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415 results about "Component placement" patented technology

Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads. The next step after component placement is soldering.

Electronic textile and method of manufacturing an electronic textile

A method of manufacturing an electronic textile (1) comprising the steps of: providing a textile carrier (2) comprising a plurality of conductor lines (6a-b); releasably attaching (101) the textile carrier (2) to a rigid support plate (20); providing (102) a conductive substance on the textile carrier (2) in a pattern forming a plurality of sets of connection pads (5a-b) on the textile carrier (2), each set of connection pads defining a component placement position for placement of an electronic component (3), and each set of connection pads (5a-b) comprising a connection pad overlapping one of the conductor lines, the connection pad having a connection pad length (Lcp) in a direction parallel to the conductor line and a connection pad width (Wcp) in a direction perpendicular to the conductor line, wherein the connection pad width (Wcp) is at least one percent of an extension (Wtc) of the textile carrier (2) in the direction perpendicular to the conductor line; automatically placing (103) electronic components (3) at the component placement positions; curing (104) the conductive substance to attach the electronic components (3) to the textile carrier (2), thereby forming the electronic textile (1) and removing (105) the electronic textile from the rigid support plate.
Owner:SIGNIFY HLDG BV +1

Electronic textile and method of manufacturing an electronic textile

A method of manufacturing an electronic textile (1) comprising the steps of: providing a textile carrier (2) comprising a plurality of conductor lines (6a-b); releasably attaching (101) the textile carrier (2) to a rigid support plate (20); providing (102) a conductive substance on the textile carrier (2) in a pattern forming a plurality of sets of connection pads (5a-b) on the textile carrier (2), each set of connection pads defining a component placement position for placement of an electronic component (3), and each set of connection pads (5a-b) comprising a connection pad overlapping one of the conductor lines, the connection pad having a connection pad length (Lcp) in a direction parallel to the conductor line and a connection pad width (Wcp) in a direction perpendicular to the conductor line, wherein the connection pad width (Wcp) is at least one percent of an extension (Wtc) of the textile carrier (2) in the direction perpendicular to the conductor line; automatically placing (103) electronic components (3) at the component placement positions; curing (104) the conductive substance to attach the electronic components (3) to the textile carrier (2), thereby forming the electronic textile (1) and removing (105) the electronic textile from the rigid support plate.
Owner:SIGNIFY HLDG BV +1
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