Drilling method of motherboard of circuit board

Abstract

The invention relates to a drilling method of a motherboard of a circuit board, which comprises the following steps of: determining drilling positions at the two opposite drilling faces of the motherboard of the circuit board; drilling at the first face of the motherboard of the circuit board: the determined position at the first face of the motherboard of the circuit board is drilled, and the drilling-in depth is 1 / 3 to 2 / 3 of the thickness of the motherboard of the circuit board; and drilling the second face of the motherboard of the circuit board: a position in the second face of the motherboard of the circuit board, which is superposed with a drill hole at the first face, is drilled with a through hole. The drilling method of the motherboard of the circuit board, which is provided by the invention, adopts the structure that the first face of the motherboard of the circuit board is firstly drilled, the drilling-in depth is 1 / 3 to 2 / 3 of the thickness of the motherboard of the circuit board, and then the second face of the motherboard of the circuit board is drilled with the through hole. For a mode of directly drilling the through hole at the thicker motherboard of the circuit board, the drilling method reduces the chip removal of drilling, solves the problem that a drill bit is broken in the drilling process, and enhances the drilling quality of the circuit board. Meanwhile, a method of drilling at both faces is adopted, and the problem of deviation in the drilling process is solved.

Description

technical field [0001] The invention relates to a drilling method, in particular to a drilling method for a motherboard of a circuit board. Background technique [0002] In the process of generating a circuit board, many drilling operations are usually required. In the prior art, when drilling a general board, a method of directly drilling a tool from one side of the board to the other side is usually used. For thinner plates, this method has little effect, but for thicker plates, it will cause problems such as broken drill and drill hole diameter exceeding the requirements due to poor chip removal. In the circuit board industry, especially when drilling thicker circuit board motherboards, there will be problems with poor chip removal, which will lead to problems such as broken drills and excessively thick drilling diameters, which seriously affect the quality of circuit boards. At the same time, for a thicker circuit board mother board, the method of directly drilling the ...

AI Technical Summary

Problems solved by technology

[0003] The technical problem that the present invention solves is: provide a kind of drilling method of circuit board mother board, overcome the method in the prior art, adopt cutting tool to directly drill from one side of back board to the other side when drilling circuit board mother board and easily The technical problems that lead to the problem of broken drill and too large diameter of the drilled hole affect the quality of the circuit board

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