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6318results about How to "Improve shielding effect" patented technology

Method for manufacturing circuit modules and circuit module

A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.
Owner:MURATA MFG CO LTD

Method for manufacturing circuit modules and circuit module

A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material. Next, second through holes are formed at locations corresponding to the remaining portions of the boundary lines of small substrates so as to extend in the thickness direction, and second electrode films are formed on the inner surfaces of the second through holes so as to be connected to the top-surface-shielding layer and the first electrode films. The filling material, with which the first through holes are filled, is cut along the boundary lines of small substrates, resulting in a division of the aggregate substrate into small substrates to obtain circuit modules.

Electromagnetic wave blocking material and electromagnetic wave blocking case

This invention provides the electromagnetic waves shield material that has a sufficient effect of shielding the electromagnetic waves by making the electric conductive fibers into mesh. And this invention also provides the electromagnetic waves shield mobile phone case that avoids a harmful effect on the human body without reducing the function of communication of the mobile phone used the said electromagnetic waves shield material.
The fibers with electric conductivity are woven into mesh by a general knitting machine like a machine for tricot. The cost is low even used for the wide area to shield the electromagnetic waves because the consumption of the fibers needed is less. The coarseness of the net is maintained the same by controlling the movement of the length and breadth each other.
To avoid the radiation to the head direction, the electromagnetic waves shield material is used for the front and upper sides of the mobile phone case which are the direction to the head when the mobile phone is in use. The regular material without electromagnetic waves shield effect is used for the both sides of the mobile phone case.
The antenna cap with electromagnetic shield structure is attached to the said upper side of the electromagnetic wave shield case. The electricity with high frequency is conducted between the above antenna cap and the upper side of the electromagnetic wave shield case. The said antenna cap is a conic tube cut it's head obliquely. The opening part is made to face in the opposite side of the head when it is attached to the antenna. A metallic pin is attached to the outside of the antenna cap. This metallic pin conducts high frequent electricity with the wire antenna at the mobile phone body when it is attached. It functions as an additional antenna to the wire antenna at the mobile phone body.
Owner:KAZU INVESTMENT

Compound waveform gasket for low closure force EMI shielding applications

InactiveUS6348654B1Reduce loadAssured electrical and physical continuityEngine sealsScreening gaskets/sealsWave shapeEngineering
A resilient EMI shielding and/or environmental sealing gasket for interposition between a first interface surface and an oppositely-disposed second interface surface. The gasket is formed of an elongate body of indefinite length which extends along a longitudinal axis. The body includes base and apex surfaces, and opposing first and second lateral surfaces which extend intermediate the base and apex surfaces. The base surface itself extends along the length the body as configured for proximally supporting the gasket on the first interface surface. The apex surface, in turn, extends radially from the longitudinal axis for distal contact with the second interface surface, and further extends along the longitudinal axis as defining a first waveform profile characterized as having a first periodic series of alternating first high and low amplitude intervals. The second lateral surface also extends along the longitudinal axis as defining a second waveform profile which is disposed generally transverse to the first waveform profile and which is similarly characterized as having a second periodic series of alternating second high and low amplitude intervals. The gasket so formed is deformable under a predetermined compressive force between the first and second interface surfaces into a stressed orientation characterized in that the body is deflected intermediate the base and apex surfaces.
Owner:PARKER INTANGIBLES LLC
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