290results about "Dielectric materials" patented technology

The invention relates to the technical field of circuit boards, in particular to a production method of a circuit board, which comprises the following steps of: sequentially arranging an improved layer and a copper foil layer on the surface of a copper substrate, and then carrying out hot pressing treatment on the substrate coated with the improved layer and the copper foil layer at the hot pressing temperature of 180 DEG C for 2 hours. In the production of the circuit board, the surface of the copper substrate is matched with the improved layer and the copper foil layer, and the improved layer is formed by coating an improved material obtained by blending epoxy resin, a modified filler, a nano titanium dioxide regulator and a curing agent on the surface of the copper substrate, so that the thermal conductivity, dielectric loss and wear resistance of a product are enhanced; the performance of the product is improved in a balanced and coordinated manner, and the performance stability effect of the product is remarkable under high-heat and high-humidity conditions.

To provide a solid composition which achieves both a low dielectric constant and a low coefficient of linear expansion.SOLUTION: A solid composition contains a fluorine resin, and a fibrous anisotropic filler, where a reduction rate of a coefficient of linear expansion at 20°C to 200°C of the solid composition to a coefficient of linear expansion at 20°C to 200°C of the fluorine resin is 50% or more.SELECTED DRAWING: None

Provided is a coating composition capable of forming a coating film layer, which has low coefficient of linear expansion at low dielectricity, excellent adhesive properties even when the surface of a counterpart material is smooth, and few coating film defects such as cracks and holes. A coating composition including 2 or more kinds of fluororesin emulsions, wherein at least 1 kind of the fluororesin, a fluororesin (I), has a number of functional groups of 30 to 1,000 per 106 main-chain carbon atoms, and the coating composition further includes an anisotropic filler, a surfactant, and a liquid medium.

Provided are: a fluororesin sheet having both a low linear expansion coefficient (CTE) and improved adhesion to a copper foil having a smooth surface; and a copper-clad laminate using the fluororesin sheet. A fluororesin sheet containing a fluororesin and silica particles, the fluororesin sheet having an oxygen element ratio of 3.0 at% or more and a linear expansion coefficient (CTE) of 100 ppm / DEG C or less when measured by X-ray photoelectron spectroscopy (XPS) on one or both surfaces thereof.

To provide a dielectric that exhibits superior electrical properties and does not cause the blistering of copper foil during the production of a copper-clad laminate using the dielectric, and a production method therefor, and also provide a copper-clad laminate using the dielectric and a production method therefor.SOLUTION: A dielectric has a moisture content of 1000 μg / g or less. A metal-clad laminate includes the dielectric and a metal foil.SELECTED DRAWING: None

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

A board main body includes first and second resin layers contacting each other and including thermoplastic resin, a first signal conductor layer on an upper main surface of the second resin layer, an overlapping region in which the first and second resin layers are present when viewed in an up-down direction, and a non-overlapping region in which the first resin layer is not present and the second resin layer is present when viewed in the up-down direction. The first signal conductor layer includes a first curved portion in which the first signal conductor layer is curved in the up-down direction such that the first signal conductor layer in the first non-overlapping region is above the first signal conductor layer in the overlapping region. The first signal conductor layer is electrically connectable to an element on the board main body in the first non-overlapping region.

A polymer composition including particles having a ratio of an average particle diameter D90 to an average particle diameter D50 of 2.3 or less, and a polymer having a dielectric loss tangent of 0.01 or less, and applications thereof.

The present invention relates to a multilayer printed circuit board and a method for manufacturing same. The multilayer printed circuit board comprises: a first circuit board including a first thermoplastic resin layer and a first circuit pattern disposed on at least one surface of the first thermoplastic resin layer; and a second circuit board including a second thermoplastic resin layer disposed on at least one surface of the first circuit board and a second circuit pattern disposed on one surface of the second thermoplastic resin layer. The melt flow rate (MFR) of the second thermoplastic resin layer is larger than the MFR of the first thermoplastic resin layer.

Methods to mask an RF switch prior to a coating process and RF switches that have been masked according to these methods.

There is described a product (100), in particular a component carrier, comprising: i) an electrically insulating layer structure (102); ii) an electrically conductive layer structure (104); and iii) at least one glass barrier layer (150), at least partially sandwiched between the electrically insulating layer structure (102) and the electrically conductive layer structure (104). The at least one glass barrier layer (150) comprises two main surfaces (150a, 150b), wherein the two main surfaces (150a, 150b) comprise a different adhesion property. Further, a manufacture method is described.

In one aspect, the present disclosure relates to an electronic device comprising: a plurality of electronic chip components; a plurality of liquid metal (LM) electrical interconnects coupled to the plurality of electronic chips; and a polyimine film encapsulating the plurality of electronic chip components and the plurality of LM electrical interconnects. In some embodiments, the polyimine film comprises the product of the polymerization reaction between terephthaldehyde, 3,3diamino-N-methyldipropylamine, and tris(2-aminoethyl)amine. In another aspect, the present disclosure relates to a method for manufacturing an electronic device, the method comprising: disposing a volume of LM on a polyimine substrate to form a plurality of electrical interconnects; disposing a plurality of electronic chip components onto the polyimine substrate and in contact with the plurality of electrical interconnects; and applying a layer of polyimine onto the polyimine substrate, the plurality of electrical interconnects, and the plurality of electronic chip components.

A printed wiring board substrate according to one embodiment is provided with: a base material layer; and a copper foil which is laminated, directly or indirectly, over at least some part of one or both surfaces of the base material layer. The base material layer includes a matrix consisting mainly of a fluororesin and one or a plurality of reinforcing material layers included in the matrix. When the average thickness of the base material layer is represented by A, and the average distance between the copper foil surface facing the matrix, and the reinforcing material layer surface closest to said surface and facing the copper foil is represented by B, the ratio B / A is 0.003 to 0.37.

A laminate article includes a dielectric substrate including a perfluorocopolymer matrix comprising a fluorinated perfluorocopolymer and a non-fluorinated perfluorocopolymer; a quartz fabric embedded in the perfluorocopolymer matrix; and an additive material dispersed in the perfluorocopolymer matrix, in which the additive material is capable of absorbing ultraviolet light; and a conductive cladding disposed on a surface of the dielectric substrate.

A substrate structure including a dielectric substrate, an adhesion promotion layer (APL), a conductive material, at least one dielectric layer and at least one pad. The dielectric substrate has an upper surface and a lower surface opposite to each other, and at least one through-hole passing through the dielectric substrate and connected to the upper surface and the lower surface. The APL is disposed on the upper surface, on the lower surface, and on an inner wall of the through-hole of the dielectric substrate. The conductive material fills the through-hole to define at least one conductive through-hole. The dielectric layer is disposed on the APL and has at least one opening exposing the conductive through-hole. A diameter of the opening is greater than a diameter of the conductive through-hole. The pad is disposed in the opening, extends onto the dielectric layer, and electrically connected to the conductive through-hole.

To provide a resin composition which can suppress warping of a cured product and has excellent adhesion to a load in the vertical direction of a cured product film after environmental testing. The solution is a resin composition containing (A) an epoxy resin, (B) a (meth)acrylic polymer which is in a liquid state at 25°C, (C) a curing agent, and (D) an inorganic filler, wherein the (A) component contains (A-1) a glycidyl amine type epoxy resin.

Provided is a method for producing a copper-clad laminate in which a copper foil and a resin are joined with high heat-resistant adhesion even if a fluororesin belonging to a low dielectric constant thermoplastic resin is used. The method includes a step of preparing a surface-treated copper foil having a copper foil and a zinc-containing layer provided on at least one side of the copper foil, and a step of obtaining a copper-clad laminate by attaching a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil, thereby obtaining a copper-clad laminate. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200°C or higher. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), the content of Zn is 10% by weight or less, and the weight ratio of the content ratio of Zn to the content of the transition element M, i.e., Zn / M, is 0.2 or more and 0.6 or less.

To provide a tabular composite material capable of sufficiently exerting an interference effect between antenna elements when used as a substrate of a micro strip patch array antenna.SOLUTION: A composite material is controlled to maintain a standard deviation of density values of plural areas obtained by dividing within a material, below a prescribed level, so that an interference effect between antenna elements can be fully exerted.SELECTED DRAWING: Figure 1

To improve electric characteristics of a dielectric for use for a high frequency band.A dielectric 2 formed by lamination of fluorine resin includes a base main layer 3b containing a base material 3a and made of melting fluorine resin, a pair of base cover layers 3c made of melting fluorine resin and formed on both surfaces of the base main layer 3b, and a pair of functional layers 5 made of fluorine resin mixed with hollow fillers 5a and laminated on the outer surfaces of the base cover layers 3c.

The invention relates to the field of PCB production, and discloses a production method of a thick copper glass substrate PCB, and the method comprises the steps: removing a dry film formed by pasting the dry film for the first time in a second glass substrate, carrying out the titanium layer removal of the area where the dry film is pasted for the first time, and carrying out the first chemical polishing of the second glass substrate, and obtaining a third glass substrate; performing second dry film pasting and second pattern electroplating on a third glass substrate to increase the thickness of the copper layer of the first glass substrate by a third copper thickness to obtain a fourth glass substrate; and removing the dry film formed by pasting the dry film for the second time in the fourth glass substrate, and performing chemical polishing on the fourth glass substrate for the second time to obtain a fifth glass substrate. The production quality of the thick copper circuit pattern can be guaranteed, and the stability of the production quality of the glass substrate PCB with the thick copper layer is improved.

Disclosed are a copper-clad laminate having a low dielectric constant, low dielectric loss, and high thermal conductivity properties, and a method for manufacturing the same, wherein an insulator substrate having a low dielectric constant, low dielectric loss and high thermal conductivity values is laminated onto a copper-foil layer and a portion of the copper-foil layer is patterned using selective etching such that a circuit pattern having a line width of 40 μm or smaller is designed, such that the copper-clad laminate is used as a digital substrate.

A printed circuit board comprises: a base material with a first main surface and a second main surface opposite the first main surface; and a first dielectric layer with a first adhesive layer placed on the first main surface and a first fluorinated resin layer placed on the first adhesive layer.

Described is a product (100), in particular, the product being a component carrier, the product comprising: i) an electrically insulating layer structure (102); ii) an electrically conductive layer structure (104); and iii) at least one glass barrier layer (150) at least partially sandwiched between the electrically insulating layer structure (102) and the electrically conductive layer structure (104). At least one of the glass barrier layers (150) comprises two major surfaces (150a, 150b), where the two major surfaces (150a, 150b) comprise different adhesive properties. Furthermore, a manufacturing method is described.

A printed wiring board includes: a first conductive pattern; a dielectric layer that is disposed to cover the first conductive pattern; a second conductive pattern that is disposed on the dielectric layer; and a plating layer. A thickness of the dielectric layer is 50 μm or more and 500 μm or less. A hole from which the first conductive pattern is exposed is formed in the dielectric layer. An aspect ratio of the hole is 0.5 or more and 2.0 or less. The plating layer is disposed on at least an inner wall surface of the hole and the first conductive pattern exposed from the hole, and electrically connected to the second conductive pattern. A thickness of the plating layer disposed on the first conductive pattern exposed from the hole is greater than a thickness of the second conductive pattern.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A fluororesin sheet according to the present invention is a delipidated sheet containing a fluoropolymer and an inorganic filler. The fluoropolymer is aligned in the surface direction of the fluororesin sheet. The inorganic filler is surface-treated. A metal clad multilayer plate according to the present invention is obtained by affixing a metal foil on at least one surface of the fluororesin sheet. A method according to the present invention comprises: a step in which a surface-treated inorganic filler and an aqueous dispersion of a fluoropolymer are mixed, compounded, and press-molded to obtain a sheet; a step in which the sheets are layered and press-molded to obtain a sheet; a step in which the obtained sheet is rolled and then dried; and a step in which the sheet is delipidated at a temperature not lower than 200°C but lower than 300°C for 5-24 hours. As a result, a fluororesin sheet exhibiting good intrinsic handling properties is provided.

The purpose of the present invention is to reduce AC resistance. In a multilayer substrate (100), a plurality of ground electrodes (41-44) are separated from each other in the thickness direction (D1) of a laminated substrate (1), and are adjacent to a plurality of signal lines (21-24) in the width direction of the plurality of signal lines (21-24). In a first transmission line region where the maximum line width of the plurality of signal lines (21-24) is minimum, the plurality of signal lines (21-24) do not overlap with any one of the plurality of ground electrodes (41-44) in the thickness direction (D1) of the laminated substrate (1). In a second transmission line region (102) in which the maximum line width of the plurality of signal lines (21-24) is the largest, one ground electrode (41) among the plurality of ground electrodes (41-44) overlaps with signal lines (22-24) other than the signal line (21) adjacent to the one ground electrode (41) among the plurality of signal lines (21-24).

The invention provides a wiring substrate and a method for manufacturing the same, which are a technique for suppressing the generation of voids between wirings. A wiring board according to an embodiment includes: a conductive layer including a parallel wiring portion in which a plurality of wires are arranged in parallel; and an insulating layer laminated on the conductive layer and containing a resin and an inorganic filler, in which a plurality of wirings of the parallel wiring portion are covered with an adhesive film, the insulating layer having a single layer including: a first structure portion filled between the wirings of the parallel wiring portion; and a second structural part located above the parallel wiring part, the second structural part having a higher content of the inorganic filler than the first structural part.