2605 results about "Edge surface" patented technology

An acetabular shell liner having a variable rim surface geometry, which improves range of motion of the femoral component within the liner and decreases the incidence of dislocation and subluxation, and methods of making and using the acetabular shell liner. Prosthetic devices, more particularly hip joint prostheses, containing the acetabular shell liner having a variable rim surface geometry are also provided.

A lens for a light emitting diode is formed with a material having a refractive index of n, and the lens includes a base, a first curved circumferential surface extending from the base, a curved center-edge surface extending from the first curved circumferential surface, and a curved centermost surface extending from the curved center-edge surface. The base includes a groove for receiving a light emitting chip therein. In the lens, a distance from a center of the base to a point of the curved center-edge surface is always shorter than the radius of curvature for the point of the curved center-edge surface. The curved centermost surface has a concave shape with respect to the base. In addition, when an obtuse angle formed between a main axis of the lens and a tangent line of a point of the curved centermost surface is A1, and an acute angle formed between a straight line linking the center of the base to the point of the curved centermost surface and the main axis of the lens is A2, the lens satisfies the equation: A1+A2<90+sin⁻¹(1/n).

This invention provides a vertebral implant for impaction in a disc space to restore and/or maintain desired disc space height and spinal orientation. The implant has an elongated basis body having a generally lens-shape provided by convex upper and lower surfaces. Bearing surfaces are provided on the cross-edge surfaces of the endwalls. Grooves are provided in the upper and lower surfaces positioned between the bearing surfaces. The implant can be prepared from a wide variety of materials including metallic materials, synthetic materials, polymeric materials, ceramic materials, and composite materials including reinforced materials i.e. glass, fiber, and/or carbon fiber reinforced materials (CFRP). These preferred materials for fabricating implants in the present invention reduce costs, increase service life and provide excellent physiological compatibility. The non-metallic material can be selected to be either a substantially permanent material, a biodegradable material or a bioerodable material. Further, the implant material can be provided to be radio opaque to facilitate monitoring of bone ingrowth both into the implant and between the opposing endplates of the adjacent vertebrae.

A framed lithium battery cell group includes a first frame member (20) and a second frame member (30). The frame members are locked together, clamping the lithium battery cell pack (10) on the seal edge surfaces (13, 16), thereby providing structural rigidity and protection from damage due to handling and vibration. Each of the frame members (20, 30) has multiple pins (25) and sockets (26) on the side opposite the clamping surface (33) to facilitate aligning and stacking multiple lithium battery cell pack and frame assemblies to form a lithium battery cell group (50). Each of the frame members (20, 30) include a buss bar capture feature (22, 32) having a bus bar (40) inserted therein for electrically connecting all of the terminals for a given lithium battery pack group to the buss bar (40).

A honeycomb structured body in which a plurality of porous ceramic members are combined with one another by interposing an adhesive layer, each of the porous ceramic members having a plurality of cells placed in parallel with one another in a longitudinal direction with a cell wall therebetween and an outer edgewall on the outer edge surface thereof, wherein the thickness of the outer edge wall of the porous ceramic member is greater than the thickness of the cell wall, and each of the porous ceramic members has a filling body which is provided so as to fill in at least one corner portion of at least one outermost cell of the porous ceramic members.

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one MEMS acoustic sensor device wherein an edge surface of the metal cap structure is attached and electrically connected to the PCB stack. In a first embodiment, a back chamber is formed underlying the at least one MEMS acoustic sensor device and within the PCB stack wherein an opening underlying the at least one MEMS acoustic sensor device accesses the back chamber. An opening in the metal cap structure not aligned with the at least one MEMS acoustic sensor device allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device. In a second embodiment, a back chamber is formed in the space under the metal cap and over the first PCB. A hollow chamber is formed between the first PCB and the second PCB wherein an opening under the at least one MEMS acoustic sensor device accesses the hollow chamber. An opening in a bottom surface of the PCB stack not aligned with the at least one MEMS acoustic sensor device also accesses the hollow chamber and allows external fluid, acoustic energy or pressure to enter the at least one MEMS acoustic sensor device.

A microelectronic assembly includes a substrate having a first and second opposed surfaces. A microelectronic element overlies the first surface and first electrically conductive elements can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

Reinforcement preforms and methods for making same for use in fiber-reinforced composite materials structures are disclosed, in which the reinforcement preforms comprise first and second reinforcement preform elements which include strength reinforcement fibers that are in desired directional orientation. The first element has a cross-fiber surface which extends transverse of its constituent strength reinforcement fibers and is in contacting juxtaposition to a selected surface region of the second element, forming an abutment therebetween. Abutment strength reinforcing fibers, which may optionally be introduced in situ by a continuum of fibers, such as a yarn or thread, extend through at least a portion of said second element and its said selected surface region, the abutment, said cross-fiber edge surface, and into the first element substantially in the direction of orientation to its constituent strength fibers to which its cross-fiber surface is transverse.

The present invention relates to an indexable milling insert and a milling tool for chip removing machining. The milling insert is intended to be able to mill substantially perpendicular corners in a work piece. The milling insert comprises an upper side, a lower side and edge surfaces extending therebetween. The upper side and the lower side are substantially identical. An imaginary circle inscribed in the milling insert touches the milling insert periphery in four to six points. Lines of intersection between the edge surfaces and the sides form relative to each other substantially perpendicular main cutting edges and minor cutting edges. Each of the sides includes a support surface, each of which being provided in a plane. Each minor cutting edge projects from the plane of the associated support surface. Each major cutting edge intersects the plane of the associated support surface.

A packaged microelectronic element includes a microelectronic element having a front surface and a plurality of first solid metal posts extending away from the front surface. A substrate has a major surface and a plurality of conductive elements exposed at the major surface and joined to the first solid metal posts. In particular examples, the conductive elements can be bond pads or can be second posts having top surfaces and edge surfaces extending at substantial angles away therefrom. Each first solid metal post includes a base region adjacent the microelectronic element and a tip region remote from the microelectronic element, the base region and tip region having respective concave circumferential surfaces. Each first solid metal post has a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.

A carbon dioxide laser is used as a non-mechanical means for smoothing and polishing the as-cut chamfer surface at the edge of the disk. Applying laser radiation to the glass surface causes transient melting and resolidification. Due to surface tension effects, the glass resolidifies to produce a surface that is significantly smoother than it was before irradiation. If scratches or abrasive marks are present on the glass surface prior to irradiation, the irradiation process "polishes out" these defects as long as they are not too deep. At a wavelength near 10 mum, the penetration depth of the radiation into the glass is approximately 1 mum. Therefore, scratches and defects of this order of magnitude are eliminated. The quality of the resulting modified chamfer surface is far superior to the original mechanically ground and polished surface.

An EMI shielding spacer gasket assembly for interposition under a predetermined compressive load within an electronics enclosure between a first surface and an oppositely-disposed second surface of the enclosure. The assembly includes a frame member and an electrically conductive, elastomeric member extending along at least a portion of the perimeter of the frame member as retained on a corresponding peripheral edge surface thereof. The elastomeric member has an outboard side which is compressible axially under the compressive load for providing an electrically conductive pathway between the surfaces of the enclosure. In an uncompressed orientation, the outboard side of the elastomeric member exhibits elongate upper and lower bearing portions which are disposed at a spaced-apart radial distance from the frame member to define a corresponding bending moment arm. Each of the bearing portions is angularly deflectable relative to the moment arm to effect the compression of the elastomeric member under a relatively low compressive load.

An LED lamp device has a lamp seat, in which a lamp trough is formed by being recessed inwardly, and the inner edge surface of the lamp seat is formed as an arc surface. The front and rear parts in longitudinal direction of the lamp trough are also bent inwardly. Three rows of lamp set are arranged along the longitudinal sides in the lamp trough. These lamp sets have a plurality of LEDs as light-emitting elements. The lamp sets at left and right rows are inclined inwardly according to the curvature of the inner edge surface. In the meantime, the lamp sets at front and rear sides of one row are also inclined inwardly. Under this arrangement, the plural lamp sets not only can enhance the illumination of the lamp, but also can concentrate its light-emitting operation, for solving a shortcoming of light dispersal in most light sources.

A method for manufacturing an electrochromic element comprises providing a first substrate having first and second surfaces and a first edge surface, providing a second substrate having third and fourth surfaces and a second edge surface, the third surfaces facing the second surface, providing an electrochromic medium located between the first and second substrates, the medium having a light transmittance that is variable upon application of electric field thereto, applying a conductive layer on a portion of at least one of the surfaces, wherein applying the layer is accomplished at substantially atmospheric pressure, and applying at least one of metallic particles, an organometallic, a metallo-organic, and combinations thereof, wherein the conductive layer has a bulk resistivity of greater than or equal to 150 μΩ·cm. The conductive layer may be applied via ink jetting, ultrasonic spraying, auger or jet pumping.

A light emitting diode includes a first doped semiconductor layer, an active region and a second doped semiconductor layer. The sectional area of the active region is less than the sectional area of the first doped semiconductor layer. One electrode of the light emitting diode is connected to the edge surfaces of the first doped semiconductor layer. The second electrode is connected to the second doped semiconductor layer. A method is described for fabricating the light emitting diode.