4598 results about "Blind hole" patented technology

A method for securing soft tissue to bone with excellent pull-out strength which does not require the surgeon to tie suture knots to secure the tissue to the bone. A blind hole or socket is created in the bone at the location the graft is to be secured. Preferably, suture is then passed through the graft at desired points. A cannulated driver is pre-loaded with a cannulated plug or screw slidably disposed onto the distal portion of the driver. In a preferred embodiment, a separate piece of suture is passed through the cannula of the driver with a loop end of that suture exposed at the distal end of the driver. The ends of the suture attached to the graft are fed through the suture loop at the end of the driver. Alternatively, the graft itself may be fed through the suture loop, in which case it is not necessary to attach suture through the graft. In another embodiment, the suture loop exposed at the distal end of the cannula of the driver may be omitted, and the sutures attached to the graft may then be fed through the driver cannula from the distal end to position the graft relative to the driver. The driver is inserted into the hole with the screw or plug just outside the hole. Tension is then placed on the suture. Once adequate tension is achieved on the suture, the driver is pressed into the hole, which engages the first thread or bump of the screw or plug on the bone. The screw or plug is then fully advanced into the hole using the driver. When the screw or plug is fully inserted, the suture loop is freed and the driver is removed. The loose ends of the sutures protruding from the anchor site can be cleaned up by clipping them short.

Methods for forming blind wafer interconnects (BWIs) from the back side of a previously thinned substrate structure such as a semiconductor wafer to the underside of a bond pad on its active surface includes the formation of a blind hole from the back side, application of a passivating layer therein, anisotropically etching to remove passivation material from the blind hole bottom, blanket-depositing at least one conductive layer within the blind hole and over the back side, blanket-depositing a resist in the blind hole and over the back side, planarizing the back side to remove resist and the at least one conductive layer, removing resist from the blind hole, and filling the blind hole with solder or other conductive material or a dielectric material. Variations in the methods include formation of a conductive pad adjacent the back side surface, disposition of a solder ball or other conductive structure on the BWI, or forming an end thereof in the form of an extended slug protruding from the back side (for ball-less attachment) as the outer terminus of the BWI.

A method for forming through-wafer interconnects (TWI) in a substrate of a thickness in excess of that of a semiconductor die such as a semiconductor wafer. Blind holes are formed from the active surface, sidewalls thereof passivated and coated with a solder-wetting material. A vent hole is then formed from the opposite surface (e.g., wafer back side) to intersect the blind hole. The blind hole is solder filled, followed by back thinning of the vent hole portion of the wafer to a final substrate thickness to expose the solder and solder-wetting material at both the active surface and the thinned back side. A metal layer such as nickel, having a glass transition temperature greater than that of the solder, may be plated to form a dam structure covering one or both ends of the TWI including the solder and solder-wetting material to prevent leakage of molten solder from the TWI during high temperature excursions. Intermediate structures of semiconductor devices, semiconductor devices and systems are also disclosed.

The invention provides a novel magnetic mechanical anti-theft lock which comprises a wafer type key, a lock core rotor and a lock shell, and the wafer type key comprises a wafer; at least six magnetic blocks are arranged in the wafer, and the lock core rotor is a T-shaped cylinder on the appearance, and matches with the lock shell in a contacting way; a second magnetic spring blind hole and a magnetic spring are arranged in the position where the lock core rotor corresponds to the magnetic blocks, and the magnetic spring and the corresponding magnetic block are mutually repellent in terms of magnetism; an iron spring is respectively arranged in the position where the lock shell corresponds to the magnetic spring, and part of the iron spring convexly extends to the blind hole of the second magnetic spring; the bottom of the iron spring is also connected with a return spring, and the lock core fixing hole accommodates the narrow part of the lock core rotor. As the lock core of the lock has no key hole, destruction by tools such as a bolt driver, a screwdriver and the like can be prevented; besides, the key of the lock can not be easily duplicated, and the lock has multiple anti-theft functions, elegant appearance, strong invisibility and higher security.

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a method for manufacturing a microelectronic workpiece having a plurality of microelectronic dies. The individual dies include an integrated circuit and a terminal electrically coupled to the integrated circuit. In one embodiment, the method includes forming an opening in the workpiece in alignment with the terminal. The opening can be a through-hole extending through the workpiece or a blind hole that extends only partially through the substrate. The method continues by constructing an electrically conductive interconnect in the workpiece by depositing a solder material into at least a portion of the opening and in electrical contact with the terminal. In embodiments that include forming a blind hole, the workpiece can be thinned either before or after forming the hole.

A laser beam machining apparatus forms blind holes at predetermined intervals in a workpiece by intermittently irradiating a laser beam from a laser nozzle to the workpiece while the laser nozzle and the workpiece being moved relatively. During the time the workpiece is subjected to machining, the electrostatic capacity between the support member and the laser nozzle is detected by an electrostatic capacity sensor while the workpiece made of conductive material is supported on the support member. The irradiation output power is controlled by a control unit which operates to vary the number of output pulses from the laser nozzle each time one hole is formed according to the result detected in response to variation in the thickness of the workpiece.

A cooling member for a cautery surgical instrument such as a surgical forceps including a pair of elongate arms joined at an end so as to provide for resilient compressible movement of the arms between a normally open position and a squeezed closed position. The cooling member provides for conduction of heat away from an electrode tip, and comprises an first portion having a first diameter and a second portion spaced away from the first portion, and that transitions from the first diameter to at least one smaller diameter section. A socket is disposed within each arm of the forceps, and includes a longitudinal blind hole that is sized so as to releasably receive the smaller diameter section of the second portion, and a catch for engaging a portion of the arm.

A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is provided on a top surface of a sealing resin portion for burying an electronic component, the side surfaces of the sealing resin portion that are opposite to each other, and the side surfaces of the multi-layered substrate that are opposite to each other. The metallic film is connected to the grounding patterns that are provided on the top surface of the multi-layered substrate or between the laminated layers of the multi-layered substrate. Therefore, it is possible to achieve a superior electrical shielding effect through the metallic film, as compared with the related art. Since the metallic film is formed on the side surfaces of the sealing resin and the side surfaces of the multi-layered substrate, when the metallic film is formed by a plating method, the blind hole may not be provided in the related art. Therefore, it is possible to achieve the superior circulation of the plating liquid, which results in sure connection between the sure connection between the grounding pattern and the metallic film.

An image display device (10) has a main display body (1) provided with a thin display unit (2), a low-frequency loudspeaker (woofer) (3) and two middle and high frequency loudspeakers (tweeters) (4a, 4b) and a stand (8) supporting the main display body (1). The stand (8) has a base (6) being just opposite at its top surface to a duct outlet of the woofer (3) , thereby sound emitted from the duct can be constantly absorbed by and reflected from the base and provided with the stable quality without influence of the floor's material. A housing containing the first loudspeaker and a pair of the second loudspeakers has a plurality of through holes formed in a first area corresponding to an aperture of each loudspeaker (3, 4a, 4b) and a plurality of blind holes formed in a second area surrounding the first area, wherein the second area for the first loudspeaker is different in peripheral shape and/or size from the second area for each of the second pair of loudspeakers. The above arrangement can attain an improved sound field expanding effect by using one woofer and two tweeters, attaining the sophisticated design of the loudspeaker system.

The invention discloses a method for processing a blind hole by laser. The method combines fixed point UV laser impulse and UV laser spiral line or concentric circle scanning and is used for one-step blind hole processing or multi-step blind hole processing on multilayer circuit board. The method divides the UV laser blind hole drilling process into two parts, namely a part with an area near the circle center of the blind hole not more than UV laser spot diameter and a part with an area more than the UV laser spot diameter. Fixed point UV laser impulse is adopted to drill the blind hole, so as to remove material in the region with an area near the circle center not more than UV laser spot diameter; then UV laser spiral line or centric circle scanning method is adopted to move outside, so as to remove the material in the region with an area near the circle center more than UV laser spot diameter until meeting set blind hole size; and one-step blind hole or multi-step blind hole processing is drilled by UV laser through two steps or more steps. The method can ensure processing quality consistency of each blind hole, can greatly reduce bottom unevenness of the blind hole, and also can improve margin quality of blind hole processing.

The club head contains a number of blind holes arranged at appropriate places other than the hitting surface of the club head. Each blind hole is for the accommodation of a weight member. Each weight member contains at least a weight element and a fastening element. The fastening element has a threaded rod extending from the bottom of a cone-shaped head. The fastening element is squeezed into an end of the weight element with the threaded rod penetrating through the weight element and into the club head for fixation. On the other hand, the circumference of the weight element has a number of slits so that the cone-shaped head of the fastening element can force the wall of the weight element to press tightly against the hole to further enhance the fixation.

A blind fastener for securing a plurality of workpieces is provided that has a sleeve, and a pin member. In an alternate embodiment, the blind fastener has a sleeve, a pin member and a nut. The sleeves have a head with a plurality of rearwardly sloping recesses disposed therein. The recesses are adapted to be engaged with a plurality of rearwardly sloping nibs disposed on one end of a nose secured to an installation tool. The pin members have a splined head adapted to be engaged with a splined driver secured to an installation tool. Use of the splined head on the pin member, the splined driver, rearwardly sloping recesses on the sleeve, and rearwardly sloping nibs on the nose eliminates camming out of the nibs from the recesses during installation of the blind fastener. A nose assembly for installation of the blind fastener is also provided.

The vortex flow sensor is designed to measure the mass flow rate, the volumetric flow rate, or the flow velocity of a fluid flowing in a flow tube having a tube wall, and has two temperature sensors arranged in such a way that the vortex flow sensor may also be used with fluids which would corrode the temperature sensors. A bluff body in the flow tube sheds vortices and thus causes pressure fluctuations. A vortex sensor device responsive thereto is fitted downstream of the bluff body in a hole provided in the wall of the flow tube. The vortex sensor device comprises a sensor vane extending into the fluid. The temperature sensors are disposed in a blind hole of the sensor vane. Alternatively, the temperature sensor may be disposed in blind hole of the bluff body.

A fastener includes a round, blind hole or pocket in its head. Installation and removal of the fastener is accomplished with a tool containing an eccentric segment on the end of a shaft. When rotated within the pocket, the eccentric segment displaces laterally relative to the shaft to provide a friction grip to the lateral wall of the pocket. The strength of the grip is proportional to the applied torque. Eccentric displacement allows rotation but prevents the tool from spinning out of the fastener thereby eliminating cam-out and surface damage resulting from contact with a spinning tool tip. The eccentric head of the tool can be made disposable and to shear off when a predetermined torque is reached. The smooth-sided round hole offers no purchase for commonly available tools; making the fastener tamper-resistance. In another embodiment, the fastener includes a raised portion in the pocket. A tool having a complementary opening shears off the raised portion at a predetermined torque.

The invention relates to a cold forging technology for a gear shaft; the cold forging technology is characterized in that a new technology of the cold forging forming of the inside and outside and split flow forging, a volume split flow space is arranged between the gear shaft diameter and a concave die, the metal flow resistance is reduced and the unit extruding force carried by the die is lowered by split flow; high-strength die steel and split structure are adopted to produce a gear hole forming die; the concave die is produced by adopting three-layer sleeve prestressed structure so as to improve the compression resistance of the die; a punch is made from an alloy steel material and used for the cold forging and precision forming of a complex gear form blind hole, which improves the forming quality and production efficiency of the gear hole, and lowers the consumption of the raw materials markedly. The cold forging technology of the invention has the advantages of achieving the smooth forming of the gear form blind hole, improving the production efficiency greatly, and improving the quality of the gear hole and the qualification rate of the product markedly.

The invention relates to an LED illumination module having an LED (23) and a rotationally symmetrical, integral, light-transparent auxiliary optic (10) having an inner converging lens part (14) and an outer reflector part (16). The auxiliary optic (10) has an opening (11) in the form of a blind hole which is arranged at the rear and in which the LED (23) can be displaced longitudinally and axially along the optical axis (20) such that, owing to the displacement, a change in the cone of light from a cone of light having a cone angle < 12° to a cone angle >20° can be produced and, in at least one LED position with respect to the opening (11) of the auxiliary optic (10), an inner region of the cone of light is illuminated homogeneously over a cross-sectional area at right angles to the optical axis (20).

A vortex flow pickup serves for measuring mass flow, volume flow or flow velocity of a fluid which is flowing in a measuring tube having a tube wall, and has a temperature sensor arranged in such a way that the vortex flow pickup may also be used together with those fluids which corrode the temperature sensor. A bluff body which produces vortices, and consequently pressure fluctuations, is arranged in the measuring tube. A vortex sensor responding to these pressure fluctuations is fitted downstream of the bluff body in a bore of the tube wall of the measuring tube. The vortex sensor comprises a diaphragm which covers the bore and on which a sensor vane protruding into the fluid is fastened. The temperature sensor is fixed on the bottom of a blind hole of the sensor vane. On the side of the diaphragm lying opposite the sensor vane, a sensor element is fastened. The temperature sensor may alternatively be arranged in a longitudinal bore of the bluff body.

A method for placing material onto a target board by means of a transfer board comprising a plurality of blind holes, the method comprising the steps of immersing the transfer board in a material bath, wherein a first pressure acts on the material bath and a second pressure acts in the blind holes, and wherein the first pressure and the second pressure are substantially equal; generating a pressure difference between the first pressure and the second pressure, so that the blind holes of the transfer board are filled at least partially with the liquid material; extracting the transfer board from the material bath; and positioning the transfer board opposite to the target board, the material being expelled from the blind holes, such that the material touches the target board.

Constructs that are at least partially constructed of allograft cancellous bone are disclosed, along with cartilage particles that may be used with the constructs for repairing articular cartilage defects. A multi-piece construct includes a base member, a cap member and at least one pin that secures the cap member to the base member. The base member may be constructed of mineralized cancellous bone, and is used to replace the subchondral bone removed when a surgeon cuts a bore in the area of an adjacent cartilage defect. The base member includes a blind bore and first and second through-going transverse bores in opposite sides of a wall of the base member. The cap member includes an upper section that has a thickness that is similar to that of a patient's surrounding articular cartilage layer and a stem depending from the upper section that is dimensioned to be received in and by the blind bore of the base member. The stem includes a transverse through-going bore, which may be aligned with the transverse through-going bores of the base member to receive the pin therein when the construct has been assembled. The cap member is at least partially formed of demineralized allograft cancellous bone, into which a mixture containing lyophilized, freeze-milled allograft cartilage particles may be infused for the repair of articular cartilage defects. The cartilage particles have a size within a range of from about 10 microns to about 210 microns.

The invention discloses a through wafer interconnect structure processing method comprising: 1. etching a blind hole on a substrate; 2. etching a pattern dielectric substance layer on the substrate; 3. etching the pattern dielectric substance layer and the dielectric material at the bottom of the blind hole, keeping the dielectric material of a blind hole side wall; forming a dielectric substance hole on the substrate; 4. depositing a layer of conductive material on the dielectric substance hole and forming a conductive hole; 5. re-depositing a layer of pattern dielectric substance on the conductive layer and filling the conductive hole; 6. etching the back side of the plate to expose the conductive layer and forming a solder micro-convex point on the conductive layer, wherein the pattern dielectric substance material is preferable poly-p-xylene. The invention simplifies the process steps, reduces the process time and the cost; depresses a parasitic capacitance by using two layers of the pattern dielectric substance layers, improves a interconnect electrical behavior, suits for the high speed and RF three-dimensional interconnection structure; releases the thermal mismatch between the conductive material and the silicon and greatly reduces the thermal mechanical stress.

This invention is a portable pneumatic cutter tool for cutting countersinks into a workpiece 17 having pre-drilled holes 15. When pressure is applied, a piston return cylinder 57 and a feed rate cylinder 79 are also pressurized, which sets a body piston 72 and spindle piston 80 reacts against a spindle bar 82 which holds nose 94 in its outer-most limit position. A pistol grip drill 44 drives a geared belt 34 to cut the countersink after actuation by trigger 45. A flare tube shaft 14 expands a multiple finger and pad arrangement of a collet 12 to provide clamp-up on the back side of workpiece 17. Clamp-up on the front side of workpiece 17 is provided by pneumnatic pressure and solid mechanical stops 16. The countersink cutter 18 advances into workpiece 17, reaching its depth, and returns automatically to its start position.

A liquid crystal device comprises a layer (2) of a nematic liquid crystal material contained between two cell walls (3, 4) each carrying electrode structures (6, 7) and an alignment surface (20, 21). The alignment layer (20, 21) on one or both cell wall (4), is formed of a plurality of small (<15 μm) surface features each separably capable of providing a bistable pretilts and an alignment direction and collectively causing larger variations of molecular orientation across the layer (2). The device may be switched between a light transmissive state and a light non-transmissive state. The small surface features may be areas of grating (21), protrusions (25), or blind holes (26), separated by mono stable flat surfaces (Fm) coated with a homeotropic alignment layer. Preferably, the grating etc provides bistable switching operation between a low surface tilt and high surface tilt, and the low tilt alignment direction varies between adjacent grating areas.

An engine intake valve has a threaded blind bore opening from its top surface facing the engine cylinder. A pressure sensor has a body portion whose exterior is threaded and is configured in size and shape to be completely received within and retained in the blind bore. The pressure sensor is configured to generate a pressure signal indicative of the cylinder pressure.

An equipment for making abrasive particles in even distribution, array pattern and preferred orientation comprises an adsorbing releasing apparatus being composed of a plurality of acicular soft magnetic metallic sticks, an upper and a lower stators, and a plurality of windings. Each winding forms an electric circuit through a electrical source, a resistance, and a switch a plurality of blind holes being distributed on face of the blind hole feeding tropism board. Using electric current to form magnetic field for the acicular soft magnetic metallic sticks absorb or release abrasive particles plated with soft magnetic materials. The equipment is simple, convenient in operation, high in efficiency and reliability. The equipment makes abrasive particles in matrix with an ideal state in distributing density, uniformity, arrange, and tropism. Thereby, the function of the abrasive materials is fully exerted and the life of products is prolonged.

The present invention discloses a joint force moment sensor providing torque and bending moment overload protection, and relates to a joint force moment sensor, to solve the problems that the existing joint force moment sensor can only realize the overload protection on the force moment vertical to the ground. The present invention provides a blind hole (10) on each overload protection beam (5), four through holes (9) coaxial with the blind holes (10) are respectively arranged on the inner edge of an output connecting flange (2) along the radial direction, one end of each protection pin (6) respectively gets through the corresponding through holes (9) and arranged in the corresponding blind hole (10), and the other end of each protection pin (6) is fitted with the corresponding through hole (9) through a clearance. Under different operating modes of the sensor of the present invention, the variances of the overload protection annular clearances between the protection pins and the through holes are different, not only the joint force moment overload protection can be provided, but also the bending moment overload protection can be realized, thus making the system run more safely and reliably.

The invention relates to the technical field of PCB (printed circuit board) plating, in particular to a copper plating solution for PCB through holes and PCB blind holes, and a preparation method and a plating method of the copper plating solution. Each liter of the copper plating solution comprises the following components according to contents: 100-250g of copper sulfate pentahydrate, 100-200g of sulfuric acid, 30-100ppm of chlorine ions, 5-50g of brightener, 3-30g of carrier, 2-20g of leveling agent and the balance of deionized water, wherein the concentration ratio of the copper sulfate pentahydrate to the sulfuric acid is (1-1.25) : 1. The plating method comprises the following steps: putting a PCB with through holes and blind holes into a plating bath with the copper plating solution; plating during air agitation to obtain a copper plating layer. The copper plating layer formed by the plating method has a good deep plating capability as high as 92% above, has a hole-filling rate as high as 96% above, and is dense, smooth, relatively good in malleability, good in gloss, high in toughness and low in internal stress.

The invention discloses a brake pad which is applied to a disc type brake system of a high-speed train. A friction block constituted by the brake pad can be flexibly replaced. The brake pad comprises a brake pad back plate which is made of a metal material, an elastic supporting sheet, the friction block and a circular spring clamp, wherein the elastic supporting sheet is provided with a spherical supporting surface and a central guide hole; the lower part of the friction block is provided with a spherical supporting surface and a positioning and connecting shaft which is provided with a clamping groove; the connecting shaft can penetrate through the central guide hole and a back plate positioning hole of the elastic supporting sheet and is locked on the back plate by the circular spring clamp to realize floating connection; the friction block is provided with a polygonal block with a blind hole in the center; and every three friction blocks form an interlocking group, so that the rotation of the friction block during working of the brake pad is prevented. The brake pad can achieve the maximum contact friction area of the brake pad and a brake disc in a train braking process, so that the braking process is stable and the brake pad has the functions of damping, vibration reduction, noise reduction, heat dissipation and the like. The friction block is easy to replace, so that the train operation cost is lowered.

A fuel supply apparatus for installation in a fuel tank includes a fuel pump, a housing, and a filter element disposed in the housing and having an upstream side communicating with the discharge port of the fuel pump. A check valve communicates with a downstream side of the fuel filter, and a pressure regulator communicates with the upstream side of the filter element. A sedimentation flow path may be provided for removing sediment from fuel discharged from the pressure regulator. The sedimentation flow path may be substantially cylindrical vortex spaces between fins disposed on the inner periphery of the pump holder and has blind holes at the bottom for trapping the sediments.

A method for detecting single molecule includes providing a carrier. The carrier includes a substrate and a metal layer. The substrate has a surface and defines a number of blind holes caved in the substrate from the surface thereof. The metal layer covers the surface of the substrate and inner surfaces of the number of blind holes. Single molecule samples are disposed on the metal layer. The single molecule samples are detected by a Raman Spectroscopy system.

The invention discloses a shell making method for a deep blind hole of a precision casting. The method comprises the following steps of: making a wax pattern module; coating the module to make a shell; sequentially coating a surface layer, a transition layer, a third layer and a fourth layer; after coating the third layer or fourth layer, performing air drying until the shell is completely dried; stirring silica sol zircon powder slurry and mullite sand according to a mass ratio of 4:(6-6.5) into paste to obtain filling; pouring the filling into the position of the deep blind hole of the casting; then aligning the deep blind hole of the casting with a fan for forced air drying until the deep blind hole of the casting is completely dried; continuously reinforcing according to the casting size until the required layer number of the shell is obtained; and dewaxing to obtain a corresponding shell. The shell making method for a deep blind hole of a precision casting, disclosed by the invention, is simple and convenient to operate, effectively solves the difficulty in shell making for a shell deep blind hole of a precision casting, enhances the strength of the shell at the deep blind hole, greatly reduces the defects of breakage, deviation and the like of the shell at the deep blind hole, realizes an obvious effect and fundamentally guarantees the delivery time of the products for customers.