819results about "Printed circuit aspects" patented technology

The present invention relates to a printed circuit board comprising an inlay to enable simplified, robust, and cost-effective mounting of a printed circuit board (PCB) on a substrate, in particular a heat sink. Furthermore, a lighting module, in particular an interchangeable lighting module, for a motor vehicle is provided, which comprises such a printed circuit board mounted on a substrate.

Method for creating an electrode on a substrate using a laser assisted deposition process. A metal paste is printed and dried on the substrate to form a conductive layer, and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Power modules with enhanced thermal conductivity are disclosed herein. In certain embodiments, a power module includes a circuit board, an inductor component attached to a first or top side of the circuit board, and a semiconductor die attached to a second or bottom side of the circuit board opposite the first side. The power module further includes a thermally conductive wrap at least partially around a dielectric body of the inductor component. The thermally conductive wrap serves to transfer heat from the semiconductor die to a cold plate or heat sink that can be attached to the inductor component opposite the circuit board.

The present invention relates to a printed circuit board comprising an inlay to enable simplified, robust, and cost-effective mounting of a printed circuit board (PCB) on a substrate, in particular a heat sink. Furthermore, a lighting module, in particular an interchangeable lighting module, for a motor vehicle is provided, which comprises such a printed circuit board mounted on a substrate.

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

A photosensitive resin film containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and (B) an inorganic filler, in which the amount of the inorganic filler (B) contained is 25% by volume or more, and in which the cured product of the photosensitive resin film has a refractive index of 1.550 or more, and a printed wiring board and a semiconductor package each using the photosensitive resin film.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

The application relates to the technical field of display, and discloses a circuit board structure, a display panel, a display device and a preparation method. The circuit board structure comprises a circuit board body, a first connecting part, a second connecting part, a connecting circuit board, a plurality of first wires and a plurality of second wires. The circuit board body is provided with a containing hole. The first connecting part is arranged on the circuit board body and located on one side of the containing hole. The plurality of first wires are arranged on the circuit board body and located on the same side of the containing hole as the first connecting part, and are connected with the first connecting part. The second connecting part is arranged on the circuit board body and located on the side of the containing hole away from the first connecting part. The plurality of second wires are arranged on the circuit board body and located on the same side of the containing hole as the second connecting part, and are connected with the second connecting part. The connecting circuit board is provided with a plurality of connecting wires, and the connecting wires are connected with the first connecting part and the second connecting part. The circuit board structure enables the wires located on both sides of the hole to be connected.

The present application provides an electric working machine, and a method of assembling a drive unit for driving a motor of the electric working machine, one aspect of which relates to an electric working machine provided with a motor, a circuit substrate, a first semiconductor switch, a second semiconductor switch, a first conductive line, a second conductive line, and a solid metal member. The circuit substrate has a first circuit surface, a second circuit surface, and a through hole. The first semiconductor switch is mounted on the first circuit surface and has a first terminal. The second semiconductor switch is mounted on the second circuit surface and has a second terminal. The first conductive line is disposed on the first circuit surface and electrically connected to the first terminal. The second conductive line is disposed on the second circuit surface and electrically connected to the second terminal. The solid metal member is inserted into the through hole and electrically connected to the first conductive line and the second conductive line.

An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

A circuit board according to an embodiment of the disclosure can include a substrate layer on a first portion of the circuit board and a second portion of the circuit board different from the first portion, a power line on the first portion of the circuit board, a signal line on the second portion of the circuit board, a shield layer spaced apart from the power line and the signal line, and a cover layer between the substrate layer and the shield layer, wherein the cover layer includes a cover substrate layer on the first portion and the second portion of the circuit board, a conductive layer on the first portion of the circuit board corresponding to the power line and between the cover substrate layer and the shield layer, and an insulating layer on the second portion of the circuit board corresponding to the signal line and disposed between the cover substrate layer and the shield layer.

To provide a sheet-like conductive member which can increase the reliability of an electric connection to the contact of a connector and a wiring part of an equipment target object in spite of having a flexible conductor formed by conductive strings.SOLUTION: The sheet-like conductive member has a flexible conductor 20 formed by conductive strings embroidered or embedded in a sheet body. The flexible conductor 20 includes: a first end part 20A electrically connected to a wiring part of a cloth; a second end part 20B electrically connected to a contact; and a connection part 20C for connecting the first end part 20A and the second end part 20B to each other. The exposed area of the conductive strings in the unit area of the first end part 20A and the second end part 20B is larger than the exposed area of the conductive strings in the unit area of the connection part.SELECTED DRAWING: Figure 12

The present disclosure relates to a printed circuit board including: a glass layer having an upper surface and a lower surface, and a side surface connecting the upper surface and the lower surface; a through-hole penetrating between the upper surface and the lower surface of the glass layer; and a metal via filling at least a portion of the through-hole, where at least one of the upper surface and the lower surface of the glass layer, and at least one of the upper surface and the lower surface of the metal via respectively have a surface roughness greater than a surface roughness of a side surface of the glass layer.

The present invention relates to a power electronic system (2) comprising: at least one electronic device; a printed circuit board (4) on which a plurality of electrical components are mounted; and positive and negative polarity connection components (6) configured to electrically connect the electronic device to an energy storage device, each polarity connection component (6) being formed by a first polarity branch (8, 12) and a second polarity branch (10, 14) that are different from each other and electrically connected to each other, the first positive polarity branch (8) and the first negative polarity branch (12) being electrically connected to the second positive polarity branch (10) and the second negative polarity branch (14) respectively via the printed circuit board (4).

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

The present invention relates to a housing (1) for an electronic circuit, the housing having a housing bottom (2), a housing top (3), and a printed circuit board (4) arranged in the housing (1) for receiving the electronic circuit. The housing bottom (2) is designed in a basin shape and has at least two support elements (6) for the printed circuit board (4) on at least two opposing inner walls (5). Furthermore, at least one position-fixing molded portion (7) is provided on each of the at least two opposing inner walls (5) for engaging with a corresponding fixing slot (8) in the printed circuit board (4) for position fixing. A first portion (10) of a locking device is provided on each of the at least two opposite outer walls (9) for connection with the housing top (3). The printed circuit board (4) is designed in a rectangular shape and has fixing slots (8) on at least two opposite sides for receiving the position of the housing bottom (2). The molded part is formed, and the printed circuit board (4) has slots (13) at its four corners (15), the slots extending parallel to the inner wall (5) of the bottom of the housing (2), on which support elements (6) are mounted, wherein the length of the slot (13) is greater than the distance between the slot (13) and the adjacent edge (14) of the printed circuit board, so that an elongated, elastic tab (16) is formed at each corner (15) of the printed circuit board (4), wherein the top of the housing (3) is designed to be basin-shaped and has pin-shaped portions (19) extending from the plane of the top edge (18) of the housing at its four corners, the pin-shaped portions being designed to press the tabs (16) formed on the printed circuit board (4) from the plane of the printed circuit board into the bottom of the housing (2) in the assembled state of the housing (1), and has a second part (11) of a locking device on at least two opposite outer walls (9) for connection with the bottom of the housing (2).

A wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.

The invention relates to a printed circuit board connection (1) comprising two flexible printed circuit boards (2, 3), the conductor tracks (21, 31) of which are connected by an anisotropically conductive adhesive layer (10). It is proposed to provide a clamping device (5) which is configured to clamp the conductor tracks (2, 3) in a region of overlap (100) and thereby increase the stability of the electrical connection.

A method for fabricating vias in a multilayer dielectric PCB stack (50) comprising alternating plurality of first dielectric layers (52) and second dielectric layers (54), the first dielectric layers (52) comprising a first dielectric material having a first glass transition temperature (Tg), and the second dielectric layers (54) comprising a second dielectric material having a second glass transition temperature (Tg) higher than the first glass transition temperature (Tg), wherein a plurality of vias (64) are formed (202, 204) into the plurality of first dielectric layers (52) and second dielectric layers (54), the method comprising: at least partially dissolving (206) the first dielectric layers (52) between the vias (64); filling (208, 210) the vias (64) and the spaces formed between the second dielectric layers (54) due to the voids left by the at least partial dissolution of the first dielectric layers (52) with metal (68, 70), thereby obtaining a metal network (72) interconnecting the vias (64) with each other.

The copper base substrate of the present invention is a copper base substrate in which a copper substrate, an insulating layer, and a circuit layer are sequentially stacked, the ratio of the thickness (unit: μm) of the insulating layer to the elastic modulus (unit: GPa) of the insulating layer at 100°C is 50 or more, and the elastic modulus of the circuit layer at 100°C is 100 GPa or less.

A system and process for manufacturing a flexible circuit board by laser cutting are provided. The process includes the steps of: S1, loading and adding protective layers, introducing a copper foil base layer, and laminating the protective layers to upper and lower surfaces of the copper foil base layer, respectively, S2, performing laser cutting on a semi-finished product treated in S1 to form a circuit structure; S3, removing scraps from the semi-finished product treated in S2, performing activated cleaning on the surfaces of the copper foil, and performing pseudo-lamination hot-pressing for; S4, performing combinational hot-pressing on the semi-finished product treated in S3; S5, performing a windowing operation on the semi-finished product treated in S4; and S6, detecting and coding the semi-finished product treated in S5.

The application relates to the technical field of automobile parts, and provides a double-sided chip-embedded circuit board and a manufacturing method thereof. The double-sided chip-embedded circuit board comprises a prefabricated circuit board, the upper and lower surfaces of which are conductive layers; a chip packaging unit embedded in the prefabricated circuit board; an upper conductive film layer attached to the upper surface of the prefabricated circuit board through an upper dielectric layer and covering the chip packaging unit, and the electrodes of the chip packaging unit are led out to the surface of the upper conductive film layer; and a lower conductive film layer attached to the lower surface of the prefabricated circuit board through a lower dielectric layer and exposing the back surface of the chip packaging unit, and the back surface of the chip packaging unit is provided with heat dissipation fins. In the application, the upper and lower surfaces of the prefabricated circuit board are respectively attached with conductive film layers, the upper conductive film layer is used for leading out the electrodes of the chip packaging unit, and the lower conductive film layer can be used for arranging other functional modules of the circuit board, so that the double-sided chip-embedded circuit board has reasonable electrical performance layout and better stability.

A cluster (100) is configured to be inserted and subsequently embedded into a recess (116) provided in a component carrier (104), the cluster comprising at least one component (102), and an uncured solid resin portion (106) encapsulating said component (102), said uncured solid resin portion (106), or at least one said component (102) and said uncured solid resin portion (106) forming an outer surface of said cluster (100).

Power semiconductor device (11) comprising: a circuit body having a pair of conductor components (32, 33) and a power semiconductor element (35, 36) embedded between the pair of conductor components (32, 33); a substrate (25) in which a through-hole (27) is formed; and a sealing material (13) sealing at least a section of both the circuit body and the substrate (25), wherein the circuit body is inserted into the through-hole (27) and has a first exposed surface (51) and a second exposed surface (52) that are exposed by the sealing material (13), and the substrate (25) in the through-hole (27) has a first projection (28) and a second projection (29) that project towards a center of the through-hole (27) and are connected to the circuit body.wherein the first projection (28) and the second projection (29) are formed at opposite positions in the through-hole (27) and the first projection (28) and / or the second projection (29) are terminals that transfer energy to the power semiconductor element (35, 36), and wherein the power semiconductor device (11) is characterized in that an AC wiring (64) which is installed in the substrate (25) and the second projection (29) are arranged such that they are opposite each other in the substrate (25).

A method for producing a photosensitive element includes a step of forming a photosensitive layer on a support film by using a photosensitive resin composition, in which in a case where a surface of the support film opposite to a surface of the support film on which the photosensitive layer is formed is defined as a first surface, and the surface of the support film on which the photosensitive layer is formed is defined as a second surface, a surface roughness Sq1 of the first surface is 4.0 nm or less, and a total value of the surface roughness Sq1 of the first surface and a surface roughness Sq2 of the second surface, Sq1 + Sq2, is 9.0 nm or more.

The wiring circuit board (1) includes a metal support layer (11), a first insulating layer (12), and wirings (133A, 133B). The wiring (133A) has a first outer edge (E21) and a first inner edge (E22). The wiring (133B) has a second outer edge (E31) and a second inner edge (E32). At least one of the first outer edge (E21) and the second outer edge (E31) does not overlap with the metal support layer (11) in the thickness direction. The first inner edge (E22) and the second inner edge (E32) overlap with the metal support layer (11) in the thickness direction.

Disclosed is a method for forming a conductive line having a controlled coefficient of thermal expansion (CTE). The method includes the step of coating a suspension onto the surface of a substrate. The suspension comprises a solvent and a solid component, the solid component comprising a mixture of at least two types of conductive nanoparticles. The method further includes the steps of sintering the suspension to form a conductive line and removing the unsintered portion of the suspension. The at least two types of conductive nanoparticles include a first type of conductive nanoparticle having a positive CTE and a second type of conductive nanoparticle having a different CTE from the first type of conductive nanoparticle. The ratio of the at least two types of conductive nanoparticles determines the final CTE of the conductive line.

To provide a circuit board that makes it difficult for electronic components to detach from the circuit board. [Solution] The circuit board is a circuit board having at least one pair of second terminals, wherein a bonding material is placed on the second terminals, and the second terminals and the bonding material are placed in a recess formed in a resin layer, surrounded by the resin layer, and when the sum of the thicknesses of the second terminals and the bonding material is dimension h2, dimension h2 is 1 μm or more and 10 μm or less, and when the width of the recess in the resin layer is dimension d2, dimension d2 is 2 μm or more and 30 μm or less, metal wiring made of a sintered body of metal particles is removed from the second terminals, and the inner surface of the recess has a tapered shape.

The application relates to the technical field of automobile parts, and provides a bias type chip embedded circuit board and a manufacturing method thereof. The bias type chip embedded circuit board comprises a core plate, a chip packaging unit embedded in the core plate, the chip packaging unit comprising a conductive substrate and a chip unit embedded in the conductive substrate, wherein the chip unit is offset on one side of the conductive substrate, and the other side of the conductive substrate is reserved for an electrode leading-out area of the chip unit; a prepreg and a conductive layer are stacked on the core plate; and a leading-out wire is led out from the front face of the chip packaging unit and arranged in the prepreg and the conductive layer. In the application, the chip unit is offset on one side of the conductive substrate, and the other side of the conductive substrate is reserved for the electrode leading-out area of the chip unit, so that the leading-out wire of each electrode of the chip unit can be led out from the front face of the chip packaging unit when the bias type chip embedded circuit board is formed, and wiring is facilitated.