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5338 results about "Grounding electrodes" patented technology

Grounding electrodes are connected to the building’s electrical system through grounding electrode conductors, also known as ground wires. A number of different metal alloys can function as grounding electrodes, the most common of which are the focus of this article.

Low-temperature compatible wide-pressure-range plasma flow device

The invention is embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and a substrate or work piece is placed in the gas flow downstream of the electrodes, such that said substrate or work piece is substantially uniformly contacted across a large surface area with the reactive gases emanating therefrom. The invention is also embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and one of the grounded electrodes contains a means of mixing in other chemical precursors to combine with the plasma stream, and a substrate or work piece placed in the gas flow downstream of the electrodes, such that said substrate or work piece is contacted by the reactive gases emanating therefrom. In one embodiment, the plasma flow device removes organic materials from a substrate or work piece, and is a stripping or cleaning device. In another embodiment, the plasma flow device kills biological microorganisms on a substrate or work piece, and is a sterilization device. In another embodiment, the plasma flow device activates the surface of a substrate or work piece, and is a surface activation device. In another embodiment, the plasma flow device etches materials from a substrate or work piece, and is a plasma etcher. In another embodiment, the plasma flow device deposits thin films onto a substrate or work piece, and is a plasma-enhanced chemical vapor deposition device or reactor.
Owner:RGT UNIV OF CALIFORNIA

Method of processing a substrate

The invention is embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and a substrate or work piece is placed in the gas flow downstream of the electrodes, such that said substrate or work piece is substantially uniformly contacted across a large surface area with the reactive gases emanating therefrom. The invention is also embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and one of the grounded electrodes contains a means of mixing in other chemical precursors to combine with the plasma stream, and a substrate or work piece placed in the gas flow downstream of the electrodes, such that said substrate or work piece is contacted by the reactive gases emanating therefrom. In one embodiment, the plasma flow device removes organic materials from a substrate or work piece, and is a stripping or cleaning device. In another embodiment, the plasma flow device kills biological microorganisms on a substrate or work piece, and is a sterilization device. In another embodiment, the plasma flow device activates the surface of a substrate or work piece, and is a surface activation device. In another embodiment, the plasma flow device etches materials from a substrate or work piece, and is a plasma etcher. In another embodiment, the plasma flow device deposits thin films onto a substrate or work piece, and is a plasma-enhanced chemical vapor deposition device or reactor.
Owner:RGT UNIV OF CALIFORNIA

Spark Plug for a Gas-Operated Internal Combustion Engine

The invention relates to a spark plug for a gas-fired internal combustion engine, and Includes a metallic body, with an insulator fastened in the body. A central electrode, leads through the insulator and includes a protruding end of a precious metal alloy. An annular ground electrode is fastened to the body and surrounds the end of the central electrode which, at the inside thereof facing the central electrode is provided with a precious metal or with a precious metal alloy. The mutually facing surfaces of the central electrode and ground electrode formed by the precious metal or the precious metal alloy are coaxially disposed cylinder surfaces. A cap is provided and attached to the body and which, after installation of the spark plug into a combustion chamber of the internal combustion engine, shields the central electrode and the ground electrode from the combustion chamber. Together with the body of the spark plug, the central electrode forms an ante-chamber, in which the central electrode and the ground electrode are disposed. The cap having at least one opening, which enables a gas exchange between the ante-chamber and the space outside of the ante-chamber. According to the invention, a deviation of the cylinder surfaces from the ideal cylinder geometry is less than +−20 μm, and a deviation of the positions of the axes of the cylinder surfaces from their ideal coaxial position is less than +−50 μm.
Owner:FEDERAL MOGUL IGNITION
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