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445results about How to "Adhesion" patented technology

Stacked chip package using warp preventing insulative material and manufacturing method thereof

In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower chip and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips / wafers is greatly improved, while providing complete fill of the gap. In addition, mechanical reliability is improved and CTE mismatch is reduced, alleviating the problems associated with warping, cracking and delamination, and leading to an improvement in device yield and device reliability.
Owner:SAMSUNG ELECTRONICS CO LTD

Viscoelastic Mounting Device

An apparatus for selectively holding a device, such as a camera, to a surface is disclosed. An internal frame has at one end an attachment means, such as a threaded stud, for selectively attaching the device to the apparatus. The frame further includes a substantially circular flat base that has a first side and a second side. The flat base is substantially conformable to the shape of the surface. A longitudinal shaft is included that extends orthogonally from the first side of the base. A viscoelastic material is fixed about the internal frame and extends beyond a second end of the frame. The viscoelastic material is temporarily adhered to the frame and is capable of selectively adhering the apparatus to the surface. The viscoelastic material preferably includes an R.T.V.-type silicon-based compound, a dimethyl siloxane compound, a borosilicone rubber combination with silicone oil, a silicone polymer combination with boric oxide, or a combination thereof. As such, the viscoelastic material is able to temporarily adhere to most surfaces with enough strength to hold the apparatus and the device thereto, even against the force of gravity and in virtually any typical environmental temperature. At least one lateral frame member is included, projecting away from the longitudinal shaft for increasing the surface area of the frame to which the viscoelastic material adheres. An outer covering surrounds the viscoelastic material and the frame and serves as a barrier between the viscoelastic material and the device.
Owner:BYRD RANDEL LOUIS
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