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2291results about How to "Lower working temperature" patented technology

LED (Light Emitting Diode) lamp filament and manufacturing method thereof

The invention provides an LED (Light Emitting Diode) lamp filament and a manufacturing method thereof. An LED chip is encapsulated on the edge top surface of a thin and long sheet metal support of the LED filament innovatively, meanwhile the sheet metal is inserted into a preformed transparent plastic model frame to produce a light source, and accordingly the automated continuous production of the LED lamp filament is implemented and the problem of the facing direction strength caused by the too thin and too long metal support is solved due to the transparent plastic model frame; meanwhile the lateral direction strength of the metal support is effectively utilized and accordingly the integral mechanical strength of the LED lamp filament is ensured; the heat dissipation characteristics of the metal is directly utilized, meanwhile the heat dissipation efficiency of the LED chip is maximized through the innovative encapsulation of thermal conductive coatings, and accordingly the problem of a heat dissipation bottleneck of the LED lamp filament is effectively solved, the LED lamp filament can work at the rated power for a long time, and the cost is reduced; the LED light extraction efficiency is improved, the light attenuation is reduced, the high lighting effect and ambient light of lamp filament light emission is implemented, and the market vacancy of the existing LED lamp filament is filled through innovative fluorescence encapsulation materials.
Owner:DONGGUAN RIWEI ELECTRONICS

Optical module and adjusting method of working temperature of laser thereof

The invention discloses an optical module and an adjusting method of a working temperature of a laser thereof. The method comprises determining a current environment temperature according to an obtained temperature value after a micro controller unit (MCU) in the optical module obtains the temperature value detected by a temperature sensor; determining a working temperature set value corresponding to the current environment temperature and a BIAS current set value; controlling a driving circuit to output corresponding BIAS current according to the determined working temperature set value; and controlling a thermoelectric cooler (TEC) control circuit to adjust the working temperature of the laser to be a corresponding temperature according to the determined working temperature set value. Due to the facts that the working temperature of the laser is allowed to be changed correspondingly along with the environment temperature within a certain range and BIAS current adjustment is simultaneously adopted to serve as a compensation means to enable optical power and extinction ratio to be constant, the difference between the working temperature of the laser and the environment temperature is reduced, heating or refrigeration current provided for a TEC is reduced, and the goal of reducing power consumption is achieved.
Owner:HISENSE BROADBAND MULTIMEDIA TECH

Variable-gradient fractal lattice sandwiched reinforcement phase change heat sink

The invention discloses a variable-gradient fractal lattice sandwiched reinforcement phase change heat sink and aims to provide an efficient phase change heat sink which is high in heat exchange efficiency, has certain universality and can be developed in a serialization mode. The variable-gradient fractal lattice sandwiched reinforcement phase change heat sink is realized according to the following technical scheme: reinforcement heat transfer structures are distributed in a phase change heat sink shell in an array; each variable-gradient fractal lattice sandwiched unit takes a variable-gradient V structure as a first-stage reinforcement heat transfer structure (4) according to the heat transfer and heat exchange characteristics of the phase change heat sink; on this basis, at variable-gradient V-shaped ends of the first-stage reinforcement heat transfer structures, the variable-gradient V structures in the same shape are gradually increased to form multiple stages of reinforcement heat transfer structures, and the specific surface areas of the multiple stages of reinforcement heat transfer structures are multiplied in sequence; the first-stage reinforcement heat transfer structures can transfer heat to an area far away from a heat radiation bottom plate rapidly in a reinforcement mode, and the second-stage reinforcement heat transfer structures (5) and the third-stage reinforcement heat transfer structures can transfer heat to phase change material far away from the heat radiation bottom plate rapidly to complete heat exchange.
Owner:10TH RES INST OF CETC

Groove type atomic gas cavity and atomic clock physical system formed by same

The invention relates to a groove type atomic gas cavity produced by applying MEMS technology and an atomic clock physical system formed by the same. The cavity is characterized in that the cavity is formed in such a manner that a silicon wafer with a groove and Pyrex glass sheets define a cavity structure through bonding; the cavity structure is used for alkali metal atom vapor and buffer gases to fill in; the cross section of the groove is in a shape of inverted trapezoid; and the groove comprises a bottom surface and side walls forming included angles with the bottom surface. The cavity is manufactured based on MEMS (micro-electro-mechanical system) technology. The silicon groove is formed through anisotropic etching of the (100) monocrystalline wafer. The groove type cavity is manufactured through silicon-glass anode bonding. The side walls of the cavity are {111} crystal planes of the silicon wafer. The cavity and the system have the following beneficial effects: by utilizing the cavity, the distance between two reflectors in the cavity is easy to enlarge through atomic cavity dimension design, thus increasing the length of the interaction space between laser and atomic gas, enhancing the signal to noise ratio of the CPT (coherent population trapping) signal and being beneficial to improvement of the frequency stability of the micro CPT atomic clock.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Formaldehyde air-sensitive material and its preparation method and preparation method for formaldehyde air-sensitive device

InactiveCN101144789AWith quantum effectSelf-catalytic activityMaterial resistanceGas detectorPolyethylene glycol
The invention relates to a formaldehyde gas sensitive material, the preparation method thereof and a manufacture method of a formaldehyde gas sensitive component. The component of the formaldehyde gas sensitive material takes an SnO2-TiO2 binary nanometer composite material as a substrate, the mol ratio of the Ti / Sn is 0.2 to 0.5, the fractional ratio of the quality adulterated is 2 percent to 5 percent Cd2, the formaldehyde gas sensitive material is adjusted to be pasty after being ground with an appropriate amount absolute ethyl alcohol and 0.2 to 1 portion polyethylene glycol, and is painted on the surface of an electrode pipe evenly, and a formaldehyde gas sensitive electrode pipe is produced through 400 degree annealing processing for two to four hours; finally a formaldehyde gas sensitive component is made through the welding, the electrical ageing and the sealing to the gas sensitive electrode pipe according to the heater type structure traditional process. The gas sensitive sensor made through the invention has low operating temperature, has high sensitivity to the formaldehyde gas, has good antiinterference performance to other indoor pollutant gases, such as benzene, toluene, xylene and ammonia, etc, the response time and the recovery time are short, and the gas sensitive sensor is used for the detection to the indoor decorating formaldehyde gas pollution.
Owner:WUHAN INSTITUTE OF TECHNOLOGY
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