78results about "Dielectric materials" patented technology

This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

There is described a product (100), in particular a component carrier, comprising: i) an electrically insulating layer structure (102); ii) an electrically conductive layer structure (104); and iii) at least one glass barrier layer (150), at least partially sandwiched between the electrically insulating layer structure (102) and the electrically conductive layer structure (104). The at least one glass barrier layer (150) comprises two main surfaces (150a, 150b), wherein the two main surfaces (150a, 150b) comprise a different adhesion property. Further, a manufacture method is described.

In one aspect, the present disclosure relates to an electronic device comprising: a plurality of electronic chip components; a plurality of liquid metal (LM) electrical interconnects coupled to the plurality of electronic chips; and a polyimine film encapsulating the plurality of electronic chip components and the plurality of LM electrical interconnects. In some embodiments, the polyimine film comprises the product of the polymerization reaction between terephthaldehyde, 3,3diamino-N-methyldipropylamine, and tris(2-aminoethyl)amine. In another aspect, the present disclosure relates to a method for manufacturing an electronic device, the method comprising: disposing a volume of LM on a polyimine substrate to form a plurality of electrical interconnects; disposing a plurality of electronic chip components onto the polyimine substrate and in contact with the plurality of electrical interconnects; and applying a layer of polyimine onto the polyimine substrate, the plurality of electrical interconnects, and the plurality of electronic chip components.

A substrate structure including a dielectric substrate, an adhesion promotion layer (APL), a conductive material, at least one dielectric layer and at least one pad. The dielectric substrate has an upper surface and a lower surface opposite to each other, and at least one through-hole passing through the dielectric substrate and connected to the upper surface and the lower surface. The APL is disposed on the upper surface, on the lower surface, and on an inner wall of the through-hole of the dielectric substrate. The conductive material fills the through-hole to define at least one conductive through-hole. The dielectric layer is disposed on the APL and has at least one opening exposing the conductive through-hole. A diameter of the opening is greater than a diameter of the conductive through-hole. The pad is disposed in the opening, extends onto the dielectric layer, and electrically connected to the conductive through-hole.

Disclosed are a copper-clad laminate having a low dielectric constant, low dielectric loss, and high thermal conductivity properties, and a method for manufacturing the same, wherein an insulator substrate having a low dielectric constant, low dielectric loss and high thermal conductivity values is laminated onto a copper-foil layer and a portion of the copper-foil layer is patterned using selective etching such that a circuit pattern having a line width of 40 μm or smaller is designed, such that the copper-clad laminate is used as a digital substrate.

A printed circuit board comprises: a base material with a first main surface and a second main surface opposite the first main surface; and a first dielectric layer with a first adhesive layer placed on the first main surface and a first fluorinated resin layer placed on the first adhesive layer.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The purpose of the present invention is to reduce AC resistance. In a multilayer substrate (100), a plurality of ground electrodes (41-44) are separated from each other in the thickness direction (D1) of a laminated substrate (1), and are adjacent to a plurality of signal lines (21-24) in the width direction of the plurality of signal lines (21-24). In a first transmission line region where the maximum line width of the plurality of signal lines (21-24) is minimum, the plurality of signal lines (21-24) do not overlap with any one of the plurality of ground electrodes (41-44) in the thickness direction (D1) of the laminated substrate (1). In a second transmission line region (102) in which the maximum line width of the plurality of signal lines (21-24) is the largest, one ground electrode (41) among the plurality of ground electrodes (41-44) overlaps with signal lines (22-24) other than the signal line (21) adjacent to the one ground electrode (41) among the plurality of signal lines (21-24).

The invention provides a wiring substrate and a method for manufacturing the same, which are a technique for suppressing the generation of voids between wirings. A wiring board according to an embodiment includes: a conductive layer including a parallel wiring portion in which a plurality of wires are arranged in parallel; and an insulating layer laminated on the conductive layer and containing a resin and an inorganic filler, in which a plurality of wirings of the parallel wiring portion are covered with an adhesive film, the insulating layer having a single layer including: a first structure portion filled between the wirings of the parallel wiring portion; and a second structural part located above the parallel wiring part, the second structural part having a higher content of the inorganic filler than the first structural part.

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

A printed circuit board includes a bendable portion. The bendable portion is bendable in a bending direction in plan view and has a first dielectric layer, a signal pattern, a second dielectric layer, a cloth, and a ground pattern. The first dielectric layer has a first main surface. The signal pattern is arranged on the first main surface. The second dielectric layer has a second main surface and a third main surface opposite to the second main surface, and the second main surface is arranged to face the first main surface. The cloth includes a plurality of first reinforced fibers extending in a first direction in plan view and a plurality of second reinforced fibers extending in a second direction inclined with respect to the first direction in plan view, the plurality of first reinforced fibers and the plurality of second reinforced fibers being knitted together in a cloth form.

Provided is a laminate having excellent adhesion between a copper-containing substrate and a perfluoropolymer film. Also provided is a method for forming a laminate having excellent adhesiveness as described above. The laminate is characterized in that the laminate comprises a copper-containing base material and a coating film containing a perfluoropolymer, the adhesion strength between the base material and the coating film is 0.2 N / mm or more, and the surface roughness of the coating film is less than 15 [mu] m.

A dielectric that reduces frequency dependency of a dielectric constant in terahertz high-frequency bands (110 to 330 GHz) of the dielectric constant and a method for producing the same, are provided. The dielectric having a slope of a dielectric constant (Dk) with respect to frequencies from 220 GHz to 330 GHz of 0.00001 or more and 0.0005 or less, as measured with a Fabry-Perot resonator J-band.

A fluororesin sheet according to the present invention includes a fluoropolymer and an inorganic filler. The fluoropolymer is oriented in a surface direction of the fluororesin sheet. The inorganic filler is a surface-treated degreased sheet. A metal-clad laminate according to the present invention includes the above fluororesin sheet with a metal foil attached to at least one surface of the fluororesin sheet. A method according to the present invention includes a step of mixing an aqueous dispersion of a fluoropolymer and a pre-surface-treated inorganic filler to form a compound, and press-molding the compound to form a sheet, a step of laminating the sheet and press-molding the sheet to form a sheet, a step of rolling and thereafter drying the resulting sheet, and a step of degreasing the resulting sheet at a temperature of 200°C or more and below 300°C for 5 to 24 hours. A fluororesin sheet with good handleability by itself is thereby provided.

Provided is a resin composition capable of producing a molded article with excellent impact strength. The resin composition contains an amorphous resin (A) belonging to super engineering plastics and a fluorine-containing copolymer (B), the amorphous resin (A) or the fluorine-containing copolymer (B) having an average dispersed particle size r1 and an average dispersed particle size r2 that is determined after measuring a melt flow rate in conformity with ASTM D1238 after preheating for five minutes and under a load of 5000 g at 380°C or at a temperature at which the resin composition melts or higher, the r1 and the r2 satisfying a ratio r2 / r1 of lower than 1.70, where the r1 and the r2 are obtained by measuring the same resin or the same copolymer.

Disclosed is a substrate comprising a ceramic main body (1) and an organic surface structure (2) on at least one outer face of the ceramic main body (1), outer redistribution layers (3) being integrated into the organic surface structure.

A resin laminated board includes resin layers laminated on one another and conductors located outside and inside the laminated resin layers. The resin layers include a first resin layer, a second resin layer, and a third resin layer sequentially laminated on one another. The conductors include first conductor layers, second conductor layers, and interlayer connection conductors. The first conductor layers are located at a lower main surface of the first resin layer. The second conductor layers or the interlayer connection conductors that overlap a portion of the first resin layer when viewed in a thickness direction of the third resin layer are located at the third resin layer. The second resin layer is a thermoplastic resin, and a melting point of the second resin layer is lower than a melting point of the first resin layer. At least the second resin layer includes air bubbles.

To provide a dielectric that exhibits superior electrical properties and does not cause the blistering of copper foil during the production of a copper-clad laminate using the dielectric, and a production method therefor, and also provide a copper-clad laminate using the dielectric and a production method therefor.SOLUTION: A dielectric has a residual organic matter content of 500 μg / g or less. A metal-clad laminate includes the dielectric and a metal foil.SELECTED DRAWING: None

According to various embodiments, a flexible printed circuit board includes: a first flexible dielectric layer that includes reinforcing fibers; a second flexible dielectric layer that includes no reinforcing fibers; and a first conductive layer that is disposed between the first dielectric layer and the second dielectric layer and contacts the first dielectric layer and the second dielectric layer.

Disclosed are a copper-clad laminate having a low dielectric constant, low dielectric loss, and high thermal conductivity properties, and a method for manufacturing the same, wherein an insulator substrate having a low dielectric constant, low dielectric loss and high thermal conductivity values is laminated onto a copper-foil layer and a portion of the copper-foil layer is patterned using selective etching such that a circuit pattern having a line width of 40 µm or smaller is designed, such that the copper-clad laminate is used as a digital substrate.

A fluoroplastic substrate for high-speed communications has a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a permittivity at 40 GHz of from 2.0 to 3.2. The substrate includes a quartz glass cloth having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a fluoroplastic having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0005.

To provide a laminate having excellent adhesiveness between a copper-containing base material and a perfluoropolymer film, and also to provide a method for forming the laminate having excellent adhesiveness.SOLUTION: Provided is a laminate comprising a copper-containing base material and a perfluoropolymer-containing film, wherein the adhesive strength between the base material and the film is 0.2 N / mm or more, and the film has a surface roughness of less than 15 μm.SELECTED DRAWING: None

A component carrier (100) for carrying at least one component (1400) and comprising a plurality of electrically conductive layer structures (102, 104), and a plurality of electrically insulating layer structures (106, 108), wherein the plurality of electrically conductive layer structures (102, 104) and the plurality of electrically insulating layer structures (106, 108) form a laminated stack, and wherein at least one of the electrically insulating layer structures (106, 108) is configured as a flame retardant structure (108) preventing propagation of fire along the component carrier (100).

The fluororesin sheet according to the present invention comprises a fluoropolymer and an inorganic filler, the fluoropolymer being oriented in the plane direction of the fluororesin sheet, and the inorganic filler being surface-treated and being a degreased sheet. The metal-clad laminate according to the present invention is obtained by bonding a metal foil to at least one surface of the fluororesin sheet. The method according to the present invention comprises: a step in which an aqueous dispersion of a fluoropolymer is mixed with an inorganic filler that has been surface-treated in advance to produce a composite, and the composite is press-molded to produce a sheet; a step in which the sheets are laminated and press-molded to form a sheet; a step in which the obtained sheet is rolled and then dried; and a step for degreasing at a temperature of 200 DEG C or more and less than 300 DEG C for 5-24 hours. As a result, a fluororesin sheet having good workability as a monomer is provided.

To provide a resin sheet including a fluororesin with excellent thermal expansion characteristics in the thickness direction.SOLUTION: This resin sheet includes a fluororesin and an anisotropic filler, and the anisotropic filler is uniaxially oriented in the film thickness direction and is randomly distributed in the surface direction.SELECTED DRAWING: Figure 2

An electronic device is provided. The electronic device includes a hinge, a first housing having at least a portion coupled to a first side of the hinge and including a first substrate assembly, a second housing having at least a portion coupled to a second side of the hinge, including a second substrate assembly, and configured to be foldable and unfoldable, a flexible display supported on the first and second housing and configured to be foldable and unfoldable, an FPCB electrically connecting the first and second substrate assembly, a through hole formed in the first housing forming a path through which the at least one FPCB passes, a first sealing member disposed so as to compress a first side surface of the at least one FPCB disposed in the through hole, and a second sealing member presses the second side surface of the FPCB disposed in the through hole.

The present invention relates to a surface-treated copper foil that has excellent adhesive strength with a resin substrate, exhibits low bending deformation after bonding with the resin substrate, and has low transmission loss, and is therefore suitable as a high-frequency foil, and to a copper foil laminate and a printed wiring board including the same. The present invention relates to a surface-treated copper foil including a surface treatment layer formed on at least one side of an original copper foil, and an oxidation prevention layer formed on the surface treatment layer, wherein at least one side of the surface-treated copper foil contains fine copper particles having an average particle size of 100 nm or less, and the surface-treated copper foil has a deformation value (Y) of 5 or less, as expressed by the following formula: deformation value (Y) = tensile strength deformation value (Y1) + elongation deformation value (Y2) (where Y1 = (T1 - T2) / (kgf / mm 2 ), Y2=(E2-E1) / %, T2 and E2 are the tensile strength and elongation measured after heat treatment at a pressure of 4.9 MPa and a temperature of 220°C for 90 minutes, respectively, and T1 and E1 are the tensile strength and elongation measured at room temperature, respectively.

An electronic component that includes: an element body; and an insulating film covering an outer surface of the element body. The insulating film has a mix layer and a glass layer. The mix layer has a first glass and powder particles. The glass layer contains a second glass and has a smaller content percentage of the powder particles than the mix layer. The mix layer is on a side of the insulating film closer to the element body when viewed from the glass layer.

Provided is a plate-shaped composite material which can sufficiently exhibit an interference effect between antenna elements when utilized as, for example, a substrate of a microstrip patch antenna. The interference effect between the antenna elements can be sufficiently exhibited by controlling the composite material so that, when the material is divided into a plurality of regions, a standard deviation of density values of the respective regions is kept at a certain value or less.