139results about "Conductive material mechanical removal" patented technology

The present invention relates to a method for manufacturing a ceramic substrate. Each of upper and lower metal layers respectively bonded to upper and lower surfaces of the ceramic substrate may have a thickness of 0.3 mm to 10 mm, so as to be applicable to a high output power module, and may reduce a chemical etching process time by performing, in advance, a trenching process, which is a mechanical processing scheme, in order to form an electrode pattern on the upper metal layer.

The invention relates to the technical field of PCB (Printed Circuit Board) processing, and discloses a method for removing lead warped copper by deep drilling in a gold finger gold plating process, which comprises the following steps of: optimizing the position and the shape of a gold-plated lead: changing the gold-plated lead from a short side of a gold finger to a side wall of the gold finger, and optimizing the shape of the gold-plated lead to be elliptical; the widest part R of the center of the ellipse satisfies Rlt by taking mil as a unit; x-R is larger than or equal to 4 mil, and X is the diameter of a deep drilling point; according to high-precision photosensitive wet film protection, before a gold-plated lead is removed through deep drilling, a photosensitive wet film is adopted to cover a gold finger lead area, the wet film is accurately positioned and printed through drilling positioning holes in the four corners, the protective area covers the gold finger lead and extends outwards by Y mil, and Y is larger than or equal to 4 mil. The method for removing the warped copper of the lead through deep drilling in the gold-plating process of the golden finger aims at solving the problem that the copper is prone to being warped when the gold-plated lead is removed through deep drilling in the gold-plating process of the golden finger.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a manufacturing method of a printed circuit board and the printed circuit board, and the manufacturing method of the printed circuit board comprises the steps: providing a substrate which comprises a dielectric layer and a metal layer, and arranging a first region and a BGA region on one surface, deviating from the dielectric layer, of the metal layer, the metal layer corresponding to the first area is provided with a plurality of shunting grooves, and the metal layer corresponding to the BGA area is provided with a plurality of BGA holes; the substrate is electroplated, an electroplated layer is formed, the electroplated layer comprises a first electroplated part, a plurality of second electroplated parts and at least one third electroplated part, the first electroplated part is located on the inner wall of the BGA hole, and the diversion grooves are filled with the second electroplated parts; and carrying out thinning treatment on the third electroplating part. According to the manufacturing method of the printed circuit board and the printed circuit board provided by the invention, the problem that the plated copper in the BGA area is not easy to remove when the surface copper thickness of the BGA area is increased by adopting a local thickening process in the related technology can be improved.

The invention discloses a method for manufacturing a circuit board of a thick copper slope circuit, which comprises the following steps of: attaching a first dry film layer on a thick copper layer, manufacturing a dry film pattern, retaining the dry film layer on the thick copper circuit, developing and removing the dry film layer on a thin copper circuit, developing the dry film layer on the slope circuit to form a matrix developing pattern, etching a slope circuit area to form a matrix etching pattern, and manufacturing the circuit board of the thick copper slope circuit. The method comprises the following steps of: grinding off a thick copper slope line, processing a line pattern, manufacturing a second dry film pattern, forming a surrounding pattern of all slope line areas, manufacturing a first solder mask layer in the surrounding pattern, manufacturing a second solder mask layer in other areas, and carrying out post-process processing to form a circuit board of the thick copper slope line; the processing precision and reliability of a slope circuit are improved through a mode of taking chemical processing of developing and etching as a main mode and taking polishing as an auxiliary mode, and a solder mask layer with the thickness reaching the standard and a complete covering effect is formed through manufacturing an encircling pattern and manufacturing a first solder mask layer and a second solder mask layer; the whole machining process effectively improves the machining precision and reliability.

The invention discloses a thick copper circuit production method of a circuit board and the circuit board. The method comprises the following steps: carrying out fine carving treatment on a first copper layer and a second copper layer of a to-be-treated circuit board to obtain a first thick copper circuit and a second thick copper circuit; resin filling processing is carried out between the first thick copper circuits and the second thick copper circuits to obtain a first circuit board, first hole filling resin between the first thick copper circuits is provided with a first groove after being cooled, and second hole filling resin between the second thick copper circuits is provided with a second groove after being cooled; grinding and polishing the first hole filling resin and the second hole filling resin to obtain a third circuit board; and performing line forming processing on the third circuit board to obtain a target circuit board. The first copper layer and the second copper layer are subjected to fine carving treatment, so that the forming of the thick copper circuit is quickly completed, and the production efficiency is high; and the resin is filled between the thick copper circuits, so that the interference between the thick copper circuits is reduced, and the production quality of the circuit board is improved.

The invention provides a method for processing a circuit board containing a plug-in hole step groove, and belongs to the technical field of printed circuit board production, and the method comprises the steps: processing a first core board and a second core board; a glue blocking film is pasted at the position of the preset step groove in the first core plate; sequentially stacking the first core board, the prepreg and the second core board from bottom to top, and then pressing the first core board, the prepreg and the second core board; a plug-in hole is drilled downwards in the preset position of the first core plate; milling a step groove in alignment with the position of the step groove preset on the first core plate, exposing the glue blocking film, and stripping the glue blocking film; carrying out copper deposition, copper plating and tin plating on the circuit board processed in the step; removing the tin layer and the copper surface on the side wall of the step groove; removing the tin layer at the base material position on the first core plate at the bottom of the step groove to expose a copper surface; and removing the exposed copper surface, and then removing the rest tin layer. The processing method can prevent excessive copper reduction when the redundant copper surface in the step groove is removed from causing corrosion to the core plate pattern at the bottom of the step groove and the hole copper of the plug-in hole.

The present specification relates to a capacitor manufacturing method comprising the steps of: a) forming a stack comprising, in order from an upper surface of a substrate, a first conductive layer made of aluminum or an aluminum-based alloy, a first electrode, a first dielectric layer, and a second electrode; b) etching an upper portion of the stack by chemical plasma etching, said chemical plasma etching being interrupted before the upper surface of the first conductive layer; and c) etching a lower portion of the stack by physical plasma etching, said physical plasma etching being interrupted in the upper surface of the first conductive layer.

The invention provides a circuit board with copper columns with different heights, a preparation method of the circuit board and a circuit board assembly. The first copper column and the second copper column which are different in height are formed by tearing off the separable copper foil layer and the base material layer, and certain base material layer and copper foil layer are reserved on the surface of the copper column, so that the uniformity (smoothness) of the height of the copper column can be improved, the heat dissipation performance can be improved, and the pollution problem caused by using a dry film is avoided. According to the circuit board, three-dimensional wiring can be achieved on a two-dimensional plane, coupling between adjacent signal lines is reduced, crosstalk between signals can be reduced, the mechanical strength balance of connecting points is ensured through the smooth copper column thickness, and therefore the reliability of a printed part can be improved.

The invention relates to the technical field of circuit board manufacturing, in particular to a composite target manufacturing method which comprises the steps that a composite target circuit pattern needing to be etched on the inner-layer circuit surface in a copper substrate is obtained, the inner-layer circuit surface comprises an upper-layer circuit surface and a lower-layer circuit surface, copper at the position corresponding to a hole site is etched off on the upper-layer circuit surface, and the lower-layer circuit surface is etched off on the lower-layer circuit surface; on the surface of the lower layer circuit, copper at the corresponding position of the composite target is etched, a plurality of inner layer boards to be laminated are laminated on the surface of the etched inner layer circuit after being laminated in sequence to form a multi-layer circuit board, and the position information of the composite target on the plurality of multi-layer circuit boards is obtained through a target drilling machine, the composite target on the multilayer circuit board comprises an alignment center and an alignment target point. Therefore, according to the composite target obtained through manufacturing, the position alignment of the drilling hole and the laser hole can be considered at the same time, the alignment degree of the line and the two different hole primitives is guaranteed to the maximum degree, and therefore the alignment precision of the graph is improved.

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

The present disclosure provides a wiring harness production method, a nozzle and a wiring harness. The wiring harness production method includes: Step S10: preparing a substrate; Step S20: spraying a conductive material onto the substrate to form a conductive loop; and Step S30: forming an insulating protective layer at the periphery of the conductive loop and on a surface thereof. The present disclosure solves the technical problems of complex production process and high processing cost of a wiring harness for electrically connecting electrical components.

A printed circuit board structure (100) and a method for manufacturing the same are provided. The printed circuit board structure (100) comprises a ceramic plate (13), a thick circuit layer (111) formed on the ceramic plate (13), and a thin circuit layer (C1) formed on the ceramic plate (13). The thick circuit layer (111) has a thickness greater than or equal to 200 µm, and the thin circuit layer (C1) has a thickness in the range of 1 µm to 150 µm. The thin circuit layer (C1) comprises a sputtering layout segment (21) bonded to the ceramic plate (13) and an electroplating layer (6) bonded to the sputtering layout segment (21). The material of the electroplating layer (6) is different from that of the sputtering layout segment (21).

The invention relates to the technical field of circuit board production, in particular to a manufacturing method of a convex copper block and a manufacturing method of a copper-embedded circuit board. The manufacturing method of the convex copper block comprises the following steps: a depth control milling step: a preset milling belt is configured for a milling machine, the preset milling belt comprises a starting point, an end point and a milling belt path, the starting point corresponds to the inner side edge of a to-be-milled area, the end point corresponds to the outer side edge of the to-be-milled area, and the milling belt path extends from the starting point to the end point by multiple circles from inside to outside; selecting a milling cutter with a preset cutter diameter, wherein the preset cutter diameter is not greater than 1 / 2 of the width of the to-be-milled area; and a milling cutter is adopted to carry out depth-controlled milling treatment on the copper plate according to a preset milling belt. The manufacturing method of the copper-embedded circuit board comprises the manufacturing method of the convex copper block. According to the manufacturing method of the convex copper block and the manufacturing method of the copper-embedded circuit board, the copper plate material is processed by adopting a multi-circle depth control milling scheme of a knife from inside to outside, so that the depth control precision of the convex copper block is improved, and the tolerance requirement can be met.

The invention provides a die cutting circuit waste discharge method and system and a die cutting circuit board processing method and system. The waste discharge method for the die cutting circuit comprises the following steps: providing a bottom supporting film which is provided with an isolating layer made of a release film; a conducting film is attached to the face, provided with the isolating layer, of the bottom supporting film, and the isolating layer is located between the conducting film and the bottom supporting film; the conducting film is subjected to die cutting to form a circuit layer to be reserved and a waste material layer to be discharged, the shape of the isolation layer corresponds to the shape of the waste material layer, and the isolation layer is located between the waste material layer and the backing film; and bonding the die-cut conductive film by using a waste discharge adhesive tape, tearing off the waste discharge adhesive tape to discharge the waste material layer, and reserving the circuit layer on the backing film. The isolating layer is arranged between the waste material layer and the bottom supporting film, so that the adhesive force between the waste material layer and the bottom supporting film is reduced, a waste discharge adhesive tape is conveniently discharged out of the waste material layer, and the risk that the waste discharge adhesive tape breaks the circuit layer is reduced.

The invention discloses a manufacturing method of a wire-clamping circuit board, the wire-clamping circuit board and a lamp strip. The wire-clamping circuit board comprises a first thin film; a metal foil line; a part of or all of the flat wire circuits are provided with gaps, so that the widths of the part of or all of the flat wire circuits are different; the second thin film is provided with a plurality of bonding pad windows; the first thin film and the second thin film are combined together, and the flat wire circuit and the metal foil circuit are clamped between the two thin films; the thickness of the flat wire circuit is greater than that of the metal foil circuit; the flat wire circuit is a main circuit, and the metal foil circuit is an auxiliary circuit, or the metal foil circuit is provided with both the main circuit and the auxiliary circuit; the main line is longer than the auxiliary line; metal exposed out of the bonding pad window is a flat wire circuit or / and a metal foil circuit. Through the design of the notches, part of positions are narrowed, but other positions can be kept wider, so that the current load is increased, and the problem of separation and layering of the thin film is solved.

Printed circuit board, characterized by: a) A carrier substrate bound with structured channels, wherein the channels are formed by subtractive processing of the substrate or by applied insulating dam lines. b) Electrically conductive metal powder that fills the channels.

The invention relates to a flexible printed circuit board comprising a conductor track unit (14). A first side (30) of the conductor track unit (14) is connected to a first carrier film (16) by means of a first adhesive layer (18). A first outer side (20) of the flexible printed circuit board (12) is formed by a surface of the first carrier foil (16) facing away from the conductor track unit (14). The flexible printed circuit board (12) comprises a second carrier film (26) which is connected to a second side (32) of the conductor track unit (14) by means of a second adhesive layer (28). A second outer side (34) of the flexible printed circuit board (12) is formed by a surface of the second carrier film (26) facing away from the conductor track unit (14). The first adhesive layer (18) has a lower thickness (40) than the second adhesive layer (28). The invention also relates to a control device comprising such a printed circuit board (12) and to a method for manufacturing a flexible printed circuit board (12).

The application discloses a PCB milling device and a use method, relates to the technical field of PCB processing, and solves the problem that a large amount of heat is generated due to the friction and extrusion of a cutter of a PCB milling machine, the copper foil or elements on the PCB are possibly ablated when the temperature of the cutter of the milling machine is too high, and the PCB is damaged by heat, and the device comprises a fixed plate fixedly installed on a control mechanism of the milling machine, a top plate and a bottom plate fixedly installed on a side of the fixed plate away from the control mechanism, and a plurality of connecting columns fixedly installed between the top plate and the bottom plate and equidistantly distributed. The milling mechanism is used for processing the PCB, and the number of the milling mechanisms is two groups; the driving motor in the driving mechanism can drive the two milling mechanisms to rotate left and right, the two milling mechanisms are alternately used to process the PCB, the cutter is alternately cooled, and the cutter is effectively prevented from being overheated to damage the PCB.

The invention relates to an automatic turning mechanism for removing an electrophoresis layer through laser etching, which comprises a base, a rotating frame, a laser etching device and a laser etching device, the rotating frame is rotationally connected with the base; the rotating end of the driving part is fixedly connected with the rotating frame, and the driving part is used for controlling and driving the rotating frame to rotate; the clamp is fixedly connected to the rotating frame, the side, making contact with a product, of the clamp is provided with a positioning groove and a lever piece, the side, making contact with the product, of the positioning groove is in profile modeling with the structure of the product and is used for positioning the product, and the lever piece is used for locking and attaching the product into the clamp. And then the product on the rotating frame is driven to rotate to be vertically upward to be subjected to laser etching to remove an electrophoresis layer, the product can be clamped only once, but different planes can be rotated to be vertically upward, laser etching of the electrophoresis layers of the different planes of the product is facilitated, and the laser etching efficiency of the product is improved.

The invention discloses an aluminum substrate production process for cutting a circuit through a die, which is characterized by comprising the following steps of: (1) physically cutting the circuit through a die-cutting machine by using a copper foil roll to manufacture a circuit layer; (2) manufacturing an aluminum bottom plate layer by using an aluminum coil or an aluminum plate; (3) rolling an insulating film into an insulating layer; (4) adhering an insulating layer to the front surface of the aluminum bottom plate layer; (5) adhering the circuit layer to the front surface of the insulating layer, and performing high-temperature compounding through a hot press; (6) a solder mask layer is manufactured on the front face of the circuit layer, and an aluminum substrate semi-finished product is manufactured; and (7) baking the aluminum substrate semi-finished product to obtain an aluminum substrate finished product. The circuit layer is manufactured by physically cutting the circuit of the copper foil roll through the die-cutting machine instead of the traditional circuit layer which is manufactured by etching the copper foil, so that the production efficiency is high, the production process is simple, environmental pollution caused by chemical liquid medicine is avoided, the production cost is reduced, the production quality is improved, and batch production is facilitated.

A surface mount technology (SMT) panel frame is provided. The SMT panel frame (100) includes a panel (110) and at least one copper material region (130) disposed on the panel (110). The panel (110) is substantially sufficient to securely hold at least one printed circuit board (120), the panel (110) is removably arranged around the printed circuit board (120), and predetermined areas on the printed circuit board (PCB) (120) are designated for placing data matrix codes (DMC), reference points and test points. At least one copper material region (130) is selectively arranged within the panel (110) based on the arrangement of the data matrix code, the reference and the test points such that the copper material region is aligned with the location and arrangement of the panel reference points, DMC and test points, thereby reducing the need of the entire panel (110) for copper.

The invention relates to the technical field of circuit board processing and engraving, in particular to an engraving device for circuit board processing, which comprises a moving table, a fixed clamping plate and a lateral positioning plate are fixed at the top end of the moving table, a moving clamping plate mounting plate is movably mounted at the top end of the moving table, and a moving clamping plate is slidably connected to the moving table; the circuit board clamping device has the beneficial effects that the clamping spring pushes the movable clamping plate to move in the direction close to the fixed clamping plate, finally, the movable clamping plate abuts against the surface of the end, away from the fixed clamping plate, of the circuit board, and the clamping spring still generates pushing force on the movable clamping plate under the elastic effect of the clamping spring; therefore, the circuit board is clamped between the fixed clamping plate and the movable clamping plate, and the function of pre-positioning the circuit boards of various specifications is achieved. And through the self-locking function of threaded connection between the clamping screw rod hole and the clamping screw rod, the clamping stability of the circuit board is enhanced, so that stable positioning of the circuit boards of various specifications is realized.

A method of manufacturing an electrical device, comprising: forming a patterned inorganic liftoff layer to expose a target electrode site on a softening polymer layer, depositing an electrode layer on the inorganic liftoff layer and on the exposed target electrode site, and removing the inorganic liftoff layer by a horizontal liftoff etch to leave the electrode layer on the exposed target electrode site.

The invention discloses a manufacturing method of a double-layer circuit board, the double-layer circuit board and an LED lamp strip. The double-layer circuit board comprises a first insulating film; a first line layer; a via hole is formed in the middle insulating film, and the first circuit layer is exposed out of the via hole at the via hole; the second circuit layer is arranged at part of or all of the via holes, circuits of the second circuit layer are combined on the first insulating film, and the second circuit layer shields part of the middle insulating film in the via holes; the front solder mask layer is combined on the second circuit layer, pad windows are arranged on the front solder mask layer, part of the pad windows are arranged at the via holes, and metal of the first circuit layer and metal of the second circuit layer are exposed out of each pad window at the via holes; or, part of the bonding pad window at the via hole exposes the metal of the first circuit layer and the metal of the second circuit layer, and part of the bonding pad window only exposes the metal of the first circuit layer. Tin cavities can be avoided, and the yield is improved.

An electronic system having a mounting substrate with a plurality of layers. The mounting substrate combines an upper shield structure and a lower shield structure to form an interlocking shielding structure to reduces crosstalk interference and improve return loss and insertion loss for high-speed serial communication circuits. The upper shield structure and the lower shield structure have a series of grounded reference shields that reduce unwanted electrical signal interferences.

A method for forming an electrical circuit on an insulating ceramic substrate or on an insulating ceramic layer (25) of a substrate (21), the method comprising: depositing an electrically conductive material (23) onto a surface of the ceramic substrate or ceramic layer; and aligning a laser beam (26) to the conductive material on the ceramic substrate and moving the laser beam relative to the ceramic substrate or ceramic layer along a predetermined circuit pattern such that the conductive material melts onto the ceramic surface or ceramic layer to form a conductive line (24).

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

The present invention provides a semiconductor die including a first pad-level dielectric layer embedded in a first bonding pad and located above a first substrate. Each of the first bonding pads is located in a corresponding pad cavity in the first pad-level dielectric layer. Each of the first bonding pads includes: a first metal liner, the first metal liner containing a first metal liner material and contacting a sidewall of the corresponding pad cavity; a first metal fill material portion, the first metal fill material portion embedded in the first metal liner; and a metal electromigration barrier layer, the metal electromigration barrier layer contacting the first metal fill material portion and adjacent to the first metal liner.

The invention discloses a preparation method of an RFID (Radio Frequency Identification Device) antenna, which comprises the following steps of: coating a low-viscosity water-based adhesive on a release surface of release paper to form an adhesive layer, and compounding an aluminum foil on the adhesive layer to obtain a composite foil material; according to the design pattern of the RFID antenna, the aluminum foil layer on the composite foil is subjected to precise die cutting, and a needed antenna pattern and a waste area are formed; the aluminum foil in the waste area is removed, and the antenna pattern is left to be attached to the release paper; the surface of the PET base material is coated with a high-viscosity permanent adhesive, and the release paper bearing the antenna pattern is attached to the PET base material in an aligned mode, so that the antenna pattern is firmly combined with the permanent adhesive; and finally, the antenna pattern is transferred to the PET base material by stripping the release paper. And slitting the PET base material on which the antenna pattern is transferred to obtain the RFID antenna. Precise die cutting is achieved by temporarily fixing the aluminum foil through the low-viscosity adhesive layer, then pattern transfer is completed through the high-viscosity adhesive layer, and the problem of transfer defects caused by adhesive layer viscosity contradiction in a traditional process is solved.

The invention discloses a method for preventing and improving edge cracking of a PCB (Printed Circuit Board) molded routing board, which comprises the following steps: in a molding process, when the appearance of an SET board or a unit board is routed on a production board by adopting a routing knife, the size of the single edge of the SET board or the unit board is pre-increased by 0.2 mm on the basis of design; and performing fine trimming on the SET plate or the unit plate by adopting a trimming cutter or a dense tooth cutter so as to remove the pre-enlarged part in the SET plate or the unit plate. According to the method, under the condition that the normal board milling efficiency is not affected, the problem of edge cracking of the milled board can be solved, and the board milling quality can be guaranteed.