507 results about "Laser drilling" patented technology

The invention discloses a PCB laser drilling deviation detection method and system, and the method comprises the following steps: obtaining original image data corresponding to a PCB laser drilling region, standard hole site coordinate data in a drilling design file, and real-time operation parameter data corresponding to laser drilling equipment; performing preprocessing to generate preprocessed image data, a standard coordinate data set and an equipment operation reference data set; extracting edge contour feature data of a drilling area based on the preprocessed image data, and generating an initial deviation vector of an actual drilling contour and a design contour in combination with the standard coordinate data set; constructing a drilling deviation influence factor matrix based on the equipment operation reference data set in combination with the initial deviation vector, and generating a weight coefficient of each influence factor for drilling deviation; and correcting the initial deviation vector based on the weight coefficient, judging whether deviation exists in the drill hole or not, and generating a drill hole deviation detection result. According to the invention, the drilling deviation detection precision of the PCB can be improved.

The invention relates to the technical field of laser processing, particularly discloses an ultrathin prepreg single-emitting laser hole forming system, and aims to solve the contradiction among precision, thermal damage and efficiency in ultrathin prepreg laser processing. According to the system, through cooperation of an ultrashort pulse laser source, precise light beam shaping and transmission, material processing and positioning, real-time monitoring and feedback and an intelligent control and optimization module, laser and material interaction is finely regulated and controlled. In a single laser event or an equivalent single laser event, high-precision and low-damage microstructure processing of the ultrathin prepreg is realized, the defects of a heat affected zone, carbonization, layering and the like are effectively reduced, and the processing quality and efficiency are improved.

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method, a storage medium, laser drilling equipment and a high-frequency high-speed substrate. The laser drilling method comprises the steps that hole machining information of a hole structure is obtained, wherein the hole machining information comprises the hole position, the hole outer contour and the hole depth; taking the hole position as a positioning reference, and performing at least one of laser winding and cutting treatment and laser etching treatment on the high-frequency high-speed substrate to form a hole structure; wherein the laser winding and cutting treatment comprises the steps that first laser is controlled to move along a first closed path matched with the outer contour of the hole, so that the side wall of the hole structure is formed; and the laser etching treatment comprises the steps of controlling a second laser to carry out punching processing on an enclosed area of the outer contour of the hole so as to remove a base material in the enclosed area and form a bottom wall of the hole structure, and the method can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate and also can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate. And the processing efficiency of manufacturing a high-quality hole structure on the high-frequency and high-speed substrate can be obviously improved.

The invention provides an ultrafast laser drilling method for a carbon fiber composite material, and relates to the technical field of laser machining.The ultrafast laser drilling method comprises the steps that a material removal image and a plasma light intensity signal in the laser drilling process are obtained in real time, whether a fiber sputtering effect occurs in the material removal image or not is recognized, and if the fiber sputtering effect does not occur, the material removal image is recognized; if so, determining a hole-making influence area, and acquiring temperature distribution data of the hole-making influence area; analyzing to set a first revolution-rotation speed adjusting rule, and adjusting the revolution speed and the rotation speed of the laser based on the first revolution-rotation speed adjusting rule; and if the fiber sputtering effect occurs, quantifying the fiber sputtering effect to construct a rotation error signal, performing periodic analysis on the plasma light intensity signal to construct a revolution error signal, setting a second revolution-rotation speed adjustment rule, and adjusting the revolution speed and the rotation speed of the laser based on the second revolution-rotation speed adjustment rule.

The invention discloses a clamping device, laser machining equipment and a laser drilling method.The clamping device is used for clamping an annular workpiece and comprises mounting bases, a clamping belt, a driving wheel and a first telescopic mechanism, and the mounting bases are symmetrically arranged on the two sides of a clamping position of the workpiece; at least two rotating mechanisms used for being connected with the first ends of the first telescopic mechanisms are arranged on the side, close to the workpiece clamping position, of the mounting base, the second ends of the first telescopic mechanisms and the driving wheels are used for being supported on the inner surface of the clamping belt so as to tension the clamping belt, and the outer surface of the clamping belt is used for being tightly attached to and supported on the outer wall of the annular workpiece. The first telescopic mechanism is used for telescopically adjusting the distance between the clamping belt and a workpiece at the clamping position and / or adjusting the tension degree of the clamping belt; the rotating mechanism is used for driving the first telescopic mechanism to swing so as to adjust the position of the second end of the first telescopic mechanism; the driving wheel is used for driving the clamping belt to rotate when the clamping belt is matched with the workpiece so as to drive the workpiece to move.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The embodiment of the invention provides a packaging substrate laser drilling method and a packaging substrate, the packaging substrate comprises a first copper layer, a dielectric layer and a second copper layer which are stacked in sequence, and the method comprises the steps that first drilling operation is carried out with first laser energy, and an annular area is ablated on the first copper layer; second drilling operation is conducted through second laser energy, the copper cover in the middle of the annular area and part of the dielectric layer are removed, a blind hole is formed, and the second laser energy is smaller than the first laser energy; third drilling operation is carried out with third laser energy, the dielectric layer at the bottom of the blind hole is removed until the second copper layer is exposed out of the bottom of the blind hole, and the third laser energy is smaller than the second laser energy. According to the packaging substrate laser drilling method, on the premise that the laser drilling quality requirement is met, the laser drilling machining efficiency can be improved.

The invention discloses waste stripping equipment during quartz round hole forming, and relates to the technical field of laser drilling, the waste stripping equipment comprises a laser processing table, a laser drilling head is arranged on the laser processing table, and a waste stripping assembly is arranged on the laser processing table. Through operation of the waste stripping assembly, when laser finishes drilling a single round hole, hole core waste is immediately adsorbed through negative pressure and is vertically downwards separated from the round hole, the purpose of immediately stripping the waste is achieved, retention of the hole core waste in the round hole is avoided, and it is not needed to wait for laser drilling of all the round holes to be completed; the hole core waste of a single round hole is rapidly stripped in a high-temperature state, molten quartz left on the hole wall of the round hole and the hole core waste cannot be cooled and solidified, and secondary adhesion of the round hole and the hole core waste is avoided.

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

The preparation method of the glass-based top core plate comprises the following steps: providing a glass substrate, and forming an initial through hole in the glass substrate by adopting laser drilling; pressing a first dielectric material layer on the surface of the glass substrate and in the through hole; performing secondary laser drilling or mechanical drilling on the initial through hole to form a target through hole; electroplating the target through hole and forming a circuit; laminating the two glass substrates in the opposite directions of the dielectric material layers, and stacking a temporary substrate between the two glass substrates; performing primary layer adding of a second dielectric material on the stacked structure, wherein the layer adding number can be an odd number or an even number; removing the temporary base plate to realize plate disassembly; adding a third dielectric material on the surface of the top of the glass substrate after the glass substrate is detached; carrying out polish-brush planarization processing on the surface of the added layer to expose the circuit; forming redistribution layers on the planarized surface, wherein the number of the redistribution layers can be an odd number or an even number; according to the invention, the production yield can be improved, the warping of the substrate is reduced, the structural stability is enhanced, and the upper-layer RDL superfine circuit and the lower-layer thick circuit are conducted.

The invention provides a drilling processing method for a ceramic substrate. The drilling processing method for the ceramic substrate comprises the following steps: forming a large hole in the ceramic substrate by adopting laser drilling, wherein the aperture of the large hole is 0.25-5mm or is 0.5 times greater than the thickness of the ceramic substrate; filling the macropores with a composite material containing a ceramic filler and thermosetting resin, and forming a supporting layer through a curing process; and the supporting layer is mechanically drilled to form small holes, and the hole diameter of the small holes is smaller than that of the large holes. According to the ceramic substrate drilling machining method, through stepped drilling of laser taper hole guiding, composite material filling and mechanical precision drilling, the problem that small holes of a thin substrate are prone to cracking during machining is solved, the yield is increased, the risk of breakage of a hard drill bit for mechanical drilling can be reduced, machining time is shortened, and the production cost is reduced; the drilling processing method is compatible with various ceramic substrates, and can solve the problem of multi-material integration of electronic packaging.

The invention provides a molten pool dynamic simulation model and system for simulating laser drilling based on a level-set method, and the model comprises a two-dimensional molten pool simulation model which comprises heat transfer-laminar flow (two-phase flow) and level-set physical field coupling; on the basis of the confirmed implementation process parameters and material physical property parameters, a molten pool interface simulation metallographic phase under given process operation is compared with an actual metallographic phase, and a heat transfer mathematical model in the laser drilling process is obtained through simulation confirmation; and the three-dimensional thermal-mechanical coupling model is constructed based on a heat transfer mathematical model and further coupled with a solid mechanical physical field, so that temperature distribution and stress distribution at the welding printing position in the laser drilling process are obtained through simulation. The technical problems that in an existing laser drilling welding technology, parameter debugging depends on experience, dynamic monitoring of a molten pool is difficult, and thermal stress prediction means are lacked can be effectively solved, and powerful theoretical support and data basis are provided for optimizing the welding technology and improving the welding quality.

The invention discloses a machining method for improving the quality of a carrier plate through laser drilling. The machining method comprises the following steps that a first copper foil layer is cleaned, and the surface roughness of the first copper foil layer is detected; a laser drilling machine is adopted to machine a plurality of grooves in the surface of the first copper foil layer; the laser drilling machine performs roughness processing on the surface of the first copper foil layer in an out-of-focus scanning mode to form a rough surface with a convex structure; and the second dielectric layer is laminated with the first copper foil layer subjected to roughness processing. According to the method, laser drilling is directly adopted to carry out groove and roughness processing on the copper foil layer, and after the groove is additionally formed in the surface of the copper foil layer, the groove is filled with the filling material to form a mechanical anchoring point; meanwhile, due to the surface roughness design of the copper foil layer, the filling material can be better attached, the interlayer binding force is enhanced, and layering is avoided; in addition, the groove serves as a part of a heat conduction path, the high heat conductivity of copper can be utilized, heat distribution can be more uniform, heat can be transmitted to surrounding materials more quickly, and heat stress is reduced.

The application discloses a kind of laser trepanning devices, including host computer, and cooperate the laser cutting head of host computer, cable is connected between the host computer and the laser cutting head, further including support device, vertical lifting device is installed by the support device, the part cut down on plate is lifted after passing through the vertical lifting device and separates from main plate, rotary device is rotationally equipped by the vertical lifting device, the laser cutting head is installed by the rotary device, after the rotary device revolves around the vertical lifting device, the laser cutting head is completed trepanning after revolving on the surface of main plate, the host computer is installed by the support device, pull wire device is installed by the support device, the cable is clamped by the pull wire device, the cable passes through the support device;The device can be moved trepanning, meet the need of large trepanning, and facilitate separation of waste.

The invention provides ceramic plate laser drilling equipment, which relates to the laser drilling processing technology and comprises a drilling unit, a shell is arranged on one side of the drilling unit, a transfer unit is arranged on the front sides of the drilling unit and the shell, a cleaning unit is arranged at the top of the drilling unit in a sliding manner, and a partition plate is fixedly arranged in the shell. The interior of the shell is divided into a detection chamber and a collection chamber through a partition plate, a trimming unit is assembled in the detection chamber, an extending absorption unit is assembled in the collection chamber, and the absorption unit is connected with the trimming unit and the cleaning unit; the trimming unit comprises a conveying assembly, a first cleaning assembly, a second cleaning assembly and a discharging assembly. The absorption unit comprises a first-stage fan, a first negative pressure pipe, a second negative pressure pipe and a collection assembly. Through mechanical linkage and modular cooperation design, closed-loop automation of punching, cleaning and sorting is achieved, and the technical effects are concentrated on efficiency improvement, thorough cleaning and environmental protection.

The application provides a laser drilling process monitoring and regulation combined protection method and system, which comprises the following steps: collecting signal evolution information, current hole depth and motion trajectory information in a laser drilling process; performing feature extraction on the obtained signal evolution information to obtain time sequence characteristic values evolving with time, and constructing a penetration time prediction model according to the obtained time sequence characteristic values; combining the obtained current hole depth and motion trajectory information with the time sequence characteristic values to construct a hole drilling stage identification model; comprehensively constructing a state identification model by combining a penetration time prediction model prediction result with a hole drilling stage identification model identification result confidence at different moments; identifying a current hole drilling processing stage according to the obtained state identification model, controlling a laser processing process according to an identification result, and adopting different hole drilling strategies in different hole drilling stages; and the application can ensure efficient, high-precision and no-wall-damage processing of the laser drilling process.

The invention provides a pixelated perovskite-based array X-ray imaging detector preparation method and system and a medium, and the method comprises the steps: selecting a polyimide film, and forming a through hole array pattern on the polyimide film; performing layered ablation on the polyimide film based on a laser drilling process to obtain a through hole; injecting UV peelable glue into the through hole to form a bottom barrier layer, jet-printing an annular glue ridge on the inner wall of the through hole to form a side wall partition, and depositing an Au electrode layer; removing the UV peelable glue by adopting a UV glue stripping solution, and growing perovskite crystals in the through holes based on a solution method or a solid-phase melting method; preparing a TFT (Thin Film Transistor) array on the polyimide film, and forming an insulating coating at the bottom of the polyimide film by adopting an evaporation or chemical vapor deposition process to obtain an imaging detector; according to the invention, high-precision and high-reliability integration of the polyimide film and the TFT array is realized, the charge collection efficiency is improved, the signal crosstalk is reduced, and micron-sized pixel size detection is realized.

The invention provides a low-damage CFRP laser drilling device and method based on dynamic multi-mode light beam regulation and control. The CFRP laser drilling device comprises an ultrafast laser source, a dynamic light field regulation and control module, a double-pulse regulation and control module, a galvanometer scanning module, a motion module and a controller module, the ultrafast laser source, the dynamic light field regulation and control module, the double-pulse regulation and control module and the galvanometer scanning module are arranged on the same light path, and the motion module is used for bearing a workpiece to be machined. The controller module is connected with the ultrafast laser source, the dynamic light field regulation and control module, the double-pulse regulation and control module, the galvanometer scanning module and the motion module. According to the method, the energy density can be accurately regulated and controlled in a microsecond-level time domain and a micron-level space range, so that the CFRP microporous structure with low heat influence, high consistency and high geometric accuracy is prepared, the stability and reliability of the machining process are effectively improved, and the requirement for micropore precision machining in the fields of aerospace and precision manufacturing is met.

The invention relates to the technical field of laser drilling, in particular to a multiband laser time-sharing machining system for a large-length-diameter-ratio deep hole in a superhard and brittle material, which comprises a shell, and a picosecond laser, a femtosecond laser, two field lenses, a dichroic mirror, a beam shaping device and a laser head which are arranged in the shell, and a heat dissipation device is arranged at the bottom end of the beam shaping device in the shell. A multi-stage chip removal device is installed at the end of the laser head, and the picosecond laser and the femtosecond laser are combined through a dichroic mirror and share the same light beam shaping device. The femtosecond laser device and the picosecond laser device are integrated, lasers of different wave bands are emitted in a time-sharing mode, and efficient and high-precision machining of the large-length-diameter-ratio deep hole of the super-hard and brittle material is achieved. Meanwhile, the multi-stage chip removal device cleans fines generated by machining in time in an air blowing and negative pressure suction mode, and the machining quality is guaranteed.

The invention relates to the technical field of silicon nitride ceramic trepanning, in particular to a femtosecond laser trepanning method and device for silicon nitride ceramic. The invention discloses a femtosecond laser trepanning method for silicon nitride ceramics. The method comprises the following steps: pre-preparation work; the fixed silicon nitride ceramic substrate is holed based on a three-stage scanning strategy, and the effective depth of field is constrained by the Rayleigh length; the three-stage scanning strategy is as follows: S1, low-energy grooving; s2, high-energy multiple cutting; s3, performing low-energy stroke trimming; annular feeding is executed according to a preset two-dimensional hole site vector path during scanning in each stage of the three-stage machining process. According to the method, high-quality and high-controllability micropore array processing can be realized on the silicon nitride ceramic substrate, and the method has wide engineering application value.

The application discloses a tunnel laser drilling device and relates to the technical field of tunnel drilling. The device comprises a first positioning device for laser positioning of a top hole, a second positioning device for laser positioning of a side wall hole, an auxiliary arm drilling device, a work platform for rotary and lifting movements, and a control device. The auxiliary arm drilling device is used for drilling operation of the top hole and the side wall hole. The first positioning device, the second positioning device, the auxiliary arm drilling device, and the work platform are all connected with the control device. The device can realize quick and accurate positioning and drilling operation, and is also beneficial to reducing the labor intensity of operators.

The invention relates to a high-quality and high-efficiency laser drilling method. Aiming at the problems of low processing efficiency, poor hole making quality, unstable processing technology and the like in small hole laser processing of difficult-to-process materials, the method specifically comprises the following steps of: 1, performing high-feed rotary spiral hole making, and removing a large amount of materials to form through holes; namely, a proper rotating laser beam (rotating radius r1) is selected to form a laser ring, and spiral drilling is performed in a high-feed manner, so that a large amount of materials can be removed, and through holes can be formed. The second step is low-feed rotary finish machining, a small amount of materials are removed to form a through hole, the rotating radius r2 of a rotating laser beam is adjusted, the hole is subjected to finish machining at the low z-axis feeding speed, the high-quality through hole is obtained, and if the quality of the through hole or the hole repairing part is not qualified, the parameters are further adjusted. According to the method, the advantages of high femtosecond laser machining precision and small thermal damage are combined, efficient machining of the small holes is achieved, and a solution is provided for high-quality and efficient machining of the small holes.

The invention relates to the technical field of laser drilling, in particular to a real-time monitoring acousto-optic deflection laser drilling system, method, equipment and medium, and the system comprises a laser light source, a power monitoring module, an acousto-optic deflector, a galvanometer, a three-light coaxial device and a control system. The power monitoring module collects a power signal of a machining laser beam in real time, and the control system compares the power signal with a preset threshold value and dynamically adjusts laser output parameters. The three-light coaxial device carries out in-situ imaging on the surface of a workpiece while transmitting laser to obtain a drilling morphology image, and a control system recognizes defects such as fused heap or hole shape distortion based on the image and dynamically adjusts laser machining parameters or light beam deflection parameters. According to the system, through a double-closed-loop feedback mechanism, synchronous regulation and control of laser energy and machining morphology are achieved, and the consistency and precision of micropore machining are remarkably improved.

The invention relates to the field of data processing, in particular to an automatic optimization method for a laser drilling path of a circuit board, and introduces a dual-pheromone ant colony algorithm to overcome the defect that a traditional algorithm only pursues a shortest path but neglects a heat accumulation effect. Two independent pheromones of path length and heat distribution are constructed, a hole site neighborhood heat influence factor and a path global heat entropy are defined to quantify the heat dissipation performance, and an algorithm is guided to consider the distance and heat during path selection, so that the processing efficiency and heat control are effectively balanced, the algorithm is prevented from falling into a suboptimal solution due to local heat concentration, and the processing efficiency is improved. And finally, a comprehensive optimal path considering the path length and the heat dissipation effect is found. According to the method, the path length pheromone and the heat distribution pheromone are constructed and independently updated by adopting the dual-pheromone ant colony algorithm, so that the drilling path length and heat control are balanced, and the optimal solution is found.

The invention relates to the field of safety air bag blast tube machining, and discloses a laser tapping machine for a safety air bag blast tube, the laser tapping machine comprises a bottom plate and a laser tapping head, two first fixing plates are fastened on the upper surface of the bottom plate close to the middle through bolts, and a material transfer structure is arranged between the two first fixing plates; a second fixing plate is fastened to each first fixing plate through a bolt, abutting turnover structures are arranged on the two second fixing plates, two third fixing plates are connected to the two sides of the upper face of the bottom plate, and a laser trepanning head is arranged on a movable lifting structure between the two third fixing plates; material storage structures are arranged on the edges of the front side and the rear side of the upper face of the bottom plate, when a blasting pipe is fed to a tapping position, the blasting pipe is automatically subjected to abutting tapping through an abutting overturning structure, the abutting blasting pipe can be automatically driven to be overturned, the tapping requirements of different positions are met, operation is more labor-saving and convenient, and the production efficiency is improved. And the working efficiency is greatly improved.

The waterproof breathable device comprises a panel, waterproof breathable cloth and a bottom plate which are sequentially stacked, the panel and the bottom plate are provided with corresponding breathable areas, the waterproof breathable cloth is provided with a plurality of through holes, and the through holes are correspondingly distributed in the breathable areas and the periphery of the bottom plate. And the panel is bonded with the bottom plate through the through hole. The breathable waterproof cloth disclosed by the utility model is subjected to laser drilling treatment, so that the fitting firmness of the hot melt adhesive, the waterproof cloth and the TPU is remarkably enhanced, shoe parts have excellent waterproofness and breathability, and the durability and the use experience of products are improved.

The application belongs to the technical field of laser precision machining, and particularly relates to a laser drilling method for heterogeneous composite materials based on partition parameter regulation. f In view of the problems that a multilayer heterogeneous structure such as a SiC / SiC composite material is prone to hole wall cracking, interface delamination and re-solidification blockage in through-hole machining, the workpiece is divided into a coating area and a matrix area, the scanning speed, the focal point increment and the scanning number matching the material characteristics are selected respectively, and linear variable pitch spiral scanning combined with workpiece self-rotation is adopted to realize the relative uniform distribution of the energy density in the hole. On the premise of ensuring the integrity of the coating / matrix interface, the method can effectively reduce the hole taper and obtain a high-quality through-hole with smooth hole wall and significantly reduced defects.

The invention provides a through hole preparation method and device, a multi-layer circuit board and electronic equipment, in the through hole preparation method, a middle through hole located in a middle patterned conductive layer and the middle patterned conductive layer are formed through one-time etching, so that when a target through hole is formed through the method, laser does not need to be used for drilling in the middle patterned conductive layer, and the through hole preparation efficiency is improved. According to the method, the first blind hole and the second blind hole are obtained only by respectively carrying out laser drilling on the first patterned conductive layer and the second patterned conductive layer, and the first blind hole, the middle through hole and the second blind hole can be communicated to form the target through hole, so that when the target through hole is formed by the method, the laser drilling frequency can be reduced, the working procedure is simplified, the process cost is reduced, and the production efficiency is improved. And the efficiency is also improved. Besides, compared with mechanical drilling, according to the through hole preparation method, the target through hole is formed through laser drilling, the diameter of the formed target through hole is small, and the occupied area of the board is small.

This invention discloses a high-altitude high-intensity laser drilling device for power transmission towers, relating to the technical field of laser cutting and drilling devices. It includes a positioning disk one and a positioning disk two, with an installation assembly positioned between them. A support assembly is slidably mounted on the side wall of the installation assembly. A drive assembly is mounted on the side wall of the positioning disk one. An axial adjustment assembly is rotatably connected inside the drive assembly. A laser generator is rotatably mounted inside the axial adjustment assembly. The laser generator moves axially through the drive of the axial adjustment assembly, and the axial adjustment assembly rotates eccentrically between the positioning disk one and the positioning disk two through the drive assembly. By setting an eccentric circular groove built into the drive assembly, and cooperating with a gear meshing transmission structure, the axial adjustment assembly and the laser generator can achieve stable eccentric revolution, forming a regular annular cutting trajectory according to processing requirements, effectively ensuring the consistency and centerness of the drilled hole diameter, and avoiding excessive hole diameter deviation.

The application discloses an improved semi-additive process based on customized ultra-thin copper foil flexible copper-clad plate and a fine circuit board, and belongs to the technical field of flexible printed circuit boards. The process adopts a customized ultra-thin copper foil FCCL substrate, and the circuit is prepared through substrate selection pretreatment, pattern size pre-compensation, laser drilling and black shadow process hole metallization, pattern transfer and selective electroplating thickening, film stripping and flash etching forming. The micro-etching amount is cooperatively controlled throughout the process, and combined with optimized plasma cleaning and high hole filling electroplating, the fine circuit production with a minimum line width and line spacing of 45 microns or less can be stably realized, and the highest fine circuit production can reach 25 / 25 microns. The application solves the problems of traditional process, such as large side etching, low precision, poor yield and the like, and the circuit board prepared has the advantages of excellent size stability, strong heat resistance and uniform micro-hole filling, is suitable for high-density interconnection and high-end consumer electronic demand, and has significant advantages of precision, yield and reliability compared with existing processes.