739 results about "Laser drilling" patented technology

The invention discloses a PCB laser drilling deviation detection method and system, and the method comprises the following steps: obtaining original image data corresponding to a PCB laser drilling region, standard hole site coordinate data in a drilling design file, and real-time operation parameter data corresponding to laser drilling equipment; performing preprocessing to generate preprocessed image data, a standard coordinate data set and an equipment operation reference data set; extracting edge contour feature data of a drilling area based on the preprocessed image data, and generating an initial deviation vector of an actual drilling contour and a design contour in combination with the standard coordinate data set; constructing a drilling deviation influence factor matrix based on the equipment operation reference data set in combination with the initial deviation vector, and generating a weight coefficient of each influence factor for drilling deviation; and correcting the initial deviation vector based on the weight coefficient, judging whether deviation exists in the drill hole or not, and generating a drill hole deviation detection result. According to the invention, the drilling deviation detection precision of the PCB can be improved.

The invention discloses an HDI micro blind hole laser drilling processing method and system, and relates to the field of HDI drilling processing, CO2 laser drilling is firstly carried out on a plate, then UV laser shaping is carried out, finally quality detection is carried out, and the core is that a plurality of local datum points distributed in a matrix mode are preset on the HDI plate to be processed. In the CO2 laser drilling process, the drilling task and the positioning action of the local datum point are executed alternately through a control program. By periodically measuring the actual position of the adjacent local datum point in the machining period, the dynamic position offset generated in the area due to the heat effect can be captured in real time, and the machining coordinates of the follow-up target drilling point in the area can be corrected in real time through the offset. The continuous local dynamic compensation effectively overcomes the dynamic thermally induced deformation problem which cannot be handled by the traditional single global correction, so that the drilling precision in the large-size and high-density machining process is ensured.

The invention relates to a laser drilling method for a thin copper HDI circuit board. The laser drilling method comprises the following steps that a circuit board to be machined is positioned and installed on a machining station of laser machining equipment; a first section of laser drilling is carried out, a first laser parameter is adopted, uncovering drilling is carried out on a preset machining area of the outer copper foil layer, and an initial hole structure is formed; performing second-section laser drilling, namely performing compensation drilling on the dielectric layer exposed at the bottom of the initial hole structure by adopting a second laser parameter of which the energy is lower than that of the first laser parameter to form a transition hole structure; and in the third section of laser drilling, a third laser parameter with energy lower than that of the second laser parameter is adopted, the bottom of the transition hole structure is trimmed, and a final hole channel is formed. According to the method, drilling is conducted in three sections, namely the first section of uncovering drilling, the second section of compensation drilling and the third section of finishing treatment. Therefore, the bottom cushion copper cannot absorb a large amount of heat in a short time, the base material layer below the bottom cushion copper can be protected from being burnt, and the product quality is improved.

The invention discloses a PCB blind hole machining method and device, laser drilling equipment and a storage medium, the laser drilling equipment comprises a picosecond or femtosecond laser device and a CO2 laser device, after a first machining parameter of the picosecond or femtosecond laser device and a second machining parameter of the CO2 laser device are determined, on one hand, the first machining parameter of the picosecond or femtosecond laser device and the second machining parameter of the CO2 laser device are determined; the picosecond or femtosecond laser performs cold machining on the surface copper layer to form the annular heat insulation groove, the surface copper layer can be prevented from generating suspended copper at the opening of the blind hole, on the other hand, heat generated when the CO2 laser machines the blind hole can be prevented from being diffused to the opening of the blind hole in the surface copper layer through the annular heat insulation groove, suspended copper is further prevented from being generated, and on the other hand, the heat dissipation efficiency is improved. The picosecond or femtosecond laser device with low processing efficiency is adopted for annularly cutting the annular heat insulation groove in the surface copper layer, then the CO2 laser device with high processing efficiency is used for removing materials in the area in the outer contour of the annular heat insulation groove to achieve drilling, the processing efficiency of the two laser devices with different processing efficiency is considered, and the laser drilling efficiency is improved.

The invention discloses a laser drilling method and system for a heterogeneous laminated material. The laser drilling method comprises the steps that a first acoustic emission sensor and a second acoustic emission sensor are arranged; in the blind hole forming process, the depth of the blind hole is obtained through a second acoustic emission sensor; determining the laying angle of the carbon fiber prepreg cloth according to the depth of the blind hole, calling a first acoustic emission sensor, and collecting an acoustic emission signal; judging whether the metal layer is exposed or not according to an acoustic emission signal acquired by a first acoustic emission sensor, and if the metal layer is considered to be exposed, acquiring a spectral signal in real time through a laser-induced breakdown spectroscopy detection system; and outputting the laser beam again, and controlling the laser beam to perform layer-by-layer scanning. The position of the metal layer in the blind hole machining process is preliminarily positioned based on the acoustic emission sensor system, then LIBS is used for accurately positioning distribution of the metal layer, laser process parameters are fed back and adjusted, and the spiral track during laser scanning is adjusted, so that the blind hole machining quality is improved.

The invention relates to the technical field of laser processing, particularly discloses an ultrathin prepreg single-emitting laser hole forming system, and aims to solve the contradiction among precision, thermal damage and efficiency in ultrathin prepreg laser processing. According to the system, through cooperation of an ultrashort pulse laser source, precise light beam shaping and transmission, material processing and positioning, real-time monitoring and feedback and an intelligent control and optimization module, laser and material interaction is finely regulated and controlled. In a single laser event or an equivalent single laser event, high-precision and low-damage microstructure processing of the ultrathin prepreg is realized, the defects of a heat affected zone, carbonization, layering and the like are effectively reduced, and the processing quality and efficiency are improved.

The invention discloses a high-precision circuit board laser drilling process, and particularly relates to the technical field of circuit board processing, and the high-precision circuit board laser drilling process comprises the following steps: step 1, selecting a high-quality base material and a copper-clad layer, and carrying out pretreatment on the base material, the pretreatment comprises cleaning and deoxidation, and the interaction efficiency of laser and the material is improved; 2, according to the design requirement of the circuit board, the position needing to be drilled and the aperture size are determined and completed through CAD software, a drilling data file is generated, the circuit board to be drilled is fixed to a drilling machine, and it is guaranteed that the board face is smooth and free of deformation; thirdly, a CO2 laser is selected, light beam focusing, laser power stability and laser beam uniformity of laser drilling equipment are optimized, and stability and accuracy of laser are guaranteed. According to the invention, high-precision laser drilling processing can be realized, the drilling processing quality of the circuit board can be ensured, the processing defective rate is obviously reduced, the popularization and the use are facilitated, and meanwhile, the method is suitable for a modern production process.

The invention relates to the technical field of circuit board processing, in particular to a laser drilling method, a storage medium, laser drilling equipment and a high-frequency high-speed substrate. The laser drilling method comprises the steps that hole machining information of a hole structure is obtained, wherein the hole machining information comprises the hole position, the hole outer contour and the hole depth; taking the hole position as a positioning reference, and performing at least one of laser winding and cutting treatment and laser etching treatment on the high-frequency high-speed substrate to form a hole structure; wherein the laser winding and cutting treatment comprises the steps that first laser is controlled to move along a first closed path matched with the outer contour of the hole, so that the side wall of the hole structure is formed; and the laser etching treatment comprises the steps of controlling a second laser to carry out punching processing on an enclosed area of the outer contour of the hole so as to remove a base material in the enclosed area and form a bottom wall of the hole structure, and the method can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate and also can be used for manufacturing the high-quality hole structure on the high-frequency and high-speed substrate. And the processing efficiency of manufacturing a high-quality hole structure on the high-frequency and high-speed substrate can be obviously improved.

The invention provides an ultrafast laser drilling method for a carbon fiber composite material, and relates to the technical field of laser machining.The ultrafast laser drilling method comprises the steps that a material removal image and a plasma light intensity signal in the laser drilling process are obtained in real time, whether a fiber sputtering effect occurs in the material removal image or not is recognized, and if the fiber sputtering effect does not occur, the material removal image is recognized; if so, determining a hole-making influence area, and acquiring temperature distribution data of the hole-making influence area; analyzing to set a first revolution-rotation speed adjusting rule, and adjusting the revolution speed and the rotation speed of the laser based on the first revolution-rotation speed adjusting rule; and if the fiber sputtering effect occurs, quantifying the fiber sputtering effect to construct a rotation error signal, performing periodic analysis on the plasma light intensity signal to construct a revolution error signal, setting a second revolution-rotation speed adjustment rule, and adjusting the revolution speed and the rotation speed of the laser based on the second revolution-rotation speed adjustment rule.

The invention relates to the technical field of laser drilling and cutting, in particular to a laser drilling and cutting device for lamp metal shell machining and a method thereof.The laser drilling and cutting device comprises a base, a feeding base, a conveying shaft, a fixing piece and a laser head, the feeding base is installed at one end of the base, and the end, close to the base, of the feeding base is fixedly connected with a material guide plate; a movable plate is slidably arranged below the end, away from the material guide plate, of the feeding base, a material guide inclined plate is fixedly connected to the side, close to the feeding base, of the top end of the movable plate, and a material guide straight plate is fixed to the other end of the material guide inclined plate; the outer sides of the transmission shafts on the inner sides of the base and the feeding base are in meshed connection with a conveying rubber plate and a conveying belt correspondingly. One end of each transmission shaft penetrates through the base and is fixedly connected with a transmission rod. According to the scheme, through continuous conveying and guiding positioning, the machining efficiency of the laser drilling and cutting device on the lampshade metal shell is higher, the machining process is more stable and accurate, and the machining quality of the lamp metal shell is guaranteed.

The invention discloses an HDI plate manufacturing process for a pen electronic camera module, and the process comprises the steps: carrying out the multi-frequency acoustic wave penetration and temperature gradient processing of a substrate, and obtaining the pre-detection data of the substrate; in the laser drilling process, short-pulse multi-frequency acoustic waves and local heat regulation are applied to a target hole area, and micropore acoustic reflection data are obtained; the method comprises the following steps: independently regulating and controlling the temperature of a plurality of areas of a board surface before chemical copper deposition treatment, and recording acoustic scanning data to form a regional acoustic characteristic spectrum; performing acoustic wave excitation according to a preset time interval in the chemical copper deposition process to obtain monitoring data of the copper deposition process; periodic thermal excitation and fluid disturbance are applied in the electroplating process, and electroplating dynamic monitoring data are obtained; after electroplating is completed, temperature circulation and stress excitation treatment are carried out, and the evaluation result of the internal structure of the micro-through hole is obtained. According to the technical scheme, the micro-through-hole structure with the bubble micro-migration tendency can be accurately identified and screened in the manufacturing process, and the long-term reliability and the use stability of the HDI plate are effectively improved.

The invention provides unequal-thickness ultrathin glass and a preparation method thereof. The preparation method comprises the following steps: (1) pasting a mask on the surface of UTG glass to obtain film-pasted glass; (2) firstly punching a row of laser holes at the center line of the bending area of the film-coated glass by using laser, recording the laser holes as a first row of laser holes, and then coating the bending area with fluoride as a coating material; then laser drilling is symmetrically conducted on the left side and the right side of the first row of laser holes in the direction from the center line of the bending area to the two sides, coating treatment is repeated once every time symmetric laser drilling is completed till the bending area is full of the laser holes, and the coated glass is obtained; (3) carrying out indirect acid etching on the bending area on the front surface of the coated glass by adopting hydrochloric acid to form an arc-shaped thinned surface so as to obtain roughly etched glass; and (4) carrying out polishing treatment on the rough etching glass to obtain the unequal-thickness ultra-thin glass. The method provided by the invention can significantly improve the flexibility and bending characteristics of the unequal-thickness ultrathin glass.

The invention discloses a clamping device, laser machining equipment and a laser drilling method.The clamping device is used for clamping an annular workpiece and comprises mounting bases, a clamping belt, a driving wheel and a first telescopic mechanism, and the mounting bases are symmetrically arranged on the two sides of a clamping position of the workpiece; at least two rotating mechanisms used for being connected with the first ends of the first telescopic mechanisms are arranged on the side, close to the workpiece clamping position, of the mounting base, the second ends of the first telescopic mechanisms and the driving wheels are used for being supported on the inner surface of the clamping belt so as to tension the clamping belt, and the outer surface of the clamping belt is used for being tightly attached to and supported on the outer wall of the annular workpiece. The first telescopic mechanism is used for telescopically adjusting the distance between the clamping belt and a workpiece at the clamping position and / or adjusting the tension degree of the clamping belt; the rotating mechanism is used for driving the first telescopic mechanism to swing so as to adjust the position of the second end of the first telescopic mechanism; the driving wheel is used for driving the clamping belt to rotate when the clamping belt is matched with the workpiece so as to drive the workpiece to move.

The invention discloses an ultraviolet laser drilling device, and belongs to the field of laser drilling. The machining table is fixedly connected to the upper end of the bottom plate; the adjusting part is arranged at the upper end of the bottom plate; an air suction machine is arranged on the outer wall of the machining table, an air suction pipe is assembled at the input end of the air suction machine, an air suction box is assembled at the other end of the air suction pipe, a material receiving hopper is fixedly connected to the upper end of the air suction box, and a breathable plate is fixedly connected to the bottom of the material receiving hopper. The air suction machine and the air suction box are arranged, waste residues generated in the laser drilling process can be effectively removed by combining the rotating effect of the scraping plate and the scraping strip, the waste residues are prevented from blocking equipment and affecting the machining efficiency, through linkage of the spiral conveying piece and the rotating rod, the waste residues can be automatically conveyed out of the pipeline, manual cleaning is avoided, and the labor intensity of workers is relieved. And the overall automation level is improved.

The invention discloses a preparation process of a thin-glue bending-resistant LED flexible circuit, and belongs to the field of LED flexible circuit board preparation, and the preparation process comprises the following steps: adopting a material with a glue layer thickness of 6-8 UM, and setting a double-sided material composition as copper, glue, PI, glue and copper; s2, performing line exposure and etching on the top copper foil in a roll-to-roll mode to form a circuit pattern; s3, through holes are formed through laser drilling, the thickness of an adhesive layer is detected through a sensor in the drilling process, the laser power or the scanning speed is adjusted by a control system according to detection data, and dynamic adjustment of the laser efficiency is achieved; the thickness of the adhesive layer is reduced to 6-8 UM, so that the flexibility of the copper foil is remarkably improved, the bending frequency of the circuit board is increased to 100 or more, and the high-flexibility application requirement is met; the glue layer thinning is combined with the laser efficiency dynamic adjustment technology, the glue shrinkage problem of laser drilling is reduced, and the drilling efficiency is improved; the electroplating process is simplified, the plasma cleaning step is omitted, meanwhile, material use is optimized, and the overall production cost is reduced.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The embodiment of the invention provides a packaging substrate laser drilling method and a packaging substrate, the packaging substrate comprises a first copper layer, a dielectric layer and a second copper layer which are stacked in sequence, and the method comprises the steps that first drilling operation is carried out with first laser energy, and an annular area is ablated on the first copper layer; second drilling operation is conducted through second laser energy, the copper cover in the middle of the annular area and part of the dielectric layer are removed, a blind hole is formed, and the second laser energy is smaller than the first laser energy; third drilling operation is carried out with third laser energy, the dielectric layer at the bottom of the blind hole is removed until the second copper layer is exposed out of the bottom of the blind hole, and the third laser energy is smaller than the second laser energy. According to the packaging substrate laser drilling method, on the premise that the laser drilling quality requirement is met, the laser drilling machining efficiency can be improved.

The invention discloses waste stripping equipment during quartz round hole forming, and relates to the technical field of laser drilling, the waste stripping equipment comprises a laser processing table, a laser drilling head is arranged on the laser processing table, and a waste stripping assembly is arranged on the laser processing table. Through operation of the waste stripping assembly, when laser finishes drilling a single round hole, hole core waste is immediately adsorbed through negative pressure and is vertically downwards separated from the round hole, the purpose of immediately stripping the waste is achieved, retention of the hole core waste in the round hole is avoided, and it is not needed to wait for laser drilling of all the round holes to be completed; the hole core waste of a single round hole is rapidly stripped in a high-temperature state, molten quartz left on the hole wall of the round hole and the hole core waste cannot be cooled and solidified, and secondary adhesion of the round hole and the hole core waste is avoided.

The utility model discloses a borosilicate glass laser-beam drilling machine, which relates to the technical field of borosilicate glass processing and comprises a base. The bottom of the bottom plate is fixedly connected with the top of the base; the bottom of the positioning assembly is fixedly connected with the top of the bottom plate, and the positioning assembly is used for positioning borosilicate glass; the outer side of the fixing assembly is fixedly connected with the inner side of the positioning assembly, and the fixing assembly is used for fixing borosilicate glass; the bottom of the shell is fixedly connected with the two sides of the bottom plate; and the top of the laser drilling machine body is fixedly connected with the top of the inner cavity of the shell. According to the device, the fixing assembly is arranged, so that glass is conveniently fixed, the working efficiency is improved, the positioning assembly is arranged, the position of the glass is adjusted, the glass does not need to be disassembled and reinstalled, and the glass punching position is conveniently changed.

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

The preparation method of the glass-based top core plate comprises the following steps: providing a glass substrate, and forming an initial through hole in the glass substrate by adopting laser drilling; pressing a first dielectric material layer on the surface of the glass substrate and in the through hole; performing secondary laser drilling or mechanical drilling on the initial through hole to form a target through hole; electroplating the target through hole and forming a circuit; laminating the two glass substrates in the opposite directions of the dielectric material layers, and stacking a temporary substrate between the two glass substrates; performing primary layer adding of a second dielectric material on the stacked structure, wherein the layer adding number can be an odd number or an even number; removing the temporary base plate to realize plate disassembly; adding a third dielectric material on the surface of the top of the glass substrate after the glass substrate is detached; carrying out polish-brush planarization processing on the surface of the added layer to expose the circuit; forming redistribution layers on the planarized surface, wherein the number of the redistribution layers can be an odd number or an even number; according to the invention, the production yield can be improved, the warping of the substrate is reduced, the structural stability is enhanced, and the upper-layer RDL superfine circuit and the lower-layer thick circuit are conducted.

The invention provides a drilling processing method for a ceramic substrate. The drilling processing method for the ceramic substrate comprises the following steps: forming a large hole in the ceramic substrate by adopting laser drilling, wherein the aperture of the large hole is 0.25-5mm or is 0.5 times greater than the thickness of the ceramic substrate; filling the macropores with a composite material containing a ceramic filler and thermosetting resin, and forming a supporting layer through a curing process; and the supporting layer is mechanically drilled to form small holes, and the hole diameter of the small holes is smaller than that of the large holes. According to the ceramic substrate drilling machining method, through stepped drilling of laser taper hole guiding, composite material filling and mechanical precision drilling, the problem that small holes of a thin substrate are prone to cracking during machining is solved, the yield is increased, the risk of breakage of a hard drill bit for mechanical drilling can be reduced, machining time is shortened, and the production cost is reduced; the drilling processing method is compatible with various ceramic substrates, and can solve the problem of multi-material integration of electronic packaging.

The invention provides a laser drilling method. The laser drilling method comprises the following steps: S1, positioning a workpiece and determining a target aperture; s2, the rotating speed of the workpiece and the airflow direction of protective gas are determined; s3, determining laser power, laser frequency laser, scanning speed, laser beam focus movement diameter and zooming increment; s4, determining a laser incident angle; s5, the determined machining parameters are used for drilling; according to the laser drilling method provided by the invention, the drilling efficiency can be improved, the drilling quality can be improved, the taper can be greatly reduced, and the preparation of holes with various tapers can be realized through pose adjustment.

The invention discloses a novel ball mounting method without a steel mesh and a substrate structure, and the method employs a pyrolysis film and laser drilling technology to replace a traditional steel mesh. The method comprises the core steps of pasting a pyrolysis film and a PET protective film, drilling a blind hole to a bonding pad through laser, cleaning glue residues through high-pressure water, blade-coating solder paste containing soldering flux, stripping the PET film, forming solder balls through reflow soldering, cleaning the soldering flux and flattening the solder balls. A steel mesh is replaced by the pyrolysis film and laser drilling, use of the steel mesh is eliminated, use of the steel mesh and customization of the steel mesh are not needed, the cost is saved, and the manufacturing period is shortened. The pyrolysis film is pasted on the substrate, the pattern is manufactured in a laser drilling mode, the expansion and contraction are completely consistent with those of the substrate, and the risk of solder ball deviation is reduced; in addition, the method does not need to change the design of the substrate, the ball mounting pattern is directly manufactured according to customer information, drilling is carried out, the process is simple, meanwhile, different types of substrates can be compatible, and compatibility is high.

The invention relates to a bamboo clothes hanger multi-station automatic slitting and drilling device which comprises a rack, a feeding assembly arranged at the front end of the rack and used for conveying a bamboo generating plate to be processed, a first cutting assembly located behind the feeding assembly and fixedly connected with the rack, and a second cutting assembly arranged at the tail end of the rack. The first cutting assembly comprises a first saw blade used for conducting end face reference positioning cutting on the bamboo generating plate fed by the feeding assembly, the second cutting assembly comprises a second saw blade used for cutting the drilled bamboo generating plate into a plurality of bamboo clothes hanger finished products, and a storage table extending in the conveying direction of the feeding assembly is arranged on the machine frame. Through the feeding assembly, the first cutting assembly, the laser pressing assembly, the laser drilling assembly and the second cutting assembly, multifunctional assemblies of feeding, cutting, laser pressing, drilling and the like are integrated, the full-automatic process of bamboo clothes hanger production is achieved, and the production efficiency and the product quality are remarkably improved.

The invention provides a three-dimensional microstructure simulation method based on femtosecond laser drilling, and relates to the technical field of simulation. The method comprises the following steps: providing an initial material; a gas film hole is formed in the initial material through femtosecond laser; obtaining characterization parameters of the three-dimensional microstructure of the gas film hole, wherein the characterization parameters comprise the surface roughness of the gas film hole; performing three-dimensional point cloud modeling on the air film hole by utilizing the characterization parameters to form a first model; converting the first model into a second model; and performing simulation analysis on the second model by using a simulation system to obtain performance parameters of the air film hole. According to the simulation method provided by the invention, accurate modeling and simulation are carried out on the three-dimensional microstructure of the air film hole, so that the property and behavior of the microstructure can be known more accurately, and the accuracy and reliability of a simulation result can be improved.

The invention provides a molten pool dynamic simulation model and system for simulating laser drilling based on a level-set method, and the model comprises a two-dimensional molten pool simulation model which comprises heat transfer-laminar flow (two-phase flow) and level-set physical field coupling; on the basis of the confirmed implementation process parameters and material physical property parameters, a molten pool interface simulation metallographic phase under given process operation is compared with an actual metallographic phase, and a heat transfer mathematical model in the laser drilling process is obtained through simulation confirmation; and the three-dimensional thermal-mechanical coupling model is constructed based on a heat transfer mathematical model and further coupled with a solid mechanical physical field, so that temperature distribution and stress distribution at the welding printing position in the laser drilling process are obtained through simulation. The technical problems that in an existing laser drilling welding technology, parameter debugging depends on experience, dynamic monitoring of a molten pool is difficult, and thermal stress prediction means are lacked can be effectively solved, and powerful theoretical support and data basis are provided for optimizing the welding technology and improving the welding quality.

The invention discloses a machining method for improving the quality of a carrier plate through laser drilling. The machining method comprises the following steps that a first copper foil layer is cleaned, and the surface roughness of the first copper foil layer is detected; a laser drilling machine is adopted to machine a plurality of grooves in the surface of the first copper foil layer; the laser drilling machine performs roughness processing on the surface of the first copper foil layer in an out-of-focus scanning mode to form a rough surface with a convex structure; and the second dielectric layer is laminated with the first copper foil layer subjected to roughness processing. According to the method, laser drilling is directly adopted to carry out groove and roughness processing on the copper foil layer, and after the groove is additionally formed in the surface of the copper foil layer, the groove is filled with the filling material to form a mechanical anchoring point; meanwhile, due to the surface roughness design of the copper foil layer, the filling material can be better attached, the interlayer binding force is enhanced, and layering is avoided; in addition, the groove serves as a part of a heat conduction path, the high heat conductivity of copper can be utilized, heat distribution can be more uniform, heat can be transmitted to surrounding materials more quickly, and heat stress is reduced.

The application discloses a kind of laser trepanning devices, including host computer, and cooperate the laser cutting head of host computer, cable is connected between the host computer and the laser cutting head, further including support device, vertical lifting device is installed by the support device, the part cut down on plate is lifted after passing through the vertical lifting device and separates from main plate, rotary device is rotationally equipped by the vertical lifting device, the laser cutting head is installed by the rotary device, after the rotary device revolves around the vertical lifting device, the laser cutting head is completed trepanning after revolving on the surface of main plate, the host computer is installed by the support device, pull wire device is installed by the support device, the cable is clamped by the pull wire device, the cable passes through the support device;The device can be moved trepanning, meet the need of large trepanning, and facilitate separation of waste.

The present invention relates to the technical field of laser drilling, and discloses a high-altitude high-power laser drilling device for power transmission towers, including a moving seat. The upper surface of the moving seat is fixedly connected with a handle. A laser generator is arranged below the moving seat, and a rail clip is arranged below the moving seat. The upper surface of the rail clip is rotatably connected with a pulley. In the present invention, the rail clip moves up and down to fit the power transmission tower, facilitating the fixation of the device on power transmission tower trusses with different thicknesses, improving the applicability of the device. The two rail clips move closer to each other to clamp both sides of the tower truss, further improving the applicability and clamping force of the device. The moving plate and the rail clip move quickly on the steel frame through the pulley to adjust the position, improving the drilling speed. The abutting clamping block and the rail clip generate a mutual acting force to clamp the steel frame more tightly, making the device more stable and improving the stability and accuracy during the drilling of the laser generator.