148results about How to "Prevent electrostatic discharge" patented technology

A multi-layer flexible film package which shields electromagnetic waves, prevents electrostatic discharge, and at the same time, performs a heat radiation function, and a liquid crystal display device having the same, include an insulating film having circuit patterns and internal ground wiring lines at a first side thereof, an insulating layer formed on the circuit patterns and the internal ground wiring lines, a driver integrated circuit (“IC”) electrically connected to the circuit patterns and the internal ground wiring lines, a ground layer formed on a second side opposite the first side of the insulating film and connected to the internal ground wiring lines, and via holes formed through the insulating film and electrically connecting the internal ground wiring lines and the ground layer.

A light emitting diode and a method of the same are provided. The light emitting diode includes a light-emitting structure, a silicon substrate and a bonding layer. The light-emitting structure includes two semiconductor layers of different doped types. The light-emitting structure is capable of emitting light when a current passes through. The silicon substrate includes two zones of different doped types. The bonding layer is interposed between the light-emitting structure and the silicon substrate so that the semiconductor layer and the zone closest to the bonding layer are of different doped types.

A thin film transistor array plate, a liquid crystal display panel and a method of preventing electrostatic discharge thereof are provided. The thin film transistor array comprises a substrate, pixel structures, switching devices, lead lines and electrostatic discharge (ESD) protecting circuits. The substrate has a display region and a peripheral circuit region. The pixel structures are disposed within the display region and the switching devices are disposed within the peripheral circuit region. The lead lines are disposed on the substrate to electrically connect the pixel structures and the switching devices. The ESD protecting circuits are disposed within the peripheral circuit region such that each ESD protecting circuit is electrically connected to the corresponding switching devices. The ESD protecting circuits prevent electrostatic discharge, simplify the circuit layout and improve production efficiency of the plate and the panel.

The invention discloses an array base plate and a display panel. Through the arrangement of a virtual electrode in a cutting region of the array base plate, and in addition, touch control electrodes are electrically connected with the virtual electrode through a touch control electrode lead wire, so that the touch control electrodes are in short circuit connection, i.e., the voltage difference among the touch control electrodes is zero; or a first electrostatic defending device is arranged in a step region of the array base plate, in addition, the touch control electrodes are electrically connected onto a first short circuit ring through the touch control electrode lead wire and the first electrostatic defending device, when the first electrostatic defending device is switched on through the static electricity of the touch control electrodes, the touch control electrodes conduct the static electricity on the touch control electrodes onto the first short circuit ring through the first electrostatic defending device, and the voltage of the static electricity of the touch control electrodes is reduced. Through the technical scheme provided by the invention, the static electricity discharge among the touch control electrodes can be prevented, so that the damage to the touch control electrodes and the display panel due to the static electricity discharge can be avoided.

The present invention relates to a process for preparing a thinned silicon wafer for electrical testing, the thinned silicon wafer comprising at least one circuit design and at least one through-silicon via or hole; the process comprising temporarily attaching the thinned silicon wafer to a mechanical handler by means of an electrically conductive polymeric adhesive material.

The present invention relates to a semiconductor device which includes a photoelectric conversion layer; an amplifier circuit amplifying an output current of the photoelectric conversion layer and including two thin film transistors; a first terminal supplying a high-potential power supply voltage; a second terminal supplying a low-potential power supply voltage; an electrode electrically connecting the two thin film transistors and the photoelectric conversion layer; a first wiring electrically connecting the first terminal and a first thin film transistor which is one of the two thin film transistors; and a second wiring electrically connecting the second terminal and a second thin film transistor which is the other of the two thin film transistors. In the semiconductor device, the value of voltage drop of the first wiring and the second wiring are increased by bending the first wiring and the second wiring.

A head suspension prevents a read element from electrostatic discharge damage without employing a static electricity remover or without increasing the number of manufacturing processes. The head suspension has a load beam to apply load to a head (21) that writes and reads data to and from a hard disk, a flexure (7) made of a conductive thin substrate attached to the load beam and supporting the head, an insulating base layer (35) made of flexible resin and formed on the substrate of the flexure, write wires (29) and read wires (31) connected to the head and formed on the insulating base layer, and an insulating cover layer (41, 43) covering the write and read wires on the insulating base layer. The insulating cover layer (41, 43) is made of slightly conductive flexible resin.

The invention relates to a liquid crystal display array substrate and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a structural figure comprising a grid line, a gate electrode and an active layer on a substrate; forming a structural figure comprising a data wire, a source electrode, a drain electrode and a TFT channel area, wherein the two sides of the data wire are in a slope shape or a stepped shape for preventing the aggregation of static electricity; forming the figure of a passivation layer; and forming the figure of a pixel electrode, and forming the figure of an anti-static electrode simultaneously in a frame sealant area. The two sides of the data wire are in the slope shape or the stepped shape preventing the aggregation of the static electricity, thus electrostatic discharge possibly caused by the edges and corners of the data wire is dispersed effectively; and simultaneously, the anti-static electrode is formed in the framesealant area to reduce the density of the static electricity accumulated on the surface of a golden ball, so the electrostatic discharge between the data wire and the golden ball can be avoided, and the defect of imperfect bright line caused by a short circuit between the data wire and the golden ball can be effectively prevented.

A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side. More preferably, in the magnetic head connecting portion, the cover layer is not formed, and on the base layer in the magnetic head connecting portion, a conductive polymer layer is formed, whereas on the plurality of conductive circuits in the magnetic head connecting portion, the conductive polymer layer is not present or is substantially absent, if any, to such a degree as to allow the magnetic head to be electrically connected to the conductive circuits.

The present invention relates to an image pickup device, etc., having a structure such that electrostatic discharge is unlikely to occur when an FOP and a CCD reading part are joined. This image pickup device comprises a semiconductor substrate, provided with the CCD reading part on a front surface that opposes a back surface, which serves as a light-incident surface, a package having a cavity in which the semiconductor substrate is fixed, a cover covering an upper opening of the cavity, an FOP joined to the semiconductor substrate, and electrical wirings. The cover has a guiding opening for inserting the FOP into the cavity, and the semiconductor substrate is thinned at a portion corresponding to a region at which the CCD reading part is disposed. Also, the semiconductor substrate is fixed to a bottom surface of the cavity such that the CCD reading part and the bottom surface face each other, and a light outgoing end surface of the FOP is optically coupled to the thin part of the semiconductor substrate in the state of being inserted into the cavity from the guiding opening.

An antenna apparatus for a portable terminal includes a main board and a display device. The main board has a ground for grounding and a feed terminal for feeding. The display device electrically communicates with the main board by the medium of a Flexible Printed Circuit Board (FPCB) and has an ElectroStatic Charge (ESD) prevention ground. If the display device is mounted above the main board, the ESD prevention ground of the display device comes in electric contact with the feed terminal of the main board, for emission.

A photomask and a method for forming a photomask are disclosed in which the photomask pattern is modified to bridge features that are likely to produce electrostatic discharge related defects. In one embodiment those adjacent features that are closely spaced together and have a high surface area differential, are bridged using a bridge that has a width less than the minimum optical resolution of the photolithography process.

A motorcycle includes a guard frame provided near an upper portion of a vehicle body of the motorcycle that is arranged to reduce or prevent damage to the components of the motorcycle in the event of an overturn of the motorcycle. The guard frame includes a pair of guard frame rails, each rail extending in a longitudinal direction of the vehicle body. A connecting portion connects the rear end portions of the rails. The front end portion of each rail is fixed to a body frame of the motorcycle. The connecting portion is supported by the body frame for pivotal movement about a pivot axis. The rails have a normal bow shape that projects outwardly. In some arrangements, an intermediate portion of each rail is formed of a material having lower rigidity than a material of the front and rear end portions of the rail.

This invention relates to the method and apparatus for electrostatic pickup of sound from stringed musical instruments to addresses the unique requirements of acoustic stringed musical instruments with a portable, detachable, safe-to-handle, easy-to-use, low-noise, electrostatic pickup that captures the tone of the musical instrument, is usable with common musical sound systems, avoids acoustic feedback problems associated with air microphones in live settings, and is easy to manufacture using current common materials and practices.

A touch display apparatus including a display panel, a touch panel, a transparent conductive layer, and a conductive adhesive layer is provided. The touch panel is disposed on the display panel, and includes a cover lens, a touch device, and a shielding conductive ring. The touch device is disposed on the cover lens and located between the display panel and the cover lens. The shielding conductive ring is disposed on the cover lens and located between the display panel and the cover lens. The shielding conductive ring surrounds the touch device. The transparent conductive layer is disposed on the display panel and located between the display panel and the touch panel. The conductive adhesive layer is disposed between the display panel and the touch panel. The shielding conductive ring is electrically connected with the transparent conductive layer through the conductive adhesive layer.

The invention provides a display motherboard and an electrostatic discharge method thereof, and a base station, and belongs to the technical field of electrostatic protection. A problem that the existing display motherboard easily produces a bad effect due to the electrostatic discharge in the friction orientation and like processes can be at least partially solved. The display motherboard provided by the invention comprises at least one display substrate; the display motherboard further comprises a testing line for introducing testing voltage in the testing, and the testing line is connected with a signal line in the display substrate; the display motherboard further comprises a discharge terminal which is electrically connected with the testing line through a switch unit, and is used for connecting with a grounded probe; when the absolute value of the voltage difference between the testing line and the discharge terminal is greater than or equal to a preset value, the switch unit is turned on, or the switch unit is turned off, and the preset value is greater than the maximum value of the absolute value of the testing voltage.

The invention discloses a semiconductor encapsulation piece and substrate structure which is arranged in array and preparation method, the semiconductor encapsulation piece includes: substrate unit part of which forms groove, and plugging compound is filled into the groove; semiconductor chip which is electric connected to the substrate unit; and encapsulation colloid which is formed on the substrate unit and covers the semiconductor chip. When incising along the substrate unit, the incision path passes through the plugging compound or encapsulation colloid, electric detection of substrate unit can be proceeded in advance, it can avoid problem that the material and working procedure are wasted and cost is increased induced by poor product when succeeding steps are accomplished, at the same time, the cutting surface is flat, lead circuit can not be exposed at the cutting surface, it can avoid problems of damage of static and inroad of damp.

The invention provides a liquid crystal display device which comprises a first substrate, a second substrate and sealing glue, wherein the first substrate and the second substrate are relatively arranged; the sealing glue is arranged between the first substrate and the second substrate for adhering the first substrate and the second substrate; the first substrate is provided with a driving line and a first substrate common electrode toward the direction of the second substrate; the second substrate is provided with a second substrate common substrate toward the direction of the first substrate; a plurality of conductive particles are distributed into the sealing glue; the sealing glue is divided into a first sealing glue area and a second sealing glue; the conductive particles in the first sealing glue area are contacted with the first substrate common electrode and the second substrate common electrode; the conductive particles in the second sealing area are only contacted with the second substrate common electrode; a conductive housing layer is also arranged in the second sealing glue area, and positioned between the conductive parts and the driving line; and a first insulating layer is also arranged between the conductive housing layer and the driving line. With the adoption of the liquid crystal display device, the problems that the yield is reduced due to the discharging of the top ends of the conductive particles can be prevented.

A method of fabricating an array of structures sensitive to ESD is disclosed. First, an array of structures is provided on a substrate, with the structures conductively coupled by interconnections. Thereafter, the interconnections are removed before fabricating another array of structures. Therefore, the structures have equal potential. Further, an electrostatic discharge structure is provided near the periphery of the substrates.

A surface acoustic wave apparatus is configured to avoid destruction from static electricity. The surface acoustic wave apparatus includes a piezoelectric substrate; a surface acoustic wave element having at least one interdigital electrode made up of a conductive film on the piezoelectric substrate; and a thin film electrically connected between terminals connecting to electrode fingers of the interdigital electrode, the thin film showing varistor characteristics formed on the piezoelectric substrate.