52results about "Conductive material mechanical removal" patented technology

The invention relates to the technical field of circuit board production, in particular to a manufacturing method of a convex copper block and a manufacturing method of a copper-embedded circuit board. The manufacturing method of the convex copper block comprises the following steps: a depth control milling step: a preset milling belt is configured for a milling machine, the preset milling belt comprises a starting point, an end point and a milling belt path, the starting point corresponds to the inner side edge of a to-be-milled area, the end point corresponds to the outer side edge of the to-be-milled area, and the milling belt path extends from the starting point to the end point by multiple circles from inside to outside; selecting a milling cutter with a preset cutter diameter, wherein the preset cutter diameter is not greater than 1 / 2 of the width of the to-be-milled area; and a milling cutter is adopted to carry out depth-controlled milling treatment on the copper plate according to a preset milling belt. The manufacturing method of the copper-embedded circuit board comprises the manufacturing method of the convex copper block. According to the manufacturing method of the convex copper block and the manufacturing method of the copper-embedded circuit board, the copper plate material is processed by adopting a multi-circle depth control milling scheme of a knife from inside to outside, so that the depth control precision of the convex copper block is improved, and the tolerance requirement can be met.

Printed circuit board, characterized by: a) A carrier substrate bound with structured channels, wherein the channels are formed by subtractive processing of the substrate or by applied insulating dam lines. b) Electrically conductive metal powder that fills the channels.

The application discloses a PCB milling device and a use method, relates to the technical field of PCB processing, and solves the problem that a large amount of heat is generated due to the friction and extrusion of a cutter of a PCB milling machine, the copper foil or elements on the PCB are possibly ablated when the temperature of the cutter of the milling machine is too high, and the PCB is damaged by heat, and the device comprises a fixed plate fixedly installed on a control mechanism of the milling machine, a top plate and a bottom plate fixedly installed on a side of the fixed plate away from the control mechanism, and a plurality of connecting columns fixedly installed between the top plate and the bottom plate and equidistantly distributed. The milling mechanism is used for processing the PCB, and the number of the milling mechanisms is two groups; the driving motor in the driving mechanism can drive the two milling mechanisms to rotate left and right, the two milling mechanisms are alternately used to process the PCB, the cutter is alternately cooled, and the cutter is effectively prevented from being overheated to damage the PCB.

The invention discloses an aluminum substrate production process for cutting a circuit through a die, which is characterized by comprising the following steps of: (1) physically cutting the circuit through a die-cutting machine by using a copper foil roll to manufacture a circuit layer; (2) manufacturing an aluminum bottom plate layer by using an aluminum coil or an aluminum plate; (3) rolling an insulating film into an insulating layer; (4) adhering an insulating layer to the front surface of the aluminum bottom plate layer; (5) adhering the circuit layer to the front surface of the insulating layer, and performing high-temperature compounding through a hot press; (6) a solder mask layer is manufactured on the front face of the circuit layer, and an aluminum substrate semi-finished product is manufactured; and (7) baking the aluminum substrate semi-finished product to obtain an aluminum substrate finished product. The circuit layer is manufactured by physically cutting the circuit of the copper foil roll through the die-cutting machine instead of the traditional circuit layer which is manufactured by etching the copper foil, so that the production efficiency is high, the production process is simple, environmental pollution caused by chemical liquid medicine is avoided, the production cost is reduced, the production quality is improved, and batch production is facilitated.

The invention relates to the technical field of circuit board processing and engraving, in particular to an engraving device for circuit board processing, which comprises a moving table, a fixed clamping plate and a lateral positioning plate are fixed at the top end of the moving table, a moving clamping plate mounting plate is movably mounted at the top end of the moving table, and a moving clamping plate is slidably connected to the moving table; the circuit board clamping device has the beneficial effects that the clamping spring pushes the movable clamping plate to move in the direction close to the fixed clamping plate, finally, the movable clamping plate abuts against the surface of the end, away from the fixed clamping plate, of the circuit board, and the clamping spring still generates pushing force on the movable clamping plate under the elastic effect of the clamping spring; therefore, the circuit board is clamped between the fixed clamping plate and the movable clamping plate, and the function of pre-positioning the circuit boards of various specifications is achieved. And through the self-locking function of threaded connection between the clamping screw rod hole and the clamping screw rod, the clamping stability of the circuit board is enhanced, so that stable positioning of the circuit boards of various specifications is realized.

An electronic system having a mounting substrate with a plurality of layers. The mounting substrate combines an upper shield structure and a lower shield structure to form an interlocking shielding structure to reduces crosstalk interference and improve return loss and insertion loss for high-speed serial communication circuits. The upper shield structure and the lower shield structure have a series of grounded reference shields that reduce unwanted electrical signal interferences.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

The invention discloses a preparation method of an RFID (Radio Frequency Identification Device) antenna, which comprises the following steps of: coating a low-viscosity water-based adhesive on a release surface of release paper to form an adhesive layer, and compounding an aluminum foil on the adhesive layer to obtain a composite foil material; according to the design pattern of the RFID antenna, the aluminum foil layer on the composite foil is subjected to precise die cutting, and a needed antenna pattern and a waste area are formed; the aluminum foil in the waste area is removed, and the antenna pattern is left to be attached to the release paper; the surface of the PET base material is coated with a high-viscosity permanent adhesive, and the release paper bearing the antenna pattern is attached to the PET base material in an aligned mode, so that the antenna pattern is firmly combined with the permanent adhesive; and finally, the antenna pattern is transferred to the PET base material by stripping the release paper. And slitting the PET base material on which the antenna pattern is transferred to obtain the RFID antenna. Precise die cutting is achieved by temporarily fixing the aluminum foil through the low-viscosity adhesive layer, then pattern transfer is completed through the high-viscosity adhesive layer, and the problem of transfer defects caused by adhesive layer viscosity contradiction in a traditional process is solved.

The invention discloses a method for preventing and improving edge cracking of a PCB (Printed Circuit Board) molded routing board, which comprises the following steps: in a molding process, when the appearance of an SET board or a unit board is routed on a production board by adopting a routing knife, the size of the single edge of the SET board or the unit board is pre-increased by 0.2 mm on the basis of design; and performing fine trimming on the SET plate or the unit plate by adopting a trimming cutter or a dense tooth cutter so as to remove the pre-enlarged part in the SET plate or the unit plate. According to the method, under the condition that the normal board milling efficiency is not affected, the problem of edge cracking of the milled board can be solved, and the board milling quality can be guaranteed.

A base plate assembly based on a manufacturing process of a composite circuit board according to the invention has a better load-bearing effect; conductive posts are riveted to the composite circuit board; connecting wires are fixed to upper ends of the conductive posts by means of conductive screws, so that components and the composite circuit board are electrically connected. The assembly process is simplified and the assembly efficiency is improved. Moreover, the test can be carried out as soon as the conductive posts are riveted. In this way, the problem that the defects of the base plate assembly can be discovered only after the components are assembled can be avoided effectively, thereby reducing the generation of defective products and the rework and maintenance rate and ensuring the pass rate of finished products.

A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.

Disclosed is a manufacturing method of a circuit board including the following steps: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.

This application relates to a printed circuit board manufacturing method and a printed circuit board. The method includes: forming a through hole in a multilayer printed circuit board that runs through the multilayer circuit board, where the multilayer printed circuit board is provided with an upper printed circuit board, a wiring layer, and a lower printed circuit board that are stacked; forming a blind hole from the upper printed circuit board to the wiring layer in the multilayer circuit board; drilling between the through hole and the blind hole to form a connection groove, where the through hole is in communication with the blind hole through the connection groove; and allowing an electrolyte solution to flow through the through hole, the connection groove, and the blind hole to form a conductive layer, achieving an electrical connection between the upper printed circuit board and the lower printed circuit board.

The utility model discloses a kind of line clamping circuit board and lamp strip, comprising: first film;Metal foil circuit;Flat conductor circuit, part or all flat conductor circuit is provided with notch, so that part or all flat conductor circuit is not the same in width and narrow;Second film, several pad windows are provided thereon;First film is combined together with second film, and flat conductor circuit and metal foil circuit are clamped between two films;The thickness of flat conductor circuit is greater than the thickness of metal foil circuit;Flat conductor circuit is main circuit, and metal foil circuit is auxiliary circuit, or, metal foil circuit has main circuit, and also has auxiliary circuit;The length of main circuit is greater than the length of auxiliary circuit;The metal exposed in pad window is flat conductor circuit or / and metal foil circuit. Through notch design makes part position narrow, but can make other position keep wider, to increase current load, solve the problem of film separation delamination.

A component carrier (100) which comprises a stack (102) comprising at least one electrically insulating layer structure (104) and at least one electrically conductive layer structure (106), said at least one electrically conductive layer structure (106) comprising at least one trace (108) embedded in the at least one electrically insulating layer structure (104), said at least one trace (108) comprising, in a cross section, two lateral walls (110) slanted inwardly beginning from an exterior surface (112) where said embedded trace (108) is exposed with respect to the at least one electrically insulating layer structure (104), wherein the at least one trace (108) comprises, in the cross section, two sharp edges (114) at the exterior surface (112) and at least one rounded edge (116) at an opposed extremity.

The invention belongs to the related technical field of circuit board production processes, and particularly relates to plasma glass fiber removing equipment and a method for removing residual glue of a multilayer board. A plasma device is arranged, a first shell is arranged, a first circuit board channel is arranged in the first shell, a first spraying rod is arranged at the top of the first circuit board channel, and a first spraying opening is formed in the first spraying rod so that gas can be sprayed out from the top; the electroplating device is provided with a second shell, a second circuit board channel is arranged in the second shell, a second spraying rod is arranged on the side edge of the second circuit board channel, and a second spraying opening is formed in the second spraying rod so that electroplating liquid can be sprayed from the side edge for electroplating; an oscillation rod is movably arranged at the top of the second circuit board channel, an oscillation assembly is arranged on the oscillation rod, and the oscillation assembly enables the oscillation rod to shake; therefore, residual glue in the drilled hole is reduced so as to prevent the residual glue in the hole from influencing the copper plating quality, and the electroplating depth capability is improved through the oscillation assembly, so that the copper coating quality of the circuit board with the high aspect ratio during copper coating is improved.

The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for etching a PCB based on laser and machinery. Comprising the steps of S1, material preparation; s2, graphic design; s3, shunt design is carried out; s4, setting laser parameters; s5, performing laser etching; s6, mechanical carving; according to the laser and mechanical two-in-one PCB etching method, large-area copper removal or copper removal with a large line width and a large line spacing is realized by using mechanical polishing and cutting through process division, and a fine line with a small line width and a small line spacing is completed by laser engraving, so that the efficiency, the precision and the environmental protection are considered, and the two-in-one realization efficiency is higher; chemical liquid medicine is not needed in the whole process, discharge of heavy metal and organic waste liquid is avoided, the method is green and environment-friendly, mask and wet process processes are omitted, and the cost is saved; and the short-pulse ultraviolet laser is adopted to directly etch the circuit pattern on the copper-clad substrate, so that the method has the advantage of high precision, and is suitable for manufacturing high-end PCBs such as high-density interconnection boards, flexible boards, high-frequency and high-speed boards and the like.

The application relates to a laser processing method, a laser processing device, a circuit board and a computer device. Whether the to-be-processed circuit board needs to be regionally divided is determined according to the pattern size of the to-be-processed circuit board and the scanning range of a scanning device in a laser processing device. In the case that the to-be-processed circuit board needs to be regionally divided, the to-be-processed circuit board is regionally divided according to the pattern size of the to-be-processed circuit board and the scanning range of the scanning device, so that multiple processing areas of the to-be-processed circuit board and splicing areas between adjacent processing areas are obtained. Processing points are processed in the processing areas, at least one splicing point is processed in the splicing areas, when a first processing area of adjacent processing areas is processed, the termination processing point is the splicing point, when a second processing area of adjacent processing areas is processed, the starting processing point is the splicing point, and the formation of any splicing point includes the processing of the termination processing point and the processing of the starting processing point.

A manufacturing method of a circuit board comprises the steps that a core board is provided, the core board comprises an inner side insulation layer, a signal line and a plurality of inner side conduction bodies, the signal line is arranged on the surface of the inner side insulation layer, the plurality of inner side conduction bodies are arranged on the inner side insulation layer at intervals, and the signal line is located among the plurality of inner side conduction bodies; outer side plates are respectively arranged on two opposite sides of the core plate, the outer side substrate comprises an outer side insulating layer, a grounding wire and a plurality of outer side conduction bodies, the plurality of outer side conduction bodies are arranged on the outer side insulating layer at intervals, one end of each outer side conduction body is connected with the grounding wire, and the other end of each outer side conduction body is connected with one inner side conduction body; the plurality of inner side conduction bodies, the plurality of outer side conduction bodies and the grounding wire define a shielding space, the signal wire is located in the shielding space, and a part of the inner side conduction bodies and a part of the outer side conduction bodies outside the shielding space are removed to obtain the circuit board. In addition, the invention also provides a circuit board.

An information handling resource may include a circuit board comprising an electrically-conductive pad and a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board.

The application discloses a thick copper circuit production method of a circuit board and the circuit board. The method comprises the following steps: performing fine carving treatment on a first copper layer and a second copper layer of a to-be-processed circuit board to obtain a first thick copper circuit and a second thick copper circuit; performing resin filling treatment between the first thick copper circuit and the second thick copper circuit to obtain a first circuit board, wherein the first filling hole resin between the first thick copper circuit has a first groove after cooling, and the second filling hole resin between the second thick copper circuit has a second groove after cooling; performing grinding and polishing treatment on the first filling hole resin and the second filling hole resin to obtain a third circuit board; and performing circuit forming treatment on the third circuit board to obtain a target circuit board. The first copper layer and the second copper layer are subjected to fine carving treatment, the forming of the thick copper circuit is quickly completed, and the production efficiency is high. The resin is filled between the thick copper circuits, the interference between the thick copper circuits is reduced, and the production quality of the circuit board is improved.

The invention relates to an efficient processing technology for a PCB gong board. The efficient processing technology for the PCB gong board is concise and ingenious in steps and easy to control, and each step is careful and fine. The shape and the size of the circuit board are measured through the circuit board measurement step, and the position, the size and the shape of a milling groove are planned on the circuit board through the milling groove design step. The circuit board to be processed is fixed through the circuit board fixing step. The specification of the to-be-used milling cutter is selected through the milling cutter selection step. The working parameters of the milling machine are set through the milling cutter parameter input step. Through the rough milling slotting step, a milling machine adopts a rough milling cutter to carry out rough milling processing on the circuit board. And through the fine milling slotting step, the milling machine adopts a fine milling cutter to carry out fine milling processing on the circuit board. And carrying out dust removal treatment on the circuit board subjected to the routing finish machining treatment through a dust removal step. And the circuit board subjected to routing processing is detected through the detection step. The PCB gong board efficient processing technology is high in gong board processing efficiency and precision.

The invention relates to the technical field of flexible materials, in particular to a preparation method of a wireless passive biaxial strain sensor based on a nested double-loop antenna. The strain sensor designed and manufactured by the method is composed of nested double-ring antennas, and two decoupled resonant frequencies are generated by regulating and controlling capacitance and inductance characteristics of an inner ring structure and an outer ring structure under a stretching condition and are respectively sensitive to x-axis and y-axis strain specificity. The preparation of the stretchable biaxial strain sensor is realized by activating printing ink composed of two self-healing materials of liquid metal and styrene-ethylene / butylene-styrene copolymer (SEBS) through laser scanning. Due to the circuit-free design, crosstalk-free bidirectional strain monitoring is realized, and a new scheme is provided for the biomechanical sensor.

A donor composition used in a substrate repair process includes a donor substrate. The donor composition also includes a first layer of a first metallic material disposed adjacent to the donor substrate. The donor composition further includes a second layer of a second metallic material disposed adjacent to the first layer. The donor composition yet further includes a third layer of a third metallic material disposed adjacent to the second layer. The donor composition also includes a plurality of deposition layers of one or more metallic materials disposed adjacent to the third layer.

The provided is a circuit and fuse fabrication process for a flexible printed circuit board (FPCB). The circuit and fuse fabrication process includes: pressing and bonding a release film onto a bottom of a polyethylene terephthalate (PET) silicone film; removing the release film at a circuit and fuse alignment position at the bottom of the PET silicone film through a lower circular knife die, and retaining the release film located outside the circuit and fuse alignment position; aligning the position of the PET silicone film; pressing and bonding the metal foil onto the PET silicone film with a release film side; cutting to form the circuit and the fuse; bonding a PET silicone film onto a bottom of the metal foil; removing the PET silicone film and a metal foil waste; and retaining the circuit and fuse formed by cutting on the PET silicone film with the release film side.

To prevent a fine second component from tilting or falling over at a predetermined location of a first component, such as a substrate, larger than the fine second component, such as μLED, for example, when arranging the components using various mass transfer methods such as a stamp transfer method and a laser lift-off method.SOLUTION: A method for manufacturing a connection structure in which a second component, which is finer than a first component, is joined to a predetermined area of the first component, comprises: a step A of arranging a guide film having a through hole through which the second component can pass between the first component and the second component; a step B of passing the second component through the through hole of the guide film to place it in the predetermined area of the first component; and a step C of joining the second component to the predetermined area of the first component, where the joining of the second component to the predetermined area of the first component is performed via a connection material between the predetermined area of the first component and the second component.SELECTED DRAWING: Figure 1

The invention relates to AI-driven circuit board automatic designing and manufacturing integrated equipment, and belongs to the technical field of circuit board machining.The AI-driven circuit board automatic designing and manufacturing integrated equipment comprises a supporting table, a clamping and positioning device is arranged at the top end of the supporting table, and a moving device is arranged at the top end of the supporting table in a sliding connection mode; a carving tool changing device is arranged at the front end of the moving device, a tool changing frame is arranged at the position, close to the rear side, of the top end of the supporting table, and a translation mechanism is arranged on the side wall of the top end of the supporting table. And through the arrangement of the moving device and the carving tool changing device, different tool bits can be selected according to needs in the carving process to produce and manufacture the circuit board through the tool changing design of the carving tool changing device, and therefore the production and manufacturing efficiency is improved.

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

The application discloses a kind of FDC flexible die-cutting circuit board's waste disposal process, it is related to the technical field of flexible circuit board processing, wherein, waste disposal process includes the following steps: S1: the adhesive side of inner liner film is pasted to the adhesive side of first bearing film, the first bearing film has a plurality of first recovery area and a plurality of second recovery area, tear off inner liner film;S2: one side of conductive substrate is pasted first bearing film, the second round knife cutting treatment is carried out to the side of conductive substrate away from first bearing film, so that the first waste section and the second waste section connected on conductive substrate are formed;S3: waste film is pasted to the side of conductive substrate away from first bearing film, tear off waste film, waste film is recycled second waste section by pasting first waste section.The technical scheme provided by the application improves the waste disposal efficiency of the conductive substrate after cutting, improves the yield of conductive substrate.

The utility model discloses a double-layer circuit board and an LED lamp strip. The double-layer circuit board comprises a first insulating film; a first line layer; a via hole is formed in the middle insulating film, and the first circuit layer is exposed out of the via hole at the via hole; the second circuit layer is arranged at part of or all of the via holes, circuits of the second circuit layer are combined on the first insulating film, and the second circuit layer shields part of the middle insulating film in the via holes; the front solder mask layer is combined on the second circuit layer, pad windows are arranged on the front solder mask layer, part of the pad windows are arranged at the via holes, and metal of the first circuit layer and metal of the second circuit layer are exposed out of each pad window at the via holes; or, part of the bonding pad window at the via hole exposes the metal of the first circuit layer and the metal of the second circuit layer, and part of the bonding pad window only exposes the metal of the first circuit layer. Tin cavities can be avoided, and the yield is improved.