43330results about "Printed circuit aspects" patented technology

Light Emitting Diode Light Sources for Dental Curing are disclosed. Some embodiments of the invention include structures such as Light Emitting Diode Array(s), heat sink, heat dissipation, heat pipe, and control circuitry are disclosed.

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

An interconnect apparatus for providing a communication path for data signals in a predetermined frequency band, that includes a first and a second sections of a transmission line, connected at one end to first and second data transceiving devices, respectively. A switch, such as a mechanical, electro-mechanical, electronic, electro-magnetic and electro-optical switch, having conductive / non-conductive states, is provided for connecting / disconnecting between the other ends of the first and the second sections, for providing a data communication path between the data transceiving devices while being in its conductive state a third and a fourth sections of a transmission line, each of which connected at one end to a contact of the switch and at the other end to a first and a second connector, respectively. A compensation circuitry is provided for compensating, within the frequency band, parasitic effects caused by the switch and / or cord, while the switch is in its conductive state or, while the switch is in its non-conductive state and while a connection between the first and the second connectors is provided by a cord having predetermined characteristics, such that the compensation circuitry compensates the influence of parasitic effects introduced along the communication path by the switch while being in its non-conductive state and while the cord is a part of the communication path or, by the combination of the third and a fourth sections and the connectors while the switch is in its conductive state.

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.

Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board (PWB) with a through-hole for receiving the device such that a principal face thereof is in thermal contact with the heatsink, its electrical leads are captured between at least a portion of the wiring board and the heatsink, and a top of the device protrudes through the PWB. The method comprises placing the device in the through-hole with its base exposed on and protruding from the underside of the PWB, attaching its electrical leads to contacts on the wiring board and pressing the PWB toward the heatsink with the leads captured there between. An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.

The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew.

An indicia decoding device can have an image sensor and a laser diode assembly configured to project laser light onto a substrate. When a trigger signal is received by the indicia decoding device, the device can calculate a delay and enable the laser diode assembly if a delay threshold is satisfied. The indicia decoding device, in one embodiment, can include a hand held housing and an imaging module carrying the image sensor.

A memory module includes a plurality of memory devices and a circuit. Each memory device has a corresponding load. The circuit is electrically coupled to the plurality of memory devices and is configured to be electrically coupled to a memory controller of a computer system. The circuit selectively isolates one or more of the loads of the memory devices from the computer system. The circuit comprises logic which translates between a system memory domain of the computer system and a physical memory domain of the memory module.

A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.