Printed circuit board embedded runner liquid cooling heat exchange device

Abstract

The invention discloses a printed circuit board embedded runner liquid cooling heat exchange device. The heat exchange device comprises a top PCB layer, a middle PCB layer and a bottom PCB layer, wherein a runner is laid on the middle PCB layer, and an embedded runner is formed after the runner is sealed by the top PCB layer and the bottom PCB layer. An inlet and an outlet of the runner are formed in the top PCB layer or the bottom PCB layer simultaneously, or positioned in the top PCB layer and the bottom PCB layer respectively. A plurality of metal conduction holes are formed in the top PCB layer or the bottom PCB layer provided with a heating device, the metal conduction holes are positioned under the installation position of the heating device and filled with a conductive material, and the conductive material is a good conductor of heat simultaneously. The printed circuit board embedded runner liquid cooling heat exchange device disclosed by the invention is capable of effectively solving the problem of heat dissipation of a high-power device in a printed circuit board, and is smaller in volume and higher in integration and reliability.

Description

technical field [0001] The present invention relates to the technical field of thermal management of electronic circuits based on printed circuit boards (PCB for short), in particular to a channel liquid cooling heat exchange device embedded in printed circuit boards. Background technique [0002] Relying on mature and advanced integrated circuit technology, the integration of high-power electronic components is getting higher and higher, and the size is getting smaller and smaller. However, the improvement of device integration prevents the heat generated inside from being dissipated in time, which leads to a sharp rise in the local temperature of the chip, and a sharp decline in the working performance and service life of the device. For example, if most GaAs and GaN monolithic integrated power amplifiers generate heat under continuous wave operation, the heat flux will reach hundreds of watts per square centimeter. A higher device operating temperature will reduce the ...

AI Technical Summary

Problems solved by technology

[0004] It can be seen from the above existing micro-channel heat dissipation technologies that the focus of technical research has gradually shifted from discrete micro-channel liquid cooling technology to integrated micro-channel technology with embedded circuit boards or chips, thereby solving the problem of discrete micro-channel cooling. Liquid-cooled radiators have disadvantages such as poor reliability, large thermal resistance, low cooling efficiency, and difficulty in mounting with heat-generating chips or circuit boards.

The existing embedded integrated microchannel technology mainly focuses on silicon-based integrated circuits

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