11911results about "Printed circuit aspects" patented technology

Disclosed herein are bonded structures and methods of forming the bonded structures. In some embodiments, the bonded structures include a first element having an inorganic dielectric surface, a second element having an organic dielectric surface, an interface layer between the first and second elements and bonded to the inorganic and organic dielectric surfaces. The method of forming the bonded structure includes providing the first and second elements, exposing the inorganic dielectric surface to a silane coupling agent to form the interface layer, contacting the organic dielectric surface to the interface layer, and heating the first element, second element, and interface layer to bond the first element to the second element.

A vehicle according to an embodiment comprises: a roof structure, formed as the exterior of the vehicle, comprising a first fixing part and a second fixing part; and an antenna assembly mounted on the roof structure. The antenna assembly comprises: a first cover provided with first and second groove portions on the outer surface, and a plurality of coupling portions on the inner surface, the first groove portion coupling with the first fixing part of the roof structure, and the second groove portion coupling with the second fixing part of the roof structure; and a second cover coupling with the first cover. The second cover is made of metallic material and comprises four side portions.

Active and passive electronic components are placed on a substrate and encapsulated with mold material to produce a molded core substrate for fabricating a hybrid integrated circuit (IC) device. A carrier has a release film laminated to a face thereof. A seed layer of copper is added over the release film and fiducials are plated onto the copper seed layer for component placement using alignment marks on the fiducials. Mold material is applied to the encapsulation layer and around and over the components. Mold material is ground planar with component tops. The carrier and release film are removed, leaving the copper seed layer exposed, which is etched to a pattern. Holes are formed in the mold material and then surfaces thereof are copper plated. A multilayer dielectric film is laminated over copper plating. Vias are formed in the multilayer dielectric film for connections to components.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure / s within urban settings, each configured to operate by a processor / controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data / instruction / s processing the inputs with resident code parameters generating outputs that are configured to mitigate / avert intermittent environmental events harmful / hazardous to humans. The IDS's include a launch and charging pad that hosts a UAV, which patrols an area within communication range of at least one of the IDSs so the UAV, perhaps with AI-engine assistance, can detect events in the area patrolled by the UAV.

Tamper-detect assemblies and methods of fabrication are provided. A tamper-detect assembly includes a laminate carrier with embedded tamper-detect circuitry within the laminate carrier, and one or more electronic components on the laminate carrier. Further, the tamper-detect assembly includes a heat sink cover. The heat sink cover includes a heat sink and tamper-detect circuitry integrated within the heat sink cover. The heat sink cover is mounted to the laminate carrier and encloses the one or more electronic components between the laminate carrier and the heat sink cover. Together, the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components.

The present disclosure relates to a ceramic substrate unit and a manufacturing method therefor, which can suppress warpage due to a difference between the volumes of upper and lower metal layers in a ceramic substrate by calculating the volume of the upper metal layer and forming a plurality of grooves in the lower metal layer to have a predetermined volume corresponding to the volume of an upper electrode.

The invention discloses a PDU module and a charging device, and relates to the technical field of power distribution, the PDU module comprises a control board, PCBs, a first control group and a first conductive assembly, the PCBs are connected to the control board at intervals, the first control group comprises a plurality of first relays forming an n * n triangular matrix, and the first relays are fixed on the PCBs. The first conductive assembly respectively realizes electrical communication and cross bridging of relays in the same row and in the same column through the first conductive member, the second conductive member and the bridging busbar. According to the scheme, through the triangular matrix layout, the total number of relays is remarkably reduced on the premise that the same control function as a traditional full matrix is achieved; and meanwhile, the relays are integrated on the PCB and are uniformly controlled by the control panel, so that a large number of connectors and wire harnesses are omitted, the module volume, the material cost and the assembly cost are effectively reduced, and a flexible power distribution function is realized.

An electronic device having a central area and a peripheral area surrounding the central area is provided. The electronic device includes a substrate, a through hole, a buffer layer, a first circuit structure, an electronic component and a first pad. The substrate has a first surface and a second surface opposite to the first surface. The through hole penetrates through the substrate and has a first through hole and a second through hole. The buffer layer covers the first surface, the second surface, an inner wall of the first through hole and an inner wall of the second through hole. The first circuit structure is disposed on the first surface. The first through hole corresponds to the central area, the second through hole corresponds to the peripheral area, and a width of the second through hole is greater than a width of the first through hole.

Methods and inspection robots with on body configuration are described. An example inspection robot may have a center body with a plurality of connected drive modules, each drive module having a sensing circuit to measure a drive module operating characteristic, and a visual indicator circuit to output a first visual indicator corresponding to the drive module operating characteristic. The visual indicator circuits of each of the plurality of drive modules are positioned to be simultaneously visible at a point of view.

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

A circuit board structure includes a core, a wiring layer and a buried passive component. The wiring layer and the buried passive component are disposed on the core, and the buried passive component is electrically connected to the wiring layer. The buried passive component includes a first spiral metal layer, a second spiral metal layer and a dielectric interlayer. The first spiral metal layer is intertwined with the second spiral metal layer. The dielectric interlayer is disposed between the first spiral metal layer and the second spiral metal layer. The first spiral metal layer and the second spiral metal layer are spaced apart by the dielectric interlayer at least in the core.

A method for electrically connecting a first electronic component of a battery system with a second electronic component of the battery system is provided. The first electronic component includes a flexible printed circuit (FPC) including: a pin formed by folding a connection portion of the FPC; and a conductive strip on an outer surface of the folded connection portion. The second electronic component includes a printed circuit board (PCB) having a through-hole configured to receive the pin of the FPC and includes an electrically conductive plating adjacent to the through-hole. The method includes: attaching the FPC to a first side of the PCB such that the pin of the FPC is received in the through-hole in the PCB; and soldering the pin of the FPC to the conductive plating on the PCB to electrically interconnect the FPC and the PCB.

An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.

A memory module has pads on the top and bottom surfaces of a module printed circuit board (PCB). The pads match the pin layout of one or more memory devices to be mounted on the memory module. The pads on one surface of the PCB electrically interconnect to the memory device(s), and the pads on the other surface electrically interconnect to pads on a system board, such as a motherboard. With the pad layout on the memory module, the pad layout of the system board can be the same for a memory-down implementation and for a removable memory module. The pad layout provides good signal-to-noise performance and can enable a memory module for low power double data rate (LPDDR) memory, double data rate (DDR) memory, and graphics double data rate (GDDR) memory.

Millimeter wave (mmWave) technologies, devices, and methods related to transceivers, receivers, and antenna structures for wireless communications are described. Various aspects include collocated millimeter wave (mmWave) antennas and near field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication systems with MIMO support and phase noise synchronization on a single coaxial cable, passing RF signals over cable (RFoC) in distributed phased array communication systems, clock noise leakage reduction, IF to RF auxiliary chips for backward and forward compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architectures, and the like.

A riser card includes a circuit board and first, second, and third connectors. The first and second connectors are positioned at bottom and top edges of the circuit board, respectively. The third connector is mounted to a face of the circuit board. Such riser card may be mounted on a primary system board such that the first connector is detachably connected to a first complementary connector of the primary system board with the circuit board perpendicular to the primary system board, and the first connector receives power, data, and sideband signals from the first complementary connector. The second and third connectors may mate with second and third complementary connectors of an expansion card oriented parallel to the circuit board and a stackable secondary riser card oriented perpendicular to the circuit board, respectively. The riser card communicates power and sideband signals to the stackable secondary riser card via the third connector.

A method for a system includes receiving with a first transceiver of a first smart device, an advertisement signal from a stationary beacon, outputting with the first transceiver of the first smart device, a first ephemeral ID that is not permanently associated with the first smart device, to the stationary beacon, receiving with the first transceiver of the first smart device, a beacon identifier from a stationary beacon, outputting with a second transceiver of the first smart device, the first ephemeral ID, a first user identifier and the beacon identifier to an authentication service, storing in an association log in the authentication service, the first ephemeral ID, the first user identifier and the beacon identifier, and storing in a beacon log in the authentication service, a log of the stationary beacon including the first ephemeral ID.

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

Disclosed herein are a package substrate, a chip package, and method for fabricating the same. The package substrate includes a package core comprising vias; a plurality of build-up layers disposed on an upper surface of the package core, the plurality of build-up layers comprising metal traces connected with the vias; and a magnetic core inductor disposed in a cavity of the package core. The magnetic core inductor includes a magnetic inlay, and a first metal layer disposed in the cavity on the magnetic inlay below the plurality of build-up layers. A second metal layer may be further disposed between the first metal layer and the metal traces. Both the first and second metal layers may be floating or grounded. The first and second metal layers are configured to shield other electronic components from being interfered by the magnetic field generated by the magnetic core inductor.

Inspection robots and methods for inspection of curved surfaces with sensors at selected horizontal distances are described. An example of such an inspection robot includes a housing; a drive module with a wheel and a motor operatively linked to the housing, a plurality of sensor sleds, and a payload. The payload, which is coupled to the housing, may include a first and a second rail component, each with at least one connector, where the rail components are connectable at a first selected position of a plurality of discrete engagement positions. Each of the rail components may be structured to support at least one of the plurality of sleds where each of the plurality of sleds is coupled to the payload at a respective selected horizontal position such that the plurality of sleds are at selected horizontal distances from each other.

A circuit carrier includes a substrate, a first build-up circuit structure, a second build-up circuit structure, a fine redistribution structure and at least one conductive through hole. The substrate has a top surface and a bottom surface opposite to each other. The first build-up circuit structure is disposed on the top surface of the substrate and electrically connected to the substrate. The second build-up circuit structure is disposed on the bottom surface of the substrate and electrically connected to the substrate. The fine redistribution structure is directly attached on the first build-up circuit structure, wherein a line width and a line spacing of the fine redistribution structure are smaller than those of the first build-up circuit structure. The conductive through hole penetrates the fine redistribution structure and a portion of the first build-up circuit structure and is electrically connected to the fine redistribution structure and the first build-up circuit structure.

A display device includes a display panel, a flexible circuit board, and a driving chip. The display panel includes a display area and a non-display area bent to the back of the display area. The driving chip is bonded and connected to the display panel in the non-display area. The flexible circuit board includes a bonding area bonded to the non-display area, and a first flat area, a bending area, and a second flat area arranged in sequence in a direction away from the bonding area. The flexible circuit board is at the back of the display area. The second flat area is between the first flat area and the display area. A first electromagnetic shielding layer is provided on at least a portion of the surface, close to the display area, of the second flat area.

A printed circuit board (PCB) has a dielectric substrate of fiber-reinforced polymer with opposite sides. Each side has channels formed by molding or machining the dielectric substrate. Conductive wires are inserted into the channels to define conductive traces.

A biosensor cartridge can include a circuit board having a connection terminal configured to be electrically connected to an external diagnostic device, a biosensor chip configured to detect a target material from an analysis specimen, and transmit an electrical signal to the connection terminal of the circuit board based on the target material being present in the analysis specimen, the biosensor chip including a reactant configured to react specifically with the target material, and a housing enclosing the circuit board and the biosensor chip, and the connecting terminal being exposed outside of the housing. Also, the biosensor chip includes a plurality of channel areas separated from each other, and the reactant is attached to the plurality of channel areas.

An antenna apparatus includes a multi-layer printed circuit board, an antenna, and a floating patch group. The multi-layer printed circuit board includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer. The antenna is formed from at least one of the first metal layer, the second metal layer, and the third metal layer. The floating patch group is located in the multi-layer printed circuit board and includes a plurality of floating patches. The floating patch has a width. There is a gap between the floating patch and an adjacent floating patch. The floating patches have the same or similar width and the same or similar gap. The floating patch group is arranged in a metal layer where the antenna is located. There is a spacing between the floating patch group and the antenna.

A method of manufacturing an electronic device includes providing a substrate with a predetermined first-hole region, a first surface, and a second surface. The second surface is opposite the first surface. The method includes laser processing the predetermined first-hole region from the first surface to form a first laser track and laser processing the predetermined first-hole region from the first surface to form a second laser track. The first laser track does not overlap the second laser track. The method further includes etching the predetermined first-hole region to form a first-hole.

Systems, methods, and apparatus for temperature control and active cooling of an inspection robot are disclosed. An example apparatus may include a temperature determination circuit to interpret an inspection temperature value, a temperature management circuit to determine a temperature management command in response to the inspection temperature value, and a temperature response circuit to provide the temperature management command to a temperature management device associated with an inspection robot.

A method of forming a heat spreader on a printed circuit board (PCB) having a power dissipating component operably coupled to the heat spreader, comprising attaching a thermally and electrically conductive structure to a first side of the PCB to define a first PCB region including the component and a second PCB region not including the component. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating film is deposited on the first region, the second region, and the structure. A second protective layer is applied over the portion of the conductive plating film covering the second region, leaving the remaining portion of the conductive plating film exposed. An electrically conductive and thermally conductive layer is electroplated onto the exposed region of the conductive plating film to form a heat exchanger in the first region.