6488results about "Printed circuit aspects" patented technology

The invention discloses a PDU module and a charging device, and relates to the technical field of power distribution, the PDU module comprises a control board, PCBs, a first control group and a first conductive assembly, the PCBs are connected to the control board at intervals, the first control group comprises a plurality of first relays forming an n * n triangular matrix, and the first relays are fixed on the PCBs. The first conductive assembly respectively realizes electrical communication and cross bridging of relays in the same row and in the same column through the first conductive member, the second conductive member and the bridging busbar. According to the scheme, through the triangular matrix layout, the total number of relays is remarkably reduced on the premise that the same control function as a traditional full matrix is achieved; and meanwhile, the relays are integrated on the PCB and are uniformly controlled by the control panel, so that a large number of connectors and wire harnesses are omitted, the module volume, the material cost and the assembly cost are effectively reduced, and a flexible power distribution function is realized.

A riser card includes a circuit board and first, second, and third connectors. The first and second connectors are positioned at bottom and top edges of the circuit board, respectively. The third connector is mounted to a face of the circuit board. Such riser card may be mounted on a primary system board such that the first connector is detachably connected to a first complementary connector of the primary system board with the circuit board perpendicular to the primary system board, and the first connector receives power, data, and sideband signals from the first complementary connector. The second and third connectors may mate with second and third complementary connectors of an expansion card oriented parallel to the circuit board and a stackable secondary riser card oriented perpendicular to the circuit board, respectively. The riser card communicates power and sideband signals to the stackable secondary riser card via the third connector.

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

A biosensor cartridge can include a circuit board having a connection terminal configured to be electrically connected to an external diagnostic device, a biosensor chip configured to detect a target material from an analysis specimen, and transmit an electrical signal to the connection terminal of the circuit board based on the target material being present in the analysis specimen, the biosensor chip including a reactant configured to react specifically with the target material, and a housing enclosing the circuit board and the biosensor chip, and the connecting terminal being exposed outside of the housing. Also, the biosensor chip includes a plurality of channel areas separated from each other, and the reactant is attached to the plurality of channel areas.

A method for a system includes receiving with a first transceiver of an identity reader device, an ephemeral ID from a first smart device, outputting with the first transceiver, identity reader data to the first smart device, wherein the identity reader data comprises a first identifier and a challenge, receiving with the first transceiver, responsive data from the first smart device, wherein the responsive data comprises token data and contact tracing status of the first smart device, determining in a processor of the identity reader device, whether the first smart device is authorized in response to the ephemeral ID or the token data, and the contact tracing status, and directing with the processor, a peripheral device coupled to the identity reader device to perform a user-perceptible action in response to the processor determining that the first smart device is authorized.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

There is provided an electronic device that can increase the degree of freedom of the size and layout of a circuit board. The electronic device has a circuit board, a connector mounted on an upper surface of the circuit board, with a first end of a storage medium being connectable to the connector, and a spacer that is attachable to and detachable from a member different from the circuit board and that supports a second end of the storage medium. The member different from the circuit board has at least one positioning portion for positioning the spacer. An upper surface of the member having the at least one positioning portion is disposed lower than the circuit board and the upper surface of the circuit board.

The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.

A controller includes a circuit board, and a module assembly arranged at the circuit board. The module assembly includes a first power module, a second power module, and a third power module. The circuit board includes a first current circuit connected to the first power module, a second current circuit connected to the second power module, and a third current circuit connected to the third power module. The first current circuit and the second current circuit share one or more circuit components.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

A quasi-planar transformer can include a first winding comprising one or more turns of wire, a second winding comprising one or more turns of a conductive trace disposed on a printed circuit board, and a magnetic core positioned with respect to the first and second windings so as to provide a magnetic flux path coupling the first and second windings. The first winding can be a primary winding having a first half wound in a clockwise direction on a first side of the printed circuit board and a second half wound in a counterclockwise direction on a second side of the printed circuit board, wherein the first and second halves are formed of a single continuous wire. The single continuous wire can pass through an opening in the printed circuit board. The first and second halves of the primary winding can be secured to the printed circuit board.

The invention relates to the field of copper-clad plates, and discloses a high-performance flame-retardant low-dielectric-loss copper-clad plate and a preparation method thereof.The copper-clad plate comprises epoxy resin, benzoxazine resin, composite filler, carboxyl-terminated nitrile rubber, an active diluent, a curing agent and the like; the composite filler is prepared by compounding flame-retardant modifier grafted graphene oxide and epoxy silane modified silicon dioxide hollow spheres; according to the flame-retardant modifier, boric acid and pentaerythritol are used for preparing a double-terminal hydroxyl boron-containing intermediate, then dichlorodiphenyl silane and phenylphosphonic dichloride react with hydroxyl groups at the two ends of the intermediate to prepare a flame-retardant intermediate, and amino silane and vanillic aldehyde react with chlorine atoms at the two ends of the intermediate to prepare an aldehyde modified flame-retardant intermediate; the copper-clad plate prepared by the preparation method disclosed by the invention is low in dielectric constant and dielectric loss, high in heat conductivity coefficient and good in flexibility, and also has excellent heat resistance and flame retardance.

The present invention relates to an antenna device and an electronic device using same, the antenna device having twice as many antennas arranged in the same area so as to be reduced in size by half and be capable of performing high power long-distance transmission. The antenna device according to the present invention comprises: a core printed circuit board having antenna circuits arranged therein; a Yagi-Uda antenna formed on a plurality of printed circuit boards arranged above the core printed circuit board, so as to transmit a single polarization signal; a monopole antenna connected to the Yagi-Uda antenna through a via; and a ground radiation unit arranged below the core printed circuit board so as to be symmetrical to the monopole antenna with respect to the core printed circuit board.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

A wiring module is directed to a wiring module configured to be attached to a plurality of power storage elements having electrode terminals. The wiring module includes: a plurality of busbar units: and wires connected to the busbar units. Each of the busbar units includes: a busbar connected to the electrode terminals; a circuit board; and a fixing means configured to fix the circuit board to the busbar. A conductive path is routed on the circuit board, and the conductive path includes: a connection land electrically connected to the busbar; and a wire land soldered to the corresponding wire. The busbar includes a crimping part that fixes the wire, and the wire is interposed between the crimping part and the circuit board.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

The connector includes a conductive plug contact, a bottom insulator, and a conductive inner contact, the inner contact including a retaining portion retained in a recessed portion of the plug contact, an elastically deformable flat plate portion facing a bottom surface of a flange of the plug contact, a plurality of top surface-side projections projecting toward the bottom surface of the flange from a top surface of the flat plate portion, and a plurality of bottom surface-side projections projecting toward a support surface of the bottom insulator from a bottom surface of the flat plate portion separately at positions different from positions of the top surface-side projections, part of a sheet type connection object having a conductor exposed on at least one surface thereof being sandwiched between the bottom surface of the flange of the plug contact and the top surface-side projections of the inner contact.

A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, a circuit board, and conductive element. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board. The conductive element forms a longitudinal end portion not parallel to the outer surface of the circuit board, wherein the conductive element is electrically connected to the driving assembly and the conductive portion of the circuit board.

A cable connector includes a body, a number of conductive terminals, a cable, a first shielding sheet and a second shielding sheet. The conductive terminals include a first signal terminal, a second signal terminal, a first ground terminal and a second ground terminal. The first shielding sheet includes a first contact portion, a second contact portion and a first protrusion. The second shielding sheet includes a third contact portion, a fourth contact portion and a second protrusion. The first contact portion, the first ground terminal, the third contact portion, the first protrusion, the second protrusion, the second contact portion, the second ground terminal and the fourth contact portion are jointly enclosed to form a shielding cavity. The first signal terminal and the second signal terminal are located in the shielding cavity.

An information handling system may include an information handling resource comprising a circuit board and an insert assembly mechanically coupled to the information handling resource and comprising a base mechanically attached via a press-fit mechanical coupling to an edge of the circuit board and a body mechanically coupled to the base.

A connection system comprises a printed circuit board. The printed circuit board comprises a top face and a bottom face. The printed circuit board also comprises a first edge that is normal to the top face and bottom face. The printed circuit board also comprises a second edge that is normal to the top face and bottom face. The first edge face and second edge face intersect at an angle that is not a straight angle. The connection system also comprises a coplanar card-edge socket on the printed circuit board. The socket comprises a top section that interfaces with the top face of the printed circuit board along the first and second edge faces of the printed circuit board. The socked also comprises a bottom section that interfaces with the bottom face of the printed circuit board along the first and second edge faces of the printed circuit board.

Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and / or a pitch distance ranging from 1 to 100 micrometers (μm).

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The embodiment of the invention provides a flexible circuit board assembly, a rotating shaft assembly and foldable electronic equipment, and belongs to the technical field of electronic equipment, a flexible circuit board is arranged on a rotating shaft in a penetrating mode through a through hole in the rotating shaft, a first adsorption part is connected with a second adsorption part in the through hole in an adsorption mode, and a clamping part is matched with the rotating shaft in a clamping mode. High limiting fastness of the flexible circuit board is achieved, the problem that the flexible circuit board falls off in scenes such as falling is solved, and the risk of breakage of the rotating shaft is reduced. The first adsorption part and the second adsorption part are located on the same side of the flexible circuit board, so that the thickness space occupied by the adsorption parts in the rotating shaft is reduced, the strength of the rotating shaft is improved, and the breakage risk of the rotating shaft in scenes such as falling is reduced under the condition of high adsorption effect. Moreover, the clamping part is detachably connected with the rotating shaft in a clamping manner, and the first adsorption part and the second adsorption part can be separated under the action of external force, so that the flexible circuit can be conveniently detached from the rotating shaft, and the detachment in the scenes of repair and the like is facilitated.