A method of forming a seed layer stack for a magnetic device may include depositing a bottom seed layer, forming at least one pair of
smoothing layers over the bottom seed layer, and depositing a top seed layer over and abutting the at least one pair of
smoothing layers. Forming at least one pair of
smoothing layers may include sputter depositing a sub-smoothing layer over the bottom seed layer and sputter depositing an amorphous sub-smoothing layer over and abutting the sub-smoothing layer. A top surface of as-sputter deposited sub-smoothing layer has a first top
surface roughness, and the sputter depositing of the amorphous sub-smoothing layer causes re-
sputtering of the sub-smoothing layer, such that the top surface of the as-sputter deposited sub-smoothing layer has a second top
surface roughness less than the first top
surface roughness. The sub-smoothing layer, the bottom seed layer, and the top seed layer include different materials.