9378results about "Printed circuit aspects" patented technology

Disclosed herein are bonded structures and methods of forming the bonded structures. In some embodiments, the bonded structures include a first element having an inorganic dielectric surface, a second element having an organic dielectric surface, an interface layer between the first and second elements and bonded to the inorganic and organic dielectric surfaces. The method of forming the bonded structure includes providing the first and second elements, exposing the inorganic dielectric surface to a silane coupling agent to form the interface layer, contacting the organic dielectric surface to the interface layer, and heating the first element, second element, and interface layer to bond the first element to the second element.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure / s within urban settings, each configured to operate by a processor / controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data / instruction / s processing the inputs with resident code parameters generating outputs that are configured to mitigate / avert intermittent environmental events harmful / hazardous to humans. The IDS's include a launch and charging pad that hosts a UAV, which patrols an area within communication range of at least one of the IDSs so the UAV, perhaps with AI-engine assistance, can detect events in the area patrolled by the UAV.

The invention discloses a PDU module and a charging device, and relates to the technical field of power distribution, the PDU module comprises a control board, PCBs, a first control group and a first conductive assembly, the PCBs are connected to the control board at intervals, the first control group comprises a plurality of first relays forming an n * n triangular matrix, and the first relays are fixed on the PCBs. The first conductive assembly respectively realizes electrical communication and cross bridging of relays in the same row and in the same column through the first conductive member, the second conductive member and the bridging busbar. According to the scheme, through the triangular matrix layout, the total number of relays is remarkably reduced on the premise that the same control function as a traditional full matrix is achieved; and meanwhile, the relays are integrated on the PCB and are uniformly controlled by the control panel, so that a large number of connectors and wire harnesses are omitted, the module volume, the material cost and the assembly cost are effectively reduced, and a flexible power distribution function is realized.

A method for electrically connecting a first electronic component of a battery system with a second electronic component of the battery system is provided. The first electronic component includes a flexible printed circuit (FPC) including: a pin formed by folding a connection portion of the FPC; and a conductive strip on an outer surface of the folded connection portion. The second electronic component includes a printed circuit board (PCB) having a through-hole configured to receive the pin of the FPC and includes an electrically conductive plating adjacent to the through-hole. The method includes: attaching the FPC to a first side of the PCB such that the pin of the FPC is received in the through-hole in the PCB; and soldering the pin of the FPC to the conductive plating on the PCB to electrically interconnect the FPC and the PCB.

An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.

A memory module has pads on the top and bottom surfaces of a module printed circuit board (PCB). The pads match the pin layout of one or more memory devices to be mounted on the memory module. The pads on one surface of the PCB electrically interconnect to the memory device(s), and the pads on the other surface electrically interconnect to pads on a system board, such as a motherboard. With the pad layout on the memory module, the pad layout of the system board can be the same for a memory-down implementation and for a removable memory module. The pad layout provides good signal-to-noise performance and can enable a memory module for low power double data rate (LPDDR) memory, double data rate (DDR) memory, and graphics double data rate (GDDR) memory.

A riser card includes a circuit board and first, second, and third connectors. The first and second connectors are positioned at bottom and top edges of the circuit board, respectively. The third connector is mounted to a face of the circuit board. Such riser card may be mounted on a primary system board such that the first connector is detachably connected to a first complementary connector of the primary system board with the circuit board perpendicular to the primary system board, and the first connector receives power, data, and sideband signals from the first complementary connector. The second and third connectors may mate with second and third complementary connectors of an expansion card oriented parallel to the circuit board and a stackable secondary riser card oriented perpendicular to the circuit board, respectively. The riser card communicates power and sideband signals to the stackable secondary riser card via the third connector.

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

Inspection robots and methods for inspection of curved surfaces with sensors at selected horizontal distances are described. An example of such an inspection robot includes a housing; a drive module with a wheel and a motor operatively linked to the housing, a plurality of sensor sleds, and a payload. The payload, which is coupled to the housing, may include a first and a second rail component, each with at least one connector, where the rail components are connectable at a first selected position of a plurality of discrete engagement positions. Each of the rail components may be structured to support at least one of the plurality of sleds where each of the plurality of sleds is coupled to the payload at a respective selected horizontal position such that the plurality of sleds are at selected horizontal distances from each other.

A display device includes a display panel, a flexible circuit board, and a driving chip. The display panel includes a display area and a non-display area bent to the back of the display area. The driving chip is bonded and connected to the display panel in the non-display area. The flexible circuit board includes a bonding area bonded to the non-display area, and a first flat area, a bending area, and a second flat area arranged in sequence in a direction away from the bonding area. The flexible circuit board is at the back of the display area. The second flat area is between the first flat area and the display area. A first electromagnetic shielding layer is provided on at least a portion of the surface, close to the display area, of the second flat area.

A biosensor cartridge can include a circuit board having a connection terminal configured to be electrically connected to an external diagnostic device, a biosensor chip configured to detect a target material from an analysis specimen, and transmit an electrical signal to the connection terminal of the circuit board based on the target material being present in the analysis specimen, the biosensor chip including a reactant configured to react specifically with the target material, and a housing enclosing the circuit board and the biosensor chip, and the connecting terminal being exposed outside of the housing. Also, the biosensor chip includes a plurality of channel areas separated from each other, and the reactant is attached to the plurality of channel areas.

An antenna apparatus includes a multi-layer printed circuit board, an antenna, and a floating patch group. The multi-layer printed circuit board includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer. The antenna is formed from at least one of the first metal layer, the second metal layer, and the third metal layer. The floating patch group is located in the multi-layer printed circuit board and includes a plurality of floating patches. The floating patch has a width. There is a gap between the floating patch and an adjacent floating patch. The floating patches have the same or similar width and the same or similar gap. The floating patch group is arranged in a metal layer where the antenna is located. There is a spacing between the floating patch group and the antenna.

There is provided an electronic device that is capable of restraining static electricity from flowing to electronic components mounted on the electronic device. A connector shield has an electrostatic protecting portion disposed along an opening of a fitting recess of a connector. The electrostatic protecting portion is positioned in a direction along a circuit board on which the connecter is mounted, rather than at least one of a plurality of signal terminals that the connector has.

A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.

A method for a system includes receiving with a first transceiver of an identity reader device, an ephemeral ID from a first smart device, outputting with the first transceiver, identity reader data to the first smart device, wherein the identity reader data comprises a first identifier and a challenge, receiving with the first transceiver, responsive data from the first smart device, wherein the responsive data comprises token data and contact tracing status of the first smart device, determining in a processor of the identity reader device, whether the first smart device is authorized in response to the ephemeral ID or the token data, and the contact tracing status, and directing with the processor, a peripheral device coupled to the identity reader device to perform a user-perceptible action in response to the processor determining that the first smart device is authorized.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

A display device, a bent spacer module and an assembling method thereof are provided. The display device includes: a protective cover plate; a display module, including a display surface facing the protective cover plate and a back surface away from the protective cover plate; a chip-on-film, at least part of the chip-on-film being located on the back surface and being in binding connection with an edge of the display module; a driving chip, which is located on a side, facing the display module, of the chip-on-film on the back surface, and is in binding connection with the chip-on-film; and a bent space, which is located between the driving chip and the back surface, a thickness of a part of the bent spacer contacting the driving chip being greater than that of the remaining part of the bent spacer.

There is provided an electronic device that can increase the degree of freedom of the size and layout of a circuit board. The electronic device has a circuit board, a connector mounted on an upper surface of the circuit board, with a first end of a storage medium being connectable to the connector, and a spacer that is attachable to and detachable from a member different from the circuit board and that supports a second end of the storage medium. The member different from the circuit board has at least one positioning portion for positioning the spacer. An upper surface of the member having the at least one positioning portion is disposed lower than the circuit board and the upper surface of the circuit board.

The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.

A controller includes a circuit board, and a module assembly arranged at the circuit board. The module assembly includes a first power module, a second power module, and a third power module. The circuit board includes a first current circuit connected to the first power module, a second current circuit connected to the second power module, and a third current circuit connected to the third power module. The first current circuit and the second current circuit share one or more circuit components.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

A quasi-planar transformer can include a first winding comprising one or more turns of wire, a second winding comprising one or more turns of a conductive trace disposed on a printed circuit board, and a magnetic core positioned with respect to the first and second windings so as to provide a magnetic flux path coupling the first and second windings. The first winding can be a primary winding having a first half wound in a clockwise direction on a first side of the printed circuit board and a second half wound in a counterclockwise direction on a second side of the printed circuit board, wherein the first and second halves are formed of a single continuous wire. The single continuous wire can pass through an opening in the printed circuit board. The first and second halves of the primary winding can be secured to the printed circuit board.

A semiconductor package includes a package substrate having first and second substrate pads thereon, a first semiconductor chip on the package substrate and including a first chip pad, a second semiconductor chip on the first semiconductor chip and including a second chip pad on a lower surface of the second semiconductor chip, a first bonding wire contacting the first substrate pad and the first chip pad, and a second bonding wire contacting the second substrate pad and the second chip pad. An uppermost portion of the second bonding wire is lower than or coplanar with the lower surface of the second semiconductor chip.

The invention relates to the field of copper-clad plates, and discloses a high-performance flame-retardant low-dielectric-loss copper-clad plate and a preparation method thereof.The copper-clad plate comprises epoxy resin, benzoxazine resin, composite filler, carboxyl-terminated nitrile rubber, an active diluent, a curing agent and the like; the composite filler is prepared by compounding flame-retardant modifier grafted graphene oxide and epoxy silane modified silicon dioxide hollow spheres; according to the flame-retardant modifier, boric acid and pentaerythritol are used for preparing a double-terminal hydroxyl boron-containing intermediate, then dichlorodiphenyl silane and phenylphosphonic dichloride react with hydroxyl groups at the two ends of the intermediate to prepare a flame-retardant intermediate, and amino silane and vanillic aldehyde react with chlorine atoms at the two ends of the intermediate to prepare an aldehyde modified flame-retardant intermediate; the copper-clad plate prepared by the preparation method disclosed by the invention is low in dielectric constant and dielectric loss, high in heat conductivity coefficient and good in flexibility, and also has excellent heat resistance and flame retardance.

A connection body comprises a body having upper and lower surfaces, a first path and a second path. The first path has a first wired portion configured to be connected to a first core wire of a cable structure and a first terminal portion coupled to the first wired portion by a first coupling portion. The first wired portion, the first terminal portion and the first coupling portion are formed on the upper surface of the body. The second path has a second wired portion configured to be connected to a second core wire of the cable structure and a second terminal portion coupled to the second wired portion by a second coupling portion. The second wired portion is formed on the upper surface of the body. The second terminal portion is formed on the lower surface of the body.

The present invention relates to an antenna device and an electronic device using same, the antenna device having twice as many antennas arranged in the same area so as to be reduced in size by half and be capable of performing high power long-distance transmission. The antenna device according to the present invention comprises: a core printed circuit board having antenna circuits arranged therein; a Yagi-Uda antenna formed on a plurality of printed circuit boards arranged above the core printed circuit board, so as to transmit a single polarization signal; a monopole antenna connected to the Yagi-Uda antenna through a via; and a ground radiation unit arranged below the core printed circuit board so as to be symmetrical to the monopole antenna with respect to the core printed circuit board.

An information handling system main printed circuit board having a CPU couples to a graphics printed circuit board having a GPU with an interposer that includes contacts and wirelines that communicate signals between the separate boards. For example, an interposer couples to an upper and lower side of the main and graphics printed circuit boards to align spring contacts with contact pads of the main and graphics printed circuit so that signals are transferred through the interposer, which also provides a physical structure to define a motherboard with the assembly of the main and graphics printed circuit boards into a single piece.

The present invention relates to a ceramic substrate unit and to a method for manufacturing same. The ceramic substrate has a plurality of line grooves, through which air flows, formed on an upper surface of a lower metal layer thereof, so that heat generated in a semiconductor chip can be released to the outside by air convection, and warping caused by a volume difference between an upper metal layer and the lower metal layer can be suppressed.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.