304 results about "Uv laser" patented technology

A system to selectively display a symbol at a location on a vehicle window. The system includes an arrangement of a fluorescent material at the location, wherein the fluorescent material: a) is sufficiently transparent in the absence of ultraviolet (UV) light, b) fluoresces when illuminated with UV light, c) and has a shape corresponding to the symbol, and a UV light source configured to illuminate the location with UV light to display the symbol. Such a system may use unfocused UV light sources to illuminate the symbol shaped fluorescent material as opposed to focused UV light sources such as UV lasers.

A method for manufacturing a microstructure, which includes at least one feature having a dimension less than 200 nm, on a work piece. Pulses of UV laser light having a duration of less than about 1 ps and a peak wavelength of less than about 380 nm are generated. These pulses of UV laser light are focused to a substantially diffraction limited beam spot within a target area of the work piece. The fluence of this substantially diffraction limited beam spot in the target area of the work piece is controlled such that the diameter of the section of the target area machined by one of the pulses of UV laser light is less than 200 nm.

A compact and efficient ultraviolet laser source based on a optically-pumped solid-state or fiber laser that produces near-infrared output light suitable for nonlinear frequency conversion. The infrared laser output is frequency tripled or quadrupled to produce light in the ultraviolet wavelength range (200 nm to 400 nm). The novel technology is the use of highly efficient periodically poled nonlinear crystals, such as stoichiometric and MgO-doped lithium tantalate and lithium niobate. As opposed to conventional frequency-converted UV laser sources, which have high power consumption, high cost, and low efficiency, the laser sources of this invention utilize high efficiency nonlinear conversion provided by periodically poled materials and allow lower-cost architectures without additional focusing lenses, high power pump diodes, etc.

A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within + / −100 μm of the front surface of the glass piece most desirably within + / −50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within + / −30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.

A large screen emissive display operating at atmospheric pressure includes pixels, the red, green, and blue subpixels of which are excited by UV laser light scanned onto the subpixels by a pixel activation mechanism. The pixel activation mechanism includes three grating light valves (GLVs) that are controlled by a processor in response to a demanded image to modulate the UV light as appropriate to produce the demanded image.