879 results about "Laser drilling" patented technology

The invention discloses a PCB laser drilling deviation detection method and system, and the method comprises the following steps: obtaining original image data corresponding to a PCB laser drilling region, standard hole site coordinate data in a drilling design file, and real-time operation parameter data corresponding to laser drilling equipment; performing preprocessing to generate preprocessed image data, a standard coordinate data set and an equipment operation reference data set; extracting edge contour feature data of a drilling area based on the preprocessed image data, and generating an initial deviation vector of an actual drilling contour and a design contour in combination with the standard coordinate data set; constructing a drilling deviation influence factor matrix based on the equipment operation reference data set in combination with the initial deviation vector, and generating a weight coefficient of each influence factor for drilling deviation; and correcting the initial deviation vector based on the weight coefficient, judging whether deviation exists in the drill hole or not, and generating a drill hole deviation detection result. According to the invention, the drilling deviation detection precision of the PCB can be improved.

The invention discloses an HDI micro blind hole laser drilling processing method and system, and relates to the field of HDI drilling processing, CO2 laser drilling is firstly carried out on a plate, then UV laser shaping is carried out, finally quality detection is carried out, and the core is that a plurality of local datum points distributed in a matrix mode are preset on the HDI plate to be processed. In the CO2 laser drilling process, the drilling task and the positioning action of the local datum point are executed alternately through a control program. By periodically measuring the actual position of the adjacent local datum point in the machining period, the dynamic position offset generated in the area due to the heat effect can be captured in real time, and the machining coordinates of the follow-up target drilling point in the area can be corrected in real time through the offset. The continuous local dynamic compensation effectively overcomes the dynamic thermally induced deformation problem which cannot be handled by the traditional single global correction, so that the drilling precision in the large-size and high-density machining process is ensured.

The invention relates to a laser drilling method for a thin copper HDI circuit board. The laser drilling method comprises the following steps that a circuit board to be machined is positioned and installed on a machining station of laser machining equipment; a first section of laser drilling is carried out, a first laser parameter is adopted, uncovering drilling is carried out on a preset machining area of the outer copper foil layer, and an initial hole structure is formed; performing second-section laser drilling, namely performing compensation drilling on the dielectric layer exposed at the bottom of the initial hole structure by adopting a second laser parameter of which the energy is lower than that of the first laser parameter to form a transition hole structure; and in the third section of laser drilling, a third laser parameter with energy lower than that of the second laser parameter is adopted, the bottom of the transition hole structure is trimmed, and a final hole channel is formed. According to the method, drilling is conducted in three sections, namely the first section of uncovering drilling, the second section of compensation drilling and the third section of finishing treatment. Therefore, the bottom cushion copper cannot absorb a large amount of heat in a short time, the base material layer below the bottom cushion copper can be protected from being burnt, and the product quality is improved.

The invention discloses a cross-level laser drilling method utilizing UV laser and carbon dioxide laser, and belongs to the technical field of printed circuit boards. The cross-level laser drilling method utilizing the UV laser and the carbon dioxide laser burns through a required penetrating layer with a copper layer through high-energy UV laser drilling; the dielectric layer on the reserved layer bottom copper is burnt out and subjected to hole finishing by adopting carbon dioxide laser drilling, so that no adhesive residue is ensured under the condition that the hole bottom is not burnt through, the conduction connection performance of the printed circuit board is ensured, the processing quality stability of the printed circuit board is improved, and the production cost is reduced. And the problems of burning through and burning loss of a bottom copper layer caused by high energy of UV laser can be well improved.

The invention relates to the technical field of laser drilling machines, in particular to a precise positioning laser drilling machine and a positioning structure thereof. According to the precise positioning laser drilling machine and the positioning structure thereof, the first electric push rod drives the positioning base to position the left side and the right side of a plate, then the second electric push rod drives the clamping base to descend, the edge of the plate is flattened, the plate positioning and fixing stability is improved, smoke generated in the drilling process is covered by the protection bin, and the positioning effect is good. The draught fan drives external air to be input into the air bin, air curtains are formed on the surface of the observation window and the feeding and discharging port, smoke is prevented from leaking out of the feeding and discharging port while the observation window is prevented from being covered with dust, meanwhile, centralized treatment of the smoke is achieved through work of the smoke purifier, and fixation of a plate is relieved after drilling is completed. The conveying belt works to drive the plates to move towards the outer side of the protection bin through the feeding and discharging port, meanwhile, an air curtain formed by the air bin conducts air cooling heat dissipation on the surfaces of the plates, the discharging convenience and safety are improved, and the production and machining efficiency is improved.

The invention discloses a PCB blind hole machining method and device, laser drilling equipment and a storage medium, the laser drilling equipment comprises a picosecond or femtosecond laser device and a CO2 laser device, after a first machining parameter of the picosecond or femtosecond laser device and a second machining parameter of the CO2 laser device are determined, on one hand, the first machining parameter of the picosecond or femtosecond laser device and the second machining parameter of the CO2 laser device are determined; the picosecond or femtosecond laser performs cold machining on the surface copper layer to form the annular heat insulation groove, the surface copper layer can be prevented from generating suspended copper at the opening of the blind hole, on the other hand, heat generated when the CO2 laser machines the blind hole can be prevented from being diffused to the opening of the blind hole in the surface copper layer through the annular heat insulation groove, suspended copper is further prevented from being generated, and on the other hand, the heat dissipation efficiency is improved. The picosecond or femtosecond laser device with low processing efficiency is adopted for annularly cutting the annular heat insulation groove in the surface copper layer, then the CO2 laser device with high processing efficiency is used for removing materials in the area in the outer contour of the annular heat insulation groove to achieve drilling, the processing efficiency of the two laser devices with different processing efficiency is considered, and the laser drilling efficiency is improved.

The invention discloses a laser drilling method and system for a heterogeneous laminated material. The laser drilling method comprises the steps that a first acoustic emission sensor and a second acoustic emission sensor are arranged; in the blind hole forming process, the depth of the blind hole is obtained through a second acoustic emission sensor; determining the laying angle of the carbon fiber prepreg cloth according to the depth of the blind hole, calling a first acoustic emission sensor, and collecting an acoustic emission signal; judging whether the metal layer is exposed or not according to an acoustic emission signal acquired by a first acoustic emission sensor, and if the metal layer is considered to be exposed, acquiring a spectral signal in real time through a laser-induced breakdown spectroscopy detection system; and outputting the laser beam again, and controlling the laser beam to perform layer-by-layer scanning. The position of the metal layer in the blind hole machining process is preliminarily positioned based on the acoustic emission sensor system, then LIBS is used for accurately positioning distribution of the metal layer, laser process parameters are fed back and adjusted, and the spiral track during laser scanning is adjusted, so that the blind hole machining quality is improved.

The present invention relates to the field of medical catheter drilling, and in particular to a fully automatic medical catheter laser drilling machine, comprising a drilling platform, a feed limit tube for limiting the catheter is fixed on the top of the drilling platform, one end of the feed limit tube is provided with a semicircular arc portion, and the catheter contacts and cooperates with the inner wall of the feed limit tube and the inner wall of the semicircular arc portion, a cylindrical support rod for supporting the inner wall of the catheter is placed in the feed limit tube, and a magnet is fixed on one end of the cylindrical support rod. The fully automatic medical catheter laser drilling machine realizes the periodic operation of catheter transportation and drilling through the cooperation of an active cam, a driven cam and a driving device, making the whole process more orderly and efficient. The catheter is supported by the arrangement of a magnet and a cylindrical support rod, which not only facilitates periodic feeding and realizes equidistant drilling, but also makes the drilling accuracy more accurate. The start of the laser drilling component is automatically controlled by the arrangement of a contact switch.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

The invention relates to the technical field of laser processing, particularly discloses an ultrathin prepreg single-emitting laser hole forming system, and aims to solve the contradiction among precision, thermal damage and efficiency in ultrathin prepreg laser processing. According to the system, through cooperation of an ultrashort pulse laser source, precise light beam shaping and transmission, material processing and positioning, real-time monitoring and feedback and an intelligent control and optimization module, laser and material interaction is finely regulated and controlled. In a single laser event or an equivalent single laser event, high-precision and low-damage microstructure processing of the ultrathin prepreg is realized, the defects of a heat affected zone, carbonization, layering and the like are effectively reduced, and the processing quality and efficiency are improved.

The invention discloses an HDI circuit board laser drilling device, and particularly relates to the technical field of HDI circuit board drilling, the HDI circuit board laser drilling device comprises an operation table, a rotating mechanism is rotatably connected to the right side of the middle of the upper end of the operation table, a transmission mechanism is rotatably connected to the front side of the upper end of the operation table, and a drilling mechanism is fixedly connected to the middle of the upper end of the operation table; an air blowing mechanism is arranged on the left side of the lower portion of the drilling mechanism. According to the HDI circuit board laser drilling device, in the descending process of the laser drilling head, a baffle is driven to be matched with a rectangular block, the HDI circuit board can be automatically and accurately positioned, the drilling precision and efficiency are improved, in the drilling process, a spray head is matched with a limiting pipe and a first sliding block, and therefore the HDI circuit board can be accurately drilled. According to the HDI circuit board drilling device, the surface of a drilled HDI circuit board is cleaned through the soft brush, chippings and dust generated in the drilling process can be removed, meanwhile, in the reset process of the laser drilling head, the surface of the drilled HDI circuit board is cleaned through the soft brush, the residual chippings and dust can be removed, and the cleanliness of the HDI circuit board is guaranteed.

The invention discloses a high-precision circuit board laser drilling process, and particularly relates to the technical field of circuit board processing, and the high-precision circuit board laser drilling process comprises the following steps: step 1, selecting a high-quality base material and a copper-clad layer, and carrying out pretreatment on the base material, the pretreatment comprises cleaning and deoxidation, and the interaction efficiency of laser and the material is improved; 2, according to the design requirement of the circuit board, the position needing to be drilled and the aperture size are determined and completed through CAD software, a drilling data file is generated, the circuit board to be drilled is fixed to a drilling machine, and it is guaranteed that the board face is smooth and free of deformation; thirdly, a CO2 laser is selected, light beam focusing, laser power stability and laser beam uniformity of laser drilling equipment are optimized, and stability and accuracy of laser are guaranteed. According to the invention, high-precision laser drilling processing can be realized, the drilling processing quality of the circuit board can be ensured, the processing defective rate is obviously reduced, the popularization and the use are facilitated, and meanwhile, the method is suitable for a modern production process.

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method, a storage medium, laser drilling equipment and a high-frequency high-speed substrate. The laser drilling method comprises the steps that hole machining information of a hole structure is obtained, wherein the hole machining information comprises the hole position, the hole outer contour and the hole depth; taking the hole position as a positioning reference, and performing at least one of laser winding and cutting treatment and laser etching treatment on the high-frequency high-speed substrate to form a hole structure; wherein the laser winding and cutting treatment comprises the steps that first laser is controlled to move along a first closed path matched with the outer contour of the hole, so that the side wall of the hole structure is formed; and the laser etching treatment comprises the steps of controlling a second laser to carry out punching processing on an enclosed area of the outer contour of the hole so as to remove a base material in the enclosed area and form a bottom wall of the hole structure, and the method can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate and also can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate. And the processing efficiency of manufacturing a high-quality hole structure on the high-frequency and high-speed substrate can be obviously improved.

The invention provides an ultrafast laser drilling method for a carbon fiber composite material, and relates to the technical field of laser machining.The ultrafast laser drilling method comprises the steps that a material removal image and a plasma light intensity signal in the laser drilling process are obtained in real time, whether a fiber sputtering effect occurs in the material removal image or not is recognized, and if the fiber sputtering effect does not occur, the material removal image is recognized; if so, determining a hole-making influence area, and acquiring temperature distribution data of the hole-making influence area; analyzing to set a first revolution-rotation speed adjusting rule, and adjusting the revolution speed and the rotation speed of the laser based on the first revolution-rotation speed adjusting rule; and if the fiber sputtering effect occurs, quantifying the fiber sputtering effect to construct a rotation error signal, performing periodic analysis on the plasma light intensity signal to construct a revolution error signal, setting a second revolution-rotation speed adjustment rule, and adjusting the revolution speed and the rotation speed of the laser based on the second revolution-rotation speed adjustment rule.

The invention relates to the technical field of laser drilling and cutting, in particular to a laser drilling and cutting device for lamp metal shell machining and a method thereof.The laser drilling and cutting device comprises a base, a feeding base, a conveying shaft, a fixing piece and a laser head, the feeding base is installed at one end of the base, and the end, close to the base, of the feeding base is fixedly connected with a material guide plate; a movable plate is slidably arranged below the end, away from the material guide plate, of the feeding base, a material guide inclined plate is fixedly connected to the side, close to the feeding base, of the top end of the movable plate, and a material guide straight plate is fixed to the other end of the material guide inclined plate; the outer sides of the transmission shafts on the inner sides of the base and the feeding base are in meshed connection with a conveying rubber plate and a conveying belt correspondingly. One end of each transmission shaft penetrates through the base and is fixedly connected with a transmission rod. According to the scheme, through continuous conveying and guiding positioning, the machining efficiency of the laser drilling and cutting device on the lampshade metal shell is higher, the machining process is more stable and accurate, and the machining quality of the lamp metal shell is guaranteed.

The invention discloses an HDI plate manufacturing process for a pen electronic camera module, and the process comprises the steps: carrying out the multi-frequency acoustic wave penetration and temperature gradient processing of a substrate, and obtaining the pre-detection data of the substrate; in the laser drilling process, short-pulse multi-frequency acoustic waves and local heat regulation are applied to a target hole area, and micropore acoustic reflection data are obtained; the method comprises the following steps: independently regulating and controlling the temperature of a plurality of areas of a board surface before chemical copper deposition treatment, and recording acoustic scanning data to form a regional acoustic characteristic spectrum; performing acoustic wave excitation according to a preset time interval in the chemical copper deposition process to obtain monitoring data of the copper deposition process; periodic thermal excitation and fluid disturbance are applied in the electroplating process, and electroplating dynamic monitoring data are obtained; after electroplating is completed, temperature circulation and stress excitation treatment are carried out, and the evaluation result of the internal structure of the micro-through hole is obtained. According to the technical scheme, the micro-through-hole structure with the bubble micro-migration tendency can be accurately identified and screened in the manufacturing process, and the long-term reliability and the use stability of the HDI plate are effectively improved.

The invention provides unequal-thickness ultrathin glass and a preparation method thereof. The preparation method comprises the following steps: (1) pasting a mask on the surface of UTG glass to obtain film-pasted glass; (2) firstly punching a row of laser holes at the center line of the bending area of the film-coated glass by using laser, recording the laser holes as a first row of laser holes, and then coating the bending area with fluoride as a coating material; then laser drilling is symmetrically conducted on the left side and the right side of the first row of laser holes in the direction from the center line of the bending area to the two sides, coating treatment is repeated once every time symmetric laser drilling is completed till the bending area is full of the laser holes, and the coated glass is obtained; (3) carrying out indirect acid etching on the bending area on the front surface of the coated glass by adopting hydrochloric acid to form an arc-shaped thinned surface so as to obtain roughly etched glass; and (4) carrying out polishing treatment on the rough etching glass to obtain the unequal-thickness ultra-thin glass. The method provided by the invention can significantly improve the flexibility and bending characteristics of the unequal-thickness ultrathin glass.

The invention discloses a clamping device, laser machining equipment and a laser drilling method.The clamping device is used for clamping an annular workpiece and comprises mounting bases, a clamping belt, a driving wheel and a first telescopic mechanism, and the mounting bases are symmetrically arranged on the two sides of a clamping position of the workpiece; at least two rotating mechanisms used for being connected with the first ends of the first telescopic mechanisms are arranged on the side, close to the workpiece clamping position, of the mounting base, the second ends of the first telescopic mechanisms and the driving wheels are used for being supported on the inner surface of the clamping belt so as to tension the clamping belt, and the outer surface of the clamping belt is used for being tightly attached to and supported on the outer wall of the annular workpiece. The first telescopic mechanism is used for telescopically adjusting the distance between the clamping belt and a workpiece at the clamping position and / or adjusting the tension degree of the clamping belt; the rotating mechanism is used for driving the first telescopic mechanism to swing so as to adjust the position of the second end of the first telescopic mechanism; the driving wheel is used for driving the clamping belt to rotate when the clamping belt is matched with the workpiece so as to drive the workpiece to move.

The invention discloses an ultraviolet laser drilling device, and belongs to the field of laser drilling. The machining table is fixedly connected to the upper end of the bottom plate; the adjusting part is arranged at the upper end of the bottom plate; an air suction machine is arranged on the outer wall of the machining table, an air suction pipe is assembled at the input end of the air suction machine, an air suction box is assembled at the other end of the air suction pipe, a material receiving hopper is fixedly connected to the upper end of the air suction box, and a breathable plate is fixedly connected to the bottom of the material receiving hopper. The air suction machine and the air suction box are arranged, waste residues generated in the laser drilling process can be effectively removed by combining the rotating effect of the scraping plate and the scraping strip, the waste residues are prevented from blocking equipment and affecting the machining efficiency, through linkage of the spiral conveying piece and the rotating rod, the waste residues can be automatically conveyed out of the pipeline, manual cleaning is avoided, and the labor intensity of workers is relieved. And the overall automation level is improved.

The invention discloses a preparation process of a thin-glue bending-resistant LED flexible circuit, and belongs to the field of LED flexible circuit board preparation, and the preparation process comprises the following steps: adopting a material with a glue layer thickness of 6-8 UM, and setting a double-sided material composition as copper, glue, PI, glue and copper; s2, performing line exposure and etching on the top copper foil in a roll-to-roll mode to form a circuit pattern; s3, through holes are formed through laser drilling, the thickness of an adhesive layer is detected through a sensor in the drilling process, the laser power or the scanning speed is adjusted by a control system according to detection data, and dynamic adjustment of the laser efficiency is achieved; the thickness of the adhesive layer is reduced to 6-8 UM, so that the flexibility of the copper foil is remarkably improved, the bending frequency of the circuit board is increased to 100 or more, and the high-flexibility application requirement is met; the glue layer thinning is combined with the laser efficiency dynamic adjustment technology, the glue shrinkage problem of laser drilling is reduced, and the drilling efficiency is improved; the electroplating process is simplified, the plasma cleaning step is omitted, meanwhile, material use is optimized, and the overall production cost is reduced.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The embodiment of the invention provides a packaging substrate laser drilling method and a packaging substrate, the packaging substrate comprises a first copper layer, a dielectric layer and a second copper layer which are stacked in sequence, and the method comprises the steps that first drilling operation is carried out with first laser energy, and an annular area is ablated on the first copper layer; second drilling operation is conducted through second laser energy, the copper cover in the middle of the annular area and part of the dielectric layer are removed, a blind hole is formed, and the second laser energy is smaller than the first laser energy; third drilling operation is carried out with third laser energy, the dielectric layer at the bottom of the blind hole is removed until the second copper layer is exposed out of the bottom of the blind hole, and the third laser energy is smaller than the second laser energy. According to the packaging substrate laser drilling method, on the premise that the laser drilling quality requirement is met, the laser drilling machining efficiency can be improved.

The invention discloses waste stripping equipment during quartz round hole forming, and relates to the technical field of laser drilling, the waste stripping equipment comprises a laser processing table, a laser drilling head is arranged on the laser processing table, and a waste stripping assembly is arranged on the laser processing table. Through operation of the waste stripping assembly, when laser finishes drilling a single round hole, hole core waste is immediately adsorbed through negative pressure and is vertically downwards separated from the round hole, the purpose of immediately stripping the waste is achieved, retention of the hole core waste in the round hole is avoided, and it is not needed to wait for laser drilling of all the round holes to be completed; the hole core waste of a single round hole is rapidly stripped in a high-temperature state, molten quartz left on the hole wall of the round hole and the hole core waste cannot be cooled and solidified, and secondary adhesion of the round hole and the hole core waste is avoided.

The utility model discloses a borosilicate glass laser-beam drilling machine, which relates to the technical field of borosilicate glass processing and comprises a base. The bottom of the bottom plate is fixedly connected with the top of the base; the bottom of the positioning assembly is fixedly connected with the top of the bottom plate, and the positioning assembly is used for positioning borosilicate glass; the outer side of the fixing assembly is fixedly connected with the inner side of the positioning assembly, and the fixing assembly is used for fixing borosilicate glass; the bottom of the shell is fixedly connected with the two sides of the bottom plate; and the top of the laser drilling machine body is fixedly connected with the top of the inner cavity of the shell. According to the device, the fixing assembly is arranged, so that glass is conveniently fixed, the working efficiency is improved, the positioning assembly is arranged, the position of the glass is adjusted, the glass does not need to be disassembled and reinstalled, and the glass punching position is conveniently changed.

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

The invention relates to the technical field of ceramic substrate processing, in particular to a high-precision ceramic circuit board micropore treatment process, which comprises the following steps: S1, raw material preparation: checking the integrity and flatness parameters of a high-precision ceramic circuit board raw material to ensure that the high-precision ceramic circuit board raw material meets the processing requirements, and placing the qualified raw material in a material waiting area at the starting end of a conveying mechanism; s3, positioning and feeding: when the ceramic circuit board arrives at a specific position, close to the laser drilling workbench, of the conveying mechanism, conveying the ceramic circuit board to the laser drilling workbench; the first main plate butt joint groove, the second main plate butt joint groove and the third toothed plate butt joint groove cooperate with the connecting bolt, the connecting bolt is acted by the ejector block along the first butt joint groove, the clamping block and the butt joint teeth are precisely driven to unlock, the toothed plate is meshed with the first gear and is driven by the second gear to enable the butt joint ring to rotate by 180 degrees, the direction of the chuck is precisely adjusted, manual errors are avoided, and the micropore machining precision is improved.

The preparation method of the glass-based top core plate comprises the following steps: providing a glass substrate, and forming an initial through hole in the glass substrate by adopting laser drilling; pressing a first dielectric material layer on the surface of the glass substrate and in the through hole; performing secondary laser drilling or mechanical drilling on the initial through hole to form a target through hole; electroplating the target through hole and forming a circuit; laminating the two glass substrates in the opposite directions of the dielectric material layers, and stacking a temporary substrate between the two glass substrates; performing primary layer adding of a second dielectric material on the stacked structure, wherein the layer adding number can be an odd number or an even number; removing the temporary base plate to realize plate disassembly; adding a third dielectric material on the surface of the top of the glass substrate after the glass substrate is detached; carrying out polish-brush planarization processing on the surface of the added layer to expose the circuit; forming redistribution layers on the planarized surface, wherein the number of the redistribution layers can be an odd number or an even number; according to the invention, the production yield can be improved, the warping of the substrate is reduced, the structural stability is enhanced, and the upper-layer RDL superfine circuit and the lower-layer thick circuit are conducted.

The invention provides a drilling processing method for a ceramic substrate. The drilling processing method for the ceramic substrate comprises the following steps: forming a large hole in the ceramic substrate by adopting laser drilling, wherein the aperture of the large hole is 0.25-5mm or is 0.5 times greater than the thickness of the ceramic substrate; filling the macropores with a composite material containing a ceramic filler and thermosetting resin, and forming a supporting layer through a curing process; and the supporting layer is mechanically drilled to form small holes, and the hole diameter of the small holes is smaller than that of the large holes. According to the ceramic substrate drilling machining method, through stepped drilling of laser taper hole guiding, composite material filling and mechanical precision drilling, the problem that small holes of a thin substrate are prone to cracking during machining is solved, the yield is increased, the risk of breakage of a hard drill bit for mechanical drilling can be reduced, machining time is shortened, and the production cost is reduced; the drilling processing method is compatible with various ceramic substrates, and can solve the problem of multi-material integration of electronic packaging.

The invention provides a laser drilling method. The laser drilling method comprises the following steps: S1, positioning a workpiece and determining a target aperture; s2, the rotating speed of the workpiece and the airflow direction of protective gas are determined; s3, determining laser power, laser frequency laser, scanning speed, laser beam focus movement diameter and zooming increment; s4, determining a laser incident angle; s5, the determined machining parameters are used for drilling; according to the laser drilling method provided by the invention, the drilling efficiency can be improved, the drilling quality can be improved, the taper can be greatly reduced, and the preparation of holes with various tapers can be realized through pose adjustment.

The utility model provides a cross-layer laser processing device, which relates to the technical field of circuit board processing and comprises a processing table and a laminate main body, a door-shaped support is bolted on the top surface of the processing table, a servo motor is bolted on the bottom surface of the top end of the door-shaped support, and an output shaft of the servo motor is connected with a reversing disc. Guiding air cylinders are symmetrically distributed on the two sides of the surface of the reversing disc, the movable ends of the guiding air cylinders are connected with punching motors, output shafts of the punching motors are connected with laser drill bits and micro positioning drill bits correspondingly, the surfaces of the laminates are preferentially positioned through the micro positioning drill bits, and then cross-layer drilling is conducted through the laser drill bits; compared with a traditional direct drilling mode, the mode that drilling is conducted after positioning is adopted, positioning is more accurate, meanwhile, compared with mechanical drilling, laser drilling is higher in efficiency, extrusion deformation between the laminate bodies is prevented, and nondestructive cross-layer drilling of the surfaces of the laminate bodies is achieved.