701 results about "Hole drilling method" patented technology

Machine for ground drilling, with a circulating fluid, by the utilization of electric discharge generated by high-voltage pulses between electrodes. It may comprise: —A drill-bit 1 with electrodes movable relative to each other, so that bottom-hole physical contact be secured for all the electrodes 4 on all bottom-hole topographies. —Pointed hydraulic nozzles for jetting the fluid, to remove primary cuttings and with pressure expansion across the nozzles 7 at no less than 4 MPa. —A high-voltage pulse generator deployed down-hole at a minimum distance from the drill-bit 1. —A rotating or oscillating bit causing the borehole cross-sectional excavation to occur, and electric discharge between a plurality of electrodes situated on the bit face along one or a few radii and tangents. —A bottom hole assembly for annular hole-making with core storage, transportation, down-hole closed loop discharge fluid circulation. A discharge fluid storage may be incorporated. A drilling method is also described.

A telescopic drilling method includes the steps of drilling an outer bore through a surface, inserting a hollow outer conduit into the outer bore, and at least partially inserting a first hollow inner conduit through the outer conduit. Next, the method includes the steps of preventing the first inner conduit from moving longitudinal with respect to the outer conduit engaging a rotatable inner drill bit with a ring drill bit and further drilling the outer bore using a unitary drill bit head to a successive depth. The inner drill bit is disengaged from the ring drill bit and a second end of a successive hollow inner conduit is attached to a first end of a preceding one, and the preceding inner conduit is unclamped.

Drilling method of carbon dioxide laser includes steps: preparing locating point on layer next to the outer layer; before pressfitting added layer, browning oxidizing surface of target bonding pad; after pressfitting added layer, milling location hole / polishing edge, washing surface under high pressure; browning front surface of copper, thinning and coursing the surface before drilling hole by layer; first time to drill hole by laser; positioning film perforation by using plate location hole in original etching method for making window of copper, burning through copper foil and resin above the locating point on layer next to the outer layer so as to expose the locating point; second time to drill hole by laser; using the exposed locating point as position fixing to make micro hole inplate; washing surface under high pressure to remove browning layer after drill hole. The invention saves dry film and etching liquid, and raises process precision.

Roller cone drilling wherein the bit optimization process equalizes the downforce (axial force) for the cones (as nearly as possible, subject to other design constraints).

A drilling apparatus includes an upper drill string, a lower drill string including a rotary drilling motor, an orientable rotatable connection between the drill strings, a reactive torque control device associated with the orientable rotatable connection, an orientation sensing device for providing a sensed actual orientation of the lower drill string, and a feedback control system configured to actuate the control device in response to the sensed actual orientation to achieve a target orientation of the lower drill string. A drilling method includes actuating the control device to prevent relative rotation of the drill strings, providing a sensed actual orientation of the lower drill string, comparing the sensed actual orientation with a target orientation of the lower drill string, actuating the control device to allow the lower drill string to rotate to provide the target orientation, and actuating the control device to prevent relative rotation of the drill strings.

A cutting element for a drag-type earth-boring drill bit includes a cutting table with a face including a region that is configured cut into a formation at an effective positive back rake angle and to direct formation cuttings, or chips, that have been cut from the earth formation toward the hydraulics of the drill bit. Drill bits that include one or more cutting elements that have been configured in this manner are also disclosed. Such a drill bit may also include a wear pad for limiting the depth to which a cutting element penetrates a surface of a bore hole in an earth formation. Such a wear pad may have a substantially constant thickness. Methods for removing material from earth formations are also disclosed.

A differential diameter hole drilling method by which through-holes having improved major surface quality are formed in a target material involves drilling a pilot hole having a diameter that is less than the desired diameter of the through-hole and then drilling a through-hole having the desired diameter. The pilot hole forms a channel from which thermal energy produced during laser drilling can diffuse into the environment, thereby reducing the amount of thermal energy diffusing into the surrounding target material matrix and the degree of thermal damage to the heat affected zone of the target material matrix. The pilot hole also forms a channel through which ablated target material may be removed, thereby increasing overall through-hole throughput. Pilot hole formation reduces the thermal energy required to form the remaining portion of the through-hole and thereby results in less thermal damage to the surrounding target material matrix.

The invention discloses a method for improving coal seam gas permeability through a high energy acoustoelectric composite technology to mainly solve the problems that the prior art pollutes a coal seam, cannot thoroughly improve the coal seam gas permeability, cannot improve the coal seam gas desorption and seepage and the like. According to the method for improving the coal seam gas permeability through the high energy acoustoelectric composite technology, high electric field pulses and sound waves are combined, the coal seam generates new cracks due to functions of impact wave generation, mechanical vibration and the like, original cracks are expanded, and accordingly coal seam gas transport channels are increased; meanwhile the coal seam gas deabsorption is improved through generated high-temperature effect, cavitation effect and the like and the gas filtration capacity is improved. The method for improving the coal seam gas permeability through the high energy acoustoelectric composite technology comprises a ground drainage well drilling method and a drainage drill hole method parallel to the coal seam. An implementation process comprises the following steps of (1) pulling out devices inside a drill hole; (2) injecting water to the drill hole and drill well through drift tools such as a well gauge, arranging an acoustoelectric composite action device at an appointed position and dividing the coal seam into different sections, wherein the thickness of every section is 30cm; (3) enabling the action device to repeatedly act in the sections; (4) pulling out the devices such as the acoustoelectric composite action device; (5) exhausting and mining the drill hole of the coal seam.

The invention discloses a drilling method for achieving PCB high hole-site precision. The method comprises the following steps that firstly, a PCB is fixed on a workbench, secondly, the position to be drilled on the PCB is pre-drilled through a short-blade drilling tool, and thirdly, the position, to be drilled, processed in the second step is deep drilled through a long-blade drilling tool. The operation is easy and convenient and cost is low. The PCB is fixed in the first step, so that the PCB does not move during the drilling process, and the drilling precision cannot be affected. The position to be drilled on the PCB is pre-drilled through the short-blade drilling tool in the second step, and the rigidity of the short-blade drilling tool is better relative to the long-blade drilling tool, so that in the moment that the short-blade drilling tool makes contact with a PCB surface, the short-blade drilling tool is not prone to sliding. The position, to be drilled, processed in the second step is deep drilled through the long-blade drilling tool, the lateral sliding of the long-blade drilling tool during the drilling process is reduced, and therefore the drilling alignment of the long-blade drilling tool during the deep drilling process is guaranteed, and the drilled hole site can meet the requirement for the PCB high hole-site precision.

A wafer drilling method for forming via holes reaching electrodes in a wafer having a plurality of devices formed on the front surface of a substrate and electrodes formed on the devices by applying a pulse laser beam from the rear surface side of the substrate, wherein a material forming the substrate, a material forming the electrodes and a wavelength of the pulse laser beam are selected based on absorptivity for the wavelength of the pulse laser beam, and the material forming the substrate, the material forming the electrodes and the wavelength of the pulse laser beam are set to ensure that the absorptivity of the electrodes for the wavelength of the pulse laser beam becomes lower than the absorptivity of the substrate for the wavelength of the pulse laser beam.

The invention relates to a drilling method of a motherboard of a circuit board, which comprises the following steps of: determining drilling positions at the two opposite drilling faces of the motherboard of the circuit board; drilling at the first face of the motherboard of the circuit board: the determined position at the first face of the motherboard of the circuit board is drilled, and the drilling-in depth is 1/3 to 2/3 of the thickness of the motherboard of the circuit board; and drilling the second face of the motherboard of the circuit board: a position in the second face of the motherboard of the circuit board, which is superposed with a drill hole at the first face, is drilled with a through hole. The drilling method of the motherboard of the circuit board, which is provided by the invention, adopts the structure that the first face of the motherboard of the circuit board is firstly drilled, the drilling-in depth is 1/3 to 2/3 of the thickness of the motherboard of the circuit board, and then the second face of the motherboard of the circuit board is drilled with the through hole. For a mode of directly drilling the through hole at the thicker motherboard of the circuit board, the drilling method reduces the chip removal of drilling, solves the problem that a drill bit is broken in the drilling process, and enhances the drilling quality of the circuit board. Meanwhile, a method of drilling at both faces is adopted, and the problem of deviation in the drilling process is solved.

The invention discloses a method for machining slotted holes on carbon fiber laminated boards, which belongs to a machining method for nonmetallic materials, solves the problem that by the existing milling and drilling methods, carbon fiber laminated boards are easy to laminate, split and burn, and aims at improving the machining precision of carbon fiber composite products and reducing the surface roughness of carbon fiber composite products. The method disclosed by the invention comprises a clamping step, a machining step and a post-processing step, wherein the machining step is one or two of a milling machining step and a drilling machining step. According to the invention, in the machining process, a non-deformed clamping mode is used, and through selecting reasonable cutting tool materials, geometric parameters of cutting tools, and milling and drilling machining parameters, the appearance allowances in machining are reasonably arranged, thereby solving the quality problems of laminating, splitting and burning and the like existing in the process of opening or drilling carbon fiber thin-wall revolution bodies and carbon fiber laminated boards by using the traditional methods, so that the qualified rate of carbon fiber parts is increased from 50% to more than 99%.

The invention discloses a coal mine underground self-suction abrasive jet flow drill bit which can utilize the combination of abrasive jet flow guiding smash and mechanical smash to increase the drilling speed during the coal mine underground drilling operation. The self-suction abrasive jet flow drill bit comprises an abrasive jet flow nozzle, a self-suction device and a main smashing structure, wherein the self-suction device comprises a cavity, a filter screen, a support ring positioned inside the cavity and an inlet nozzle positioned at the rear end of the cavity. According to the invention, coal debris generated in the drilling process can be sifted by the filter screen, then enters the inside of the cavity of the self-suction device, and is fully mixed with a water jet flow to form an abrasive jet flow, the abrasive jet flow is jetted from the abrasive jet flow nozzle to perform guiding smash on coal and rock mass; the main smashing structure of the drill bit comprises three cutting pieces and three main smashing teeth, and a finished drill-hole can be formed under the mechanical smash action of the main smashing structure. The invention further relates to a method for utilizing the drill bit to drill in an underground coal mine. The drill bit has high drilling speed and little abrasion, and can be widely applied to coal mine underground drilling operation.

The present invention relates to an UV laser drilling method for making microconductive through-hole one printed circuit base board. Said method includes the following steps: utilizing UV laser beam to scan the position having need of making microconductive through-hole along a certain pathway, then successively making several microholes until the area of whole surface around the microconductive through-hole in covered with the made microholes all over, and then carving the whole microconductive through-hole. Said invention adopts the ring sawing process, so that it can raise the making quality of the microconductive through-hole.

A laser drilling system (100) for drilling rocks, soil and engineering materials with the aid of high-intensity laser light is described, which comprises an optical drill (104) for supplying laser light for the drilling of said materials provided with sensors (106); a control and operations center (101) comprising computer and supervising software with integrated logic; a cooling and debris withdrawal system (105) an energy source (102); an energy conductor (103) provided with sensors (107) and laser systems (201) for emitting high-intensity laser light and optical fibers (123) for conducting the so-generated laser light, so that the information collected by sensors (106), (107) supply said control and operations center (101) and said control and operations center (101) determines improved operation conditions of the optical drill (104) for the drilling of said solid materials or mixtures of solid and liquid materials relative to state-of-the-art drilling systems. The drilling method employing the system of the invention is also described.

The invention discloses a truss type intelligent drilling device and belongs to the field of special-shaped plate drilling devices. The upper portion of a gantry frame is provided with a Y-axis beam (2), a mechanical arm (9) is arranged on the Y-axis beam (2), the lower end of the mechanical arm (9) is provided with a drilling mechanism and a drilling positioning device, and a mechanical arm swinging mechanism used for driving the mechanical arm (9) to swing around the axis of the Y-axis beam (2) is arranged between the mechanical arm (9) and the Y-axis beam (2). The mechanical arm (9) is further connected with a drill bit lifting mechanism for driving the drilling mechanism to ascend and descend, a horizontal X-axis rail device perpendicular to the Y-axis beam (2) is arranged below the mechanical arm (9), a worktable is fixed to the X-axis rail device, a workpiece fixing mechanism is fixed to the worktable, and the Y-axis beam (2) and the worktable can move relatively in the length direction of the X-axis rail device. The invention further provides an arc plate drilling method with the device, and arc plates can be automatically drilled and machined.

The invention relates to a boring method of utilizing a single-side copper clad panel as a back-boring cover plate, which comprises the following procedures: providing the single-side copper clad panel as the back-boring cover plate, the single-side copper clad panel comprises a substrate plate and a copper plate which is positioned on one side of the substrate plate; installing the single-side copper clad panel on a PCB plate, the substrate side of the single-side copper clad panel is upward, the copper side is downward and contacts with the PCB plate; carrying out the back-boring process on the PCB plate. The invention utilizes the single-side copper clad panel as the back-boring cover plate, the thickness is larger and the hardness is larger and consequently the plate is not easily picked up, and the tolerance of the copper thickness of the single-side copper clad panel is less, thereby reducing the affect on the back-boring accuracy. Moreover, the substrate side of the single-side copper clad panel has the role of cleaning the drilling tool, can effectively avoid the depth error cauded by the advanced or delayed communication of high-frequency circuit caused by dust, copper scale and aluminum scale left on the drilling tool, thereby effectively promoting the back-boring accuracy.

The invention provides a traffic tunnel crack plugging and reinforcement method used in a vibration-disturbed environment, and relates to the technical field of crack repair in traffic tunnels. The grouting material is poured by using the method of minimal damage and adopting the pinhole oblique side drilling method. , Reinforcing while plugging. The specific method is to use a cutting machine to cut grooves along the seam first, clean them up and fill them with special cement for sealing, then make grouting holes along both sides of the seam to 1/3 to 1/2 of the seam. The grouting nozzle is installed in the hole, the grouting material is injected, and through the sealing effect of the cutting groove, and through the cross grouting, the grout is injected into the depth of the crack, so that the lining concrete at the crack is restored to form a whole, which solves the existing problems in the prior art. The technical problem that underground engineering cannot effectively plug leaks in the vibration-disturbed environment prevents leakage and cracking due to vibration-disturbed deformation and damage, and restores the compactness and structural integrity of the lining concrete.