56 results about "Uv laser" patented technology

The invention discloses an HDI micro blind hole laser drilling processing method and system, and relates to the field of HDI drilling processing, CO2 laser drilling is firstly carried out on a plate, then UV laser shaping is carried out, finally quality detection is carried out, and the core is that a plurality of local datum points distributed in a matrix mode are preset on the HDI plate to be processed. In the CO2 laser drilling process, the drilling task and the positioning action of the local datum point are executed alternately through a control program. By periodically measuring the actual position of the adjacent local datum point in the machining period, the dynamic position offset generated in the area due to the heat effect can be captured in real time, and the machining coordinates of the follow-up target drilling point in the area can be corrected in real time through the offset. The continuous local dynamic compensation effectively overcomes the dynamic thermally induced deformation problem which cannot be handled by the traditional single global correction, so that the drilling precision in the large-size and high-density machining process is ensured.

The invention discloses an ultraviolet laser enhanced plasma electrolytic polishing method for an aluminum-based silicon carbide composite material, which is characterized in that the conductive performance of a reinforced phase SiC material is locally improved by utilizing the synergistic effect of the local thermal effect and the photoelectric effect of ultraviolet laser, and meanwhile, uniform-speed polishing of a metal aluminum matrix and the reinforced phase SiC material is achieved by virtue of plasma discharge. And the machining efficiency is obviously improved, a machined surface with higher quality compared with traditional machining and single plasma electrolytic polishing is obtained, and further application and popularization of the aluminum-based silicon carbide composite material are facilitated.

The subject of the present disclosure provides the production of N-type or P-type or semi-insulating rutile germanium dioxide templates and thin films in order to obtain sun-blind photo detectors from optical systems in the ultraviolet (UV) wavelength, or to obtain UV light emitting diodes, or to produce semiconductor materials required for UV laser diode production, especially for use in the field of power electronics in the defence industry and / or in missile and aircraft tracking systems. The disclosure describes a system and a method for growing r-GeO2 (rutile germanium dioxide) template and thin films using the chemical vapour deposition (CVD) method.

1. Name of the designed product: UV laser inkjet printer (small air-cooled). 2. Use of the designed product: used for marking text, graphics and variable data on the surface of different materials. 3. Design points of the designed product: in shape. 4. Picture or photo that best shows the design points: perspective view 1.

A semiconductor package and a redistribution processing method including same are disclosed. The redistribution processing method according to one embodiment of the present disclosure may comprise the steps of: using a UV laser to drill a first metal layer provided on an insulating layer; using the UV laser to etch a portion of the insulating layer provided below the first metal layer; and using plasma to etch the remaining portion of the insulating layer.

To provide a method for manufacturing a wafer that suppresses re-adhesion between the wafer and a support member by a simple method, after bonding the wafer and the support member, irradiating the temporary fixing composition with the UV laser to generate carbon particles and thereby peeling the wafer from the support member.SOLUTION: A method for manufacturing a wafer includes a peeling process for a structure (A) comprising, in this order, a support member, a cured film of a temporary fixing composition, and a wafer (a): irradiating the structure with the UV laser having a wavelength of 300 nm or more and 385 nm or less from the support member side to decompose at least a portion of the cured film of the temporary fixing composition, thereby generating carbon particles, and peeling the wafer from the support member.SELECTED DRAWING: None

An aspect of the present invention provides a composition for film coating, which can replace titanium oxide suspected of being carcinogenic and, especially, a composition for film coating suitable for laser printing after film coating. Another aspect of the present invention provides a composition for film coating, which has an excellent white coloring effect and a reduction in scuffing. Another aspect of the present invention provides a method for laser printing on tablets or capsules by using the composition according to the present invention.

Some embodiments of the present disclosure provide an N-type TOPCon cell with double-sided aluminum paste electrodes, and a preparation method therefor. The front side of the cell is provided with a front-side silver main grid and a front-side aluminum fine grid, and the back side is provided with a back-side silver main grid and a back-side aluminum fine grid. The method for preparing the cell includes: texturing→B diffusion→BSG removal→alkali polishing→depositing a tunnel oxide layer and a polysilicon layer on a back side of a substrate by means of LPCVD→P diffusion on the back side→PSG removal→plating removal→deposition of an AlOx preparatory layer and a first SiNxHy preparatory layer on the front side→deposition of a second preparatory layer SiNxHy on the back side→UV laser ablation on the front side of the substrate and the back side of the substrate→screen printing.

The present application provides an ultraviolet laser, which includes, in order, a pump source, a collimating lens, a focusing lens, a first cavity mirror, a gain medium, a Q-switching element, and a second cavity mirror in the first direction; a third cavity mirror and a displacement motor in the second direction; a first spectrometer, a frequency-doubling crystal, and a fourth cavity mirror in the third direction; a fifth cavity mirror in the fourth direction; and a second focusing lens 23, a second frequency-doubling crystal 25, a second collimating lens 26, a sixth cavity mirror 27, and a second spectrometer 28 in the fifth direction. The present application achieves adjustable cavity length by moving the displacement motor to drive the third cavity mirror in the second direction, thereby enabling the ultraviolet laser to obtain a cavity length adapted to the corresponding power output at different output powers. Consequently, a highly integrated ultraviolet laser with precisely adjustable cavity length, compatible with multiple high- and low-power overlapping stable outputs, and a compact structure is obtained.

Laser-markable dark-colored insulation materials that produce light-color marking with remarkably high contrast and durability, when marked with UV laser, are disclosed. Also disclosed are materials, synthesis, and application of the laser-markable insulation materials, and methods of making the insulation materials.

A method, device or system including a UV laser having a first contributing laser part generating a first laser light, a second contributing laser part generating a second laser light and a combined cavity sharing disposed therein at least a portion of shared operable elements of the first and second contributing laser parts, the combined cavity providing for combining the first laser light and the second laser light to generate a third laser light.

The invention relates to a process for producing components of an outer skin of a vehicle, wherein the component comprises at least one transilluminable region. The process comprises the steps of: a) providing a main body produced from a light-permeable or transparent polymer material in an injection molding process, wherein the main body has a front side and a reverse side; b) applying a color-imparting coating to the front side of the main body, wherein this comprises a color-imparting, light-impermeable paint layer; c) treating the color-imparting coating in a two-stage laser process to produce the at least one transilluminable region, wherein in the first stage the color-imparting coating is removed using an IR laser and in the second stage the transilluminable region processed in the first stage is cleaned and smoothed using a UV laser; and d) applying a sealing clearcoat layer to the color-imparting coating and to the transilluminable region of the main body.

The application relates to a preparation method of a small-size high-density microchannel, and relates to the technical field of microchannel enhanced phase change heat transfer. One of spin coating, screen printing or spraying is used to coat a photosensitive etching-resistant ink on the surface of a metal base to form a uniform and continuous photosensitive etching-resistant protective coating with a thickness of 0.2-10 microns; a microchannel mask pattern is engraved on the photosensitive etching-resistant protective coating by using a UV laser printer; the metal base with the microchannel mask pattern is soaked in an environment-friendly etching liquid for etching; the target metal base after etching is soaked in a stripping liquid capable of reacting with the photosensitive etching-resistant protective coating, so that the photosensitive etching-resistant protective coating strip is stripped from the surface of the target metal base, the microchannel wall is exposed, and a small-size high-density microchannel structure is obtained. The application has the advantages of accurate size control, good heat transfer performance, high efficiency, strong expansibility, and is especially suitable for the application field of heat dissipation such as enhanced boiling heat transfer.

The invention discloses a method for processing a boss of a metal-based printed circuit board, which comprises the following steps of: laminating a copper substrate, a PP (Propene Polymer) plate and a copper foil to obtain a laminated plate; a blind groove extending to the copper substrate is formed in the surface of the laminated plate through laser processing; activating and cleaning the groove wall and the groove bottom of the blind groove by adopting a plasma process; depositing a layer of conductive carbon on the tank wall in a physical adsorption mode; performing first pattern transfer on the blind slot area; the blind groove is filled with pattern electroplating to complete boss copper filling; stripping the film, and leveling the convex part around the boss copper in the blind groove through a grinding plate to reduce the height difference; and transferring the pattern for the second time. According to the method, laser processing is adopted, the blind groove is formed through UV laser ablation, additional etching windowing is not needed, the alignment precision is high, grooving alignment and size precision are guaranteed, groove wall resin and glass fibers are almost not carbonized, brownification and copper breaking are not needed, the binding force of a copper layer and the groove wall after groove filling is remarkably improved, and the manufacturing efficiency is greatly improved.

This invention discloses a PCB board with fine lines and its preparation method, relating to the field of PCB processing. The preparation method includes preparing a copper-clad laminate with a hydrocarbon resin substrate; using a UV laser with a wavelength of 315-400 nm to etch away copper foil to form circuit patterns; using a CO2 or green laser to remove the substrate to process holes; and cleaning, wet desmearing, shadowing, dry lamination, and electroplating the copper-clad laminate to obtain the PCB board. This application uses a UV laser to remove the copper foil on the surface of the copper-clad laminate to process circuit patterns without damaging the substrate, and utilizes a CO2 or green laser to remove the substrate to process holes. This enables ultra-fine circuit processing with a line width / spacing ≤15 μm, and the high etching factor and uniformity result in low resistance and heat loss. This method requires no chemically polluting reagents and does not use special materials, improving processing efficiency and quality while reducing production costs and environmental impact.

Described is a method and device for dilating a tubular anatomical structure. The device and method can be useful for extracting a blood clot in an artery of a mammal by concentrically irradiating an inner wall of the occluded artery using an ultraviolet (UV) laser beam delivered by an optical fiber. Dilation results from photophysical production and release of nitric oxide from the cells lining the arterial wall when UV laser light is projected as a ring beam onto the inner arterial wall.

The invention relates to a blind hole processing and manufacturing method for a PCB, and the method comprises the following steps: S1, the surface of a copper foil of the PCB is coated with a protective film, the copper foil is alloy copper, or the thickness of the copper foil is greater than 70 microns, and the transparency of the protective film is greater than or equal to 90%; s2, identifying and positioning the position of a to-be-processed blind hole in the PCB to determine a blind hole alignment point; s30, an exposed area is machined on the protective film through a laser drilling machine, and the laser drilling machine is a UV laser drilling machine; s31, the exposed area corresponds to the position of the blind hole alignment point, and the UV laser drilling machine can drill the blind hole alignment point through the exposed area; s4, tearing off the protective film to obtain a blind hole; and S5, electroplating the obtained blind holes so as to form circuit conduction among all layers of the PCB. According to the blind hole processing and manufacturing method of the PCB provided by the invention, the problem that the periphery of an orifice is seriously blackened after the blind hole is drilled can be effectively improved, and the product yield of the PCB is improved.

The invention provides a circuit board processing method for 3dB bridge mounting and a circuit board. The circuit board processing method for 3dB bridge mounting comprises the following steps: carrying out lamination processing on a plurality of layers of substrates to obtain a circuit board semi-finished product; drilling the circuit board semi-finished product to form a to-be-plated-through hole region; carrying out metal immersion plating treatment on the circuit board semi-finished product after drilling so as to form a plated-through hole region in the to-be-plated-through hole region; performing outer-layer circuit forming processing on the circuit board semi-finished product to form a bonding pad area and an outer-layer circuit area; wherein the bonding pad region is electrically connected with the outer layer circuit region and the plated-through hole region respectively; carrying out rough milling treatment on the circuit board semi-finished product; performing UV laser fine trimming treatment on the circuit board semi-finished product after rough milling; and carrying out edge cleaning and finish milling treatment on the semi-finished circuit board subjected to UV laser finishing. According to the circuit board processing method for mounting the 3dB bridge, the use reliability of the 3dB bridge after the 3dB bridge is mounted on the circuit board is relatively good.

The present disclosure generally relates to a method for printing a medical dressing (1) comprising: a) providing a medical dressing (1) comprising a plurality of layers and having a first side and a second side wherein the second side is configured to face the skin during use and at least one layer of the plurality of layers comprises a UV absorbing polymeric material, b) arranging the medical dressing (1) in a package (2) comprising at least a front layer (3) and a rear layer (4) wherein at least a portion of the front layer (3) is transparent and non-UV-absorbing and the medical dressing (1) is arranged in the package (2) such that the first side of the dressing is visible through the transparent portion of the front layer (3) and the second side of the dressing is visible through the rear layer (4). C) printing the medical dressing (1) by passing one or more UV laser beams (5) through the transparent and UV-non-absorbing portion of the front layer (3) such that the UV laser beams (5) form at least one visible marking (6) on the medical dressing (1). The present disclosure also relates to a medical dressing (1) comprising at least one visible mark (6) formed by the method.

A method, device or system including a UV laser having a first contributing laser part generating a first laser light, a second contributing laser part generating a second laser light and a combined cavity sharing disposed therein at least a portion of shared operable elements of the first and second contributing laser parts, the combined cavity providing for combining the first laser light and the second laser light to generate a third laser light.

The utility model relates to the field of laser drilling, specifically to a kind of UV laser drilling device, including support frame, the outside of support frame is provided with auxiliary plate, the top of support frame is provided with slider, the top of slider is provided with mover, the outside of mover is provided with lifter, the outside of lifter is provided with laser instrument, the inside of support frame is provided with telescopic device, the inside of support frame is also provided with moving box, the side of moving box is also provided with movable plate, and the movable plate is located in the inside of support frame.The utility model is moved along horizontal direction on support frame by setting slider, and cooperate with the vertical direction movement of slider and mover in slider, the accurate positioning in three-dimensional space of laser instrument is realized, the vertical height of laser instrument can be adjusted by the setting of lifter, to ensure the accurate control of drilling depth and position, significantly improve the machining precision.

The utility model belongs to the field of multimode optical fiber testing, and particularly discloses an ultraviolet multimode optical fiber testing system. An ultraviolet laser, an ultraviolet filter and a light path switcher are sequentially arranged along a light path; a first switching optical path of the optical path switcher is connected to the input end of the first ultraviolet optical fiber collimator, and a second switching optical path of the optical path switcher is connected to the input end of the second ultraviolet optical fiber collimator; the output end of the first ultraviolet optical fiber collimator, the ultraviolet multimode optical fiber to be detected and the broadband detection device are connected in sequence; the output end of the second ultraviolet optical fiber collimator, the ultraviolet multimode optical fiber to be detected and the attenuation detection device are connected in sequence; the broadband detection device is used for detecting the bandwidth of the ultraviolet multimode optical fiber to be detected, and the attenuation detection device is used for detecting the attenuation of the ultraviolet multimode optical fiber. The ultraviolet multi-mode optical fiber testing system can effectively evaluate the bandwidth performance or attenuation performance of the ultraviolet multi-mode optical fiber, and solves the problem that the existing multi-mode optical fiber testing system is not suitable for the performance test of the ultraviolet multi-mode optical fiber.

This invention relates to a UV laser-based system, specifically a UV laser-based system (100) for correcting impaired vision in a patient's eye (10), a UVL-LVC system (100). The UVL-LVC system (100) comprises: a UV laser source (102) designed to emit laser radiation to treat the patient's eye (10); and an imaging optics (124) for focusing the laser radiation onto the cornea (12) of the patient's eye (10), wherein the imaging optics (124) is designed such that it detects the reflection (126) of radiation at a receiving angle χMαχ of at least 2.5°, the radiation being incident on the cornea (12) of the patient's eye (10) through the imaging optics (124) and at least partially reflected from the cornea (12) of the patient's eye (10). The invention also relates to a method for centering the UVL-LVC system (100).

The application belongs to the technical field of automation testing, and provides a central control screen automation testing device and a testing method, the device comprises an upper computer, a controller, an ultraviolet projector, a transformer and a touch screen material; the upper computer is used for compiling an automation testing program and performing information interaction with the controller; the controller is used for controlling the ultraviolet projector and the reflector to adjust the irradiation position of the ultraviolet rays; the ultraviolet projector is used for projecting ultraviolet rays to the transformer; the deformation grid is filled with a high molecular gel in contact with the touch screen material; the touch screen material is elastic and is arranged at the bottom of the deformation grid of the transformer and is used for clicking the central control screen. The application realizes high-precision, automatic and repeatable touch control central control screen operation by precisely controlling the ultraviolet laser and the expansion characteristics of the high molecular gel.

Systems and method for treating corneal ectasias such as keratoconus involve contacting the corneal surface to an aperture-free molding lens under vacuum pressure and cross-linking corneal tissue using UV laser or LED light in the presence of a photosensitive substance such as riboflavin. After release of vacuum, oxygen is applied to the corneal surface to enhance the cross-linking of corneal fibers. Systems may include an imaging system, user interface, vacuum regulator and controller to provide rapid diagnosis and treatment. In some embodiments, the systems may be used to treat glaucoma by applying vacuum without cross-linking of corneal fibers.

The invention discloses a method for manufacturing a flexible circuit board with the line spacing smaller than or equal to 40 micrometers. High-density circuit manufacturing is achieved through whole-process technology optimization. A low-copper-tooth copper-clad plate is selected, and the precision of a base material is improved through UV laser drilling and nanoscale carbon film black shadow treatment; a high-resolution dry film is combined with LDI exposure and dynamic light intensity compensation, edge hardening is carried out after development is carried out in cooperation with a phenolic resin ethanol solution, and the adhesive force of the dry film is enhanced; and film stripping adopts a two-step method of hydrothermal solution alkali soaking and mechanical spraying, internal stress is eliminated by combining gradient heating baking, and then copper reduction is performed. The flexible circuit board can effectively solve the problems that in the prior art, a dry film is prone to falling off, electroplating film clamping occurs, the dry film falls off in the developing process, the film stripping phenomenon is incomplete in the film stripping process, copper is left in the line spacing, line edge burrs exist, and the like, the manufacturing precision and the yield of the flexible circuit board are improved, environmental pollution is reduced, and the production cost is reduced. And high-efficiency production of the high-density and high-reliability flexible circuit board is realized.

To provide a protective film with an antifouling layer which is used by being stuck to a display screen and is easily peeled from the display screen by using an adhesive tape.SOLUTION: A protective film 1 for a display screen includes at least a base material film 2, an antifouling layer 3 formed on the front surface side of the base material film, and an adhesive layer 5 formed on the back surface side of the base material film, and has a design 4 formed by removing the antifouling layer in a part of the outer peripheral part of the protective film. The design can be formed by irradiating a part of the antifouling layer on the outer peripheral portion of the protective film with a UV laser to remove the antifouling layer.SELECTED DRAWING: Figure 1

Described is a method and device for dilating a tubular anatomical structure. The device and method can be useful for extracting a blood clot in an artery of a mammal by concentrically irradiating an inner wall of the occluded artery using an ultraviolet (UV) laser beam delivered by an optical fiber. Dilation results from photophysical production and release of nitric oxide from the cells lining the arterial wall when UV laser light is projected as a ring beam onto the inner arterial wall.

A system and method for UV laser energy delivery for phototherapy. A main laser generates laser light at wavelengths λ2 and λ3, where 1 / λ2 + 1 / λ3 is substantially equal to 1 / λ4, with λ4 in the UVB band. This laser light is transmitted via a fiber optic cable to a separate housing containing a UVB frequency conversion assembly. The UVB frequency conversion assembly operates to generate UVB light at wavelength λ4 from input light at wavelengths λ2 and λ3. The generated UVB light is output from a handpiece and applied to a patient.

The application provides a detection method for the welding pad capacity of a UV laser cutting machine, which burns a five-point star welding pad on a single flexible core plate by the UV laser cutting machine, and evaluates the welding pad capacity of the UV laser cutting machine according to the burning quality of the five-point star welding pad. The application can more accurately evaluate the welding pad capacity of the UV laser cutting machine by burning the special-shaped welding pad in the shape of a five-point star, compared with the burning of the regular square, circular and elliptical welding pads, so as to further judge whether the UV laser cutting machine can meet the actual production required welding pad capacity, and ensure that the imported laser equipment can meet the product demand.