5835results about "Printed circuit aspects" patented technology

The invention discloses a PDU module and a charging device, and relates to the technical field of power distribution, the PDU module comprises a control board, PCBs, a first control group and a first conductive assembly, the PCBs are connected to the control board at intervals, the first control group comprises a plurality of first relays forming an n * n triangular matrix, and the first relays are fixed on the PCBs. The first conductive assembly respectively realizes electrical communication and cross bridging of relays in the same row and in the same column through the first conductive member, the second conductive member and the bridging busbar. According to the scheme, through the triangular matrix layout, the total number of relays is remarkably reduced on the premise that the same control function as a traditional full matrix is achieved; and meanwhile, the relays are integrated on the PCB and are uniformly controlled by the control panel, so that a large number of connectors and wire harnesses are omitted, the module volume, the material cost and the assembly cost are effectively reduced, and a flexible power distribution function is realized.

A riser card includes a circuit board and first, second, and third connectors. The first and second connectors are positioned at bottom and top edges of the circuit board, respectively. The third connector is mounted to a face of the circuit board. Such riser card may be mounted on a primary system board such that the first connector is detachably connected to a first complementary connector of the primary system board with the circuit board perpendicular to the primary system board, and the first connector receives power, data, and sideband signals from the first complementary connector. The second and third connectors may mate with second and third complementary connectors of an expansion card oriented parallel to the circuit board and a stackable secondary riser card oriented perpendicular to the circuit board, respectively. The riser card communicates power and sideband signals to the stackable secondary riser card via the third connector.

A biosensor cartridge can include a circuit board having a connection terminal configured to be electrically connected to an external diagnostic device, a biosensor chip configured to detect a target material from an analysis specimen, and transmit an electrical signal to the connection terminal of the circuit board based on the target material being present in the analysis specimen, the biosensor chip including a reactant configured to react specifically with the target material, and a housing enclosing the circuit board and the biosensor chip, and the connecting terminal being exposed outside of the housing. Also, the biosensor chip includes a plurality of channel areas separated from each other, and the reactant is attached to the plurality of channel areas.

A method for a system includes receiving with a first transceiver of an identity reader device, an ephemeral ID from a first smart device, outputting with the first transceiver, identity reader data to the first smart device, wherein the identity reader data comprises a first identifier and a challenge, receiving with the first transceiver, responsive data from the first smart device, wherein the responsive data comprises token data and contact tracing status of the first smart device, determining in a processor of the identity reader device, whether the first smart device is authorized in response to the ephemeral ID or the token data, and the contact tracing status, and directing with the processor, a peripheral device coupled to the identity reader device to perform a user-perceptible action in response to the processor determining that the first smart device is authorized.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.

A controller includes a circuit board, and a module assembly arranged at the circuit board. The module assembly includes a first power module, a second power module, and a third power module. The circuit board includes a first current circuit connected to the first power module, a second current circuit connected to the second power module, and a third current circuit connected to the third power module. The first current circuit and the second current circuit share one or more circuit components.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

A wiring module is directed to a wiring module configured to be attached to a plurality of power storage elements having electrode terminals. The wiring module includes: a plurality of busbar units: and wires connected to the busbar units. Each of the busbar units includes: a busbar connected to the electrode terminals; a circuit board; and a fixing means configured to fix the circuit board to the busbar. A conductive path is routed on the circuit board, and the conductive path includes: a connection land electrically connected to the busbar; and a wire land soldered to the corresponding wire. The busbar includes a crimping part that fixes the wire, and the wire is interposed between the crimping part and the circuit board.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

The connector includes a conductive plug contact, a bottom insulator, and a conductive inner contact, the inner contact including a retaining portion retained in a recessed portion of the plug contact, an elastically deformable flat plate portion facing a bottom surface of a flange of the plug contact, a plurality of top surface-side projections projecting toward the bottom surface of the flange from a top surface of the flat plate portion, and a plurality of bottom surface-side projections projecting toward a support surface of the bottom insulator from a bottom surface of the flat plate portion separately at positions different from positions of the top surface-side projections, part of a sheet type connection object having a conductor exposed on at least one surface thereof being sandwiched between the bottom surface of the flange of the plug contact and the top surface-side projections of the inner contact.

A cable connector includes a body, a number of conductive terminals, a cable, a first shielding sheet and a second shielding sheet. The conductive terminals include a first signal terminal, a second signal terminal, a first ground terminal and a second ground terminal. The first shielding sheet includes a first contact portion, a second contact portion and a first protrusion. The second shielding sheet includes a third contact portion, a fourth contact portion and a second protrusion. The first contact portion, the first ground terminal, the third contact portion, the first protrusion, the second protrusion, the second contact portion, the second ground terminal and the fourth contact portion are jointly enclosed to form a shielding cavity. The first signal terminal and the second signal terminal are located in the shielding cavity.

An information handling system may include an information handling resource comprising a circuit board and an insert assembly mechanically coupled to the information handling resource and comprising a base mechanically attached via a press-fit mechanical coupling to an edge of the circuit board and a body mechanically coupled to the base.

A connection system comprises a printed circuit board. The printed circuit board comprises a top face and a bottom face. The printed circuit board also comprises a first edge that is normal to the top face and bottom face. The printed circuit board also comprises a second edge that is normal to the top face and bottom face. The first edge face and second edge face intersect at an angle that is not a straight angle. The connection system also comprises a coplanar card-edge socket on the printed circuit board. The socket comprises a top section that interfaces with the top face of the printed circuit board along the first and second edge faces of the printed circuit board. The socked also comprises a bottom section that interfaces with the bottom face of the printed circuit board along the first and second edge faces of the printed circuit board.

Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and / or a pitch distance ranging from 1 to 100 micrometers (μm).

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The embodiment of the invention provides a flexible circuit board assembly, a rotating shaft assembly and foldable electronic equipment, and belongs to the technical field of electronic equipment, a flexible circuit board is arranged on a rotating shaft in a penetrating mode through a through hole in the rotating shaft, a first adsorption part is connected with a second adsorption part in the through hole in an adsorption mode, and a clamping part is matched with the rotating shaft in a clamping mode. High limiting fastness of the flexible circuit board is achieved, the problem that the flexible circuit board falls off in scenes such as falling is solved, and the risk of breakage of the rotating shaft is reduced. The first adsorption part and the second adsorption part are located on the same side of the flexible circuit board, so that the thickness space occupied by the adsorption parts in the rotating shaft is reduced, the strength of the rotating shaft is improved, and the breakage risk of the rotating shaft in scenes such as falling is reduced under the condition of high adsorption effect. Moreover, the clamping part is detachably connected with the rotating shaft in a clamping manner, and the first adsorption part and the second adsorption part can be separated under the action of external force, so that the flexible circuit can be conveniently detached from the rotating shaft, and the detachment in the scenes of repair and the like is facilitated.

A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

The invention provides a rigid-flex board 3D steel sheet reinforced press-fit structure. The rigid-flex board 3D steel sheet reinforced press-fit structure comprises a first press-fit auxiliary material, a second press-fit auxiliary material, a lower alignment jig, a laminated structure, an upper alignment jig, a second press-fit auxiliary material and a first press-fit auxiliary material which are sequentially arranged from bottom to top. The laminated structure comprises a windowed lower press-fit auxiliary material, a rigid-flex board and a windowed upper press-fit auxiliary material, and the 3D steel sheet comprises a substrate and a lug boss arranged on the substrate; the position, corresponding to the protruding part, of the rigid-flex board is windowed, the substrate is arranged on the lower side of the lower press-fit auxiliary material, and the protruding part penetrates through the windowed lower press-fit auxiliary material, the rigid-flex board and the windowed upper press-fit auxiliary material; and the lower alignment jig and the upper alignment jig are provided with mutually matched grooves corresponding to the bulge positions of the laminated structure. Through pretreatment of the rigid-flex board and the steel sheet, the surface activity is enhanced, the cohesiveness is improved, and the bonding strength of the 3D steel sheet and the rigid-flex board is remarkably improved in cooperation with a gradient pressing process.

A retention mechanism is provided to couple a compression attached memory module (CAMM) to a printed circuit board (PCB). The retention mechanism includes a retention bracket and a retention spring. The retention bracket is soldered by a solder flange to the PCB and retains a CAMM connector within the retention bracket. The retention spring retains the CAMM and compresses the CAMM onto the CAMM connector and the PCB.

A system includes a plurality of power modules connected in parallel and a variable current load controller coupled to the plurality of power modules. The input terminals of the plurality of power modules are configured to be coupled to an output of a fuel cell stack, and the output terminals of the plurality of power modules are configured to supply power to a forklift. The plurality of power modules is further configured to provide electrical isolation between the fuel cell stack and the forklift. The variable current load controller is configured to regulate power distribution among the plurality of power modules.

An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and / or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.