This invention discloses a
dynamic random access memory (
DRAM) and its manufacturing method, relating to the field of memory technology, to reduce the
parasitic capacitance of memory cells. The
DRAM includes a substrate and a plurality of memory cells. Each
memory cell includes a first
transistor and a second
transistor disposed along the thickness direction of the substrate, with the second
transistor located on the first transistor. The first transistor includes a first stacked structure, a first channel layer, a first
gate dielectric layer, and a first gate. The first channel layer covers a second
isolation layer and the inner wall of a first opening, the first
gate dielectric layer is located on the first channel layer, and the first gate is located within a first via formed by the first
gate dielectric layer. The second transistor includes a second stacked structure, a second channel layer, a second gate
dielectric layer, and a second gate. The second channel layer covers a third conductive layer and the inner wall of a second opening, the second gate
dielectric layer is located on the second channel layer, and the second gate is located at least within a second via formed by the second gate
dielectric layer.