36 results about "Uv laser" patented technology

A semiconductor package and a redistribution processing method including same are disclosed. The redistribution processing method according to one embodiment of the present disclosure may comprise the steps of: using a UV laser to drill a first metal layer provided on an insulating layer; using the UV laser to etch a portion of the insulating layer provided below the first metal layer; and using plasma to etch the remaining portion of the insulating layer.

An aspect of the present invention provides a composition for film coating, which can replace titanium oxide suspected of being carcinogenic and, especially, a composition for film coating suitable for laser printing after film coating. Another aspect of the present invention provides a composition for film coating, which has an excellent white coloring effect and a reduction in scuffing. Another aspect of the present invention provides a method for laser printing on tablets or capsules by using the composition according to the present invention.

Laser-markable dark-colored insulation materials that produce light-color marking with remarkably high contrast and durability, when marked with UV laser, are disclosed. Also disclosed are materials, synthesis, and application of the laser-markable insulation materials, and methods of making the insulation materials.

The invention relates to a process for producing components of an outer skin of a vehicle, wherein the component comprises at least one transilluminable region. The process comprises the steps of: a) providing a main body produced from a light-permeable or transparent polymer material in an injection molding process, wherein the main body has a front side and a reverse side; b) applying a color-imparting coating to the front side of the main body, wherein this comprises a color-imparting, light-impermeable paint layer; c) treating the color-imparting coating in a two-stage laser process to produce the at least one transilluminable region, wherein in the first stage the color-imparting coating is removed using an IR laser and in the second stage the transilluminable region processed in the first stage is cleaned and smoothed using a UV laser; and d) applying a sealing clearcoat layer to the color-imparting coating and to the transilluminable region of the main body.

The invention discloses a method for processing a boss of a metal-based printed circuit board, which comprises the following steps of: laminating a copper substrate, a PP (Propene Polymer) plate and a copper foil to obtain a laminated plate; a blind groove extending to the copper substrate is formed in the surface of the laminated plate through laser processing; activating and cleaning the groove wall and the groove bottom of the blind groove by adopting a plasma process; depositing a layer of conductive carbon on the tank wall in a physical adsorption mode; performing first pattern transfer on the blind slot area; the blind groove is filled with pattern electroplating to complete boss copper filling; stripping the film, and leveling the convex part around the boss copper in the blind groove through a grinding plate to reduce the height difference; and transferring the pattern for the second time. According to the method, laser processing is adopted, the blind groove is formed through UV laser ablation, additional etching windowing is not needed, the alignment precision is high, grooving alignment and size precision are guaranteed, groove wall resin and glass fibers are almost not carbonized, brownification and copper breaking are not needed, the binding force of a copper layer and the groove wall after groove filling is remarkably improved, and the manufacturing efficiency is greatly improved.

This invention discloses a PCB board with fine lines and its preparation method, relating to the field of PCB processing. The preparation method includes preparing a copper-clad laminate with a hydrocarbon resin substrate; using a UV laser with a wavelength of 315-400 nm to etch away copper foil to form circuit patterns; using a CO2 or green laser to remove the substrate to process holes; and cleaning, wet desmearing, shadowing, dry lamination, and electroplating the copper-clad laminate to obtain the PCB board. This application uses a UV laser to remove the copper foil on the surface of the copper-clad laminate to process circuit patterns without damaging the substrate, and utilizes a CO2 or green laser to remove the substrate to process holes. This enables ultra-fine circuit processing with a line width / spacing ≤15 μm, and the high etching factor and uniformity result in low resistance and heat loss. This method requires no chemically polluting reagents and does not use special materials, improving processing efficiency and quality while reducing production costs and environmental impact.

The invention provides a circuit board processing method for 3dB bridge mounting and a circuit board. The circuit board processing method for 3dB bridge mounting comprises the following steps: carrying out lamination processing on a plurality of layers of substrates to obtain a circuit board semi-finished product; drilling the circuit board semi-finished product to form a to-be-plated-through hole region; carrying out metal immersion plating treatment on the circuit board semi-finished product after drilling so as to form a plated-through hole region in the to-be-plated-through hole region; performing outer-layer circuit forming processing on the circuit board semi-finished product to form a bonding pad area and an outer-layer circuit area; wherein the bonding pad region is electrically connected with the outer layer circuit region and the plated-through hole region respectively; carrying out rough milling treatment on the circuit board semi-finished product; performing UV laser fine trimming treatment on the circuit board semi-finished product after rough milling; and carrying out edge cleaning and finish milling treatment on the semi-finished circuit board subjected to UV laser finishing. According to the circuit board processing method for mounting the 3dB bridge, the use reliability of the 3dB bridge after the 3dB bridge is mounted on the circuit board is relatively good.

The present disclosure generally relates to a method for printing a medical dressing (1) comprising: a) providing a medical dressing (1) comprising a plurality of layers and having a first side and a second side wherein the second side is configured to face the skin during use and at least one layer of the plurality of layers comprises a UV absorbing polymeric material, b) arranging the medical dressing (1) in a package (2) comprising at least a front layer (3) and a rear layer (4) wherein at least a portion of the front layer (3) is transparent and non-UV-absorbing and the medical dressing (1) is arranged in the package (2) such that the first side of the dressing is visible through the transparent portion of the front layer (3) and the second side of the dressing is visible through the rear layer (4). C) printing the medical dressing (1) by passing one or more UV laser beams (5) through the transparent and UV-non-absorbing portion of the front layer (3) such that the UV laser beams (5) form at least one visible marking (6) on the medical dressing (1). The present disclosure also relates to a medical dressing (1) comprising at least one visible mark (6) formed by the method.

The utility model relates to the field of laser drilling, specifically to a kind of UV laser drilling device, including support frame, the outside of support frame is provided with auxiliary plate, the top of support frame is provided with slider, the top of slider is provided with mover, the outside of mover is provided with lifter, the outside of lifter is provided with laser instrument, the inside of support frame is provided with telescopic device, the inside of support frame is also provided with moving box, the side of moving box is also provided with movable plate, and the movable plate is located in the inside of support frame.The utility model is moved along horizontal direction on support frame by setting slider, and cooperate with the vertical direction movement of slider and mover in slider, the accurate positioning in three-dimensional space of laser instrument is realized, the vertical height of laser instrument can be adjusted by the setting of lifter, to ensure the accurate control of drilling depth and position, significantly improve the machining precision.

This invention relates to a UV laser-based system, specifically a UV laser-based system (100) for correcting impaired vision in a patient's eye (10), a UVL-LVC system (100). The UVL-LVC system (100) comprises: a UV laser source (102) designed to emit laser radiation to treat the patient's eye (10); and an imaging optics (124) for focusing the laser radiation onto the cornea (12) of the patient's eye (10), wherein the imaging optics (124) is designed such that it detects the reflection (126) of radiation at a receiving angle χMαχ of at least 2.5°, the radiation being incident on the cornea (12) of the patient's eye (10) through the imaging optics (124) and at least partially reflected from the cornea (12) of the patient's eye (10). The invention also relates to a method for centering the UVL-LVC system (100).

The application belongs to the technical field of automation testing, and provides a central control screen automation testing device and a testing method, the device comprises an upper computer, a controller, an ultraviolet projector, a transformer and a touch screen material; the upper computer is used for compiling an automation testing program and performing information interaction with the controller; the controller is used for controlling the ultraviolet projector and the reflector to adjust the irradiation position of the ultraviolet rays; the ultraviolet projector is used for projecting ultraviolet rays to the transformer; the deformation grid is filled with a high molecular gel in contact with the touch screen material; the touch screen material is elastic and is arranged at the bottom of the deformation grid of the transformer and is used for clicking the central control screen. The application realizes high-precision, automatic and repeatable touch control central control screen operation by precisely controlling the ultraviolet laser and the expansion characteristics of the high molecular gel.

The invention discloses a method for manufacturing a flexible circuit board with the line spacing smaller than or equal to 40 micrometers. High-density circuit manufacturing is achieved through whole-process technology optimization. A low-copper-tooth copper-clad plate is selected, and the precision of a base material is improved through UV laser drilling and nanoscale carbon film black shadow treatment; a high-resolution dry film is combined with LDI exposure and dynamic light intensity compensation, edge hardening is carried out after development is carried out in cooperation with a phenolic resin ethanol solution, and the adhesive force of the dry film is enhanced; and film stripping adopts a two-step method of hydrothermal solution alkali soaking and mechanical spraying, internal stress is eliminated by combining gradient heating baking, and then copper reduction is performed. The flexible circuit board can effectively solve the problems that in the prior art, a dry film is prone to falling off, electroplating film clamping occurs, the dry film falls off in the developing process, the film stripping phenomenon is incomplete in the film stripping process, copper is left in the line spacing, line edge burrs exist, and the like, the manufacturing precision and the yield of the flexible circuit board are improved, environmental pollution is reduced, and the production cost is reduced. And high-efficiency production of the high-density and high-reliability flexible circuit board is realized.

To provide a protective film with an antifouling layer which is used by being stuck to a display screen and is easily peeled from the display screen by using an adhesive tape.SOLUTION: A protective film 1 for a display screen includes at least a base material film 2, an antifouling layer 3 formed on the front surface side of the base material film, and an adhesive layer 5 formed on the back surface side of the base material film, and has a design 4 formed by removing the antifouling layer in a part of the outer peripheral part of the protective film. The design can be formed by irradiating a part of the antifouling layer on the outer peripheral portion of the protective film with a UV laser to remove the antifouling layer.SELECTED DRAWING: Figure 1

Described is a method and device for dilating a tubular anatomical structure. The device and method can be useful for extracting a blood clot in an artery of a mammal by concentrically irradiating an inner wall of the occluded artery using an ultraviolet (UV) laser beam delivered by an optical fiber. Dilation results from photophysical production and release of nitric oxide from the cells lining the arterial wall when UV laser light is projected as a ring beam onto the inner arterial wall.

A system and method for UV laser energy delivery for phototherapy. A main laser generates laser light at wavelengths λ2 and λ3, where 1 / λ2 + 1 / λ3 is substantially equal to 1 / λ4, with λ4 in the UVB band. This laser light is transmitted via a fiber optic cable to a separate housing containing a UVB frequency conversion assembly. The UVB frequency conversion assembly operates to generate UVB light at wavelength λ4 from input light at wavelengths λ2 and λ3. The generated UVB light is output from a handpiece and applied to a patient.

Provided are a blister package and a method of making thereof. The blister package includes a rupturable substrate; and a blister layer overlayed by the substrate, thereby making a cavity between the rupturable substate and the blister layer. The rupturable substrate at least partially forms an engraving or etching that reduces push through force required for dispensing a product stored inside the cavity for customer dispensing. The rupturable substate and the blister layer are made of the same or same class plastic or polymer thereby making the blister package recyclable.

The present invention aims to provide a communication substrate film having low dielectric properties, excellent UV laser processability, and suppressed bleed-out of ultraviolet absorbers. [Solution] The present invention relates to a film for communication substrates comprising a non-polar resin and a triazine-based ultraviolet absorber, wherein the absorbance at a wavelength of 355 nm per 10 μm thickness is 1.0 or more. The present invention also relates to a communication device equipped with a film for communication substrates.

The invention relates to a laser-markable polymer which contains UV-absorbing ceramic nanoparticles as additives, the nanoparticles themselves being colourless, the nanoparticles being selected from the group consisting of titanium dioxide, zinc oxide, zirconium oxide, aluminium oxide, magnesium oxide, silicon dioxide, alkali-metal and alkaline-earth-metal titanates and zirconates, or mixtures thereof. The invention also relates to: the use thereof as a material for producing moulding compositions, semi-finished products, or finished articles; the moulding compositions, semi-finished products, and finished articles produced therefrom; and a method for producing a marking and / or inscription thereon using a UV laser. The resulting marking and / or inscription is characterised by particularly fine and sharply defined contours of high quality.

The invention discloses a novel flexible circuit board double-sided hollow circuit manufacturing method. The method comprises the following steps: a, substrate pretreatment: cutting a double-sided copper-clad substrate to a set size; b, pasting a protective film: pasting a layer of protective film on the non-hollowed-out surface of the L1-layer circuit by using a processing device so as to play a protection role when the L2-layer circuit is cleaned; c, L2 layer surface treatment: removing impurities, pollution and oxides on the copper surface of the L2 layer circuit by using the treatment device again, and roughening the plate surface to increase the binding force of the covering film; d, removing the protective film: removing the copper surface protective film of the L1 layer; and e, laser patterning processing: cutting out the circuit in the hollow area by using UV laser, and reserving a certain connecting position to ensure that the cut circuit pattern has a certain supporting force. According to the invention, the traditional circuit etching processing method is abandoned, the laser technology pattern is utilized, the integrity of the bonding pad in the hollow area is better protected, and the optimal product is obtained on the structure of the circuit board.

An aspect of the present invention provides a composition for film coating, which can replace titanium oxide suspected of being carcinogenic and, especially, a composition for film coating suitable for laser printing after film coating. Another aspect of the present invention provides a composition for film coating, which has an excellent white coloring effect and a reduction in scuffing. Another aspect of the present invention provides a method for laser printing on tablets or capsules by using the composition according to the present invention.

To provide a method for manufacturing printed circuit boards that strengthens the adhesive strength between the conductor circuit and the resin insulating layer, enabling the formation of fine wiring and minute via conductor diameters. [Solution] A method for manufacturing a wiring board, comprising: forming a second resin insulating layer on a first resin insulating layer and a first conductor circuit formed on its upper surface; forming via conductor openings in the second resin insulating layer that reach the first conductor circuit by first irradiation with a CO2 laser; forming a seed layer on the via conductor openings and the second resin insulating layer by second irradiation of the interior thereof with a UV laser; forming a plurality of plating resists on the seed layer to form a recess for forming a second conductor circuit and a recess for forming a via conductor; forming a second conductor circuit in the recess for forming the second conductor circuit; forming via conductors in the recess for forming the via conductor to connect the first conductor circuit and the second conductor circuit; removing the plating resist from the seed layer to expose the second conductor circuit and the via conductor; and removing the seed layer from the second resin insulating layer.

The application provides a double-sided flexible circuit board with a special conduction structure and a preparation process, and relates to the technical field of printed circuits. The double-sided flexible circuit board with the special conduction structure comprises a PET base material, a first circuit layer is etched in the middle part of an upper copper foil, a top protection layer is arranged on the upper surface of an upper solder resist layer, a second circuit layer is cut in the middle part of a lower copper foil by means of a UV laser cutting machine, the upper and lower ends of the PET base material are both formed with solder holes by means of laser, and the ends of the solder holes respectively extend to the surfaces of the first circuit layer and the second circuit layer, and the interiors of the solder holes are both provided with electroplated solder layers. The copper foil and the circuit layers are formed with a sandwich structure by means of a transparent adhesive layer and a solder resist layer, the copper foil does not directly contact the PET base material, the circuit patterns of the first circuit layer and the second circuit layer are more stable during subsequent lamination, a conduction ring is arranged around the electroplated solder layer, the strength of the electroplated solder layer during connection can be improved, material breakage caused by excessive stress concentration can be avoided, and practicality is improved.

The embodiment of the invention provides a micropore processing method of a packaging substrate and the packaging substrate, the packaging substrate comprises a first copper layer, a dielectric layer and a second copper layer which are stacked in sequence, and the processing method comprises the following steps: removing a first copper cover on the first copper layer by using UV laser to expose the dielectric layer at the bottom of the first copper cover; the second copper cover is removed on the second copper layer through UV laser, so that the dielectric layer at the bottom of the second copper cover is exposed, and the second copper cover is right opposite to the first copper cover; removing a part of the dielectric layer at the bottom of the first copper cover by using CO2 laser to form a blind hole; and removing part of the dielectric layer at the bottom of the second copper cover by using CO2 laser until the dielectric layer is communicated with the blind hole to form a micro through hole. According to the processing method provided by the embodiment of the invention, the copper foil on the surface of the packaging substrate does not need to be etched to form a copper window, and the process steps of film pasting pretreatment, film pasting, exposure, developing etching, film stripping and the like are removed, so that the process flow of micropore processing can be simplified, the production efficiency can be improved, and the production cost can be reduced.

The invention discloses a processing method of a trapezoidal through groove of an integrated circuit board, which comprises the following processing steps of: S01, providing a substrate, arranging solder mask layers on a first surface and a second surface of the substrate, covering conductive circuits on the substrate with the solder mask layers, defining a slotting region on the substrate, preparing the trapezoidal through groove in the slotting region, and forming a plurality of trapezoidal through grooves on the substrate; the vertex angle of the trapezoidal through groove ranges from 5 degrees to 15 degrees, and the trapezoidal through groove is provided with a lower bottom formed on the first surface and an upper bottom formed on the second surface; s02, forming an ink covering part covering the slotting area on the solder mask layer, leveling the ink covering part, making a circular mark with the diameter of 2.0-4.0 mm on the ink covering part, and drilling a through hole with the diameter of 1.0-3.0 mm in the substrate through a CCD (Charge Coupled Device) drilling machine by taking the circle center of the circular mark as a fixed point; and S03, a UV laser ablation process is adopted, and a trapezoidal through groove is machined in the substrate in a descorching ablation or double-face ablation mode with the perforation as the benchmark. The machining method is simple, reasonable and easy to operate and implement, and the machining efficiency, precision and quality of the trapezoidal through groove and the groove vertex angle are guaranteed.

Methodology for increasing efficiency of a pathogen inactivation via enhancing UVC light absorption at such pathogen by multiple diffuse scattering of the light at a wall defining a substantially closed volume, thereby increasing a number of angles at which the pathogen is being irradiate as compared with a direct irradiation of the pathogen with a beam of such light.

The invention discloses a method and system for improving the yield of an unclean etching rework board, and the method comprises the steps: recognizing an unclean etching region through scanning, generating a defect distribution diagram, generating a compensation type dry film protection pattern based on the defect distribution diagram, transferring the compensation type dry film protection pattern to a board surface through LDI exposure, exposing the unclean etching region after development, and protecting the rest part; a pulse type spray etching system is adopted to accurately etch the exposed area, the etching end point is monitored in real time, and etching is automatically stopped after the copper layer is completely removed; and finally, film stripping treatment is carried out, the dry film is removed, and reworking is completed. The method has the advantages that through the compensation type dry film protection pattern and the UV laser windowing technology, excessive etching and circuit damage are avoided. And meanwhile, through the design of locally widening the fine line and the gradient dry film, the risks of open circuit and uneven line are reduced. Through accurate etching control and uniform liquid permeation, the yield is remarkably improved, the rejection rate is reduced, and the precision, efficiency and quality of PCB reworking are effectively improved.

The application provides a kind of UV laser drilling method and system for ceramic surface stress detection, comprising: strain gauge processing path and ceramic processing path are designed in advance in control terminal;When the processing position of the ceramic surface to be measured is pasted with strain gauge, and the strain gauge is connected with strain gauge collector, laser engraving machine processes strain gauge according to strain gauge processing path, until strain gauge etches through hole;When the current strain data read by strain collector is stable, the current strain data is cleared, and the laser engraving machine drills the processing position of the ceramic surface to be measured according to the ceramic processing path, and the strain gauge collector collects the strain data during drilling.The application first etches through hole in strain gauge according to strain gauge processing path, clears strain collector, and then drills the processing position of the ceramic surface to be measured, reduces the influence of strain gauge thermal effect on measurement data, and improves the accuracy of blind hole method for testing ceramic tile surface residual stress.

Disclosed is a laser debonding apparatus that transmits light energy to a release layer between a carrier substrate of an object to be processed and a device, thereby separating the device from the carrier substrate. The laser debonding apparatus disclosed herein comprises: a light source for generating laser light; a beam shaper for shaping the laser light into a processing beam; and a projection optical system for projecting the processing beam onto the release layer. The laser light is pulsed UV laser light that photochemically decomposes the release layer.

The invention relates to a laser processing method for a blind hole of a flexible printed circuit board, and belongs to the technical field of printed circuit boards. The machining method comprises the following steps that S1, a to-be-drilled area of the multi-layer composite board is pretreated to obtain a pit, and the depth of the pit is the thickness of a copper layer on the surface of the board or 0.3-0.6 time of the diameter of a blind hole; s2, depositing a graphite material layer at the bottom of the recess; and S3, performing blind hole scanning processing by adopting UV laser, and then performing hole cleaning to complete laser processing of the blind hole of the flexible printed circuit board. According to the machining method, UV laser energy can be efficiently converted, the machining problem of a high-frequency and high-speed base material with the insufficient UV absorptivity is solved, it is ensured that residues are removed from the bottom of the deep blind hole, the hole wall taper is remarkably reduced, the machining quality and consistency of the blind hole with the high aspect ratio are improved, and the application value is very high.

The invention relates to the technical field of precision analysis instruments, and discloses an ultraviolet laser ablation system, which solves the problems proposed in the background technology, and comprises a laser light path subsystem, a double-volume sample chamber subsystem, a gas path control subsystem and an electric control subsystem. The laser light path subsystem realizes flexible regulation and control of light beams through a simple three-reflector structure, a switchable attenuation mirror group and a beam spot selector. The double-volume sample chamber subsystem adopts the unique design that a fixed inner-layer sample chamber is arranged in a movable outer-layer sample chamber and is combined with a high-precision sample table, so that the position effect is eliminated. The gas path control subsystem is integrated on a gas control panel, and accurate control and safety monitoring of multiple paths of gas are achieved through a mass flow controller and the like. And the electric control subsystem integrates image acquisition and motion control, so that full-automatic operation is realized. The system is compact and stable in structure and high in automation degree, and the analysis precision and the operation efficiency of the laser ablation-inductively coupled plasma mass spectrometry technology are effectively improved.