89results about "Conductive material mechanical removal" patented technology

The present invention relates to a method for manufacturing a ceramic substrate. Each of upper and lower metal layers respectively bonded to upper and lower surfaces of the ceramic substrate may have a thickness of 0.3 mm to 10 mm, so as to be applicable to a high output power module, and may reduce a chemical etching process time by performing, in advance, a trenching process, which is a mechanical processing scheme, in order to form an electrode pattern on the upper metal layer.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a manufacturing method of a printed circuit board and the printed circuit board, and the manufacturing method of the printed circuit board comprises the steps: providing a substrate which comprises a dielectric layer and a metal layer, and arranging a first region and a BGA region on one surface, deviating from the dielectric layer, of the metal layer, the metal layer corresponding to the first area is provided with a plurality of shunting grooves, and the metal layer corresponding to the BGA area is provided with a plurality of BGA holes; the substrate is electroplated, an electroplated layer is formed, the electroplated layer comprises a first electroplated part, a plurality of second electroplated parts and at least one third electroplated part, the first electroplated part is located on the inner wall of the BGA hole, and the diversion grooves are filled with the second electroplated parts; and carrying out thinning treatment on the third electroplating part. According to the manufacturing method of the printed circuit board and the printed circuit board provided by the invention, the problem that the plated copper in the BGA area is not easy to remove when the surface copper thickness of the BGA area is increased by adopting a local thickening process in the related technology can be improved.

The invention discloses a thick copper circuit production method of a circuit board and the circuit board. The method comprises the following steps: carrying out fine carving treatment on a first copper layer and a second copper layer of a to-be-treated circuit board to obtain a first thick copper circuit and a second thick copper circuit; resin filling processing is carried out between the first thick copper circuits and the second thick copper circuits to obtain a first circuit board, first hole filling resin between the first thick copper circuits is provided with a first groove after being cooled, and second hole filling resin between the second thick copper circuits is provided with a second groove after being cooled; grinding and polishing the first hole filling resin and the second hole filling resin to obtain a third circuit board; and performing line forming processing on the third circuit board to obtain a target circuit board. The first copper layer and the second copper layer are subjected to fine carving treatment, so that the forming of the thick copper circuit is quickly completed, and the production efficiency is high; and the resin is filled between the thick copper circuits, so that the interference between the thick copper circuits is reduced, and the production quality of the circuit board is improved.

The present specification relates to a capacitor manufacturing method comprising the steps of: a) forming a stack comprising, in order from an upper surface of a substrate, a first conductive layer made of aluminum or an aluminum-based alloy, a first electrode, a first dielectric layer, and a second electrode; b) etching an upper portion of the stack by chemical plasma etching, said chemical plasma etching being interrupted before the upper surface of the first conductive layer; and c) etching a lower portion of the stack by physical plasma etching, said physical plasma etching being interrupted in the upper surface of the first conductive layer.

The invention provides a circuit board with copper columns with different heights, a preparation method of the circuit board and a circuit board assembly. The first copper column and the second copper column which are different in height are formed by tearing off the separable copper foil layer and the base material layer, and certain base material layer and copper foil layer are reserved on the surface of the copper column, so that the uniformity (smoothness) of the height of the copper column can be improved, the heat dissipation performance can be improved, and the pollution problem caused by using a dry film is avoided. According to the circuit board, three-dimensional wiring can be achieved on a two-dimensional plane, coupling between adjacent signal lines is reduced, crosstalk between signals can be reduced, the mechanical strength balance of connecting points is ensured through the smooth copper column thickness, and therefore the reliability of a printed part can be improved.

The invention relates to the technical field of circuit board manufacturing, in particular to a composite target manufacturing method which comprises the steps that a composite target circuit pattern needing to be etched on the inner-layer circuit surface in a copper substrate is obtained, the inner-layer circuit surface comprises an upper-layer circuit surface and a lower-layer circuit surface, copper at the position corresponding to a hole site is etched off on the upper-layer circuit surface, and the lower-layer circuit surface is etched off on the lower-layer circuit surface; on the surface of the lower layer circuit, copper at the corresponding position of the composite target is etched, a plurality of inner layer boards to be laminated are laminated on the surface of the etched inner layer circuit after being laminated in sequence to form a multi-layer circuit board, and the position information of the composite target on the plurality of multi-layer circuit boards is obtained through a target drilling machine, the composite target on the multilayer circuit board comprises an alignment center and an alignment target point. Therefore, according to the composite target obtained through manufacturing, the position alignment of the drilling hole and the laser hole can be considered at the same time, the alignment degree of the line and the two different hole primitives is guaranteed to the maximum degree, and therefore the alignment precision of the graph is improved.

The invention relates to the technical field of circuit board production, in particular to a manufacturing method of a convex copper block and a manufacturing method of a copper-embedded circuit board. The manufacturing method of the convex copper block comprises the following steps: a depth control milling step: a preset milling belt is configured for a milling machine, the preset milling belt comprises a starting point, an end point and a milling belt path, the starting point corresponds to the inner side edge of a to-be-milled area, the end point corresponds to the outer side edge of the to-be-milled area, and the milling belt path extends from the starting point to the end point by multiple circles from inside to outside; selecting a milling cutter with a preset cutter diameter, wherein the preset cutter diameter is not greater than 1 / 2 of the width of the to-be-milled area; and a milling cutter is adopted to carry out depth-controlled milling treatment on the copper plate according to a preset milling belt. The manufacturing method of the copper-embedded circuit board comprises the manufacturing method of the convex copper block. According to the manufacturing method of the convex copper block and the manufacturing method of the copper-embedded circuit board, the copper plate material is processed by adopting a multi-circle depth control milling scheme of a knife from inside to outside, so that the depth control precision of the convex copper block is improved, and the tolerance requirement can be met.

The invention provides a die cutting circuit waste discharge method and system and a die cutting circuit board processing method and system. The waste discharge method for the die cutting circuit comprises the following steps: providing a bottom supporting film which is provided with an isolating layer made of a release film; a conducting film is attached to the face, provided with the isolating layer, of the bottom supporting film, and the isolating layer is located between the conducting film and the bottom supporting film; the conducting film is subjected to die cutting to form a circuit layer to be reserved and a waste material layer to be discharged, the shape of the isolation layer corresponds to the shape of the waste material layer, and the isolation layer is located between the waste material layer and the backing film; and bonding the die-cut conductive film by using a waste discharge adhesive tape, tearing off the waste discharge adhesive tape to discharge the waste material layer, and reserving the circuit layer on the backing film. The isolating layer is arranged between the waste material layer and the bottom supporting film, so that the adhesive force between the waste material layer and the bottom supporting film is reduced, a waste discharge adhesive tape is conveniently discharged out of the waste material layer, and the risk that the waste discharge adhesive tape breaks the circuit layer is reduced.

Printed circuit board, characterized by: a) A carrier substrate bound with structured channels, wherein the channels are formed by subtractive processing of the substrate or by applied insulating dam lines. b) Electrically conductive metal powder that fills the channels.

The invention relates to a flexible printed circuit board comprising a conductor track unit (14). A first side (30) of the conductor track unit (14) is connected to a first carrier film (16) by means of a first adhesive layer (18). A first outer side (20) of the flexible printed circuit board (12) is formed by a surface of the first carrier foil (16) facing away from the conductor track unit (14). The flexible printed circuit board (12) comprises a second carrier film (26) which is connected to a second side (32) of the conductor track unit (14) by means of a second adhesive layer (28). A second outer side (34) of the flexible printed circuit board (12) is formed by a surface of the second carrier film (26) facing away from the conductor track unit (14). The first adhesive layer (18) has a lower thickness (40) than the second adhesive layer (28). The invention also relates to a control device comprising such a printed circuit board (12) and to a method for manufacturing a flexible printed circuit board (12).

The application discloses a PCB milling device and a use method, relates to the technical field of PCB processing, and solves the problem that a large amount of heat is generated due to the friction and extrusion of a cutter of a PCB milling machine, the copper foil or elements on the PCB are possibly ablated when the temperature of the cutter of the milling machine is too high, and the PCB is damaged by heat, and the device comprises a fixed plate fixedly installed on a control mechanism of the milling machine, a top plate and a bottom plate fixedly installed on a side of the fixed plate away from the control mechanism, and a plurality of connecting columns fixedly installed between the top plate and the bottom plate and equidistantly distributed. The milling mechanism is used for processing the PCB, and the number of the milling mechanisms is two groups; the driving motor in the driving mechanism can drive the two milling mechanisms to rotate left and right, the two milling mechanisms are alternately used to process the PCB, the cutter is alternately cooled, and the cutter is effectively prevented from being overheated to damage the PCB.

The invention relates to an automatic turning mechanism for removing an electrophoresis layer through laser etching, which comprises a base, a rotating frame, a laser etching device and a laser etching device, the rotating frame is rotationally connected with the base; the rotating end of the driving part is fixedly connected with the rotating frame, and the driving part is used for controlling and driving the rotating frame to rotate; the clamp is fixedly connected to the rotating frame, the side, making contact with a product, of the clamp is provided with a positioning groove and a lever piece, the side, making contact with the product, of the positioning groove is in profile modeling with the structure of the product and is used for positioning the product, and the lever piece is used for locking and attaching the product into the clamp. And then the product on the rotating frame is driven to rotate to be vertically upward to be subjected to laser etching to remove an electrophoresis layer, the product can be clamped only once, but different planes can be rotated to be vertically upward, laser etching of the electrophoresis layers of the different planes of the product is facilitated, and the laser etching efficiency of the product is improved.

The invention discloses an aluminum substrate production process for cutting a circuit through a die, which is characterized by comprising the following steps of: (1) physically cutting the circuit through a die-cutting machine by using a copper foil roll to manufacture a circuit layer; (2) manufacturing an aluminum bottom plate layer by using an aluminum coil or an aluminum plate; (3) rolling an insulating film into an insulating layer; (4) adhering an insulating layer to the front surface of the aluminum bottom plate layer; (5) adhering the circuit layer to the front surface of the insulating layer, and performing high-temperature compounding through a hot press; (6) a solder mask layer is manufactured on the front face of the circuit layer, and an aluminum substrate semi-finished product is manufactured; and (7) baking the aluminum substrate semi-finished product to obtain an aluminum substrate finished product. The circuit layer is manufactured by physically cutting the circuit of the copper foil roll through the die-cutting machine instead of the traditional circuit layer which is manufactured by etching the copper foil, so that the production efficiency is high, the production process is simple, environmental pollution caused by chemical liquid medicine is avoided, the production cost is reduced, the production quality is improved, and batch production is facilitated.

A surface mount technology (SMT) panel frame is provided. The SMT panel frame (100) includes a panel (110) and at least one copper material region (130) disposed on the panel (110). The panel (110) is substantially sufficient to securely hold at least one printed circuit board (120), the panel (110) is removably arranged around the printed circuit board (120), and predetermined areas on the printed circuit board (PCB) (120) are designated for placing data matrix codes (DMC), reference points and test points. At least one copper material region (130) is selectively arranged within the panel (110) based on the arrangement of the data matrix code, the reference and the test points such that the copper material region is aligned with the location and arrangement of the panel reference points, DMC and test points, thereby reducing the need of the entire panel (110) for copper.

The invention relates to the technical field of circuit board processing and engraving, in particular to an engraving device for circuit board processing, which comprises a moving table, a fixed clamping plate and a lateral positioning plate are fixed at the top end of the moving table, a moving clamping plate mounting plate is movably mounted at the top end of the moving table, and a moving clamping plate is slidably connected to the moving table; the circuit board clamping device has the beneficial effects that the clamping spring pushes the movable clamping plate to move in the direction close to the fixed clamping plate, finally, the movable clamping plate abuts against the surface of the end, away from the fixed clamping plate, of the circuit board, and the clamping spring still generates pushing force on the movable clamping plate under the elastic effect of the clamping spring; therefore, the circuit board is clamped between the fixed clamping plate and the movable clamping plate, and the function of pre-positioning the circuit boards of various specifications is achieved. And through the self-locking function of threaded connection between the clamping screw rod hole and the clamping screw rod, the clamping stability of the circuit board is enhanced, so that stable positioning of the circuit boards of various specifications is realized.

An electronic system having a mounting substrate with a plurality of layers. The mounting substrate combines an upper shield structure and a lower shield structure to form an interlocking shielding structure to reduces crosstalk interference and improve return loss and insertion loss for high-speed serial communication circuits. The upper shield structure and the lower shield structure have a series of grounded reference shields that reduce unwanted electrical signal interferences.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

The invention discloses a preparation method of an RFID (Radio Frequency Identification Device) antenna, which comprises the following steps of: coating a low-viscosity water-based adhesive on a release surface of release paper to form an adhesive layer, and compounding an aluminum foil on the adhesive layer to obtain a composite foil material; according to the design pattern of the RFID antenna, the aluminum foil layer on the composite foil is subjected to precise die cutting, and a needed antenna pattern and a waste area are formed; the aluminum foil in the waste area is removed, and the antenna pattern is left to be attached to the release paper; the surface of the PET base material is coated with a high-viscosity permanent adhesive, and the release paper bearing the antenna pattern is attached to the PET base material in an aligned mode, so that the antenna pattern is firmly combined with the permanent adhesive; and finally, the antenna pattern is transferred to the PET base material by stripping the release paper. And slitting the PET base material on which the antenna pattern is transferred to obtain the RFID antenna. Precise die cutting is achieved by temporarily fixing the aluminum foil through the low-viscosity adhesive layer, then pattern transfer is completed through the high-viscosity adhesive layer, and the problem of transfer defects caused by adhesive layer viscosity contradiction in a traditional process is solved.

The invention discloses a method for preventing and improving edge cracking of a PCB (Printed Circuit Board) molded routing board, which comprises the following steps: in a molding process, when the appearance of an SET board or a unit board is routed on a production board by adopting a routing knife, the size of the single edge of the SET board or the unit board is pre-increased by 0.2 mm on the basis of design; and performing fine trimming on the SET plate or the unit plate by adopting a trimming cutter or a dense tooth cutter so as to remove the pre-enlarged part in the SET plate or the unit plate. According to the method, under the condition that the normal board milling efficiency is not affected, the problem of edge cracking of the milled board can be solved, and the board milling quality can be guaranteed.

A base plate assembly based on a manufacturing process of a composite circuit board according to the invention has a better load-bearing effect; conductive posts are riveted to the composite circuit board; connecting wires are fixed to upper ends of the conductive posts by means of conductive screws, so that components and the composite circuit board are electrically connected. The assembly process is simplified and the assembly efficiency is improved. Moreover, the test can be carried out as soon as the conductive posts are riveted. In this way, the problem that the defects of the base plate assembly can be discovered only after the components are assembled can be avoided effectively, thereby reducing the generation of defective products and the rework and maintenance rate and ensuring the pass rate of finished products.

A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.

Disclosed is a manufacturing method of a circuit board including the following steps: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.

This application relates to a printed circuit board manufacturing method and a printed circuit board. The method includes: forming a through hole in a multilayer printed circuit board that runs through the multilayer circuit board, where the multilayer printed circuit board is provided with an upper printed circuit board, a wiring layer, and a lower printed circuit board that are stacked; forming a blind hole from the upper printed circuit board to the wiring layer in the multilayer circuit board; drilling between the through hole and the blind hole to form a connection groove, where the through hole is in communication with the blind hole through the connection groove; and allowing an electrolyte solution to flow through the through hole, the connection groove, and the blind hole to form a conductive layer, achieving an electrical connection between the upper printed circuit board and the lower printed circuit board.

The utility model discloses a kind of line clamping circuit board and lamp strip, comprising: first film;Metal foil circuit;Flat conductor circuit, part or all flat conductor circuit is provided with notch, so that part or all flat conductor circuit is not the same in width and narrow;Second film, several pad windows are provided thereon;First film is combined together with second film, and flat conductor circuit and metal foil circuit are clamped between two films;The thickness of flat conductor circuit is greater than the thickness of metal foil circuit;Flat conductor circuit is main circuit, and metal foil circuit is auxiliary circuit, or, metal foil circuit has main circuit, and also has auxiliary circuit;The length of main circuit is greater than the length of auxiliary circuit;The metal exposed in pad window is flat conductor circuit or / and metal foil circuit. Through notch design makes part position narrow, but can make other position keep wider, to increase current load, solve the problem of film separation delamination.

A component carrier (100) which comprises a stack (102) comprising at least one electrically insulating layer structure (104) and at least one electrically conductive layer structure (106), said at least one electrically conductive layer structure (106) comprising at least one trace (108) embedded in the at least one electrically insulating layer structure (104), said at least one trace (108) comprising, in a cross section, two lateral walls (110) slanted inwardly beginning from an exterior surface (112) where said embedded trace (108) is exposed with respect to the at least one electrically insulating layer structure (104), wherein the at least one trace (108) comprises, in the cross section, two sharp edges (114) at the exterior surface (112) and at least one rounded edge (116) at an opposed extremity.

Provided in the present application are a die-cutting circuit waste removal method and system, and a die-cutting circuit board processing method and system. The die-cutting circuit waste removal method comprises: providing a backing film (11), wherein an isolation layer (121) made of a release film (12) is provided on the backing film (11); attaching an electrically conductive film (14) onto the backing film (11); performing die cutting on the electrically conductive film (14), so as to form a circuit layer (141) to be retained and a waste layer (142) to be removed, wherein the shape of the isolation layer (121) corresponds to the shape of the waste layer (142), and the isolation layer (121) is located between the waste layer (142) and the backing film (11); using a waste removal adhesive tape (15) to adhere to the electrically conductive film (14) subjected to die cutting, tearing off the waste removal adhesive tape (15), so as to remove the waste layer (142), and retaining the circuit layer (141) on the backing film (11).

A system for assembling a group of dies from a source substrate onto a transfer substrate. A high-throughput low-precision system is configured to pick the group of dies from the source substrate and placed onto an intermediate substrate, where the placement of the group of dies onto the intermediate substrate is performed such that the X and / or Y pitch of the placed group of dies matches a corresponding system-in-package (SiP) pitch. Furthermore, a parallel high-precision system is configured to pick and place the group of dies from the intermediate substrate onto the transfer substrate, where the placement of the group of dies onto the transfer substrate is performed at the SiP pitch, where a precision of assembly onto the transfer substrate is sub-500 nm.

The invention belongs to the related technical field of circuit board production processes, and particularly relates to plasma glass fiber removing equipment and a method for removing residual glue of a multilayer board. A plasma device is arranged, a first shell is arranged, a first circuit board channel is arranged in the first shell, a first spraying rod is arranged at the top of the first circuit board channel, and a first spraying opening is formed in the first spraying rod so that gas can be sprayed out from the top; the electroplating device is provided with a second shell, a second circuit board channel is arranged in the second shell, a second spraying rod is arranged on the side edge of the second circuit board channel, and a second spraying opening is formed in the second spraying rod so that electroplating liquid can be sprayed from the side edge for electroplating; an oscillation rod is movably arranged at the top of the second circuit board channel, an oscillation assembly is arranged on the oscillation rod, and the oscillation assembly enables the oscillation rod to shake; therefore, residual glue in the drilled hole is reduced so as to prevent the residual glue in the hole from influencing the copper plating quality, and the electroplating depth capability is improved through the oscillation assembly, so that the copper coating quality of the circuit board with the high aspect ratio during copper coating is improved.

The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for etching a PCB based on laser and machinery. Comprising the steps of S1, material preparation; s2, graphic design; s3, shunt design is carried out; s4, setting laser parameters; s5, performing laser etching; s6, mechanical carving; according to the laser and mechanical two-in-one PCB etching method, large-area copper removal or copper removal with a large line width and a large line spacing is realized by using mechanical polishing and cutting through process division, and a fine line with a small line width and a small line spacing is completed by laser engraving, so that the efficiency, the precision and the environmental protection are considered, and the two-in-one realization efficiency is higher; chemical liquid medicine is not needed in the whole process, discharge of heavy metal and organic waste liquid is avoided, the method is green and environment-friendly, mask and wet process processes are omitted, and the cost is saved; and the short-pulse ultraviolet laser is adopted to directly etch the circuit pattern on the copper-clad substrate, so that the method has the advantage of high precision, and is suitable for manufacturing high-end PCBs such as high-density interconnection boards, flexible boards, high-frequency and high-speed boards and the like.

A deposition device (1) is provided for depositing components (CMP) on a substrate (STR). The deposition device (1) comprises a substrate holder (2), a component carrier (3), a power supply (4) and a support module (5) for supporting the component carrier (3). The substrate holder (2) has a substrate support surface (2s) for holding the substrate (STR). The component carrier (3), which is supported by the support module has a component carrier surface (3s) facing the substrate support surface (2s) for carrying the components to be deposited on the substrate. The component carrier (3) comprises a resistive heater layer (31) for thermally inducing a deformation of the component carrier (3) to move the component carrier surface (3s) towards the substrate support surface (2s). The power supply (4) is configured to generate a deflection pulse (Pd), being an electric power pulse to the resistive heater layer (31) for said thermally inducing a deformation. Also a corresponding deposition method is provided.