Tape compositions for the deposition of electronic features

a technology of electronic features and compositions, applied in the field of precursor compositions, can solve the problem that the formulations for deposited electronic features are not disclosed
US20070178232A1Inactive Publication Date: 2007-08-02CABOT CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
CABOT CORP
Publication Date
2007-08-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation of co-pending U.S. patent application Ser. No. 10 / 274,495 filed Oct. 18, 2002, which claims the benefit of U.S. Provisional Application No. 60 / 348,223 filed Oct. 19, 2001. Each of the foregoing referenced patent applications is incorporated by reference herein as if set forth in its entirety.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to precursor compositions in the form of a tape that are useful for the deposition of electronic features such as conductors, resistors and dielectrics by transferring the tape to a substrate. The tape materials can also have a low conversion temperature to enable low-temperature treatment of the tape to form electronic features on a variety of substrates. The tape compositions can also be disposed on a carrier to form a mechanically robust ribbon structure.

[0004] 2. Description of Related Art

[0005] The electronics, ...

Claims

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