81 results about "Uv laser" patented technology

The invention discloses an HDI micro blind hole laser drilling processing method and system, and relates to the field of HDI drilling processing, CO2 laser drilling is firstly carried out on a plate, then UV laser shaping is carried out, finally quality detection is carried out, and the core is that a plurality of local datum points distributed in a matrix mode are preset on the HDI plate to be processed. In the CO2 laser drilling process, the drilling task and the positioning action of the local datum point are executed alternately through a control program. By periodically measuring the actual position of the adjacent local datum point in the machining period, the dynamic position offset generated in the area due to the heat effect can be captured in real time, and the machining coordinates of the follow-up target drilling point in the area can be corrected in real time through the offset. The continuous local dynamic compensation effectively overcomes the dynamic thermally induced deformation problem which cannot be handled by the traditional single global correction, so that the drilling precision in the large-size and high-density machining process is ensured.

A method for ultraviolet-laser transfer and cleaning of microelectronic devices includes transferring a microelectronic device from a donor substrate to a receiver substrate, and cleaning the microelectronic device after transfer. Prior to transfer, the microelectronic device is coupled to the donor substrate via a sacrificial layer containing gallium. A first ultraviolet laser beam ablates the sacrificial layer to release the microelectronic device from the donor substrate, leaving behind a gallium residue on the newly exposed surface of the microelectronic device. A second ultraviolet laser beam ablates the gallium residue to clean the microelectronic device. The first and second ultraviolet laser beams may be generated by the same ultraviolet laser. As compared to liquid etching, laser ablation of the gallium residue eliminates a wet-chemistry step and may be performed by the same laser apparatus used for transfer. Laser cleaning is particularly advantageous when the receiver substrate is intolerant to liquid etching.

The invention discloses a cross-level laser drilling method utilizing UV laser and carbon dioxide laser, and belongs to the technical field of printed circuit boards. The cross-level laser drilling method utilizing the UV laser and the carbon dioxide laser burns through a required penetrating layer with a copper layer through high-energy UV laser drilling; the dielectric layer on the reserved layer bottom copper is burnt out and subjected to hole finishing by adopting carbon dioxide laser drilling, so that no adhesive residue is ensured under the condition that the hole bottom is not burnt through, the conduction connection performance of the printed circuit board is ensured, the processing quality stability of the printed circuit board is improved, and the production cost is reduced. And the problems of burning through and burning loss of a bottom copper layer caused by high energy of UV laser can be well improved.

The invention discloses an ultraviolet laser enhanced plasma electrolytic polishing method for an aluminum-based silicon carbide composite material, which is characterized in that the conductive performance of a reinforced phase SiC material is locally improved by utilizing the synergistic effect of the local thermal effect and the photoelectric effect of ultraviolet laser, and meanwhile, uniform-speed polishing of a metal aluminum matrix and the reinforced phase SiC material is achieved by virtue of plasma discharge. And the machining efficiency is obviously improved, a machined surface with higher quality compared with traditional machining and single plasma electrolytic polishing is obtained, and further application and popularization of the aluminum-based silicon carbide composite material are facilitated.

The subject of the present disclosure provides the production of N-type or P-type or semi-insulating rutile germanium dioxide templates and thin films in order to obtain sun-blind photo detectors from optical systems in the ultraviolet (UV) wavelength, or to obtain UV light emitting diodes, or to produce semiconductor materials required for UV laser diode production, especially for use in the field of power electronics in the defence industry and / or in missile and aircraft tracking systems. The disclosure describes a system and a method for growing r-GeO2 (rutile germanium dioxide) template and thin films using the chemical vapour deposition (CVD) method.

The invention discloses a printing method for a composite packaging material structure with built-in hidden anti-fake laser images and texts. The method comprises the following steps: converting designed images and texts into digital images and texts; manufacturing a plate by using a laser photoetching machine to obtain an image-text nickel plate; making the digital image-text into a gravure plate; a high-precision micron-sized optical positioning mark is preset on a PET (Polyethylene Terephthalate) base film; printing transparent UV gloss oil by using a gravure plate, and dynamically adjusting the UV gloss oil coating position of a gravure press according to the real-time tracking of the position of the PET base film; performing film pressing on the PET base film on which gloss oil is completed and an image-text nickel plate, performing curing through an ultraviolet light curing lamp and then performing stripping, performing photocuring by adopting a photocuring process of pre-curing and then scanning an image through a scanning probe to compare and correct offset, and performing secondary full-curing to fix the pattern; coating and coloring the PET base film; carrying out vacuum aluminum plating on the coated PET base film; and compounding the PET base film subjected to vacuum aluminum plating with 200g roll white card, and feeding into a gravure press to finish printing. Precise overprinting of the local UV laser cold transfer pattern printed matter is achieved.

This invention relates to the production of integrated optical waveguides on the surface of planar polymer substrates (polymer chips) using UV laser lithography. The resulting optical waveguides are multilayer optical waveguides that, when light is guided in the lower part of the optical waveguide, form radiation modes. As a result, light energy is radiated from the underside of the optical waveguide into the volume of the polymer substrate, so that it is lost to the actual light guide.Since the associated attenuation losses are usually undesirable, two different partial solutions are presented, which can then be combined to suppress the unwanted radiation modes as completely as possible. A parameter window for the UV laser lithographic production of polymeric, integrated-optical (planar) optical waveguides is presented, which is located shortly before the UV photon-induced carbonization (discoloration) of the irradiated zone of the optical waveguides to be produced. Due to the thermal effect of the incident high-energy UV excimer laser radiation, a change in the refractive index depth profile within the irradiated zone occurs above a certain radiation dose, so that no more radiation modes can form there.As a further solution, polyacrylate layers are produced by spin-coating and subsequently curing acrylate layers on a carrier substrate. These layers are too thin for radiation modes to form on the underside of the optical waveguides produced by subsequent UV exposure.

The invention discloses a high-temperature-resistant flexible circuit and a preparation method and application thereof, and belongs to the technical field of flexible electronics. Liquid metal particles and a solution of a high-temperature-resistant polymer are blended, the mixed solution is subjected to blade coating on a glass plate to form a film, then the film is placed in a drying oven to evaporate a solvent and is subjected to high-temperature crosslinking, then an ultraviolet laser imprinting machine is used for conducting circuit imprinting on the surface of the cooled film, and the high-temperature-resistant flexible circuit is obtained. According to the invention, the high-temperature-resistant polymer is used as the flexible circuit substrate, and the laser-activated dispersed liquid metal particles are used as the circuit, so that the high-temperature-resistant performance of the flexible circuit is improved.

1. Name of the designed product: UV laser inkjet printer (small air-cooled). 2. Use of the designed product: used for marking text, graphics and variable data on the surface of different materials. 3. Design points of the designed product: in shape. 4. Picture or photo that best shows the design points: perspective view 1.

Described are methods and devices for dilating tubular anatomical structures. The devices and methods may be useful for extracting blood clots in mammalian arteries by concentrically irradiating the inner wall of the occluded artery using an ultraviolet (UV) laser beam delivered by an optical fiber. The dilation occurs as a result of the photophysical production and release of nitric oxide from cells lining the arterial wall when the UV laser light is projected as a ring beam onto the inner arterial wall.

A semiconductor package and a redistribution processing method including same are disclosed. The redistribution processing method according to one embodiment of the present disclosure may comprise the steps of: using a UV laser to drill a first metal layer provided on an insulating layer; using the UV laser to etch a portion of the insulating layer provided below the first metal layer; and using plasma to etch the remaining portion of the insulating layer.

To provide a method for manufacturing a wafer that suppresses re-adhesion between the wafer and a support member by a simple method, after bonding the wafer and the support member, irradiating the temporary fixing composition with the UV laser to generate carbon particles and thereby peeling the wafer from the support member.SOLUTION: A method for manufacturing a wafer includes a peeling process for a structure (A) comprising, in this order, a support member, a cured film of a temporary fixing composition, and a wafer (a): irradiating the structure with the UV laser having a wavelength of 300 nm or more and 385 nm or less from the support member side to decompose at least a portion of the cured film of the temporary fixing composition, thereby generating carbon particles, and peeling the wafer from the support member.SELECTED DRAWING: None

An aspect of the present invention provides a composition for film coating, which can replace titanium oxide suspected of being carcinogenic and, especially, a composition for film coating suitable for laser printing after film coating. Another aspect of the present invention provides a composition for film coating, which has an excellent white coloring effect and a reduction in scuffing. Another aspect of the present invention provides a method for laser printing on tablets or capsules by using the composition according to the present invention.

Some embodiments of the present disclosure provide an N-type TOPCon cell with double-sided aluminum paste electrodes, and a preparation method therefor. The front side of the cell is provided with a front-side silver main grid and a front-side aluminum fine grid, and the back side is provided with a back-side silver main grid and a back-side aluminum fine grid. The method for preparing the cell includes: texturing→B diffusion→BSG removal→alkali polishing→depositing a tunnel oxide layer and a polysilicon layer on a back side of a substrate by means of LPCVD→P diffusion on the back side→PSG removal→plating removal→deposition of an AlOx preparatory layer and a first SiNxHy preparatory layer on the front side→deposition of a second preparatory layer SiNxHy on the back side→UV laser ablation on the front side of the substrate and the back side of the substrate→screen printing.

The embodiment of the invention provides an uncovering processing control method and device for multiple PP rigid-flex boards. The uncovering processing control method comprises the steps of generating topological combination data according to historical flexible board filling characteristic parameters and historical pressing processing parameters; converting the topological combination data into a relation vector; inputting the relation vector into a neural network model for training to obtain a trained neural network model; inputting the new soft board filling characteristic parameters into the trained neural network model to obtain output pressing processing parameters; the control equipment performs pre-punching operation on the PP sheet to obtain a pre-punched PP sheet; the pre-punched PP sheet and the semi-layer board are subjected to pressing operation according to the pressing processing parameters, and a pressed rigid-flex board is obtained; the uncovering part of PP is burnt through by UV laser in advance before the control equipment is pressed, the PP is cured, the edge sealing reduces the generation of excessive glue, and the uncovering difficulty is reduced; the model training efficiency is improved, and the accurately predicted pressing process parameters are obtained.

The present application provides an ultraviolet laser, which includes, in order, a pump source, a collimating lens, a focusing lens, a first cavity mirror, a gain medium, a Q-switching element, and a second cavity mirror in the first direction; a third cavity mirror and a displacement motor in the second direction; a first spectrometer, a frequency-doubling crystal, and a fourth cavity mirror in the third direction; a fifth cavity mirror in the fourth direction; and a second focusing lens 23, a second frequency-doubling crystal 25, a second collimating lens 26, a sixth cavity mirror 27, and a second spectrometer 28 in the fifth direction. The present application achieves adjustable cavity length by moving the displacement motor to drive the third cavity mirror in the second direction, thereby enabling the ultraviolet laser to obtain a cavity length adapted to the corresponding power output at different output powers. Consequently, a highly integrated ultraviolet laser with precisely adjustable cavity length, compatible with multiple high- and low-power overlapping stable outputs, and a compact structure is obtained.

The invention relates to laser drilling equipment for improving a UV laser drilling processing technology, the laser drilling equipment for improving the UV laser drilling processing technology comprises a laser device and a lens, and laser generated by the laser device acts on a workpiece to be processed after being processed by the lens. An acousto-optic modulator is also arranged on a laser light path between the laser and the lens; the acousto-optic modulator can be controlled to turn off the laser when the laser energy is abnormal. According to the laser drilling equipment for improving the UV laser drilling processing technology, the laser light path can be selectively turned off through the acousto-optic modulator additionally arranged in the light path, and therefore when laser energy is abnormal, for example, when the first laser energy is too strong, laser can be actively turned off, and therefore the processing defect caused by the too strong laser energy is avoided.

Described is a method and device for dilating a tubular anatomical structure. The device and method can be useful for extracting a blood clot in an artery of a mammal by concentrically irradiating an inner wall of the occluded artery using an ultraviolet (UV) laser beam delivered by an optical fiber. Dilation results from photophysical production and release of nitric oxide from the cells lining the arterial wall when UV laser light is projected as a ring beam onto the inner arterial wall.

Laser-markable dark-colored insulation materials that produce light-color marking with remarkably high contrast and durability, when marked with UV laser, are disclosed. Also disclosed are materials, synthesis, and application of the laser-markable insulation materials, and methods of making the insulation materials.

A method, device or system including a UV laser having a first contributing laser part generating a first laser light, a second contributing laser part generating a second laser light and a combined cavity sharing disposed therein at least a portion of shared operable elements of the first and second contributing laser parts, the combined cavity providing for combining the first laser light and the second laser light to generate a third laser light.

The present application relates to a packaging carrier with a hollow structure and a manufacturing process thereof, wherein the manufacturing process comprises the following steps: cutting a first core board, making circuits, and printing a first resin layer on the inner circuit of the first core board to obtain a first substrate; preparing a second core board and etching off the copper foil on both sides, pasting pure film on both sides of the insulating layer of the second core board, and making a cavity by UV laser process to obtain a second substrate; cutting a third core board, making circuits, and printing a second resin layer on the inner circuit of the third core board to obtain a third substrate; overlapping and pressing the first, second and third substrates in sequence to form a semi-finished board; drilling and electroplating the semi-finished board, making outer circuits, solder masking, and surface treatment, and then laser opening the cover to form a sound hole to obtain a packaging carrier. In this manufacturing process, a layer of resin layer is printed when making the inner circuit, thereby solving the problem of short circuit of dense circuits.

Boldface printing having a sufficient line width is more easily implemented as compared with the related art. A laser marking apparatus includes a laser light output section, a laser light scanning section, a storage section, and a marking control section. The marking control section scans UV laser light along an outer scanning line farther from a center line of a line element of a character corresponding to print data for boldface than an inner scanning line prior to the inner scanning line closer to the center line for scanning lines adjacent to each other in a direction in which the line element of the character becomes thick among a plurality of the scanning lines forming the print data for boldface.

The invention relates to a process for producing components of an outer skin of a vehicle, wherein the component comprises at least one transilluminable region. The process comprises the steps of: a) providing a main body produced from a light-permeable or transparent polymer material in an injection molding process, wherein the main body has a front side and a reverse side; b) applying a color-imparting coating to the front side of the main body, wherein this comprises a color-imparting, light-impermeable paint layer; c) treating the color-imparting coating in a two-stage laser process to produce the at least one transilluminable region, wherein in the first stage the color-imparting coating is removed using an IR laser and in the second stage the transilluminable region processed in the first stage is cleaned and smoothed using a UV laser; and d) applying a sealing clearcoat layer to the color-imparting coating and to the transilluminable region of the main body.

The application relates to a preparation method of a small-size high-density microchannel, and relates to the technical field of microchannel enhanced phase change heat transfer. One of spin coating, screen printing or spraying is used to coat a photosensitive etching-resistant ink on the surface of a metal base to form a uniform and continuous photosensitive etching-resistant protective coating with a thickness of 0.2-10 microns; a microchannel mask pattern is engraved on the photosensitive etching-resistant protective coating by using a UV laser printer; the metal base with the microchannel mask pattern is soaked in an environment-friendly etching liquid for etching; the target metal base after etching is soaked in a stripping liquid capable of reacting with the photosensitive etching-resistant protective coating, so that the photosensitive etching-resistant protective coating strip is stripped from the surface of the target metal base, the microchannel wall is exposed, and a small-size high-density microchannel structure is obtained. The application has the advantages of accurate size control, good heat transfer performance, high efficiency, strong expansibility, and is especially suitable for the application field of heat dissipation such as enhanced boiling heat transfer.

Described is a method and device for dilating a tubular anatomical structure. The device and method can be useful for extracting a blood clot in an artery of a mammal by concentrically irradiating an inner wall of the occluded artery using an ultraviolet (UV) laser beam delivered by an optical fiber. Dilation results from photophysical production and release of nitric oxide from the cells lining the arterial wall when UV laser light is projected as a ring beam onto the inner arterial wall.

Manual, automated and mass methods and devices, for enhancing the effect of UV light disinfection (at UV wavelength of 200 nm to 340 nm) of transmitted UV light on or in humans and devices by at least one of the steps of: a) increasing controllable output power of a UV emitting device, including using high power UV lasers or direct placement of UV light sources, b) increasing the efficiency of UV disinfection effect with the placement of the UV emitting device including by use of side emitting fibers with uniform output and distant placement directed at surgical sites, otoscope type handheld devices directing UV light into infected orifices, biofilm disruption, fluorescent marking of pathogens and c) providing protocols for various enhanced pathogen eradication applications including tissue clearing to increase depth of penetration, use of aspiration needles for access to pathogens, site disinfection to increase cancer remission and implant in situ disinfection.

The invention discloses a method for processing a boss of a metal-based printed circuit board, which comprises the following steps of: laminating a copper substrate, a PP (Propene Polymer) plate and a copper foil to obtain a laminated plate; a blind groove extending to the copper substrate is formed in the surface of the laminated plate through laser processing; activating and cleaning the groove wall and the groove bottom of the blind groove by adopting a plasma process; depositing a layer of conductive carbon on the tank wall in a physical adsorption mode; performing first pattern transfer on the blind slot area; the blind groove is filled with pattern electroplating to complete boss copper filling; stripping the film, and leveling the convex part around the boss copper in the blind groove through a grinding plate to reduce the height difference; and transferring the pattern for the second time. According to the method, laser processing is adopted, the blind groove is formed through UV laser ablation, additional etching windowing is not needed, the alignment precision is high, grooving alignment and size precision are guaranteed, groove wall resin and glass fibers are almost not carbonized, brownification and copper breaking are not needed, the binding force of a copper layer and the groove wall after groove filling is remarkably improved, and the manufacturing efficiency is greatly improved.

This invention discloses a PCB board with fine lines and its preparation method, relating to the field of PCB processing. The preparation method includes preparing a copper-clad laminate with a hydrocarbon resin substrate; using a UV laser with a wavelength of 315-400 nm to etch away copper foil to form circuit patterns; using a CO2 or green laser to remove the substrate to process holes; and cleaning, wet desmearing, shadowing, dry lamination, and electroplating the copper-clad laminate to obtain the PCB board. This application uses a UV laser to remove the copper foil on the surface of the copper-clad laminate to process circuit patterns without damaging the substrate, and utilizes a CO2 or green laser to remove the substrate to process holes. This enables ultra-fine circuit processing with a line width / spacing ≤15 μm, and the high etching factor and uniformity result in low resistance and heat loss. This method requires no chemically polluting reagents and does not use special materials, improving processing efficiency and quality while reducing production costs and environmental impact.

Described is a method and device for dilating a tubular anatomical structure. The device and method can be useful for extracting a blood clot in an artery of a mammal by concentrically irradiating an inner wall of the occluded artery using an ultraviolet (UV) laser beam delivered by an optical fiber. Dilation results from photophysical production and release of nitric oxide from the cells lining the arterial wall when UV laser light is projected as a ring beam onto the inner arterial wall.

The invention relates to a blind hole processing and manufacturing method for a PCB, and the method comprises the following steps: S1, the surface of a copper foil of the PCB is coated with a protective film, the copper foil is alloy copper, or the thickness of the copper foil is greater than 70 microns, and the transparency of the protective film is greater than or equal to 90%; s2, identifying and positioning the position of a to-be-processed blind hole in the PCB to determine a blind hole alignment point; s30, an exposed area is machined on the protective film through a laser drilling machine, and the laser drilling machine is a UV laser drilling machine; s31, the exposed area corresponds to the position of the blind hole alignment point, and the UV laser drilling machine can drill the blind hole alignment point through the exposed area; s4, tearing off the protective film to obtain a blind hole; and S5, electroplating the obtained blind holes so as to form circuit conduction among all layers of the PCB. According to the blind hole processing and manufacturing method of the PCB provided by the invention, the problem that the periphery of an orifice is seriously blackened after the blind hole is drilled can be effectively improved, and the product yield of the PCB is improved.