269 results about "Laser drilling" patented technology

The invention provides an ultrafast laser drilling method for a carbon fiber composite material, and relates to the technical field of laser machining.The ultrafast laser drilling method comprises the steps that a material removal image and a plasma light intensity signal in the laser drilling process are obtained in real time, whether a fiber sputtering effect occurs in the material removal image or not is recognized, and if the fiber sputtering effect does not occur, the material removal image is recognized; if so, determining a hole-making influence area, and acquiring temperature distribution data of the hole-making influence area; analyzing to set a first revolution-rotation speed adjusting rule, and adjusting the revolution speed and the rotation speed of the laser based on the first revolution-rotation speed adjusting rule; and if the fiber sputtering effect occurs, quantifying the fiber sputtering effect to construct a rotation error signal, performing periodic analysis on the plasma light intensity signal to construct a revolution error signal, setting a second revolution-rotation speed adjustment rule, and adjusting the revolution speed and the rotation speed of the laser based on the second revolution-rotation speed adjustment rule.

The invention discloses waste stripping equipment during quartz round hole forming, and relates to the technical field of laser drilling, the waste stripping equipment comprises a laser processing table, a laser drilling head is arranged on the laser processing table, and a waste stripping assembly is arranged on the laser processing table. Through operation of the waste stripping assembly, when laser finishes drilling a single round hole, hole core waste is immediately adsorbed through negative pressure and is vertically downwards separated from the round hole, the purpose of immediately stripping the waste is achieved, retention of the hole core waste in the round hole is avoided, and it is not needed to wait for laser drilling of all the round holes to be completed; the hole core waste of a single round hole is rapidly stripped in a high-temperature state, molten quartz left on the hole wall of the round hole and the hole core waste cannot be cooled and solidified, and secondary adhesion of the round hole and the hole core waste is avoided.

The application provides a laser drilling process monitoring and regulation combined protection method and system, which comprises the following steps: collecting signal evolution information, current hole depth and motion trajectory information in a laser drilling process; performing feature extraction on the obtained signal evolution information to obtain time sequence characteristic values evolving with time, and constructing a penetration time prediction model according to the obtained time sequence characteristic values; combining the obtained current hole depth and motion trajectory information with the time sequence characteristic values to construct a hole drilling stage identification model; comprehensively constructing a state identification model by combining a penetration time prediction model prediction result with a hole drilling stage identification model identification result confidence at different moments; identifying a current hole drilling processing stage according to the obtained state identification model, controlling a laser processing process according to an identification result, and adopting different hole drilling strategies in different hole drilling stages; and the application can ensure efficient, high-precision and no-wall-damage processing of the laser drilling process.

The invention provides a pixelated perovskite-based array X-ray imaging detector preparation method and system and a medium, and the method comprises the steps: selecting a polyimide film, and forming a through hole array pattern on the polyimide film; performing layered ablation on the polyimide film based on a laser drilling process to obtain a through hole; injecting UV peelable glue into the through hole to form a bottom barrier layer, jet-printing an annular glue ridge on the inner wall of the through hole to form a side wall partition, and depositing an Au electrode layer; removing the UV peelable glue by adopting a UV glue stripping solution, and growing perovskite crystals in the through holes based on a solution method or a solid-phase melting method; preparing a TFT (Thin Film Transistor) array on the polyimide film, and forming an insulating coating at the bottom of the polyimide film by adopting an evaporation or chemical vapor deposition process to obtain an imaging detector; according to the invention, high-precision and high-reliability integration of the polyimide film and the TFT array is realized, the charge collection efficiency is improved, the signal crosstalk is reduced, and micron-sized pixel size detection is realized.

The invention provides a low-damage CFRP laser drilling device and method based on dynamic multi-mode light beam regulation and control. The CFRP laser drilling device comprises an ultrafast laser source, a dynamic light field regulation and control module, a double-pulse regulation and control module, a galvanometer scanning module, a motion module and a controller module, the ultrafast laser source, the dynamic light field regulation and control module, the double-pulse regulation and control module and the galvanometer scanning module are arranged on the same light path, and the motion module is used for bearing a workpiece to be machined. The controller module is connected with the ultrafast laser source, the dynamic light field regulation and control module, the double-pulse regulation and control module, the galvanometer scanning module and the motion module. According to the method, the energy density can be accurately regulated and controlled in a microsecond-level time domain and a micron-level space range, so that the CFRP microporous structure with low heat influence, high consistency and high geometric accuracy is prepared, the stability and reliability of the machining process are effectively improved, and the requirement for micropore precision machining in the fields of aerospace and precision manufacturing is met.

The invention relates to the field of safety air bag blast tube machining, and discloses a laser tapping machine for a safety air bag blast tube, the laser tapping machine comprises a bottom plate and a laser tapping head, two first fixing plates are fastened on the upper surface of the bottom plate close to the middle through bolts, and a material transfer structure is arranged between the two first fixing plates; a second fixing plate is fastened to each first fixing plate through a bolt, abutting turnover structures are arranged on the two second fixing plates, two third fixing plates are connected to the two sides of the upper face of the bottom plate, and a laser trepanning head is arranged on a movable lifting structure between the two third fixing plates; material storage structures are arranged on the edges of the front side and the rear side of the upper face of the bottom plate, when a blasting pipe is fed to a tapping position, the blasting pipe is automatically subjected to abutting tapping through an abutting overturning structure, the abutting blasting pipe can be automatically driven to be overturned, the tapping requirements of different positions are met, operation is more labor-saving and convenient, and the production efficiency is improved. And the working efficiency is greatly improved.

The waterproof breathable device comprises a panel, waterproof breathable cloth and a bottom plate which are sequentially stacked, the panel and the bottom plate are provided with corresponding breathable areas, the waterproof breathable cloth is provided with a plurality of through holes, and the through holes are correspondingly distributed in the breathable areas and the periphery of the bottom plate. And the panel is bonded with the bottom plate through the through hole. The breathable waterproof cloth disclosed by the utility model is subjected to laser drilling treatment, so that the fitting firmness of the hot melt adhesive, the waterproof cloth and the TPU is remarkably enhanced, shoe parts have excellent waterproofness and breathability, and the durability and the use experience of products are improved.

The application belongs to the technical field of laser precision machining, and particularly relates to a laser drilling method for heterogeneous composite materials based on partition parameter regulation. f In view of the problems that a multilayer heterogeneous structure such as a SiC / SiC composite material is prone to hole wall cracking, interface delamination and re-solidification blockage in through-hole machining, the workpiece is divided into a coating area and a matrix area, the scanning speed, the focal point increment and the scanning number matching the material characteristics are selected respectively, and linear variable pitch spiral scanning combined with workpiece self-rotation is adopted to realize the relative uniform distribution of the energy density in the hole. On the premise of ensuring the integrity of the coating / matrix interface, the method can effectively reduce the hole taper and obtain a high-quality through-hole with smooth hole wall and significantly reduced defects.

This invention discloses a high-altitude high-intensity laser drilling device for power transmission towers, relating to the technical field of laser cutting and drilling devices. It includes a positioning disk one and a positioning disk two, with an installation assembly positioned between them. A support assembly is slidably mounted on the side wall of the installation assembly. A drive assembly is mounted on the side wall of the positioning disk one. An axial adjustment assembly is rotatably connected inside the drive assembly. A laser generator is rotatably mounted inside the axial adjustment assembly. The laser generator moves axially through the drive of the axial adjustment assembly, and the axial adjustment assembly rotates eccentrically between the positioning disk one and the positioning disk two through the drive assembly. By setting an eccentric circular groove built into the drive assembly, and cooperating with a gear meshing transmission structure, the axial adjustment assembly and the laser generator can achieve stable eccentric revolution, forming a regular annular cutting trajectory according to processing requirements, effectively ensuring the consistency and centerness of the drilled hole diameter, and avoiding excessive hole diameter deviation.

The application discloses an improved semi-additive process based on customized ultra-thin copper foil flexible copper-clad plate and a fine circuit board, and belongs to the technical field of flexible printed circuit boards. The process adopts a customized ultra-thin copper foil FCCL substrate, and the circuit is prepared through substrate selection pretreatment, pattern size pre-compensation, laser drilling and black shadow process hole metallization, pattern transfer and selective electroplating thickening, film stripping and flash etching forming. The micro-etching amount is cooperatively controlled throughout the process, and combined with optimized plasma cleaning and high hole filling electroplating, the fine circuit production with a minimum line width and line spacing of 45 microns or less can be stably realized, and the highest fine circuit production can reach 25 / 25 microns. The application solves the problems of traditional process, such as large side etching, low precision, poor yield and the like, and the circuit board prepared has the advantages of excellent size stability, strong heat resistance and uniform micro-hole filling, is suitable for high-density interconnection and high-end consumer electronic demand, and has significant advantages of precision, yield and reliability compared with existing processes.

This invention belongs to the field of polymer materials, specifically relating to a low-heat-shrinkage polymeric film for laser drilling and its preparation method. The film comprises modified polyphenylene ether resin, vinyl-containing benzoxazine resin, a specific cationic initiator, a toughening agent, and inorganic modified fillers: gadolinium lanthanum zirconate core-shell nanocrystals and lithium aluminum borosilicate nanowires. The preparation method includes: first, surface-treating the two inorganic fillers with a silane coupling agent and then dispersing them in a solvent to obtain a slurry; then, mixing this slurry with the modified polyphenylene ether resin, vinyl-containing benzoxazine resin, cationic initiator, and toughening agent to form a homogeneous adhesive; finally, coating the adhesive onto a carrier film and drying and curing it at three temperature stages from low to high to obtain the finished film. The film prepared by this method exhibits extremely low heat shrinkage during laser drilling, effectively controlling resin protrusion or indentation defects on the hole wall, and significantly improving the quality and reliability of micropore processing.

The application is a laser punching device with automatic switching of drum wheel phase and an implementation method thereof, comprising a servo drive system, a laser punching device and an axle encoder. The method is to set the transmission gears of the punching rotating drum wheel in the laser punching device and the preceding drum wheel adjacent to the laser punching device as half-tooth structures which do not interfere with each other, and the gear of the punching rotating drum wheel and the gear of the subsequent drum wheel on the cigarette machine are in meshing transmission connection. The preceding drum wheel is driven to rotate by the main motor of the cigarette machine, and the punching rotating drum wheel and the subsequent drum wheel are controlled to rotate by the servo drive system. The encoder for collecting position and speed signals is arranged at the position of the preceding drum wheel, and the encoder is in communication connection with the servo drive system. When producing laser punched cigarettes or non-punched cigarettes, only the setting of the electric control system is needed to automatically switch the drum wheel phase, thereby reducing manual labor and saving cigarette brand switching time. After being switched into the non-punched cigarette production mode, the mechanical parts of the laser punching equipment can be prevented from continuing to wear and tear, and the influence on the appearance quality of the cigarettes and the quality of the empty head of the cigarettes is also reduced.

The invention discloses a manufacturing method of an electromagnetic shielding structure for board-level plastic package of a vertical structure chip and a flip chip, which comprises the following steps of: firstly, manufacturing a bottom interconnection line layer, a bottom bonding pad and an external grounding point at the bottom end of a partition box dam of a shielding cover structure according to design requirement parameters, and then manufacturing the partition box dam and a copper column for realizing vertical interconnection; after the plastic package chip is fixedly mounted, a vertical interconnection line and a top metal layer of a shielding cover structure are sequentially manufactured layer by layer; when the carrier is separated, a layer of copper foil is reserved for manufacturing an outer circuit layer and an outer bonding pad, and finally cutting is carried out to obtain a single packaged finished product; a top metal layer, a partition box dam, vertically interconnected copper columns, interconnection line layers at all levels, bonding pads and grounding points are directly processed and manufactured by using a substrate wet process such as laser drilling, copper deposition, electroplating and pattern transfer in the prior art, so that the space occupation area can be reduced, the process is simplified, the space utilization rate is improved, and the cost input is reduced; and the stability and reliability of the product are ensured.

The application relates to the technical field of adjusting devices, and provides an adjusting device and a laser drilling machine. The adjusting device comprises a supporting seat, a sliding seat and a first adjusting assembly. The supporting seat is provided with a first inclined surface. The sliding seat is provided with a second inclined surface which is in sliding fit with the first inclined surface. An adapter for connecting an acousto-optic modulator is arranged on the sliding seat. The first adjusting assembly is connected to the supporting seat. The first adjusting assembly is configured to drive the sliding seat to move along the inclined direction of the first inclined surface. The adjusting device provided by the application can meet the requirement of accurate adjustment of the acousto-optic modulator.

The application belongs to the technical field of laser processing equipment, and discloses a light beam deflection mechanism applied to rapid scanning of a soft ceramic laser drilling and cavity opening equipment, comprising a two-dimensional acousto-optic deflection assembly, a radio frequency driving control system, a precision adjustment fixing assembly, an optical auxiliary assembly and a cooling and heat dissipation assembly, wherein each assembly is cooperatively matched and linked with an equipment galvanometer system and an XY moving platform; after being optimized by the optical auxiliary assembly, a laser beam is incident into the two-dimensional acousto-optic deflection assembly, the radio frequency driving control system is adjusted to realize high-precision and rapid deflection of the light beam, the precision adjustment fixing assembly guarantees positioning accuracy, and the cooling and heat dissipation assembly controls thermal effects. The application realizes 0.1 mu rad deflection accuracy and 1 mu s scanning switching speed, controls the soft ceramic processing thermal effect area within 5 mu m, and can satisfy fine processing of through holes, buried holes, blind holes and <50 mu m micro holes.

According to the semiconductor packaging structure and the preparation method thereof provided by the invention, the semiconductor chip is wrapped by the plastic packaging layer, so that the risk of chip fracturing during lamination can be reduced; a plurality of semiconductor chips are connected in parallel through a metal plate or a metal layer, and a small-area electrode metal disc of a single chip is converted into a large-area metal disc of the metal layer, so that the influence of the positions of the chips on the laser drilling precision is avoided, and the effects of enlarging the process window range of pressing and laser drilling in the embedding process and reducing the reject ratio are achieved; meanwhile, the large-area metal layer can accommodate more laser holes to lead out electroplated metal, so that the volume of a lead-out metal wire is increased, and the through-flow and heat dissipation capabilities are improved; and the flexibility and high precision of metal lead bonding enable the method to be compatible with surface metals of various existing semiconductor chips.

The invention relates to an intelligent control laser drilling system and an intelligent power supply control method. The intelligent control laser drilling system comprises a UPS (Uninterrupted Power Supply), a time relay and a power supply contactor, the power supply contactor is connected to a three-phase 380V input power supply and is controlled by the control panel power supply switch; the time relay is connected to a starting 24V power supply of the UPS and is used for controlling an enable signal of the UPS; and the output of the UPS is connected to the PLC power supply, the analog quantity power supply and the industrial personal computer power supply to supply power to the laser drilling control system. According to the invention, a set of cooperative control system which takes a time relay as a core hub and organically integrates parts such as UPS hardware, UPS monitoring software, an industrial personal computer, a main power supply contactor and the like is realized. According to the system, by defining and executing various software and hardware linkage control logics, it is ensured that the laser drilling system can achieve orderly, safe and reliable power supply management and shutdown control under various power supply working conditions, and the problems of data damage and system risks caused by sudden power failure are effectively solved.

This invention discloses an ultrasonic-assisted water-guided laser drilling device and method based on flow focusing, belonging to the field of water-guided laser processing technology. The device includes an optical path control module, an optical-liquid-gas coupling module, an ultrasonic assistance module, and a movement module. It employs a laser energy control method that uses in-situ monitoring and real-time adjustment during laser processing. A uniform laminar water jet is obtained through a multi-channel, distributed high-pressure water path design, and the coupling energy beam is controlled using flow-focused water-guided laser beam refinement technology. Ultrasonic vibration-assisted processing further improves the drilling quality. In summary, this invention can be used for the precision machining of hole structures in aerospace components, improving machining quality and thus enhancing the overall service performance of equipment.

The invention discloses an MEMS (Micro Electro Mechanical System) four-electrode conductivity sensor based on a laser drilling back lead and a preparation method thereof. The MEMS four-electrode conductivity sensor comprises an LCP (Liquid Crystal Polymer) substrate and a four-electrode circular ring structure arranged on the front surface of the LCP substrate, the four-electrode circular ring structure sequentially comprises a first current electrode, a first voltage electrode, a second voltage electrode and a second current electrode from the center of the substrate to the outside; a micro through hole penetrating through the LCP substrate is formed in the non-electric field sensitive area of each electrode through laser drilling; the platinum wire penetrates into the micro-through hole from the back of the LCP substrate, the bottom end is sintered and fixed through a conductive material covering the micro-through hole area on the back of the LCP substrate, and the top end is in low-resistance electrical connection with the metal layer of each electrode. According to the sensor, a four-electrode structure with optimized electric field constraint is adopted, the technology of laser drilling-platinum wire threading-platinum paste sintering is innovatively applied, front face drilling and back face lead packaging is achieved, the sensor can be directly used as a standard surface-mounted device to be installed, and the measuring performance, the environmental adaptability and the integration convenience are improved.

The invention relates to a manufacturing method of an ultra-precise circuit substrate, which at least comprises the following steps: carrying out inner layer blanking to obtain a substrate, respectively drilling and removing carrier copper, and then carrying out base copper precise thinning, laser windowing, laser drilling and copper melting to obtain an initial inner layer plate; performing wiring of an inner-layer circuit on the initial inner-layer board, performing electroplating and hole-filling electroplating, and performing selective precision thinning, film removal and flash etching treatment to obtain an inner-layer board; and laminating the inner-layer plate and the outer-layer raw material plate, and processing the outer layer to obtain the ultra-precise circuit substrate. According to the manufacturing method of the ultra-precise circuit substrate provided by the invention, high aspect ratio porefilling electroplating and no porefilling core wrapping are realized by adopting a step-by-step electroplating process of electroplating combined porefilling electroplating; and a selective precision thinning process is added before film removal and flash etching to carry out overall precision thinning on the base copper, so that conditions are created for realization of a precision circuit, and finally, manufacturing of an ultra-precision circuit substrate is realized.

The invention discloses a manufacturing method of a through hole of a circuit board structure. The manufacturing method of the through hole of the circuit board structure comprises a preparation step, a first drilling step, a second drilling step, a hole repairing step and an electroplating step. In the preparation step, a circuit substrate with a first surface and a second surface is provided. A first conductive layer and a second conductive layer are respectively formed on the first surface and the second surface. A first drilling step: performing laser drilling on the first surface of the circuit substrate and the first conductive layer to form a blind hole; and a second drilling step: performing laser drilling on the second surface of the circuit substrate corresponding to the blind hole position and the second conductive layer to form a through hole penetrating through the blind hole. And a hole repairing step: carrying out laser hole repairing on one side of the through hole on the second surface. And an electroplating step: electroplating the circuit substrate to form an electroplated layer on the through hole, thereby effectively improving the problem of abnormal bowl bottom separation in the manufacturing method of the through hole of the existing circuit board structure.

The invention provides a pulse laser system and a pulse laser drilling method. The pulse laser system comprises a transmitting module used for providing a pulse laser beam, the pulse width of the pulse laser beam ranges from 50 fs to 500 fs, the repetition frequency of the pulse laser beam ranges from 0.5 GHz to 10 GHz, and the pulse energy of the pulse laser beam ranges from 100 muJ to 1000 muJ; the light beam adjusting module is used for converting the pulse laser beam into a first modulated laser beam; an optical module for converting the first modulated laser beam into a second modulated laser beam; a scanning module for selectively projecting a second modulated laser beam in a projection direction; the focusing module is used for converting the second modulated laser beam into a flat-topped laser beam projected to a workpiece to be drilled; and the monitoring module is used for monitoring the drilling state of the workpiece to be drilled in real time. Therefore, the machining efficiency of the to-be-drilled workpiece can be improved, and meanwhile the damage rate of the to-be-drilled workpiece is reduced.

The invention discloses a collaborative tool system and method for special-shaped circuit board laser drilling, and relates to the field of circuit board tools, the collaborative tool system comprises a drilling platform, a supporting platform is fixed to the drilling platform, a special-shaped tool mechanism is arranged on the drilling platform, and the special-shaped tool mechanism comprises a fixed tool base and a movable tool base; the supporting platform is located between the fixed tool base and the movable tool base, the end face, close to the movable tool base, of the fixed tool base is provided with a tool assembly, the tool assembly a comprises a first-stage arc-shaped base and a second-stage arc-shaped base, the first-stage arc-shaped base is rotationally installed on the fixed tool base, and the rotating axis of the first-stage arc-shaped base is collinear with the axis of the first-stage arc-shaped base. The first-stage arc-shaped seat is rotatably provided with a plurality of second-stage arc-shaped seats in the arc direction of the first-stage arc-shaped seat, the end face, close to the fixed tool seat, of the movable tool seat is provided with a tool assembly a, the structure of the tool assembly a is the same as that of the tool assembly, the local irregular contour of the side face of the circuit board can be precisely attached, and the double positioning effect of'macroscopic adaptation and microscopic attachment 'is achieved.

This application provides a laser drilling angle controller for adjusting the drilling angle of a drilling rig. It includes an annular base and an annular angle adjustment plate rotatably connected to the base. The angle adjustment plate is coaxial with the base and can rotate around its central axis. The base has a first locking structure for locking the angle adjustment plate. Multiple leveling columns are evenly spaced along the circumference of the base and can slide along its axial direction. The base has a second locking structure for locking the leveling columns. The angle adjustment plate has a leveling display. An angle plate is provided on the angle adjustment plate, and a drilling rig mounting bracket is rotatably connected to it. The rotation axis of the drilling rig mounting bracket is perpendicular to the surface of the angle adjustment plate and orthogonal to its central axis. The drilling rig mounting bracket has a third locking structure for locking its position. A support frame is connected to the base. This controller allows for multi-directional angle adjustment and can handle uneven drilling surfaces.

The invention belongs to the technical field of laser drilling machines, and particularly relates to a laser drilling machine detection device and method.The laser drilling machine detection device comprises an optical detection module, a laser positioning module, a data processing unit and a closed-loop control module. The optical detection module comprises an industrial camera and a thermal infrared imager which are coaxial in light path. The optical detection module is used for collecting visible light images and temperature field distribution of a drilling area in real time. The laser positioning module comprises a displacement sensor integrated on the laser drilling machine and is used for monitoring three-dimensional coordinates of a laser focus in real time. The data processing unit is used for connecting the optical detection module and the laser positioning module. The closed-loop control module is based on the output signal of the data processing unit. According to the laser drilling machine detection device, the structural layout of the laser drilling machine detection device can be optimized, the real-time detection efficiency of the detection device can be improved, meanwhile, the product microdefect detection precision can be greatly improved, and therefore the product machining qualification rate can be remarkably increased.

The utility model relates to full-automatic glass laser drilling and chamfering equipment which comprises a rack, a laser drilling device, a control device, a double-row conveying and clamping device, a rear gear mechanism, a front gear mechanism and a glass hole chamfering device. The rear gear mechanism, the laser drilling device, the front gear mechanism and the glass hole chamfering device are sequentially arranged in the conveying direction of the double-row conveying clamping device. The distance between the rear gear mechanism and the drilling station of the laser drilling device is equal to the distance between the front gear mechanism and the chamfering station of the glass hole chamfering device. The double-row conveying and clamping device, the rear gear mechanism, the laser drilling device, the front gear mechanism and the glass hole chamfering device are all electrically connected with the control device. According to the laser drilling and chamfering device, laser drilling and chamfering work can be synchronously carried out on the glass sheet, the machining efficiency of the glass sheet can be improved, the chamfering accuracy of a glass hole can be ensured, and therefore the chamfering quality is improved.

The invention relates to an actuator (1) and a method for deburring and shaping a bore, for a remote-operated robotic arm for laser drilling, comprising: - an attachment base (3) that can be detachably coupled to a robotic arm; - a cutting tip (4) having at least one frustoconical portion (5) provided with cutting edges (6); - a motor (7) suitable for rotating the cutting tip (4) in relation to the attachment base (3) about a cutting axis (8); - a device (9) for translating the cutting tip (4) in relation to the attachment base (3), along the cutting axis (8); - a remote control module for remotely operating the motor (7) and the translation device (9).

The invention relates to the technical field of IC (integrated circuit) packaging carrier plates, in particular to an FCBGA carrier plate bump manufacturing method, which comprises the following steps of: printing developing ink on a pattern plate in a solder resist manner, pasting an anti-plating PET (polyethylene terephthalate) film, punching copper cylinder holes in preset positions of the pattern plate by using a laser punching technology, filling the copper cylinder holes by using electroplating to form copper cylinders, and forming bumps on the pattern plate. And tinning the top of the copper column in a chemical tinning mode, forming Bump on the exposed part of the top of the pattern plate, and tearing off the anti-plating PET film to finish processing. Solder resist exposure and solder resist development procedures in a traditional solder ball implanting process are avoided, and the problem that the opening caliber is larger than 50 microns and the distance is larger than 90 microns due to the solder resist ink characteristic and the solder ball characteristic is avoided.

This invention discloses a laser drilling device for producing porous copper foil, comprising a chassis. The chassis is characterized by having a drilling chamber, an upper functional chamber, and a lower functional chamber. The drilling chamber contains a cold light source laser drilling device and a fixed conveying device, with the cold light source laser drilling device positioned above the fixed conveying device. The fixed conveying device includes an adsorption box with a suction hole at its top. A mesh conveyor belt is fitted around the outside of the adsorption box, slidingly adhering to the top surface of the adsorption box. A cooling system is located in the upper functional chamber, with its output connected to the cold light source laser drilling device. A suction pump is located in the lower functional chamber, with its suction end connected to the interior of the adsorption box to extract gas and create a negative pressure within the adsorption box. The advantages of this invention are a reasonable structural layout, strong synergy among components, stable copper foil fixation, high drilling accuracy, reliable operation, and convenient maintenance.