236 results about "Component placement" patented technology

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The invention discloses a circuit board module deformation testing system and method for SMT automatic patch forming, and belongs to the technical field of circuit board deformation testing, and the system comprises a warping judgment execution demand analysis module, a first execution strategy determination module, a second execution strategy determination module and a support sinking adjustment module. The circuit board warping and supporting structure deformation risk can be accurately quantified, the Z-axis compensation value, the mounting speed, the pressure and other parameters are dynamically adjusted, mounting deviation caused by circuit board deformation is compensated in real time, the element mounting precision is controlled within the preset range, meanwhile, through hot spot area tracking and supporting sinking graded adjustment, the element mounting precision is improved, and the element mounting precision is improved. The stress concentration risk is reduced, the problems of poor welding, element breakage and the like caused by aggravation of deformation are avoided, the stability of the SMT mounting process is improved, the deformation-related reject ratio is reduced, and the consistency and reliability of the mounting quality of the circuit board are improved.

The utility model relates to the technical field of semiconductor device packaging, in particular to a semiconductor chip packaging device, which comprises a device body, a conveying device, a pushing piece, an adsorption piece and a gluing piece, and is characterized in that the conveying device is arranged on the device body and is used for conveying a substrate, a placing plate and a clamping assembly, and the placing plate is provided with a semiconductor chip; the pushing piece is arranged on the device body in a lifting mode and located above the conveying belt. The adsorption part is arranged on the pushing part in a sliding manner and is used for adsorbing a semiconductor chip; the gluing piece is arranged on the pushing piece, and the gluing piece is used for gluing the substrate; the clamping assembly is arranged on the device body, is in transmission connection with the pushing piece and is used for clamping the containing plate and the base plate. According to the utility model, the gluing piece is used for gluing the substrate, the adsorption piece is used for transferring the semiconductor chip on the placing plate to the substrate, and the clamping assembly can clamp the substrate and the placing plate, so that the automation degree is high, the manual participation is less, and the packaging efficiency is high.

Disclosed are an automotive Ethernet circuit board and communications system, and a vehicle. The automotive Ethernet circuit board includes: a component placement layer, configured to carry a PHY chip and a control chip of the PHY chip; a plurality of signal wiring layers, configured to carry signal wiring between components in the component placement layer; and a signal shielding layer, located between the plurality of signal wiring layers and configured to prevent interference of a clock signal in the signal wiring. In the embodiments of the present application, a plurality of signal wiring layers are used for signal wiring between components, and a plurality of complete signal shielding layers are used to prevent interference of a clock signal in the wiring. The embodiments help reduce signal crosstalk between PCBs, prevent interference of a clock signal in signal wiring, and improve stability and consistency of a data communications system.

A scalable, GPU-accelerated printed circuit board (PCB) placement process can utilize various cost factors to determine placement on the PCB. The cost factors can include the wirelength parameter, the net crossing parameter, the routability parameter, or the density parameter. Other factors can be utilized as well. The cost factor algorithm can be used to design a PCB placement using the desired optimizations. The processes can utilize a two-sided PCB, and rotation or orientation of each component design. The processes are scalability for large commercial designs maintaining the desired operating times and optimizations constraints. A synthesized benchmark suite to support tool comparisons and track progress is disclosed.

The invention relates to the technical field of chip mounter control, and provides a chip mounter control method and system based on machine vision, and the method comprises the steps: obtaining a soldering paste region image in a staged manner in the staged mounting of a chip mounter through the machine vision, so as to obtain corresponding soldering paste region data, according to the pressure data of each stage and the data of the soldering paste area, a mounting pressure and soldering paste area change relation model is constructed, and the relation model reflects current soldering paste fluid characteristics; and substituting the preset soldering paste area requirement of each soldering point into the mounting pressure and soldering paste area change relation model to obtain a second pressurizing pressure for mounting of each soldering point, and performing pressure control on a mounting head corresponding to the soldering point, so that the mounting pressure can be accurately controlled in the element mounting process of the chip mounter, and the mounting efficiency is improved. The pressure is enabled to adapt to the change of the soldering paste in the process, the chip mounting and subsequent welding efficiency is improved, and the production quality of a circuit board is improved.

The invention discloses a processing method capable of reducing tombstone standing of an electronic component, and the method comprises the steps: S1, solder paste printing: arranging a bonding pad of a 0402 component at the central position of a PCB, and coating the surface of a steel mesh with solder paste through a solder paste screen printing machine; s2, solder paste pre-detection: after the steel meshes are filled with the solder paste, a transparent sheet is arranged between the PCB and the first visual camera, a PCB outline identification frame and a bonding pad identification frame which are made of a light-proof material are arranged on the transparent sheet, and the first visual camera collects a pre-detection image of overlapping of the PCB and the transparent sheet; calculating whether the overflow area of the solder paste on the bonding pad in the pre-detection image exceeding the bonding pad identification frame exceeds a set threshold value or not, and if the overflow area does not exceed the set threshold value, judging that the solder paste coating is qualified; s3, element surface mounting is carried out; s4, reflow soldering; and S5, performing AOI optical detection. Compared with the prior art, the problem that electronic components stand up in the SMT process is solved.

The utility model discloses height-adjustable electronic information display equipment which comprises a base, a bottom frame is arranged at the bottom end of the base, rear wheels are installed on the outer walls of the two sides of the lower end of the bottom frame, a linkage shaft is arranged on the inner wall between the rear wheels, a bearing seat is arranged above the base, and upper connecting seats are arranged on the two sides of the bottom end of the bearing seat. Lower connecting bases are arranged at the top ends of the bases below the upper connecting bases, lifting driving pieces are installed on the two sides of the top ends of the lower connecting bases, the top ends of the lifting driving pieces are connected with the bottom ends of the upper connecting bases, a stand column is arranged in the center of the top end of the bearing base, and an annular piece containing frame is connected to the outer wall of the upper end of the stand column in a bolted mode. The height and angle of the electronic information screen can be easily adjusted by a user according to personal habits or environmental requirements, the phenomenon of neck and eye fatigue caused by long-time use of the user is reduced, the purpose of easily transferring the display equipment is achieved, the electronic information screen is easily detached, and the user experience is improved. The convenience in maintenance of the display equipment is improved.

This invention discloses a circuit board surface mount correction method, apparatus, system, and medium. The circuit board surface mount correction method includes: acquiring basic accuracy data of the bare circuit board state and solder paste association data after solder paste has been printed on the circuit board; generating a D data stream based on the basic accuracy data, the solder paste association data, and corresponding component information, and sending the D data stream to a pick-and-place machine and a pre-reflow AOI (Automated Optical Inspection) unit; the pick-and-place machine completing component placement based on the D data stream; the pre-reflow AOI acquiring placement result information for each component on the circuit board after placement, and calculating offset data for each component based on the D data stream to generate an H data stream; and the pick-and-place machine performing surface mount correction based on the H data stream. This circuit board surface mount correction method achieves the effect of improving component placement correction accuracy and yield.

The utility model discloses a fine tuning device of a circuit board test rack, comprising a fixed pedestal, the outer side of which is provided with a plurality of threading ports; the probe plate is connected to the inner side of the fixed base in a sliding mode, a plurality of detachable probes are fixedly installed on the inner side of the probe plate, the bottom ends of the probes are connected with lines, and the lines are led out from the threading openings; the pressure sensing assembly is arranged between the fixed base and the probe plate; the placing frame assembly is arranged at the top end of the fixed base; the circuit board is placed on the inner side of the top end of the placing frame assembly; the supporting frame is fixedly connected to the top end of the fixed base, and the supporting frame is in an L shape and is divided into a vertical plate and a horizontal plate; and the downward pressing assembly is arranged at the top end of the horizontal plate of the supporting frame. Compared with the prior art, the utility model has the advantages that the pressure when the probe is in contact with the circuit board can be monitored and adjusted, the probe is prevented from being damaged, and stable connection is kept.

The utility model relates to a batch fixing device suitable for detecting jig PIN port test equipment, which comprises a device support, a placing platform is mounted on the device support, a plurality of mounting grooves are formed in the placing platform, fixing assemblies are mounted in the mounting grooves, and a plurality of longitudinal adjusting devices are mounted on the placing platform on two sides of the mounting grooves in a mirroring manner. A pressing plate assembly is installed between the longitudinal adjusting devices, and the placing platform is located below the pressing plate and provided with a stopping assembly. Therefore, by the adoption of the fixing assembly, fool-proof placement of the detection jig can be achieved, and batch pre-positioning placement is met. Through mutual cooperation of the longitudinal adjusting device and the pressing plate assembly, the detection jig can be temporarily limited, abnormal displacement of the detection jig in the detection period is avoided, and smooth butt joint of the detection contact pins is achieved.

A fabric assembly for an electronic device includes multiple fabric layers joined together at select locations. The fabric layers each include multiple indentations, or de-bosses. The fabric layers can be combined, or bonded, together at one or more respective indentations. As an example, the indentations can be bonded together through a welding operation, including radio frequency welding. When the fabric assembly is integrated with an electronic device, the fabric assembly permits passage of soundwaves therethrough. The indentations can be equally or unequally spaced throughout each fabric layer. When unequally spaced, the fabric assembly can be positioned over a component of an electronic device such that the locations with few or no indentations are positioned at a location corresponding to the component, thus allowing access to the component.

A method for manufacturing a combined sintered-prepared silver film and a carrier (1), a) a step of creating a carrier (2) including a designed opening (5); b) a step of casting a silver film layer (7) into the designed opening (5), for example, a step of casting a silver paste; and c) a method comprising the step of drying the carrier (2) and the silver film layer (7) to form a combined sintered-prepared silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be produced by permanently bonding two plastic films using a plasma bonding process or using a temperature-stable adhesive. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define a designed opening (5). The backing layer (4) may be configured to seal the bottom of the designed opening (5), wherein, at the beginning of step b), the top of the designed opening (5) may be open to receive a cast silver film layer (7). The combined sintered-prepared silver for the substrate (10) a) a step of positioning a combined sintered-prepared silver film and carrier (1) of the type comprising a carrier (2) including a designed opening (5) and a silver film layer (7) cast into the designed opening (5) on the upper surface of a substrate (10) such that the silver film layer (7) faces downward; b) a step of transferring a silver film layer (7) onto a substrate (10) by lamination; c) a step of removing the carrier (2) of the combined sintered-prepared silver film and the carrier (1); d) a step of forming an assembly by placing the component (22) on the substrate (10) so as to be in contact with the transferred silver film layer (7); and e) includes the step of sintering the assembly to create a silver bond between the component (22) and the substrate (10). In step b) of the method of assembling the component (22) to the substrate (10), lamination is performed using a lamination press (11+12) at a pressure of 3 to 8 MPa, optionally 3 to 6 MPa, optionally 8 MPa, and a temperature of 130 to 150°C, optionally 130°C. In step e) of this method, sintering is performed at a pressure of 10 MPa and a temperature of 250°C.

The utility model discloses accurate stacking equipment after aluminum plate shearing, which belongs to the technical field of aluminum plate cutting and processing and comprises a placing plate, a receiving component is fixedly mounted on one side of the placing plate, a vertical plate is fixedly connected to the back of the placing plate, and an adaptive component is fixedly mounted in the middle of the upper surface of the vertical plate; the receiving assembly comprises a first motor, one side of the first motor is fixedly mounted on one side of the placement plate, and the output end of the first motor is fixedly connected with a positive and negative threaded rod; through the receiving assembly and the adaptive assembly, the lap joint plates are used for receiving the pushed aluminum plates, and the distance between the lap joint plates on the two sides can be adjusted through the positive and negative threaded rods, so that the aluminum plates with different lengths can be received, then the aluminum plates are driven to move downwards and can be directly put down to a placement plate or the surface of an existing aluminum plate, and the aluminum plates can be prevented from directly falling off from the high position; therefore, the production quality of the aluminum plate is ensured, the production efficiency is improved, and the safety of the whole working environment is enhanced.

The application discloses an assembly device, an assembly system and an assembly method, and belongs to the technical field of mechanical automation. The assembly device comprises a carrier, a plug-in device and a first assembly device. The carrier comprises a first area and a second area. The assembly device provided by the application places a bottom shell in the first area of the carrier, places a clamping piece and a socket assembly in the second area of the carrier, separately positions the components to be assembled by the carrier, facilitates the plug-in device and the first assembly device to position and execute operations step by step, automatically completes the assembly of the clamping piece and the socket assembly in the second area of the carrier by the plug-in device, effectively guarantees the consistency and accuracy of the assembly of the clamping piece and the socket assembly, and further guarantees that the first assembly device successfully assembles the clamping piece and the socket assembly assembled in the second area into the bottom shell in the first area, thereby achieving high work efficiency.

The invention relates to the technical field of semiconductor lead frame core bonding, and particularly discloses semiconductor lead frame core bonding equipment which comprises a conveying belt, a plurality of material guiding assemblies and a plurality of material guiding assemblies, wherein the front and back of the conveying belt are respectively provided with a frame, and the back of the frame on the back is fixedly connected with a supporting frame. The conveying belts are sequentially arranged above the conveying belt; the adjusting assembly is arranged between the material guiding assembly and the supporting frame. Through cooperation of the material guiding assembly, the placing assembly, the adjusting assembly and the fixing unit, flexible adjustment can be performed according to specific models and fixing positions of chips and lead frames. The adjusting assembly can accurately adjust the feeding position of the material guiding assembly, so that the chip can be directly conveyed to the position near the lead frame, and the distance between the chip and the lead frame is greatly reduced. Therefore, the contact time of the placing assembly and the fixing unit with the chip is shortened, the chip bonding time is effectively shortened, and all parts are matched more closely.

A method for learning-based automatic component placement of analog circuits is presented. The method comprises the following steps: acquiring a netlist file of an analog circuit comprising a plurality of components; according to the netlist file, obtaining the total number of a plurality of wells of the analog circuit and the number of components sharing the first well, the number of the components sharing the first well among the wells being the largest; according to the total number of the traps, determining the number of a plurality of bounded-slice grid (BSG, BSG) units, and according to the total number of the traps, determining the number of the plurality of bounded-slice grid (BSG, BSG) units; determining the size of each bounded slice line grid unit according to the number of the components sharing the first trap; and performing a training process to determine an optimal component placement scheme by using a reinforcement learning model including an actor model and a reviewer model.

This utility model discloses a lithium battery sealing performance testing device for tablet computers, including a testing box. A support frame is fixed to the top surface of the testing box, a glass window is opened on the surface of the testing box, a controller is fixed to the side of the testing box, an installation plate is provided inside the testing box, a reciprocating motor is fixed to the side of the testing box, a reciprocating lead screw is fixed to the output end of the reciprocating motor, and the reciprocating lead screw is threadedly connected to the installation plate. An airtightness tester is fixed to the top surface of the testing box. It also includes a placement component and a voltage regulating component. The placement component has an axisymmetric structure about the installation plate, so that the device can prepare for the next test when performing a lithium battery sealing performance test. The lithium battery can move laterally in the placement component, so that the surface of the lithium battery can be fully in contact with the gas in the testing box, with no blind spots, making the lithium battery test more accurate. The voltage regulating component can quickly squeeze or pull the gas in the testing box, improving the testing efficiency of lithium battery sealing performance.

The present invention relates to the technical field of circuit boards, and in particular to a PCB production process and equipment with a combination function. The PCB production equipment with a combination function includes a support component, a suction cup component, a moving component, a printing component, two screen fixing components, a U-shaped protective frame, an airbag and a buffer reset component. The support component is placed on the ground, the suction cup component and the moving component are both fixedly installed on the top of the support component, and the printing component includes a sliding section, a fixed section, an ink return component and a scraper component. The suction cup component can suck the circuit board, the ink return component of the printing component can scrape the ink back to the front of the scraper component, the scraper component can print the ink on the circuit board, the screen fixing component can fix the screen, the protective frame can prevent people from touching the printing component to a certain extent when the printing component is working, the airbag can blow the volatile gas of the ink to one side, and the buffer reset component can prevent people from damaging the scraper component when testing the height of the scraper component.

A technique for processing an integrated circuit / tape assembly having a plurality of integrated circuits supported by an underlying dicing tape involves: placing the integrated circuit / tape assembly on a bottom file frame carrier (FFC) frame having a structure (e.g., an inner edge or a flexible peg); placing a top FFC frame having a central opening over the integrated circuit / tape assembly; and mating the top and bottom FFC frames such that the dicing tape is pulled on the structure, thereby laterally stretching the dicing tape, which causes a wafer saw frame holding the integrated circuits together to break. The lateral stretching of the dicing tape increases the distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby preventing the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than a conventional FFC configuration, which makes shipment and storage more efficient.

The invention relates to the technical field of detection, and discloses a detection device for intelligent control of electrical automation equipment, which comprises a conveying belt and further comprises two U-shaped plates, the two U-shaped plates are fixedly mounted on two sides of the tail end of the conveying belt, and the top ends of the upper transverse edges of the U-shaped plates are inclined planes; the number of the U-shaped copper plates is two, the two U-shaped copper plates are fixedly installed on the surfaces of the two U-shaped plates respectively, and the two U-shaped copper plates are electrically connected; and the plurality of placing assemblies are uniformly distributed on the surface of the conveying belt, and the placing assemblies are used for placing electrical equipment needing to be detected. Compared with the prior art, the electrical equipment can be automatically detected, classified discharging can be automatically conducted according to the detection result after detection, the situation that the quality is confused after detection is avoided, in addition, manual intervention is not needed during detection, the detection effect on the electrical equipment is improved, and then the use effect of the equipment is improved.

The utility model relates to the field of semiconductor equipment, and discloses a temperature stabilizing unit and equipment with the temperature stabilizing unit, the temperature stabilizing unit comprises a placing table, a supporting chuck and a vacuum assembly, the placing table is provided with an air hole and a channel, the vacuum assembly is aligned with the channel, and the air hole is used for introducing compressed gas towards the back surface of a silicon wafer to be subjected to temperature control when the silicon wafer to be subjected to temperature control leaves the placing table; the supporting chuck is used for jacking up the silicon wafer to be subjected to temperature control, so that the silicon wafer to be subjected to temperature control leaves the placement table; after the compressed gas is completely introduced, the silicon wafer to be subjected to temperature control is driven to fall to the placement table; and the vacuum assembly is used for adsorbing residual water on the back surface of the silicon wafer to be subjected to temperature control through the channel in a vacuum manner when the silicon wafer to be subjected to temperature control falls to the placement table. After part of residual water is removed, the silicon wafer to be subjected to temperature control falls on the placement table, and the vacuum adsorption assembly vacuumizes through the channel on the placement table, so that the residual water on the back surface of the silicon wafer to be subjected to temperature control is effectively removed, the alignment and overlay heat effect caused by uneven temperature is reduced, and the possibility that water is retained on the transmission arm can be reduced.

The utility model discloses a hardware necking type body side punching die, and relates to the technical field of hardware punching. The hardware punching device comprises a placing table, a downward pressing assembly is arranged at the top of the placing table, a positioning assembly and a punching assembly are arranged on the outer surface of the placing table, a guiding assembly is arranged between the downward pressing assembly and the positioning assembly, and hardware is arranged at the top of the placing table. According to the hardware punching device, the pressing assembly, the positioning assembly and the punching assembly are connected, when the pressing assembly moves downwards, the positioning assembly is pushed firstly, the hardware is clamped by the positioning assembly, limiting and fixing of the hardware are achieved, then the pressing assembly continues to descend, the punching assembly is pushed by the pressing assembly to move, and the hardware is punched by the punching assembly; in the process, clamping positioning and punching of the hardware can be completed through one-time descending of the downward pressing assembly, the machining mode is simple, cost is low, deviation can be prevented after the hardware is fixed, and stability is high.

This utility model discloses an amorphous component placement device for a horizontal magnetic furnace, relating to the field of materials science and technology. The utility model includes a limiting frame, with a connecting plate slidably connected to the inner wall of the limiting frame. A placement mechanism is provided on the connecting plate, and a picking mechanism is provided on the limiting frame. The placement mechanism includes a sliding groove. By incorporating a clamping plate, and with a spring in a compressed state, the spring rebounds, pushing the sliding plate towards the placement box. Simultaneously, the sliding plate slides on a fixed rod, causing the clamping plate to move. The clamping plate then causes a slider to slide within the sliding groove. Through the clamping plate that can clamp the placement box, the placement box containing the amorphous components is fixed in position, ensuring the stability of the components within the furnace and guaranteeing the uniformity of the heating process, thereby improving the heating effect and component performance.

The application relates to a printed circuit board arrangement temporary storage mechanism and relates to the field of circuit board processing technology, which comprises a support assembly, a placing assembly and a blowing assembly. The placing assembly comprises a placing frame and a plurality of placing pieces for placing the printed circuit boards. The plurality of placing pieces are located in the placing frame, the distribution direction of the plurality of placing pieces is consistent with the length direction of the vertical side of the placing frame, and placing gaps are left between the plurality of placing pieces. The blowing assembly comprises an outer box body, at least one blowing piece and at least one ionization piece. The placing frame is located in the outer box body, a blowing gap is left between the placing frame and the outer box body, the blowing piece is located in the blowing gap, the blowing piece comprises an inner box body, a fan and a plurality of branch pipes, the fan is used for connecting the inner box body and the outside, the plurality of branch pipes are all connected to one side of the inner box body close to the placing frame, one branch pipe corresponds to one placing gap, and the ionization piece is located in the inner box body and is used for ionizing air. The application has the effect of improving the difficulty in eliminating static electricity.

The utility model discloses an electronic commerce product display cabinet which comprises a base, a transparent display frame is installed on the base, a top cover is installed at the end, away from the base, of the transparent display frame, a rotating disc is rotationally connected to the upper end face of the base, a connecting rod is detachably installed between the rotating disc and the top cover, and a plurality of containing assemblies are installed on the connecting rod. And the placing assembly comprises a first connecting ring, the outer wall of the first connecting ring is rotationally connected with a second connecting ring, the second connecting ring is fixedly connected with a placing table, the second connecting ring is provided with a third threaded hole, and the annular clamping groove is provided with a strip-shaped hole matched with the third threaded hole. Compared with the prior art, the e-commerce product display cabinet has the advantages that the placing tables can be additionally arranged according to actual use requirements, the height and the angle in the horizontal direction of the placing tables can be independently adjusted, the e-commerce product display cabinet can adapt to e-commerce products of different specifications, and details of the e-commerce products can be better displayed.

A vertical line card (VLC) arrangement for networking modules is disclosed. The system includes a mainboard containing a high-speed ASIC and one or more outward cage structures, along with a centrally located daughterboard supporting one or more additional cages. This architecture significantly shortens high-speed SerDes traces, preserves front-to-back airflow, and sustains high port density. By mounting certain cages directly on the mainboard, extra insertion losses from interconnects are eliminated, while the centrally positioned daughterboard ensures only minimal additional signal degradation. Strategic cutouts and angled faceplates provide optimal thermal management. Overall, the solution avoids expensive flyover cables or multiple board-to-board connectors and accommodates busbar power delivery for high-current ASICs. This modular design offers flexibility in port counts, component placement, and power management, enabling robust signal integrity and enhanced heat dissipation for next-generation data center and telecom systems.

This invention relates to the field of magnetic blow-out switch technology, specifically to a synchronous on / off detection device for magnetic blow-out switches. The device includes a detection platform and a control panel disposed on one side of the detection platform. The control panel is equipped with a touch screen and a start switch. A platform plate is disposed on the top surface of the detection platform. A placement component is disposed in the center of the top surface of the platform plate and is used to place several stacked magnetic blow-out switch bodies, wherein the bottom magnetic blow-out switch body has a trigger block connected to its bottom end. A clamping detection component is disposed on both sides of the placement component. A trigger component is disposed in the center of the placement component. A drive component is disposed on one side of the platform plate. A control system is connected to the touch screen and the start switch signal. Compared with the prior art, this application achieves multi-point clamping and "pre-pressure—detection—voltage stabilization" closed-loop control by setting up clamping detection components in conjunction with a clamping detection control module.

The utility model relates to the technical field of showing stands, and discloses a rotatable multi-angle showing stand which comprises a fixed bottom plate, a rotating assembly, a placement table top and a clamping assembly, an anti-skid pad is pasted on the periphery of the bottom of the fixed bottom plate, and the bottom of the rotating assembly is arranged in the middle of the upper portion of the fixed bottom plate. Through the arrangement of the rotating assembly and the clamping assembly, the rotating assembly can quickly drive an object placed on the placing table top to change the viewing angle of audiences, and in the angle adjusting process, the placed object can be clamped through the clamping assembly, so that the viewing angle of the audiences can be adjusted, and the viewing angle of the audiences can be adjusted. And therefore, when an article is driven by rotation to shake, it is ensured that the article can be stably fixed on the placement table top, the stability of the article is improved, and the phenomenon that the surface of the article is damaged due to the fact that the surface of the article is excessively extruded can be avoided in an elastic clamping mode under the condition that the article is fixed.