1273 results about "Laser drilling" patented technology

The present disclosure provides a protective method and system combining process monitoring and control in laser drilling. This method includes collecting signal evolution information, a current hole depth, and motion track information in a laser drilling process; performing a feature extraction on the signal to obtain sequential eigenvalues evolving over time, and constructing a prediction model of the penetration time based on the eigenvalues; combining the hole depth and motion track information with the eigenvalues to construct a drilling stage identification model; combining a prediction result of the prediction model of penetration time and identification confidence of the identification model at different moments to construct a state identification model; and judging a current drilling stage according to the model, controlling the processing process according to a judgment result, and using different drilling strategies at different drilling stages. High-efficiency, high-accuracy, and wall-damage-free processing can be ensured.

The invention discloses a PCB laser drilling deviation detection method and system, and the method comprises the following steps: obtaining original image data corresponding to a PCB laser drilling region, standard hole site coordinate data in a drilling design file, and real-time operation parameter data corresponding to laser drilling equipment; performing preprocessing to generate preprocessed image data, a standard coordinate data set and an equipment operation reference data set; extracting edge contour feature data of a drilling area based on the preprocessed image data, and generating an initial deviation vector of an actual drilling contour and a design contour in combination with the standard coordinate data set; constructing a drilling deviation influence factor matrix based on the equipment operation reference data set in combination with the initial deviation vector, and generating a weight coefficient of each influence factor for drilling deviation; and correcting the initial deviation vector based on the weight coefficient, judging whether deviation exists in the drill hole or not, and generating a drill hole deviation detection result. According to the invention, the drilling deviation detection precision of the PCB can be improved.

The invention relates to the field of intelligent detection, and provides a process for laser drilling of hole deviation of high-density through holes in an ultrathin substrate, which adopts an image recognition and processing technology based on computer vision to extract drill hole distribution characteristics of a drill hole distribution detection image and a drill hole distribution design image and enhance grid significant characteristics. And intelligently obtaining a hole deviation identification result according to the drill hole distribution difference between the enhanced features of the drill hole distribution detection image and the drill hole distribution design image. Thus, finer aperture details can be captured, the accuracy and precision of high-density through hole deviation identification are improved, the influence of human factors is reduced, the consistency and reliability of detection are ensured, and the identification process is more automatic and efficient.

The invention discloses an HDI micro blind hole laser drilling processing method and system, and relates to the field of HDI drilling processing, CO2 laser drilling is firstly carried out on a plate, then UV laser shaping is carried out, finally quality detection is carried out, and the core is that a plurality of local datum points distributed in a matrix mode are preset on the HDI plate to be processed. In the CO2 laser drilling process, the drilling task and the positioning action of the local datum point are executed alternately through a control program. By periodically measuring the actual position of the adjacent local datum point in the machining period, the dynamic position offset generated in the area due to the heat effect can be captured in real time, and the machining coordinates of the follow-up target drilling point in the area can be corrected in real time through the offset. The continuous local dynamic compensation effectively overcomes the dynamic thermally induced deformation problem which cannot be handled by the traditional single global correction, so that the drilling precision in the large-size and high-density machining process is ensured.

The invention relates to a laser drilling method for a thin copper HDI circuit board. The laser drilling method comprises the following steps that a circuit board to be machined is positioned and installed on a machining station of laser machining equipment; a first section of laser drilling is carried out, a first laser parameter is adopted, uncovering drilling is carried out on a preset machining area of the outer copper foil layer, and an initial hole structure is formed; performing second-section laser drilling, namely performing compensation drilling on the dielectric layer exposed at the bottom of the initial hole structure by adopting a second laser parameter of which the energy is lower than that of the first laser parameter to form a transition hole structure; and in the third section of laser drilling, a third laser parameter with energy lower than that of the second laser parameter is adopted, the bottom of the transition hole structure is trimmed, and a final hole channel is formed. According to the method, drilling is conducted in three sections, namely the first section of uncovering drilling, the second section of compensation drilling and the third section of finishing treatment. Therefore, the bottom cushion copper cannot absorb a large amount of heat in a short time, the base material layer below the bottom cushion copper can be protected from being burnt, and the product quality is improved.

The invention discloses a cross-level laser drilling method utilizing UV laser and carbon dioxide laser, and belongs to the technical field of printed circuit boards. The cross-level laser drilling method utilizing the UV laser and the carbon dioxide laser burns through a required penetrating layer with a copper layer through high-energy UV laser drilling; the dielectric layer on the reserved layer bottom copper is burnt out and subjected to hole finishing by adopting carbon dioxide laser drilling, so that no adhesive residue is ensured under the condition that the hole bottom is not burnt through, the conduction connection performance of the printed circuit board is ensured, the processing quality stability of the printed circuit board is improved, and the production cost is reduced. And the problems of burning through and burning loss of a bottom copper layer caused by high energy of UV laser can be well improved.

The invention relates to the technical field of laser drilling machines, in particular to a precise positioning laser drilling machine and a positioning structure thereof. According to the precise positioning laser drilling machine and the positioning structure thereof, the first electric push rod drives the positioning base to position the left side and the right side of a plate, then the second electric push rod drives the clamping base to descend, the edge of the plate is flattened, the plate positioning and fixing stability is improved, smoke generated in the drilling process is covered by the protection bin, and the positioning effect is good. The draught fan drives external air to be input into the air bin, air curtains are formed on the surface of the observation window and the feeding and discharging port, smoke is prevented from leaking out of the feeding and discharging port while the observation window is prevented from being covered with dust, meanwhile, centralized treatment of the smoke is achieved through work of the smoke purifier, and fixation of a plate is relieved after drilling is completed. The conveying belt works to drive the plates to move towards the outer side of the protection bin through the feeding and discharging port, meanwhile, an air curtain formed by the air bin conducts air cooling heat dissipation on the surfaces of the plates, the discharging convenience and safety are improved, and the production and machining efficiency is improved.

The invention discloses a PCB blind hole machining method and device, laser drilling equipment and a storage medium, the laser drilling equipment comprises a picosecond or femtosecond laser device and a CO2 laser device, after a first machining parameter of the picosecond or femtosecond laser device and a second machining parameter of the CO2 laser device are determined, on one hand, the first machining parameter of the picosecond or femtosecond laser device and the second machining parameter of the CO2 laser device are determined; the picosecond or femtosecond laser performs cold machining on the surface copper layer to form the annular heat insulation groove, the surface copper layer can be prevented from generating suspended copper at the opening of the blind hole, on the other hand, heat generated when the CO2 laser machines the blind hole can be prevented from being diffused to the opening of the blind hole in the surface copper layer through the annular heat insulation groove, suspended copper is further prevented from being generated, and on the other hand, the heat dissipation efficiency is improved. The picosecond or femtosecond laser device with low processing efficiency is adopted for annularly cutting the annular heat insulation groove in the surface copper layer, then the CO2 laser device with high processing efficiency is used for removing materials in the area in the outer contour of the annular heat insulation groove to achieve drilling, the processing efficiency of the two laser devices with different processing efficiency is considered, and the laser drilling efficiency is improved.

The invention belongs to the field of laser drilling, and discloses a blind hole laser machining system and method.The blind hole laser machining system comprises a laser, a zoom beam expander, a dynamic zoom module and a scanning galvanometer; a zoom beam expander is arranged at an outlet of the laser, and the zoom beam expander is sequentially provided with a dynamic zoom module and a scanning galvanometer in the laser emission direction; wherein the dynamic zooming module is used for changing the divergence angle of a laser beam so as to adjust the focal length in real time, and a first laser beam and a second laser beam are emitted through the exit aperture of the scanning galvanometer. Through focusing and microsecond-level compensation of the dynamic focusing module on the laser focus, accurate focusing in a three-dimensional space is achieved, light spots are adjusted in real time, the problem that the light path of double lasers is unstable is solved, and the machining precision in the whole machining process is ensured.

The invention discloses a laser drilling method and system for a heterogeneous laminated material. The laser drilling method comprises the steps that a first acoustic emission sensor and a second acoustic emission sensor are arranged; in the blind hole forming process, the depth of the blind hole is obtained through a second acoustic emission sensor; determining the laying angle of the carbon fiber prepreg cloth according to the depth of the blind hole, calling a first acoustic emission sensor, and collecting an acoustic emission signal; judging whether the metal layer is exposed or not according to an acoustic emission signal acquired by a first acoustic emission sensor, and if the metal layer is considered to be exposed, acquiring a spectral signal in real time through a laser-induced breakdown spectroscopy detection system; and outputting the laser beam again, and controlling the laser beam to perform layer-by-layer scanning. The position of the metal layer in the blind hole machining process is preliminarily positioned based on the acoustic emission sensor system, then LIBS is used for accurately positioning distribution of the metal layer, laser process parameters are fed back and adjusted, and the spiral track during laser scanning is adjusted, so that the blind hole machining quality is improved.

The present invention relates to the field of medical catheter drilling, and in particular to a fully automatic medical catheter laser drilling machine, comprising a drilling platform, a feed limit tube for limiting the catheter is fixed on the top of the drilling platform, one end of the feed limit tube is provided with a semicircular arc portion, and the catheter contacts and cooperates with the inner wall of the feed limit tube and the inner wall of the semicircular arc portion, a cylindrical support rod for supporting the inner wall of the catheter is placed in the feed limit tube, and a magnet is fixed on one end of the cylindrical support rod. The fully automatic medical catheter laser drilling machine realizes the periodic operation of catheter transportation and drilling through the cooperation of an active cam, a driven cam and a driving device, making the whole process more orderly and efficient. The catheter is supported by the arrangement of a magnet and a cylindrical support rod, which not only facilitates periodic feeding and realizes equidistant drilling, but also makes the drilling accuracy more accurate. The start of the laser drilling component is automatically controlled by the arrangement of a contact switch.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

The invention discloses a sheet metal laser drilling device, relates to the field of sheet metal processing, solves the problem that it is difficult for existing laser drilling devices to clean up the residues generated by laser drilling in time, comprises: a device base and a processing table fixedly installed on the top of the device base, a processing plate fixedly installed on the top of the processing table, a plurality of supporting tooth plates equidistantly distributed are fixedly installed on the inner side of the processing plate, driving slide rails are fixedly installed on both sides of the processing table, a U-shaped frame is fixedly installed between the two driving slide rails, and a laser transmitter is arranged at the bottom of the U-shaped frame; further comprises: a slag collecting mechanism, which is used to collect the sheet metal residues generated by the laser transmitter, and the slag collecting mechanism is installed inside the processing table; the invention can receive sparks and residues generated by the punching point at the bottom of the sheet metal when the laser transmitter punches the sheet metal through the slag collecting mechanism, prevent the sparks and residues from splashing, solve the problem of residue accumulation, and thus achieve the effect of residue collection.

The invention relates to the technical field of laser processing, particularly discloses an ultrathin prepreg single-emitting laser hole forming system, and aims to solve the contradiction among precision, thermal damage and efficiency in ultrathin prepreg laser processing. According to the system, through cooperation of an ultrashort pulse laser source, precise light beam shaping and transmission, material processing and positioning, real-time monitoring and feedback and an intelligent control and optimization module, laser and material interaction is finely regulated and controlled. In a single laser event or an equivalent single laser event, high-precision and low-damage microstructure processing of the ultrathin prepreg is realized, the defects of a heat affected zone, carbonization, layering and the like are effectively reduced, and the processing quality and efficiency are improved.

The invention discloses a manufacturing method of an insulating printed circuit board based on high voltage resistance. The manufacturing method comprises the following steps: S1, mixing ceramic powder and polyimide, and heating and curing to form a base material; s2, pollutants on the surface of the base material are removed through a plasma cleaning technology, and the binding force of the base material and a subsequent layer is improved; s3, transferring a circuit pattern to the surface of the base material on the base material through a laser direct writing technology; s4, performing deposition on the circuit pattern through a vacuum deposition technology to form a copper film layer; s5, performing mask manufacturing by using photoresist, and removing the copper film layer which is not covered by the mask through wet or dry etching to form a circuit; s6, a laser drilling technology is used for drilling micropores, and the inner walls of the micropores are metalized through a chemical copper plating technology; and S7, after circuit manufacturing is completed, ultraviolet light curing epoxy resin is used as an insulating coating. The circuit board material and the implementation method are innovated, so that the problems in the prior art are solved, and the voltage resistance, the insulating property and the reliability of the circuit board are improved.

The invention discloses an HDI circuit board laser drilling device, and particularly relates to the technical field of HDI circuit board drilling, the HDI circuit board laser drilling device comprises an operation table, a rotating mechanism is rotatably connected to the right side of the middle of the upper end of the operation table, a transmission mechanism is rotatably connected to the front side of the upper end of the operation table, and a drilling mechanism is fixedly connected to the middle of the upper end of the operation table; an air blowing mechanism is arranged on the left side of the lower portion of the drilling mechanism. According to the HDI circuit board laser drilling device, in the descending process of the laser drilling head, a baffle is driven to be matched with a rectangular block, the HDI circuit board can be automatically and accurately positioned, the drilling precision and efficiency are improved, in the drilling process, a spray head is matched with a limiting pipe and a first sliding block, and therefore the HDI circuit board can be accurately drilled. According to the HDI circuit board drilling device, the surface of a drilled HDI circuit board is cleaned through the soft brush, chippings and dust generated in the drilling process can be removed, meanwhile, in the reset process of the laser drilling head, the surface of the drilled HDI circuit board is cleaned through the soft brush, the residual chippings and dust can be removed, and the cleanliness of the HDI circuit board is guaranteed.

The invention discloses a high-precision circuit board laser drilling process, and particularly relates to the technical field of circuit board processing, and the high-precision circuit board laser drilling process comprises the following steps: step 1, selecting a high-quality base material and a copper-clad layer, and carrying out pretreatment on the base material, the pretreatment comprises cleaning and deoxidation, and the interaction efficiency of laser and the material is improved; 2, according to the design requirement of the circuit board, the position needing to be drilled and the aperture size are determined and completed through CAD software, a drilling data file is generated, the circuit board to be drilled is fixed to a drilling machine, and it is guaranteed that the board face is smooth and free of deformation; thirdly, a CO2 laser is selected, light beam focusing, laser power stability and laser beam uniformity of laser drilling equipment are optimized, and stability and accuracy of laser are guaranteed. According to the invention, high-precision laser drilling processing can be realized, the drilling processing quality of the circuit board can be ensured, the processing defective rate is obviously reduced, the popularization and the use are facilitated, and meanwhile, the method is suitable for a modern production process.

The invention provides a pipe laser drilling device, which belongs to the technical field of laser processing, and comprises a rack, and a feeding mechanism, a positioning mechanism and a laser cutting mechanism which are arranged above the rack, a bearing plate is arranged on the rack, a bearing rod capable of being inserted into an inner cavity of a pipe is arranged in the middle of the bearing plate, a framework is transversely and slidably connected to the end, close to the laser cutting mechanism, of the bearing rod through a spring, and rubber rings capable of abutting against the inner wall of the pipe are arranged at the left end and the right end of the outer surface of the framework. Two scraping plates are vertically and slidably connected into vertical holes formed in the bearing rod through tension springs. A hydraulic cavity channel is formed in the bearing rod and communicates with the vertical hole and the sliding groove where the framework is located at the same time, and a locking piece used for locking the scraper blade in the vertical hole is arranged on the bearing rod. According to the device, the probability of bending deformation of the pipe can be reduced while burrs at the hole of the pipe are removed.

The invention relates to the technical field of glass pot cover machining, and discloses glass pot cover machining equipment and a method thereof.The glass pot cover machining equipment comprises a protective cover, a conveying mechanism, a clamp, a precise recognition control system, an ultraviolet laser system and a man-machine interaction system, a punching machining area is arranged in the middle of the conveying mechanism, and the clamp comprises two full-wrapping clamping arms and two half-wrapping clamping arms; a cooling and dust-settling mechanism is arranged outside the protective cover and comprises a cooling and dust-settling spray head, and a communicating hose which is integrally communicated with the cooling and dust-settling spray head is arranged outside the cooling and dust-settling spray head. In the process of clamping and positioning the glass pot cover, the cooling and dust falling spray head can spray cooling liquid to pre-cool the surface of the glass pot cover, and in the process of laser drilling of the glass pot cover, the cooling and dust falling spray head can conduct cooling and dust falling on the drilling position along with movement of the laser drilling head; and the punching precision is prevented from being influenced by the heat effect generated at the punching position.

The invention belongs to the field of laser drilling, and relates to a laser micro-hole machining optical system and a micro-hole machining method.The laser micro-hole machining optical system comprises a laser, a beam expander, a parallel plate, a galvanometer, a spectroscope, a focus lens and a rotary wave plate set; the beam expander, the parallel plate, the galvanometer, the spectroscope and the focus lens are sequentially arranged on a light path where emergent light of the laser is located from front to back. The rotary wave plate group is arranged on a light path where emergent light of the laser is located and located at any position between the beam expander and the focus lens. According to the laser micro-hole machining optical system and the micro-hole machining method, the polarization state of the optical system can be achieved and changed, and debugging is convenient.

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method, a storage medium, laser drilling equipment and a high-frequency high-speed substrate. The laser drilling method comprises the steps that hole machining information of a hole structure is obtained, wherein the hole machining information comprises the hole position, the hole outer contour and the hole depth; taking the hole position as a positioning reference, and performing at least one of laser winding and cutting treatment and laser etching treatment on the high-frequency high-speed substrate to form a hole structure; wherein the laser winding and cutting treatment comprises the steps that first laser is controlled to move along a first closed path matched with the outer contour of the hole, so that the side wall of the hole structure is formed; and the laser etching treatment comprises the steps of controlling a second laser to carry out punching processing on an enclosed area of the outer contour of the hole so as to remove a base material in the enclosed area and form a bottom wall of the hole structure, and the method can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate and also can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate. And the processing efficiency of manufacturing a high-quality hole structure on the high-frequency and high-speed substrate can be obviously improved.

The invention provides an ultrafast laser drilling method for a carbon fiber composite material, and relates to the technical field of laser machining.The ultrafast laser drilling method comprises the steps that a material removal image and a plasma light intensity signal in the laser drilling process are obtained in real time, whether a fiber sputtering effect occurs in the material removal image or not is recognized, and if the fiber sputtering effect does not occur, the material removal image is recognized; if so, determining a hole-making influence area, and acquiring temperature distribution data of the hole-making influence area; analyzing to set a first revolution-rotation speed adjusting rule, and adjusting the revolution speed and the rotation speed of the laser based on the first revolution-rotation speed adjusting rule; and if the fiber sputtering effect occurs, quantifying the fiber sputtering effect to construct a rotation error signal, performing periodic analysis on the plasma light intensity signal to construct a revolution error signal, setting a second revolution-rotation speed adjustment rule, and adjusting the revolution speed and the rotation speed of the laser based on the second revolution-rotation speed adjustment rule.

The invention relates to the technical field of laser drilling and cutting, in particular to a laser drilling and cutting device for lamp metal shell machining and a method thereof.The laser drilling and cutting device comprises a base, a feeding base, a conveying shaft, a fixing piece and a laser head, the feeding base is installed at one end of the base, and the end, close to the base, of the feeding base is fixedly connected with a material guide plate; a movable plate is slidably arranged below the end, away from the material guide plate, of the feeding base, a material guide inclined plate is fixedly connected to the side, close to the feeding base, of the top end of the movable plate, and a material guide straight plate is fixed to the other end of the material guide inclined plate; the outer sides of the transmission shafts on the inner sides of the base and the feeding base are in meshed connection with a conveying rubber plate and a conveying belt correspondingly. One end of each transmission shaft penetrates through the base and is fixedly connected with a transmission rod. According to the scheme, through continuous conveying and guiding positioning, the machining efficiency of the laser drilling and cutting device on the lampshade metal shell is higher, the machining process is more stable and accurate, and the machining quality of the lamp metal shell is guaranteed.

The invention discloses an HDI plate manufacturing process for a pen electronic camera module, and the process comprises the steps: carrying out the multi-frequency acoustic wave penetration and temperature gradient processing of a substrate, and obtaining the pre-detection data of the substrate; in the laser drilling process, short-pulse multi-frequency acoustic waves and local heat regulation are applied to a target hole area, and micropore acoustic reflection data are obtained; the method comprises the following steps: independently regulating and controlling the temperature of a plurality of areas of a board surface before chemical copper deposition treatment, and recording acoustic scanning data to form a regional acoustic characteristic spectrum; performing acoustic wave excitation according to a preset time interval in the chemical copper deposition process to obtain monitoring data of the copper deposition process; periodic thermal excitation and fluid disturbance are applied in the electroplating process, and electroplating dynamic monitoring data are obtained; after electroplating is completed, temperature circulation and stress excitation treatment are carried out, and the evaluation result of the internal structure of the micro-through hole is obtained. According to the technical scheme, the micro-through-hole structure with the bubble micro-migration tendency can be accurately identified and screened in the manufacturing process, and the long-term reliability and the use stability of the HDI plate are effectively improved.

The utility model discloses a punching tool for TGV glass production, and relates to the technical field of TGV glass production, the punching tool comprises a workbench, a placing frame is fixedly installed in the middle of the upper portion of the surface of the workbench, and supporting columns are fixedly installed on the left side and the right side of the upper portion of the surface of the workbench; an adjusting mechanism is arranged in the middle of the opposite side above the supporting columns, a laser drilling head is arranged below the adjusting mechanism, the adjusting mechanism comprises transverse frames which are fixedly installed on the opposite sides above the surfaces of the supporting columns on the two sides correspondingly, and a first lead screw is rotationally arranged on the inner surface of the transverse frame on the left side through a bearing; and a first guide rod is fixedly mounted on the inner surface of the right transverse frame. Compared with an existing common punching tool for TGV glass production, according to the punching tool for TGV glass production, through the adjusting mechanism, the laser punching head is located in the same plane and can move at will, accurate punching can be conducted on any position of glass, using is more flexible, and practicability is higher.

The invention relates to the technical field of drip irrigation tape processing, in particular to a joint strip type drip irrigation tape dripper laser drilling device which comprises a winding drum, a traction mechanism and a guide mechanism, a drip irrigation tape is wound on the winding drum, one end of the drip irrigation tape is connected with the winding drum, the other end of the drip irrigation tape is dragged by the traction mechanism, and under the action of a limiting mechanism and a cylindrical rod, the drip irrigation tape dripper laser drilling device is formed. The drip irrigation tape can be in a circular tube shape when passing through the lower portion of the laser puncher, the laser puncher can accurately punch the drip irrigation tape under the action of the high-definition camera and the visual recognition system, and due to blocking of the expansion plate, it can be ensured that the lower-layer pipe wall is not damaged while the laser puncher punches the upper-layer pipe wall of the drip irrigation tape; under the cooperation of the expansion mechanism and the expansion plate, the device can be suitable for drip irrigation belts with different diameters, the adaptability of the device is improved, orifices formed by the drip irrigation belts through laser high-temperature trepanning are rapidly shaped, and the situation that the orifices make contact with the lower-layer pipe wall before being cooled, and adhesion occurs is avoided.

The invention provides unequal-thickness ultrathin glass and a preparation method thereof. The preparation method comprises the following steps: (1) pasting a mask on the surface of UTG glass to obtain film-pasted glass; (2) firstly punching a row of laser holes at the center line of the bending area of the film-coated glass by using laser, recording the laser holes as a first row of laser holes, and then coating the bending area with fluoride as a coating material; then laser drilling is symmetrically conducted on the left side and the right side of the first row of laser holes in the direction from the center line of the bending area to the two sides, coating treatment is repeated once every time symmetric laser drilling is completed till the bending area is full of the laser holes, and the coated glass is obtained; (3) carrying out indirect acid etching on the bending area on the front surface of the coated glass by adopting hydrochloric acid to form an arc-shaped thinned surface so as to obtain roughly etched glass; and (4) carrying out polishing treatment on the rough etching glass to obtain the unequal-thickness ultra-thin glass. The method provided by the invention can significantly improve the flexibility and bending characteristics of the unequal-thickness ultrathin glass.

The invention discloses a clamping device, laser machining equipment and a laser drilling method.The clamping device is used for clamping an annular workpiece and comprises mounting bases, a clamping belt, a driving wheel and a first telescopic mechanism, and the mounting bases are symmetrically arranged on the two sides of a clamping position of the workpiece; at least two rotating mechanisms used for being connected with the first ends of the first telescopic mechanisms are arranged on the side, close to the workpiece clamping position, of the mounting base, the second ends of the first telescopic mechanisms and the driving wheels are used for being supported on the inner surface of the clamping belt so as to tension the clamping belt, and the outer surface of the clamping belt is used for being tightly attached to and supported on the outer wall of the annular workpiece. The first telescopic mechanism is used for telescopically adjusting the distance between the clamping belt and a workpiece at the clamping position and / or adjusting the tension degree of the clamping belt; the rotating mechanism is used for driving the first telescopic mechanism to swing so as to adjust the position of the second end of the first telescopic mechanism; the driving wheel is used for driving the clamping belt to rotate when the clamping belt is matched with the workpiece so as to drive the workpiece to move.

The invention discloses an ultraviolet laser drilling device, and belongs to the field of laser drilling. The machining table is fixedly connected to the upper end of the bottom plate; the adjusting part is arranged at the upper end of the bottom plate; an air suction machine is arranged on the outer wall of the machining table, an air suction pipe is assembled at the input end of the air suction machine, an air suction box is assembled at the other end of the air suction pipe, a material receiving hopper is fixedly connected to the upper end of the air suction box, and a breathable plate is fixedly connected to the bottom of the material receiving hopper. The air suction machine and the air suction box are arranged, waste residues generated in the laser drilling process can be effectively removed by combining the rotating effect of the scraping plate and the scraping strip, the waste residues are prevented from blocking equipment and affecting the machining efficiency, through linkage of the spiral conveying piece and the rotating rod, the waste residues can be automatically conveyed out of the pipeline, manual cleaning is avoided, and the labor intensity of workers is relieved. And the overall automation level is improved.

The invention discloses a preparation process of a thin-glue bending-resistant LED flexible circuit, and belongs to the field of LED flexible circuit board preparation, and the preparation process comprises the following steps: adopting a material with a glue layer thickness of 6-8 UM, and setting a double-sided material composition as copper, glue, PI, glue and copper; s2, performing line exposure and etching on the top copper foil in a roll-to-roll mode to form a circuit pattern; s3, through holes are formed through laser drilling, the thickness of an adhesive layer is detected through a sensor in the drilling process, the laser power or the scanning speed is adjusted by a control system according to detection data, and dynamic adjustment of the laser efficiency is achieved; the thickness of the adhesive layer is reduced to 6-8 UM, so that the flexibility of the copper foil is remarkably improved, the bending frequency of the circuit board is increased to 100 or more, and the high-flexibility application requirement is met; the glue layer thinning is combined with the laser efficiency dynamic adjustment technology, the glue shrinkage problem of laser drilling is reduced, and the drilling efficiency is improved; the electroplating process is simplified, the plasma cleaning step is omitted, meanwhile, material use is optimized, and the overall production cost is reduced.