A copper electroplating solution
A technology for electroplating copper and solution, applied in the field of metal electroplating, can solve the problems of reducing the thickness of the dielectric layer and increasing the feature aspect ratio, and achieves the effects of improving the step coverage, reducing the roughness and improving the reliability.
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[0024] Example 1
[0025] The distribution ratio of copper electroplating solution is as follows:
[0026] Copper sulfate: 80g / L
[0027] Sulfuric acid: 150g / L
[0028] Chloride ion concentration: 40ppm
[0029] Sodium dipentyl succinate sulfonate: 5g / L
[0030] Sodium disulfide dipropane sulfonate: 5ppm
[0031] The copper electroplating liquid configured according to the above-mentioned components is repeatedly filtered and then air-stirred to continuously maintain the circulation of the copper electroplating liquid during the electroplating process.
Example Embodiment
[0032] Example 2:
[0033] The distribution ratio of copper electroplating solution is as follows:
[0034] Copper sulfate: 90g / L
[0035] Sulfuric acid: 160g / L
[0036] Chloride ion concentration: 45ppm
[0037] Sodium dipentyl succinate sulfonate: 5.5g / L
[0038] Sodium thiazoline propane sulfonate: 5.5ppm
[0039] The copper electroplating liquid configured according to the above-mentioned components is repeatedly filtered and then air-stirred to continuously maintain the circulation of the copper electroplating liquid during the electroplating process.
Example Embodiment
[0040] Example 3:
[0041] The distribution ratio of copper electroplating solution is as follows:
[0042] Copper sulfate: 100g / L
[0043] Sulfuric acid: 170g / L
[0044] Chloride ion concentration: 50ppm
[0045] Sodium dihexyl succinate sulfonate: 6g / L
[0046] Sodium thiazoline propane sulfonate: 6ppm
[0047] The copper electroplating liquid configured according to the above-mentioned components is repeatedly filtered and then air-stirred to continuously maintain the circulation of the copper electroplating liquid during the electroplating process.
[0048] Of course, the copper electroplating solution provided by the present invention can be added with other auxiliary additives on the basis of the formula, but the content of the present invention is further optimized, and it is also within the protection scope of the present invention.
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