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Tape compositions for the deposition of electronic features

a technology of electronic features and compositions, applied in the field of precursor compositions, can solve the problem that the formulations for deposited electronic features are not disclosed

Inactive Publication Date: 2007-08-02
CABOT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about a tape composition that can be deposited onto a substrate and form electronic features with good electrical properties. The tape composition can have a wide range of properties and can be used in high volume applications. The composition can be transferred onto a substrate using various methods such as heat, light, mechanical force, electric or magnetic force, or some combination of these. The tape composition can include molecular precursors, nanoparticles, and a binder to provide strength and cohesiveness during transfer. The method for forming electronic features using the tape composition can have low processing temperatures and short heating times. The invention also provides a wide range of properties for the tape composition, including low resistivity, low cost, and the ability to form complex and high precision circuitry.

Problems solved by technology

However, the deposits were chosen for optical properties and were either not conductive or were poorly conductive.
However, formulations for depositing electronic features are not disclosed.

Method used

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  • Tape compositions for the deposition of electronic features

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0504] A resistor ribbon was fabricated from a paste containing 6.3 wt. % ruthenium oxide, 49.2 wt. % low melting glass powder, 0.1 wt. % Menhaden fish oil, 14.3 wt. % SAA-100 binder, 14.3 wt. % DMAc and 15.8 wt. % alpha-terpineol. The ribbon was made by casting a layer with a Meyer rod (metering rod) with a mechanical drive system onto a corona treated MYLAR backing (a polyester film available from E.I. duPont deNemours, Wilmington, Del.) and drying. The material on the MYLAR backing along with a KAPTON (polyimide film available from E.I. duPont deNemours, Wilmington, Del.) and glass substrate was heated uniformly by contact with a warm surface to 80° C. and transferred by means of mechanical pressure from a stylus. A pattern was formed corresponding to the path followed by the stylus.

example 2

[0505] A conductor ribbon was fabricated from a paste made from 51.8 wt. % silver particles, 14.3 wt. % silver trifluoroacetate, 6.2 wt. % poly(propylene carbonate), and 27.7 wt. % DMAc was cast with a Meyer rod and mechanical drive system onto corona treated MYLAR and dried on a backing. The material on the backing along with the substrate (KAPTON and glass) was heated uniformly by contact with a warm surface to 80° C. and transferred by means of mechanical pressure from a stylus. A pattern was formed corresponding to the path followed by the stylus. Heating of the transferred material provided a conducting pattern.

example 3

[0506] A resistor ribbon was fabricated from a paste containing 7.5 wt. % ruthenium oxide, 47.7 wt. % glass powder, 0.1 wt. % Menhaden fish oil, 13.9 wt. % DMAc, 13.9 wt. % SM-100 (styrene allyl alcohol) binder, and 16.9 wt. % alphaterpineol was cast with a Meyer rod and mechanical drive and dried on a corona treated MYLAR backing. The material on the backing along with the substrate (KAPTON and glass) was heated uniformly to 90° C. by contact with a warm surface. The tape was contacted with a patterned rubber template and transferred by means of mechanical pressure from the template. A pattern was formed corresponding to the pattern on the rubber template.

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PUM

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Abstract

Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation of co-pending U.S. patent application Ser. No. 10 / 274,495 filed Oct. 18, 2002, which claims the benefit of U.S. Provisional Application No. 60 / 348,223 filed Oct. 19, 2001. Each of the foregoing referenced patent applications is incorporated by reference herein as if set forth in its entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to precursor compositions in the form of a tape that are useful for the deposition of electronic features such as conductors, resistors and dielectrics by transferring the tape to a substrate. The tape materials can also have a low conversion temperature to enable low-temperature treatment of the tape to form electronic features on a variety of substrates. The tape compositions can also be disposed on a carrier to form a mechanically robust ribbon structure. [0004] 2. Description of Related Art [0005] The electronics, ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B05D5/12B05D3/02B05D1/12B05D1/28B05D7/00H01B13/00H05K3/04H05K3/20
CPCH05K3/207H05K3/046B33Y10/00B33Y80/00B05D5/12B32B27/00H01L21/70
Inventor KODAS, TOIVO T.HAMPDEN-SMITH, MARK J.VANHEUSDEN, KARELDENHAM, HUGHSTUMP, AARON D.SCHULT, ALLEN B.ATANASSOVA, PAOLINAKUNZE, KLAUS
Owner CABOT CORP
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