413 results about "Component placement" patented technology

The invention relates to the field of circuit board processing, and discloses a printed circuit board splitting device, which comprises a workbench, the top end of the workbench is fixedly provided with a protective cover, and the outer wall of the protective cover is connected with an opening and closing door through a hinge; the movable cleaning assembly is arranged on the workbench and used for cleaning dust on the surface of the circuit board while moving the circuit board; the supporting and collecting assembly is arranged on the workbench and used for limiting the circuit board and collecting impurities generated during machining; the processing assembly is arranged on the workbench and used for cutting and splitting the circuit board; the auxiliary assembly is arranged on the workbench and used for assisting the machining assembly; and the placing assembly is arranged on the workbench and is used for placing the unprocessed circuit board and the processed circuit board. And through cooperation of internal structures of the movable cleaning assembly, the effect that residual dust and chippings on the surface of the circuit board are effectively cleaned through the cleaning device while the circuit board is accurately moved is achieved.

Active and passive electronic components are placed on a substrate and encapsulated with mold material to produce a molded core substrate for fabricating a hybrid integrated circuit (IC) device. A carrier has a release film laminated to a face thereof. A seed layer of copper is added over the release film and fiducials are plated onto the copper seed layer for component placement using alignment marks on the fiducials. Mold material is applied to the encapsulation layer and around and over the components. Mold material is ground planar with component tops. The carrier and release film are removed, leaving the copper seed layer exposed, which is etched to a pattern. Holes are formed in the mold material and then surfaces thereof are copper plated. A multilayer dielectric film is laminated over copper plating. Vias are formed in the multilayer dielectric film for connections to components.

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention discloses an intelligent environmental sanitation information management device, which comprises a placement seat, a touch display screen, a main control circuit board and a detachable circuit board, and is characterized in that the main control circuit board is provided with a control chip, a first communication unit and a lithium battery pack, and the detachable circuit board is welded with a fingerprint identification module and a second communication unit; a bidirectional pushing assembly is arranged in the placing seat, and a side mounting hole is formed in the left side of the placing seat. The fingerprint identification module has the following advantages and effects: the fingerprint identification module is welded on the detachable circuit board, and the plug-in circuit board and the side mounting hole are detachably mounted, so that subsequent disassembly of the plug-in circuit board is facilitated, and repair or replacement after a fault occurs is facilitated; and through the arrangement of the bidirectional pushing assembly, the detachable circuit board can be locked, and the detachable circuit board can be pushed out of the side mounting hole or hidden in the placement seat.

An electronic devices according to various embodiments disclosed in this document may include a first housing, a second housing coupled to the first housing so as to slide in a first direction and in a second direction opposite the first direction, a printed circuit board disposed in the second housing, a rear cover disposed in the second housing and configured to support the printed circuit board, a rollable display including a display area exposed to the outside of the electronic device, an accommodation area received inside the electronic device, and a bending area connecting the display area and the accommodation area and configured to be bent, and having the display area that is reduced or expanded based on a sliding-in or sliding-out operation of the second housing, a driving motor disposed in the first housing and configured to drive the second housing to slide in or slide out, and a battery disposed in a space provided in the first housing and the second housing, wherein the rear cover may be formed so as not to overlap the accommodation area of the rollable display when the rollable display is viewed vertically when the second housing is in a full slide-in state in the second direction.

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The invention discloses a cold and hot impact test device and method for an automobile electronic component, and belongs to the technical field of cold and hot impact test equipment.The cold and hot impact test device for the automobile electronic component comprises an experiment box, a mounting column is rotationally arranged in the experiment box, and six partition plates are evenly distributed on the mounting column in the circumferential direction; the ends, away from the mounting columns, of the partition plates make movable contact with the inner wall of the experiment box, the six partition plates divide the inner space of the experiment box into a thermal shock test area, a first buffer area, a second buffer area, a cold shock test area, a third buffer area and a fourth buffer area, a thermal shock assembly is arranged on the experiment box, and a cold shock assembly is arranged on the experiment box. An intermittent rotating assembly connected with the mounting column is arranged at the bottom of the experiment box, a placement assembly is arranged between every two adjacent partition plates, a clamping assembly used for fixing an electronic component body is arranged on each placement assembly, and the rapid thermal shock cycle test device has the advantages of being effective in placement, stable in clamping, rapid in thermal shock cycle test, stable in structure and convenient and fast to operate.

The invention discloses a circuit board module deformation testing system and method for SMT automatic patch forming, and belongs to the technical field of circuit board deformation testing, and the system comprises a warping judgment execution demand analysis module, a first execution strategy determination module, a second execution strategy determination module and a support sinking adjustment module. The circuit board warping and supporting structure deformation risk can be accurately quantified, the Z-axis compensation value, the mounting speed, the pressure and other parameters are dynamically adjusted, mounting deviation caused by circuit board deformation is compensated in real time, the element mounting precision is controlled within the preset range, meanwhile, through hot spot area tracking and supporting sinking graded adjustment, the element mounting precision is improved, and the element mounting precision is improved. The stress concentration risk is reduced, the problems of poor welding, element breakage and the like caused by aggravation of deformation are avoided, the stability of the SMT mounting process is improved, the deformation-related reject ratio is reduced, and the consistency and reliability of the mounting quality of the circuit board are improved.

An electronic device cover may include a first cover portion, a second cover portion formed to be movable relative to the first cover portion, a hinge assembly disposed on one surface of the second cover portion, and a holder rotatably coupled to the hinge assembly. The holder has a first end and a second end and a rotation center of the holder may be disposed between both ends of the holder, and the holder may be formed to rotate in a plane parallel with the surface of the second cover.

The utility model belongs to the technical field of semiconductor production process, and particularly relates to a wafer protective film tearing device, which is used for being arranged above an external wafer film tearing workbench, and comprises a mounting frame, a wafer protective film tearing device and a wafer protective film tearing device, the adhesive tape mounting assembly is arranged on the mounting frame; the adhesive tape clamping assembly can be transversely and movably arranged on the mounting frame and is positioned beside the adhesive tape mounting assembly; the adhesive tape bonding assembly can be vertically and movably arranged on the mounting frame and is positioned beside the adhesive tape clamping assembly; and the adhesive tape cutting assembly is arranged on the mounting frame and located beside the adhesive tape bonding assembly. According to the utility model, the adhesive tape mounting assembly is used for placing the adhesive tape roll, the adhesive tape clamping assembly is used for clamping the adhesive tape, the adhesive tape bonding assembly is used for bonding the adhesive tape clamped by the adhesive tape clamping assembly on the surface of the wafer protective film, and the adhesive tape cutting assembly is used for cutting off the adhesive tape after the adhesive tape is bonded on the surface of the wafer protective film, so that the full-automatic film tearing of the wafer protective film is realized.

The invention belongs to the technical field of chip testing, and particularly relates to integrated circuit chip testing equipment which comprises a machine body, a testing part and a transferring part, the testing part is installed on the machine body and comprises an appearance testing assembly and an electrical performance testing assembly, and the transferring part is used for transporting a chip to sequentially pass through the appearance testing assembly and the electrical performance testing assembly. The transfer part comprises a first circular ring, a second circular ring, a third circular ring, a fourth circular ring and a fourth circular ring, the placing assemblies are mounted on the first circular ring in an annular array manner; each placing assembly comprises a connecting plate mounted on the first circular ring; the fixing plate is movably arranged on the connecting plate and is used for fixing a chip; through the arrangement of the placement assembly, the problems that the appearance test system cannot detect that the pins are separated from the chip and the pins are left on the electrical performance test assembly under the action of friction force between the pins and the electrical performance test assembly when the pins are transferred to the electrical performance test after the appearance test is qualified are solved.

The utility model relates to the technical field of semiconductor device packaging, in particular to a semiconductor chip packaging device, which comprises a device body, a conveying device, a pushing piece, an adsorption piece and a gluing piece, and is characterized in that the conveying device is arranged on the device body and is used for conveying a substrate, a placing plate and a clamping assembly, and the placing plate is provided with a semiconductor chip; the pushing piece is arranged on the device body in a lifting mode and located above the conveying belt. The adsorption part is arranged on the pushing part in a sliding manner and is used for adsorbing a semiconductor chip; the gluing piece is arranged on the pushing piece, and the gluing piece is used for gluing the substrate; the clamping assembly is arranged on the device body, is in transmission connection with the pushing piece and is used for clamping the containing plate and the base plate. According to the utility model, the gluing piece is used for gluing the substrate, the adsorption piece is used for transferring the semiconductor chip on the placing plate to the substrate, and the clamping assembly can clamp the substrate and the placing plate, so that the automation degree is high, the manual participation is less, and the packaging efficiency is high.

Disclosed are an automotive Ethernet circuit board and communications system, and a vehicle. The automotive Ethernet circuit board includes: a component placement layer, configured to carry a PHY chip and a control chip of the PHY chip; a plurality of signal wiring layers, configured to carry signal wiring between components in the component placement layer; and a signal shielding layer, located between the plurality of signal wiring layers and configured to prevent interference of a clock signal in the signal wiring. In the embodiments of the present application, a plurality of signal wiring layers are used for signal wiring between components, and a plurality of complete signal shielding layers are used to prevent interference of a clock signal in the wiring. The embodiments help reduce signal crosstalk between PCBs, prevent interference of a clock signal in signal wiring, and improve stability and consistency of a data communications system.

A scalable, GPU-accelerated printed circuit board (PCB) placement process can utilize various cost factors to determine placement on the PCB. The cost factors can include the wirelength parameter, the net crossing parameter, the routability parameter, or the density parameter. Other factors can be utilized as well. The cost factor algorithm can be used to design a PCB placement using the desired optimizations. The processes can utilize a two-sided PCB, and rotation or orientation of each component design. The processes are scalability for large commercial designs maintaining the desired operating times and optimizations constraints. A synthesized benchmark suite to support tool comparisons and track progress is disclosed.

The invention relates to the technical field of chip mounter control, and provides a chip mounter control method and system based on machine vision, and the method comprises the steps: obtaining a soldering paste region image in a staged manner in the staged mounting of a chip mounter through the machine vision, so as to obtain corresponding soldering paste region data, according to the pressure data of each stage and the data of the soldering paste area, a mounting pressure and soldering paste area change relation model is constructed, and the relation model reflects current soldering paste fluid characteristics; and substituting the preset soldering paste area requirement of each soldering point into the mounting pressure and soldering paste area change relation model to obtain a second pressurizing pressure for mounting of each soldering point, and performing pressure control on a mounting head corresponding to the soldering point, so that the mounting pressure can be accurately controlled in the element mounting process of the chip mounter, and the mounting efficiency is improved. The pressure is enabled to adapt to the change of the soldering paste in the process, the chip mounting and subsequent welding efficiency is improved, and the production quality of a circuit board is improved.

The invention discloses a processing method capable of reducing tombstone standing of an electronic component, and the method comprises the steps: S1, solder paste printing: arranging a bonding pad of a 0402 component at the central position of a PCB, and coating the surface of a steel mesh with solder paste through a solder paste screen printing machine; s2, solder paste pre-detection: after the steel meshes are filled with the solder paste, a transparent sheet is arranged between the PCB and the first visual camera, a PCB outline identification frame and a bonding pad identification frame which are made of a light-proof material are arranged on the transparent sheet, and the first visual camera collects a pre-detection image of overlapping of the PCB and the transparent sheet; calculating whether the overflow area of the solder paste on the bonding pad in the pre-detection image exceeding the bonding pad identification frame exceeds a set threshold value or not, and if the overflow area does not exceed the set threshold value, judging that the solder paste coating is qualified; s3, element surface mounting is carried out; s4, reflow soldering; and S5, performing AOI optical detection. Compared with the prior art, the problem that electronic components stand up in the SMT process is solved.

The utility model discloses height-adjustable electronic information display equipment which comprises a base, a bottom frame is arranged at the bottom end of the base, rear wheels are installed on the outer walls of the two sides of the lower end of the bottom frame, a linkage shaft is arranged on the inner wall between the rear wheels, a bearing seat is arranged above the base, and upper connecting seats are arranged on the two sides of the bottom end of the bearing seat. Lower connecting bases are arranged at the top ends of the bases below the upper connecting bases, lifting driving pieces are installed on the two sides of the top ends of the lower connecting bases, the top ends of the lifting driving pieces are connected with the bottom ends of the upper connecting bases, a stand column is arranged in the center of the top end of the bearing base, and an annular piece containing frame is connected to the outer wall of the upper end of the stand column in a bolted mode. The height and angle of the electronic information screen can be easily adjusted by a user according to personal habits or environmental requirements, the phenomenon of neck and eye fatigue caused by long-time use of the user is reduced, the purpose of easily transferring the display equipment is achieved, the electronic information screen is easily detached, and the user experience is improved. The convenience in maintenance of the display equipment is improved.

This invention discloses a circuit board surface mount correction method, apparatus, system, and medium. The circuit board surface mount correction method includes: acquiring basic accuracy data of the bare circuit board state and solder paste association data after solder paste has been printed on the circuit board; generating a D data stream based on the basic accuracy data, the solder paste association data, and corresponding component information, and sending the D data stream to a pick-and-place machine and a pre-reflow AOI (Automated Optical Inspection) unit; the pick-and-place machine completing component placement based on the D data stream; the pre-reflow AOI acquiring placement result information for each component on the circuit board after placement, and calculating offset data for each component based on the D data stream to generate an H data stream; and the pick-and-place machine performing surface mount correction based on the H data stream. This circuit board surface mount correction method achieves the effect of improving component placement correction accuracy and yield.

The utility model discloses a fine tuning device of a circuit board test rack, comprising a fixed pedestal, the outer side of which is provided with a plurality of threading ports; the probe plate is connected to the inner side of the fixed base in a sliding mode, a plurality of detachable probes are fixedly installed on the inner side of the probe plate, the bottom ends of the probes are connected with lines, and the lines are led out from the threading openings; the pressure sensing assembly is arranged between the fixed base and the probe plate; the placing frame assembly is arranged at the top end of the fixed base; the circuit board is placed on the inner side of the top end of the placing frame assembly; the supporting frame is fixedly connected to the top end of the fixed base, and the supporting frame is in an L shape and is divided into a vertical plate and a horizontal plate; and the downward pressing assembly is arranged at the top end of the horizontal plate of the supporting frame. Compared with the prior art, the utility model has the advantages that the pressure when the probe is in contact with the circuit board can be monitored and adjusted, the probe is prevented from being damaged, and stable connection is kept.

The utility model relates to a batch fixing device suitable for detecting jig PIN port test equipment, which comprises a device support, a placing platform is mounted on the device support, a plurality of mounting grooves are formed in the placing platform, fixing assemblies are mounted in the mounting grooves, and a plurality of longitudinal adjusting devices are mounted on the placing platform on two sides of the mounting grooves in a mirroring manner. A pressing plate assembly is installed between the longitudinal adjusting devices, and the placing platform is located below the pressing plate and provided with a stopping assembly. Therefore, by the adoption of the fixing assembly, fool-proof placement of the detection jig can be achieved, and batch pre-positioning placement is met. Through mutual cooperation of the longitudinal adjusting device and the pressing plate assembly, the detection jig can be temporarily limited, abnormal displacement of the detection jig in the detection period is avoided, and smooth butt joint of the detection contact pins is achieved.

A fabric assembly for an electronic device includes multiple fabric layers joined together at select locations. The fabric layers each include multiple indentations, or de-bosses. The fabric layers can be combined, or bonded, together at one or more respective indentations. As an example, the indentations can be bonded together through a welding operation, including radio frequency welding. When the fabric assembly is integrated with an electronic device, the fabric assembly permits passage of soundwaves therethrough. The indentations can be equally or unequally spaced throughout each fabric layer. When unequally spaced, the fabric assembly can be positioned over a component of an electronic device such that the locations with few or no indentations are positioned at a location corresponding to the component, thus allowing access to the component.

A method for manufacturing a combined sintered-prepared silver film and a carrier (1), a) a step of creating a carrier (2) including a designed opening (5); b) a step of casting a silver film layer (7) into the designed opening (5), for example, a step of casting a silver paste; and c) a method comprising the step of drying the carrier (2) and the silver film layer (7) to form a combined sintered-prepared silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be produced by permanently bonding two plastic films using a plasma bonding process or using a temperature-stable adhesive. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define a designed opening (5). The backing layer (4) may be configured to seal the bottom of the designed opening (5), wherein, at the beginning of step b), the top of the designed opening (5) may be open to receive a cast silver film layer (7). The combined sintered-prepared silver for the substrate (10) a) a step of positioning a combined sintered-prepared silver film and carrier (1) of the type comprising a carrier (2) including a designed opening (5) and a silver film layer (7) cast into the designed opening (5) on the upper surface of a substrate (10) such that the silver film layer (7) faces downward; b) a step of transferring a silver film layer (7) onto a substrate (10) by lamination; c) a step of removing the carrier (2) of the combined sintered-prepared silver film and the carrier (1); d) a step of forming an assembly by placing the component (22) on the substrate (10) so as to be in contact with the transferred silver film layer (7); and e) includes the step of sintering the assembly to create a silver bond between the component (22) and the substrate (10). In step b) of the method of assembling the component (22) to the substrate (10), lamination is performed using a lamination press (11+12) at a pressure of 3 to 8 MPa, optionally 3 to 6 MPa, optionally 8 MPa, and a temperature of 130 to 150°C, optionally 130°C. In step e) of this method, sintering is performed at a pressure of 10 MPa and a temperature of 250°C.

To provide a dynamic release tape for assembling a discrete component.SOLUTION: A method includes the steps of placing a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape having a flexible support layer, a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes a step of applying radiation to the dynamic release structure to release the discrete component from the dynamic release tape.SELECTED DRAWING: Figure 5

The utility model discloses accurate stacking equipment after aluminum plate shearing, which belongs to the technical field of aluminum plate cutting and processing and comprises a placing plate, a receiving component is fixedly mounted on one side of the placing plate, a vertical plate is fixedly connected to the back of the placing plate, and an adaptive component is fixedly mounted in the middle of the upper surface of the vertical plate; the receiving assembly comprises a first motor, one side of the first motor is fixedly mounted on one side of the placement plate, and the output end of the first motor is fixedly connected with a positive and negative threaded rod; through the receiving assembly and the adaptive assembly, the lap joint plates are used for receiving the pushed aluminum plates, and the distance between the lap joint plates on the two sides can be adjusted through the positive and negative threaded rods, so that the aluminum plates with different lengths can be received, then the aluminum plates are driven to move downwards and can be directly put down to a placement plate or the surface of an existing aluminum plate, and the aluminum plates can be prevented from directly falling off from the high position; therefore, the production quality of the aluminum plate is ensured, the production efficiency is improved, and the safety of the whole working environment is enhanced.

The utility model provides a tapping machine discharging device which comprises a discharging box, a material distributing assembly and a blowing fan are arranged in the discharging box, and a material guiding table is arranged on the top of the discharging box. The distributing assembly is placed at the bottom of the discharging box and comprises a vertical plate, a first distributing box and a second distributing box, and the first distributing box and the second distributing box are arranged on the two sides of the vertical plate correspondingly. The discharging end of the material guide table is located above the first material distribution box. The blowing fan is assembled on the inner wall, away from the second material distribution box, of the discharging box and located above the first material distribution box. According to the utility model, when a product and generated scraps fall into the blanking box from the material guide table, the blowing fan can blow the scraps with light weight to one side and enable the scraps to fall into the second material distribution box, and the product can directly fall into the first material distribution box, so that the follow-up treatment of the scraps is omitted, the labor cost is reduced, and the production efficiency is improved.

The application discloses an assembly device, an assembly system and an assembly method, and belongs to the technical field of mechanical automation. The assembly device comprises a carrier, a plug-in device and a first assembly device. The carrier comprises a first area and a second area. The assembly device provided by the application places a bottom shell in the first area of the carrier, places a clamping piece and a socket assembly in the second area of the carrier, separately positions the components to be assembled by the carrier, facilitates the plug-in device and the first assembly device to position and execute operations step by step, automatically completes the assembly of the clamping piece and the socket assembly in the second area of the carrier by the plug-in device, effectively guarantees the consistency and accuracy of the assembly of the clamping piece and the socket assembly, and further guarantees that the first assembly device successfully assembles the clamping piece and the socket assembly assembled in the second area into the bottom shell in the first area, thereby achieving high work efficiency.

The invention relates to the technical field of semiconductor lead frame core bonding, and particularly discloses semiconductor lead frame core bonding equipment which comprises a conveying belt, a plurality of material guiding assemblies and a plurality of material guiding assemblies, wherein the front and back of the conveying belt are respectively provided with a frame, and the back of the frame on the back is fixedly connected with a supporting frame. The conveying belts are sequentially arranged above the conveying belt; the adjusting assembly is arranged between the material guiding assembly and the supporting frame. Through cooperation of the material guiding assembly, the placing assembly, the adjusting assembly and the fixing unit, flexible adjustment can be performed according to specific models and fixing positions of chips and lead frames. The adjusting assembly can accurately adjust the feeding position of the material guiding assembly, so that the chip can be directly conveyed to the position near the lead frame, and the distance between the chip and the lead frame is greatly reduced. Therefore, the contact time of the placing assembly and the fixing unit with the chip is shortened, the chip bonding time is effectively shortened, and all parts are matched more closely.

A method for learning-based automatic component placement of analog circuits is presented. The method comprises the following steps: acquiring a netlist file of an analog circuit comprising a plurality of components; according to the netlist file, obtaining the total number of a plurality of wells of the analog circuit and the number of components sharing the first well, the number of the components sharing the first well among the wells being the largest; according to the total number of the traps, determining the number of a plurality of bounded-slice grid (BSG, BSG) units, and according to the total number of the traps, determining the number of the plurality of bounded-slice grid (BSG, BSG) units; determining the size of each bounded slice line grid unit according to the number of the components sharing the first trap; and performing a training process to determine an optimal component placement scheme by using a reinforcement learning model including an actor model and a reviewer model.

This utility model discloses a lithium battery sealing performance testing device for tablet computers, including a testing box. A support frame is fixed to the top surface of the testing box, a glass window is opened on the surface of the testing box, a controller is fixed to the side of the testing box, an installation plate is provided inside the testing box, a reciprocating motor is fixed to the side of the testing box, a reciprocating lead screw is fixed to the output end of the reciprocating motor, and the reciprocating lead screw is threadedly connected to the installation plate. An airtightness tester is fixed to the top surface of the testing box. It also includes a placement component and a voltage regulating component. The placement component has an axisymmetric structure about the installation plate, so that the device can prepare for the next test when performing a lithium battery sealing performance test. The lithium battery can move laterally in the placement component, so that the surface of the lithium battery can be fully in contact with the gas in the testing box, with no blind spots, making the lithium battery test more accurate. The voltage regulating component can quickly squeeze or pull the gas in the testing box, improving the testing efficiency of lithium battery sealing performance.