A method of manufacturing a flexible printed circuit board

A flexible printed circuit, flexible printing technology, applied in the direction of printed circuit manufacturing, printed circuit, multi-layer circuit manufacturing, etc., can solve the problems of poor thermal conductivity and heat dissipation, poor dimensional stability, curling, etc.

Active Publication Date: 2017-01-18
LIYANG TECH DEV CENT
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because of the softness of the single-sided flexible circuit board, the light-cured product is prone to deformation, curling, and unevenness, which increases the workload of the subsequent production process and affects production efficiency.
[0003] At present, the flexible printed circuit boards in the industry have the following disadvantages: poor thermal conductivity and heat dissipation, difficult to control the expansion and contraction size, and difficult to improve reliability; extremely poor dimensional stability, low wiring density, not high temperature resistance, and not easy to make multi-layer board, and in the prior art, when mechanical punching and mechanical cutting are used in the production of multilayer flexible circuit boards, the aperture cannot be precisely controlled, and it is easy to cause waste boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method of manufacturing a flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] see figure 1 , the manufacturing method of the flexible printed circuit board that the present invention proposes comprises the following steps successively:

[0033] (1) Making the first flexible printed circuit board ( figure 1 100 in);

[0034] (2) Make the second flexible printed circuit board ( figure 1 200 in);

[0035] (3) Pressing the first flexible printed circuit board and the second flexible printed circuit board ( figure 1 300 in);

[0036] (4) Laser drilling the multilayer flexible printed circuit board completed in step (3) ( figure 1 400 in);

[0037] (5) Print solder resist ink on the above-mentioned multi-layer flexible printed circuit board where the electronic components do not need to be soldered ( figure 1 500 in);

[0038] (6) Cut the multi-layer flexible printed circuit board into predetermined specifications by laser cutting process ( figure 1 600 in).

[0039] Among them, step (1) specifically includes the following steps:

[0040] (1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a manufacturing method of a flexible printed circuit board. The manufacturing method comprises the following steps that: (1) a first flexible printed circuit board is manufactured; (2) a second flexible printed circuit board is manufactured; (3) the first flexible printed circuit board and the second flexible printed circuit board are laminated; (4) laser drilling is performed on a multilayer flexible printed circuit board accomplished in the step (3); (5) solder-resisting printing ink is printed on positions of the multilayer flexible printed circuit board where electronic components are not needed to be welded; and (6) the multilayer flexible printed circuit board is cut into a flexible printed circuit board in a predetermined specification through using a laser cutting process.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a method for manufacturing a flexible printed circuit board. Background technique [0002] Because the flexible circuit board can be bent, folded, wound, and can move freely in the three-dimensional space and expand and contract, and has good heat dissipation performance, it can also use FPC to reduce the volume, realize lightweight, miniaturization, and thinning, and achieve component devices and Wire connection integration. Moreover, the cost of the single-sided flexible board is low, and it has a layer of chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is rolled copper foil. The insulating substrate can be easily selected from polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride; therefore, single-sided flexible circuit boards are widely used in the automot...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46
Inventor 丛国芳
Owner LIYANG TECH DEV CENT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap