31results about How to "Improve connection characteristics" patented technology

A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.

A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

An optical connector having: a ferrule into which a first optical fiber is inserted; an optical fiber connector disposed at an back end of the ferrule; and a cross-linkable refractive index matching member attached onto an end face on a back end side of the first optical fiber. The end face on the back end side of the first optical fiber and an end face of a second optical fiber to be inserted into the optical fiber connector from a back end side thereof are to be connected by a butting connection. The cross-linkable refractive index matching member is formed such that a cross-linkable refractive index matching agent is coated on the end face on the back end side of the first optical fiber, and the coated agent is cross-linked and hardened.

A single mode fiber is provided which is suitable for high-speed, large-capacity optical communication and for optical wiring. The single mode fiber has a first cladding region with a uniform refractive index, a core region with a refractive index higher than that of the first cladding region, and a second cladding region including at least four air hole regions placed in the first cladding region. Optimization can be achieved by making the distance from the center of the core region to the air hole regions equal to 2-4.5 times the core radius, and the air hole radius equal to or greater than 0.2 times the core radius. It is preferable the core radius be 3.2-4.8 μm, the relative index difference of the core region from the first cladding region be 0.3-0.55%.

The invention discloses a manufacturing method of a flexible printed circuit board. The manufacturing method comprises the following steps that: (1) a first flexible printed circuit board is manufactured; (2) a second flexible printed circuit board is manufactured; (3) the first flexible printed circuit board and the second flexible printed circuit board are laminated; (4) laser drilling is performed on a multilayer flexible printed circuit board accomplished in the step (3); (5) solder-resisting printing ink is printed on positions of the multilayer flexible printed circuit board where electronic components are not needed to be welded; and (6) the multilayer flexible printed circuit board is cut into a flexible printed circuit board in a predetermined specification through using a laser cutting process.

The invention relates to a connection device of a converter ring and a furnace shell, in particular to a spherical hinge disc suspension type connection device of the converter ring and the furnace shell. The connection device is characterized by consisting of 3 to 4 connection units. Each connecting unit comprises a lug, a support shaft, a sliding sleeve, a support ring, and a spherical hinge bearing, wherein the lug is fixedly connected with the converter ring and provided with a through hole for the sliding sleeve which is positioned in the through hole and is fixedly connected with the lug; the external end of the support shaft is inserted into the sliding sleeve; the internal end of the support shaft is fixedly connected with the internal ring of the spherical hinge bearing; and the external ring of the spherical hinge bearing is fixedly connected with the support ring which is fixedly connected with the furnace shell. The connection device has the characteristics of simple structure, high reliability, free maintenance, and no additional stress generation in operation process of the converter.

The invention relates to a connecting device for a converter backing ring and a furnace shell. The connecting device for the spherical hinge slider type converter backing ring and the furnace shell comprises three connecting units, wherein each connecting unit comprises a hanging disc, a big ear base, a supporting shaft, a sliding sleeve and a spherical hinge shaft; the hanging disc comprises a backing ring welded on the furnace shell and rib plates radially arranged around the backing ring; the rib plates are respectively welded with the backing ring and the furnace shell; the big ear base is positioned under the backing ring and is fixedly connected to the backing ring; the big ear base is provided with a sliding sleeve through hole; the sliding sleeve is arranged in the sliding sleeve through hole; an external end of the supporting shaft is fixed with the sliding sleeve; an interior end of the supporting shaft is the shaft shoulder; the interior of the supporting shaft is fixedly connected to an inner ring of the spherical hinge shaft; the spherical hinge shaft is outside of the shaft shoulder; and the outer ring of the spherical hinge shaft is fixed with the backing ring. The connecting device of the invention is characterized by simple and reliable structure, bearing static determinacy of furnace shell and capability of improving bearing condition.

The present invention relates to an anisotropic conductive film that can prevent a short circuit by adjusting density of conductive particles pressed to electrode parts between electrodes and density of conductive particles in a space between the electrodes and exhibit enhanced cost-reduction effects and connection characteristics, and a semiconductor device connected thereby.

The invention belongs to the technical field of metal electroplating, in particular to a copper electroplating solution. The copper electroplating solution includes: copper sulfate, sulfuric acid, chloride ion, sodium alkyl succinate sulfonate and sulfonates. Its advantage is that the acid-copper ratio of the electroplating solution is increased, which can ensure the thickness of the copper layer in the nano-scale deep hole; the fluidity is better, and the step coverage ability of electroplating copper has been effectively improved. After the high-grade copper is filled, there are no voids and cracks; the electroplated samples have good reliability in the subsequent device preparation process.