a melt flow rate in conformity with ASTM D1238 after preheating for five minutes and under a load of 5000 g at 380°C or at a temperature at which the resin composition melts or higher, the r1 and the r2 satisfying a ratio r2 / r1 of lower than 1.70, where the r1 and the r2 are obtained by measuring the same resin or the same copolymer.

This application provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This application further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this application helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

Disclosed is a substrate comprising a ceramic main body (1) and an organic surface structure (2) on at least one outer face of the ceramic main body (1), outer redistribution layers (3) being integrated into the organic surface structure.

A resin laminated board includes resin layers laminated on one another and conductors located outside and inside the laminated resin layers. The resin layers include a first resin layer, a second resin layer, and a third resin layer sequentially laminated on one another. The conductors include first conductor layers, second conductor layers, and interlayer connection conductors. The first conductor layers are located at a lower main surface of the first resin layer. The second conductor layers or the interlayer connection conductors that overlap a portion of the first resin layer when viewed in a thickness direction of the third resin layer are located at the third resin layer. The second resin layer is a thermoplastic resin, and a melting point of the second resin layer is lower than a melting point of the first resin layer. At least the second resin layer includes air bubbles.

The present invention provides a non-woven fabric prepreg, a metal-foil-clad plate and a printed circuit board. The non-woven fabric prepreg comprises a fluorine-containing resin binder non-woven fabric and a fluorine-containing resin composition, wherein the fluorine-containing resin binder non-woven fabric comprises a binder and inorganic fibers, and the binder is a fluorine-containing resin emulsion; and the fluorine-containing resin composition comprises, in parts by weight, 30-100 parts of a fluorine-containing resin emulsion, and 0-70 parts of an inorganic filler. The non-woven fabric prepreg and a copper-clad plate containing the non-woven fabric prepreg of the present invention have good dielectric properties and a low thermal expansion coefficient, such that the copper-clad plate can meet the performance requirements of the high-frequency communication field on a copper-clad plate material.

The invention discloses a manufacturing method and structure of a coupling mechanism based on a PCB polar plate. According to the invention, high-voltage insulation protection can be realized by using the epoxy glass fiber board and the solder resist insulation coating of the PCB, the surface of the PCB is coated with the high-dielectric-constant film, and the output power and efficiency of the system are improved by improving the dielectric constant and the equivalent capacitance of the coupling mechanism. The structure comprises two PCB polar plates which are symmetrically arranged in parallel, wherein each PCB polar plate is provided with a first solder mask layer (1), a copper laying layer (2), an epoxy glass fiber base material layer (3) and a second solder mask layer (4) which are sequentially stacked from outside to inside; and the outer surfaces of the second solder mask layers of the two PCB bipolar plates are coated with high dielectric constant films (5). Wherein the lead (6) is located at the central position of the PCB. The method provides an important thought for the research of electric field coupling type wireless power transmission, and has a good engineering application value.