4239 results about "Negative voltage" patented technology

A power converter includes a DC to AC inverter that is connected to a neutral node formed between first and second capacitors connected across two DC supply lines. The inverter is operated to selectively couple the DC supply lines and the neutral node to an output terminal thereby producing an alternating voltage waveform formed by a sequence of output pulses having positive, zero and negative voltage levels. To compensate for a voltage imbalance across the capacitors, an imbalance compensation coefficient is derived from the difference in voltages across the first and second capacitors and from the direction of current between the neutral node and the inverter. The imbalance compensation coefficient is employed to adjust the width of the output pulses so as to charge and discharge the capacitors to correct the imbalance.

A plasma processing apparatus performs a process on a substrate by using plasma. The plasma processing apparatus includes a processing chamber; a mounting table which is located in the processing chamber and on which a substrate is mounted; a gas shower head formed of a conductive material provided to face the mounting table and having at the bottom surface thereof a plurality of gas injection openings for supplying a processing gas into the processing chamber; an induction coil to which a high frequency current is supplied to generate an inductively coupled plasma in a region surrounding a space below the gas shower head; a negative voltage supplying unit for applying a negative DC voltage to the gas shower head to allow an electrical field, which is induced by the induction coil, to be drawn to a central portion of the processing region; and a unit for evacuating the processing chamber.

The invention discloses a film deposition method which comprises the following steps: placing a first electrode plate used as an anode and a second electrode plate used as a cathode in parallel in a reaction chamber, wherein the surface of the second electrode plate facing to the first electrode plate is provided with a sacrificial layer; putting a substrate on the surface of the first electrode plate facing to the sacrificial layer; leading etching gas into the reaction chamber; grounding the first electrode plate, and applying DC negative voltage to the second electrode plate; ionizing the etching gas into a plasma so as to etch the sacrificial layer, and depositing a film on the surface of the substrate. The film deposition method can improve the performance, particularly the stability of the film and the uniformity of large-area film deposition.

This application is directed to driving methods for electrophoretic displays. The driving methods comprise applying different voltages selected from multiple voltage levels, to pixel electrodes and optionally also to the common electrodes. In a preferred method, the different voltages are selected from a group consisting of 0V, at least two levels of positive voltage and at least two levels of negative voltage.

An electric arc welding apparatus comprising at least a first consumable electrode and a second consumable electrode movable in unison along a welding path between the edges of two adjacent, mutually grounded plates, a first power supply for passing a first welding current at a first low frequency between the first electrode and the two plates, a second power supply for passing a second welding current at a second low frequency between the second electrode and the two plates, where each of the power supplies includes a three phase voltage input operated at line frequency, a rectifier to convert the input voltage to a DC voltage link and a high frequency switching type inverter converting the DC voltage link to a high frequency AC current, an output rectifier circuit to provide a positive voltage tenninal and a negative voltage terminal, and an output switching network operated at a given low frequency for directing a pulsating welding current at the given low frequency from the two terminals across one of the electrodes and the plates, and a circuit for independently adjusting the given low frequency so the value of the first low frequency of the first power supply is different from the second low frequency of the second power supply.

A non-volatile “reverse memory cell” suitable for use as a building block for a 3-dimensional memory array includes a charge-trapping layer which is programmed or charged through gate-injection, rather than channel-injection. Such a reverse cell may be implemented as either an n-channel memory cell or a p-channel memory cell, without incurring design or process penalties, or any complexity in programming or erase operations. Furthermore, all reading, programming, erase, program-inhibiting operations may be carried out in the reverse memory cell using only positive or only negative voltages, thereby simplifying both the design and the power management operations.

The present invention provides a stacked organic light emitting device, comprising a first conductive layer, at least one intermediate conductive layer and a second conductive layer, and light emitting units disposed between the conductive layers, wherein at least two non-neighboring conductive layers among the conductive layers are conductive layers belonging to Group 1 such that they are electrically connected with each other to a common potential; at least one non-neighboring conductive layer among the conductive layers which are not electrically connected with the conductive layers belonging to Group 1 to a common potential are conductive layers belonging to Group 2 such that they are electrically connected with each other to a common potential; and the conductive layers belonging to Group 1 and the conductive layers belonging to Group 2 are connected with each other via a voltage regulator for alternately applying a positive voltage and a negative voltage.

A method for depositing on a substrate surface a thin film layer comprising a target material comprises providing a cathode including a target having a sputtering surface comprised of the target material, with the target sputtering surface facing the substrate surface with a space therebetween, and sputtering the target material onto the substrate surface by applying a plurality of negative voltage pulses to the cathode while simultaneously applying a bias voltage to the substrate. Embodiments include depositing thin film layers onto static or moving substrates and application of constant or time-varying substrate bias voltage. The invention finds particular utility in the formation of high purity layers in the automated manufacture of magnetic data/information storage and retrieval media.

During a stand-by state in which power supply is cut off, a high-voltage power supply control circuit isolates a global negative voltage line transmitting a negative voltage and a local negative voltage line provided corresponding to each respective sub array block from each other and isolates a global ground line and a local ground line transmitting a ground voltage from each other. These local ground line and local negative voltage line are charged to a high voltage level through a high voltage line before cut-off from the corresponding power supply. A leakage current path from a word line to the negative voltage line or the ground line is cut off, so that the word line in a non-selected state can reliably be maintained at a non-selection voltage. Thus, in a low power consumption stand-by mode, data stored in a memory cell can be held in a stable manner.

In a case when a structure of forming a p+ layer on a substrate rear surface side is employed in order to prevent dark current generation from the silicon boundary surface, various problems occur. According to this invention, an insulation film 39 is provided on a rear surface on a silicon substrate 31 and a transparent electrode 40 is further provided thereon, and by applying a negative voltage with respect to the potential of the silicon substrate 31 from a voltage supply source 41 to the insulation film 39 through the transparent electrode 40, positive holes are accumulated on a silicon boundary surface of the substrate rear surface side and a structure equivalent to a state in which a positive hole accumulation layer exists on aforesaid silicon boundary surface is to be created. Thus, various problems in the related art can be avoided.

In a semiconductor memory device which requires a refresh operation, a control method stops supplying a word line voltage which is a boosted voltage higher than an external supply voltage, a memory array substrate voltage which is a negative voltage supplied to a semiconductor substrate, and a bit line precharge voltage for use in reproducing data held in memory cells for a predetermined period at the end of each refresh operation. In this event, voltage output terminals of the word line and memory array substrate voltages are respectively driven to a ground potential. For recovering these voltages, the delivery of the word line voltage is stopped until the memory array substrate voltage rises to some extent.

A novel RF buffer circuit adapted for use with an RF switch circuit and method for switching RF signals is described. The RF switch circuit is fabricated in a silicon-on-insulator (SOI) technology. The RF switch includes pairs of switching and shunting transistor groupings used to alternatively couple RF input signals to a common RF node. The switching and shunting transistor grouping pairs are controlled by a switching control voltage (SW) and its inverse (SW_). The switching and shunting transistor groupings comprise one or more MOSFET transistors connected together in a “stacked” or serial configuration. The stacking of transistor grouping devices, and associated gate resistors, increase the breakdown voltage across the series connected switch transistors and operate to improve RF switch compression. A fully integrated RF switch is described including digital control logic and a negative voltage generator integrated together with the RF switch elements. In one embodiment, the fully integrated RF switch includes a built-in oscillator, a charge pump circuit, CMOS logic circuitry, level-shifting and voltage divider circuits, and an RF buffer circuit. Several embodiments of the charge pump, level shifting, voltage divider, and RF buffer circuits are described. The inventive RF switch provides improvements in insertion loss, switch isolation, and switch compression.

An electric power source for a motor vehicle is equipped with a welded state discriminator, and while a positive-side contactor and negative-side contactor are controlled to be switched off, the welded state discriminator detects a voltage of a positive-side contactor or negative-side contactor on its loading side with respect to a connecting point of a battery unit on a positive side and a battery unit on a negative side, so that when in a plus voltage where the detected voltage thus obtained is larger than a predetermined voltage, the positive-side contactor is judged to be in a welded state, and when in a minus voltage where the detected voltage is larger than the predetermined voltage, the negative-side contactor is judged to be in a welded state.

A linear low dropout voltage regulator is described that makes use of a depletion mode NMOS pass transistor and of a PMOS transistor in series to the NMOS transistor and connected to its drain. The depletion NMOS transistor assures low dropout operations, while the series PMOS transistor allows the current regulation even under the condition of shorted load. The same PMOS transistor may be used to disable the current in the load without generating a negative voltage at the gate of the depletion pass transistor. This regulator is inherently stable without the need for an output capacitor in parallel to the load.

In terms of achieving a reduction in the cost of an antenna switch, there is provided a technology capable of minimizing harmonic distortion generated in the antenna switch even when the antenna switch is particularly formed of field effect transistors formed over a silicon substrate. Between the source region and the drain region of each of a plurality of MISFETs coupled in series, a distortion compensating capacitance circuit is coupled which has a voltage dependency such that, in either of the cases where a positive voltage is applied to the drain region based on the potential of the source region and where a negative voltage is applied to the drain region based on the potential of the source region, the capacitance decreases to a value smaller than that in a state where the potential of the source region and the potential of the drain region are at the same level.

An electroluminescent device contains (1) first and second electrodes, at least one of which is transparent to radiation; (2) a hole conducting layer containing first nanoparticles wherein the hole conducting layer is in contact with said first electrode; (3) an electron conducting layer containing second nanoparticles where the electron conducting layer is in contact with the hole conducting layer and the second electrode; and optionally (4) a voltage source capable of providing positive and negative voltage, where the positive pole of the voltage source is connected to the first electrode and the negative pole is connected to the second electrode. In some embodiments, the electroluminescent device also includes an electron-hole combination layer between the hole and electron conducting layers.

A solar power management system is provided for managing electric energy conversion by a photovoltaic cell module, supplying the converted electric energy to an external load, and storing the converted electric energy in a battery. The solar power management system comprises a multiphase maximum power tracking (MPT) module, a charging circuit, and a voltage conversion module. The multiphase MPT module regulates output current of the photovoltaic cell module to output maximum power within the high limit thereof and obtain improved solar energy conversion efficiency. The voltage conversion module converts the electric energy generated by the photovoltaic cell module into different voltage formats, such as 5.6V DC, 1.0V DC, 0.6˜0.3V DC low voltage, or −1.2V DC negative voltage, to meet different external load requirements. The solar power management system has simple circuitry and can be configured as a system on chip (SoC) at reduced cost while provides very wide applications.